CN206320181U - Bearing tile structure - Google Patents
Bearing tile structure Download PDFInfo
- Publication number
- CN206320181U CN206320181U CN201621413945.7U CN201621413945U CN206320181U CN 206320181 U CN206320181 U CN 206320181U CN 201621413945 U CN201621413945 U CN 201621413945U CN 206320181 U CN206320181 U CN 206320181U
- Authority
- CN
- China
- Prior art keywords
- heat dissipating
- dissipating layer
- supporter
- tile
- bearing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000012634 fragment Substances 0.000 claims abstract description 45
- 239000000463 material Substances 0.000 claims abstract description 13
- 238000005245 sintering Methods 0.000 claims description 10
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 8
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 8
- 229910001369 Brass Inorganic materials 0.000 claims description 6
- 239000010951 brass Substances 0.000 claims description 6
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229920002480 polybenzimidazole Polymers 0.000 claims description 5
- 229920002530 polyetherether ketone Polymers 0.000 claims description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 5
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 5
- -1 polytetrafluoroethylene Polymers 0.000 claims description 5
- 239000011148 porous material Substances 0.000 claims description 5
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 claims description 4
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 claims description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910000861 Mg alloy Inorganic materials 0.000 claims description 3
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 150000003949 imides Chemical class 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000003607 modifier Substances 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000007731 hot pressing Methods 0.000 description 4
- 229920006324 polyoxymethylene Polymers 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 2
- 239000011354 acetal resin Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000005255 carburizing Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Sliding-Contact Bearings (AREA)
- Finishing Walls (AREA)
Abstract
The utility model discloses a kind of bearing tile structure, bearing tile structure includes wearing layer, tile fragment supporter and heat dissipating layer, the heat dissipating layer is fixedly installed on the side surface of tile fragment supporter one by connector, wearing layer, which is fixed, is covered in heat dissipating layer dorsad on the side surface of tile fragment supporter one, the utility model heat dissipating layer is not constrained by material and process equipment, heat dissipating layer and tile fragment supporter stable connection, low cost of manufacture, bearing tile service life is improved, and then improves the bearing capacity and service life of bearing.
Description
Technical field
The utility model relates to a kind of bearing tile, particularly relates to a kind of bearing tile structure.
Background technology
Tile fragment can produce many heats at work, for the heat produced by reducing tile fragment under the operating mode of high speed and high pressure
Amount, so as to improve the bearing capacity and service life of bearing, particularly there is more preferable performance under high-temperature condition, most at present to do
Method is to increase by one layer of non-ferrous metal between wearing layer and tile fragment supporter using the method for hot pressing or sintering, is dissipated by middle
Thermosphere takes away heat, but this hot pressing and sintering process have many requirements to equipment and raw material, is not suitable for general processing and sets
It is standby.In addition, this method is also required to the material of non-ferrous metal and steel plate, and waste than larger.For example：Heat dissipating layer is used
During lower-cost brass, because the simultaneous compatibility of brass is poor, general is difficult to suppress or be sintered on steel plate；If using beryllium
Copper, cost is too high, during using tin bronze, to also can not suppress or sintering containing chromium component in steel plate.
Utility model content
In order to overcome drawbacks described above, the utility model provides a kind of bearing tile structure, the structure of the bearing tile structure
Simply, it is low to process equipment and material requirements, manufacturing cost, stable connection.
The utility model is in order to solve the technical scheme that its technical problem is used：A kind of bearing tile structure, including it is resistance to
Layer, tile fragment supporter and heat dissipating layer are ground, the heat dissipating layer is fixedly installed on the side surface of tile fragment supporter one by connector, resistance to
Mill layer, which is fixed, is covered in heat dissipating layer dorsad on the side surface of tile fragment supporter one.
As further improvement of the utility model, the connector be one kind in screw, rivet, buckle, pin or
A variety of combinations.
As further improvement of the utility model, the heat dissipating layer is consistent with tile fragment supporter profile, tile fragment supporter
On be distributed with some screwed holes, heat dissipating layer is provided with countersunk head through hole corresponding with tile fragment supporter upper screwed hole position, and screw is worn
Cross heat dissipating layer countersunk head through hole and with the screw hole on tile fragment supporter, the head of screw is just placed in heat dissipating layer completely
In countersunk head.
As further improvement of the utility model, tied between the heat dissipating layer and wearing layer by back-off structure or sintering
Structure is fixed together.
As further improvement of the utility model, the back-off structure is distributed in the heat dissipating layer side corresponding with wearing layer
Wall surrounding.
As further improvement of the utility model, the back-off structure is oat tail groove structure, trapezoid groove structure, screwed hole
One or more combinations in structure and step pore structure.
As further improvement of the utility model, the heat dissipating layer thickness is the 1/4 of bearing tile integral thickness.
As further improvement of the utility model, the tile fragment supporter stainless steel integrated formed structure, heat dissipating layer
Material has for any one in brass, red copper, beryllium copper, the alloy of cupric, aluminium alloy, magnesium alloy, tin alloy and babbit
Non-ferrous metal, wearing layer is polytetrafluoroethylene (PTFE) (PTFE), polyimides (PI), polyamide-acid imide (PAI), polybenzimidazoles
(PBI), acetal resin (POM), polyethylene terephthalate are (PET), polyether-ether-ketone (PEEK) and containing above-mentioned material
Expect the one that one or more combinations in the modifier and babbit, ceramics, epoxy resin, phenolic resin of composition are formed
Molding structure.
The beneficial effects of the utility model are：The utility model between wearing layer and tile fragment supporter by passing through connection
The mode of part connection increases by one layer of heat dissipating layer, it is to avoid hot pressing and sintering process, heat dissipating layer and tile fragment supporter stable connection, no
Constrained by material and process equipment, effectively reduced the manufacturing cost of bearing tile, improved bearing tile service life, enter
And improve the bearing capacity and service life of bearing.
Brief description of the drawings
Fig. 1 is the first stereogram of the present utility model；
Fig. 2 is the second stereogram of the present utility model；
Fig. 3 is front view of the present utility model；
Fig. 4 be in Fig. 3 A-A to sectional view；
Fig. 5 is B-B direction sectional view in Fig. 3；
Fig. 6 is right view of the present utility model.
Embodiment
Embodiment：A kind of bearing tile structure, including wearing layer 1, tile fragment supporter 2 and heat dissipating layer 3, the heat dissipating layer 3
It is fixedly installed in by connector 4 on the side surface of tile fragment supporter 2 one, wearing layer 1 is fixed and is covered in the dorsad tile fragment branch of heat dissipating layer 3
On the side surface of support body 2 one.
Heat dissipating layer 3 is fixedly mounted on the side of tile fragment supporter 2 by connector 4, it is to avoid using hot pressing and the group of sintering
Dress mode, greatly reduces the requirement to process equipment and the material of heat dissipating layer 3, reduces processing cost, improve stable connection
Property, the radiating effect in the bearing tile course of work is improved, the bearing capacity and service life of bearing is greatly improved.
The connector 4 is one or more combinations in screw, rivet, buckle, pin.
The heat dissipating layer 3 is consistent with the profile of tile fragment supporter 2, and some screwed holes, heat dissipating layer are distributed with tile fragment supporter 2
3 be provided with countersunk head through hole corresponding with the upper screwed hole position of tile fragment supporter 2, screw through heat dissipating layer 3 countersunk head through hole and with
Screw hole on tile fragment supporter 2, the head of screw is just placed in the countersunk head of heat dissipating layer 3 completely.
It is fixed together between the heat dissipating layer 3 and wearing layer 1 by back-off structure 5 or sintering structure, by falling
The mode of buckle structure 5 or sintering realizes the connection of heat dissipating layer 3 and wearing layer 1, stable connection, the two accurate positioning.
The back-off structure 5 is distributed in heat dissipating layer 3 and the corresponding side wall surrounding of wearing layer 1, and the surrounding of heat dissipating layer 3 needs
There is back-off structure 5, the wearing layer 1 that is placed on of purpose comes off, tried one's best if space and design some back-offs more.
The back-off structure 5 be oat tail groove structure, trapezoid groove structure, thread pore structure and one kind in step pore structure or
A variety of combinations, is such as combined together by way of oat tail groove structure and screw hole, can also individually use dovetail groove,
T-slot mechanism is snapped together by nested against one another, common such as the mode of coating and injection moulding in mould, makes wearing layer 1 firmly multiple
Close on the surface of heat dissipating layer 3.
The thickness of heat dissipating layer 3 is the 1/4 of bearing tile integral thickness, and tile fragment gross thickness does not include the height of boss, should
Thickness both ensure that radiating effect, and not influence bearing tile integral thickness and wearability, and the thickness of certain heat dissipating layer 3 can also
More than or less than the 1/4 of bearing tile integral thickness.
The material of the tile fragment supporter 2 is stainless steel, and the material of heat dissipating layer 3 is brass, red copper, beryllium copper, the conjunction of cupric
Any one non-ferrous metal in gold, aluminium alloy, magnesium alloy, tin alloy and babbit, wearing layer 1 is polytetrafluoroethylene (PTFE)
(PTFE), polyimides (PI), polyamide-acid imide (PAI), polybenzimidazoles (PBI), acetal resin (POM), poly- pair
PET is (PET), the modifier and babbit of polyether-ether-ketone (PEEK) and the composition containing above-mentioned material, pottery
One or more combinations in porcelain, epoxy resin, phenolic resin.
A kind of bearing tile structure processing method, is comprised the following steps that：
The first step：The machine-shaping of tile fragment supporter 2：
First with machining center by the processing of the external form of tile fragment supporter 2 in place, and the Surface Machining of tile fragment supporter 2 several
Screwed hole, the position of screw hole and quantity can determine according to tile fragment size, are typically defined, protected as far as possible by the groove for not interfering both sides
There is stress at card edge and center.The size of screw thread is taken large values as far as possible with actually active spatial design, such as 5 M2.5 spiral shell
Line；
Second step：The machine-shaping of heat dissipating layer 3：
Heat dissipating layer 3 uses brass material, by machining center by its sharp processing into consistent with tile fragment supporter 2, and
The surrounding of its dorsad side of tile fragment supporter 2 process back-off structure 5 and it is some with the upper screwed hole position of tile fragment supporter 2 just
To countersunk head through hole, countersunk head is located towards the side of wearing layer 1, must assure that tile fragment supporter 2 and heat dissipating layer 3 two connect before installation
Contacting surface it is smooth；
3rd step：The assembling of tile fragment supporter 2 and heat dissipating layer 3：
The heat dissipating layer 3 machined in second step is assembled on tile fragment supporter 2 by screw, the head of screw is sunk to
Into the countersunk head of countersunk head through hole；
4th step：Assembly in step 3 is cleaned, then added cleaned assembly by coating and injection moulding
Any one mode in work, molding or sintering forms wearing layer 1 on the surface of heat dissipating layer 3, then again by grinding and being polished to
Drawing size.
Screw is CARBURIZING FURNACE FOR STAINLESS FASTENER in the first step, and the depth of thread is no more than the 2/3 of supporter.
Claims (8)
1. a kind of bearing tile structure, it is characterised in that：It is described including wearing layer (1), tile fragment supporter (2) and heat dissipating layer (3)
Heat dissipating layer is fixedly installed on the side surface of tile fragment supporter one by connector (4), and wearing layer is fixed and is covered in heat dissipating layer dorsad
On the side surface of tile fragment supporter one.
2. bearing tile structure according to claim 1, it is characterised in that：The connector be screw, rivet, buckle,
One or more combinations in pin.
3. bearing tile structure according to claim 2, it is characterised in that：The heat dissipating layer and tile fragment supporter profile one
Cause, some screwed holes are distributed with tile fragment supporter, heat dissipating layer is provided with corresponding with tile fragment supporter upper screwed hole position heavy
Head through hole, screw through heat dissipating layer countersunk head through hole and with the screw hole on tile fragment supporter, the head of screw is just complete
It is placed in the countersunk head of heat dissipating layer.
4. bearing tile structure according to claim 1, it is characterised in that：By falling between the heat dissipating layer and wearing layer
Buckle structure (5) or sintering structure are fixed together.
5. bearing tile structure according to claim 4, it is characterised in that：The back-off structure is distributed in heat dissipating layer and resistance to
Grind the corresponding side wall surrounding of layer.
6. bearing tile structure according to claim 4, it is characterised in that：The back-off structure is oat tail groove structure, ladder
One or more combinations in shape slot structure, thread pore structure and step pore structure.
7. bearing tile structure according to claim 1, it is characterised in that：The heat dissipating layer thickness is that bearing tile is overall
The 1/4 of thickness.
8. bearing tile structure according to claim 1, it is characterised in that：The tile fragment supporter be stainless steel one into
Type structure, the material of heat dissipating layer is brass, red copper, beryllium copper, the alloy of cupric, aluminium alloy, magnesium alloy, tin alloy and babbit
In any one non-ferrous metal, wearing layer is polytetrafluoroethylene (PTFE), polyimides, polyamide-acid imide, polybenzimidazoles, poly-
Formaldehyde resin, polyethylene terephthalate are, the modifier and babbit of polyether-ether-ketone and the composition containing above-mentioned material,
The integrated formed structure that one or more combinations in ceramics, epoxy resin, phenolic resin are formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621413945.7U CN206320181U (en) | 2016-12-22 | 2016-12-22 | Bearing tile structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621413945.7U CN206320181U (en) | 2016-12-22 | 2016-12-22 | Bearing tile structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206320181U true CN206320181U (en) | 2017-07-11 |
Family
ID=59260017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621413945.7U Active CN206320181U (en) | 2016-12-22 | 2016-12-22 | Bearing tile structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206320181U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106763197A (en) * | 2016-12-22 | 2017-05-31 | 昆山佰亚高分子科技有限公司 | Bearing tile structure and its processing method |
-
2016
- 2016-12-22 CN CN201621413945.7U patent/CN206320181U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106763197A (en) * | 2016-12-22 | 2017-05-31 | 昆山佰亚高分子科技有限公司 | Bearing tile structure and its processing method |
| CN106763197B (en) * | 2016-12-22 | 2020-05-26 | 昆山佰亚高分子科技有限公司 | Bearing shoe structure and processing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240724 Address after: Room 509, 5th Floor, Zhiyuan International Business Building, No. 101 Kefa Road, High tech Zone, Suzhou City, Jiangsu Province, China 215129 Patentee after: Suzhou Promise Precision Machinery Co.,Ltd. Country or region after: China Address before: Room 3, No. 103 Shunyang Road, Huaqiao Town, Kunshan City, Suzhou City, Jiangsu Province, 215300 Patentee before: KUNSHAN BAIYA POLYMER TECHNOLOGY CO.,LTD. Country or region before: China |
|
| TR01 | Transfer of patent right |