CN206226825U - Halogen insulation copper-clad plate - Google Patents
Halogen insulation copper-clad plate Download PDFInfo
- Publication number
- CN206226825U CN206226825U CN201621270447.1U CN201621270447U CN206226825U CN 206226825 U CN206226825 U CN 206226825U CN 201621270447 U CN201621270447 U CN 201621270447U CN 206226825 U CN206226825 U CN 206226825U
- Authority
- CN
- China
- Prior art keywords
- basic unit
- clad plate
- channel
- heat conductive
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052736 halogen Inorganic materials 0.000 title claims abstract description 17
- 150000002367 halogens Chemical class 0.000 title claims abstract description 17
- 238000009413 insulation Methods 0.000 title claims abstract description 16
- 238000002955 isolation Methods 0.000 claims description 8
- 239000006185 dispersion Substances 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 239000006260 foam Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model discloses a kind of insulation copper-clad plate of Halogen, including the first basic unit, the second basic unit and first line layer, in first basic unit through hole is offered along its thickness direction, heat conductive rod is filled with the through hole, anti-interference magnet ring is arranged with the heat conductive rod, the utility model heat dispersion is more preferable.
Description
Technical field
The utility model is related to printed circuit board technology field, more particularly to a kind of insulation copper-clad plate of Halogen.
Background technology
In some special application fields, such as the application scenario such as remote sensing satellite, Aero-Space, microstrip antenna, high frequency antenna,
Faint interference signal can all influence the normal work of wiring board.The copper-clad plate of prior art, generally in epoxy glass-fiber-fabric substrate
Surface sets one layer of Copper Foil as conductive layer, and epoxy glass-fiber-fabric substrate is long-term (to be less than subzero in high temperature (more than 100 degree) and low temperature
Less than 10 degree) work cannot holding circuit stability, while interference free performance is poor, make it in the application of above-mentioned special dimension
It is very restricted.
For drawbacks described above, Application No.:The Chinese patent of CN201520641980.3 discloses a kind of Halogen insulation and covers
Copper coin, including the first basic unit and the first line layer that is arranged in first basic unit at least one side, first line layer
It is integrated in the way of bonding with first basic unit;Also include the second basic unit, second basic unit is arranged on described first
Line layer away from the one side of first basic unit, and it is laminated with the first line in the way of bonding be integrated, described the
First line layer wraps up wherein in one basic unit and second basic unit.Wherein, first basic unit and the second basic unit are
Polyimide foam base material, the first line layer is copper foil layer.
Above-mentioned patent document uses polyimide foam for copper-clad plate basic unit to lift the interference free performance of copper-clad plate.But
Polyimide foam heat conductivility is very poor, almost heat-insulated, and first line layer is wrapped in it by the first basic unit and the second basic unit
In, will cause the heat of first line layer can not distribute, and be gathered in always between the first basic unit and the second basic unit, may finally lead
Overheat is caused even to burn, thus it is to be improved.
Utility model content
In view of the shortcomings of the prior art, the utility model provides a kind of more preferable Halogen insulation copper-clad plate of heat dispersion.
To achieve the above object, the utility model provides following technical scheme:A kind of Halogen insulation copper-clad plate, including the
One basic unit, the second basic unit and first line layer, through hole is offered in first basic unit along its thickness direction, is filled out in the through hole
Filled with heat conductive rod, anti-interference magnet ring is arranged with the heat conductive rod.
Further, first basic unit offers netted channel, the through hole in the side away from first line layer
Lead to channel, heat conductive isolation sheet is laid with the channel.
Or, first basic unit offers netted channel in the side away from first line layer, and the through hole leads to
Channel, metallic heat radiating plate is laid with the channel.
Further, the structure of second basic unit is identical with the first basic unit.
In sum, heat conductive rod can be derived to the first basic unit away from First Line the heat that first line layer is produced in time
The surface of road floor, and distribute, anti-interference magnet ring ensures the interference free performance of copper-clad plate, is ensureing the basis of insulating properties
On, greatly improve heat dispersion.
Brief description of the drawings
Fig. 1 is the front view of the utility model Halogen insulation copper-clad plate;
Fig. 2 is sectional views of the Fig. 1 along line A-A;
Fig. 3 is the enlarged drawing of B in Fig. 2;
Fig. 4 is the top view of the utility model Halogen insulation copper-clad plate;
Fig. 5 is the three dimensional structure diagram of the utility model Halogen insulation copper-clad plate.
Brief description of the drawings:1st, the first basic unit;2nd, the second basic unit;3rd, first line layer;4th, heat conductive rod;5th, anti-interference magnet ring;6、
Channel;7th, heat conductive isolation sheet.
Specific embodiment
The embodiment of the utility model Halogen insulation copper-clad plate is described further referring to figs. 1 to Fig. 5.
A kind of Halogen insulation copper-clad plate, including the first basic unit 1, the second basic unit 2 and first line layer 3, first basic unit 1
Interior being offered along its thickness direction is filled with heat conductive rod 4 in through hole, the through hole, anti-interference magnetic is arranged with the heat conductive rod 4
Ring 5.
Heat conductive rod 4 can be made by heat conduction carbon fiber or heat conductive isolation sheet 7 or other heat-conductings;First basic unit 1 and
The insulating barrier of isolation material can be set in two basic units 2;All layers are free of halogen.
By using above-mentioned technical proposal, the heat that first line layer 3 is produced is conducted in time by heat conductive rod 4, such as Fig. 3 institutes
Show, along a directions, such heat would not be gathered in first line layer 3 to heat-transfer path, on the basis of insulating properties are ensured, dissipate
Hot property is greatly improved;And anti-interference magnet ring 5 can ensure the interference free performance of copper-clad plate.
The present embodiment is preferred, and first basic unit 1 offers netted channel 6 in the side away from first line layer 3,
The through hole leads to channel 6, and the channel 6 is interior to be laid with heat conductive isolation sheet 7.
By using above-mentioned technical proposal, as shown in Figures 3 to 5, heat is derived to the first basic unit 1 in time by heat conductive rod 4
It is in conduction to the heat conductive isolation sheet 7 in channel 6 and fast by netted heat conductive isolation sheet 7 after away from the surface of first line layer 3
Speed is distributed, the b paths in such as Fig. 3, is greatly increased with extraneous contact surface, further improves radiating efficiency.
Or, first basic unit 1 offers netted channel 6 in the side away from first line layer 3, and the through hole leads to
To channel 6, metallic heat radiating plate is laid with the channel 6.
By using above-mentioned technical proposal, netted metallic heat radiating plate plays jamproof effect while heat conduction.
The present embodiment is preferred, and the structure of second basic unit 2 is identical with the first basic unit 1.
By using above-mentioned technical proposal, the second basic unit 2 is symmetrical arranged with the radiator structure of the first basic unit 1, further
Improve heat dispersion.
In sum, the heat that first line layer 3 is produced is conducted in time by heat conductive rod 4, as shown in figure 3, heat-transfer path is along a
Direction, such heat would not be gathered in first line layer 3, and on the basis of insulating properties are ensured, heat dispersion is greatly improved;
And anti-interference magnet ring 5 can ensure the interference free performance of copper-clad plate.
The above is only preferred embodiment of the present utility model, and protection domain of the present utility model is not limited merely to
Above-described embodiment, all technical schemes belonged under the utility model thinking belong to protection domain of the present utility model.Should refer to
Go out, for those skilled in the art, some improvement under the premise of the utility model principle is not departed from and
Retouching, these improvements and modifications also should be regarded as protection domain of the present utility model.
Claims (4)
1. a kind of Halogen insulation copper-clad plate, including the first basic unit, the second basic unit and first line layer, it is characterised in that described the
Offered along its thickness direction in one basic unit and heat conductive rod is filled with through hole, the through hole, be arranged with the heat conductive rod anti-dry
Disturb magnet ring.
2. Halogen insulation copper-clad plate according to claim 1, it is characterised in that first basic unit is away from first line
The side of layer offers netted channel, and the through hole leads to channel, heat conductive isolation sheet is laid with the channel.
3. Halogen insulation copper-clad plate according to claim 1, it is characterised in that first basic unit is away from first line
The side of layer offers netted channel, and the through hole leads to channel, metallic heat radiating plate is laid with the channel.
4. Halogen insulation copper-clad plate as claimed in any of claims 1 to 3, it is characterised in that second basic unit
Structure it is identical with the first basic unit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621270447.1U CN206226825U (en) | 2016-11-23 | 2016-11-23 | Halogen insulation copper-clad plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621270447.1U CN206226825U (en) | 2016-11-23 | 2016-11-23 | Halogen insulation copper-clad plate |
Publications (1)
Publication Number | Publication Date |
---|---|
CN206226825U true CN206226825U (en) | 2017-06-06 |
Family
ID=58791338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201621270447.1U Expired - Fee Related CN206226825U (en) | 2016-11-23 | 2016-11-23 | Halogen insulation copper-clad plate |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN206226825U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109016704A (en) * | 2018-07-12 | 2018-12-18 | 常州澳弘电子有限公司 | A kind of processing method of aluminum-based copper-clad plate |
-
2016
- 2016-11-23 CN CN201621270447.1U patent/CN206226825U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109016704A (en) * | 2018-07-12 | 2018-12-18 | 常州澳弘电子有限公司 | A kind of processing method of aluminum-based copper-clad plate |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN203057688U (en) | Pcb | |
CN205755052U (en) | There is laser direct forming structuring function and the aluminium base of Rotating fields insulating barrier | |
CN206226825U (en) | Halogen insulation copper-clad plate | |
CN209845439U (en) | Printed circuit board assembly PCBA and terminal | |
CN202121860U (en) | Flexible circuit board used for precision electronic device | |
CN104968138B (en) | A kind of printed circuit board (PCB) | |
CN207011077U (en) | A kind of multilayer circuit board that can improve heat-sinking capability | |
CN206283714U (en) | One kind electromagnetic shielding diaphragm | |
CN204046918U (en) | One heat dissipation type circuit board | |
CN203482489U (en) | Multilayer printed circuit board (PCB) | |
CN206542626U (en) | A kind of pcb board | |
CN203233592U (en) | PCB board | |
CN207491295U (en) | A kind of MULTILAYER COMPOSITE circuit board for microwave high-frequency circuit | |
CN206181537U (en) | An improved non-deformable high-density laminated circuit board | |
CN206212403U (en) | Heat radiating type flexible print circuit board | |
CN205793653U (en) | High reliability potting wiring board | |
CN209627789U (en) | A kind of multi-layer PCB board with shielding radiator structure | |
CN207766643U (en) | A kind of high-speed high frequency circuit board with SHD figure layers | |
CN206686438U (en) | A kind of multi-layer H DI wiring boards of internal layer interconnection | |
CN206879209U (en) | A kind of 4G network lines plate | |
CN205408274U (en) | High frequency microwave printing HDI circuit board | |
CN202697020U (en) | PCB plate | |
CN205430766U (en) | HDI high density lamination circuit board | |
CN206024228U (en) | High radiating thickness copper coin | |
CN207340283U (en) | High-frequency multilayer printed wiring board is used in one kind communication |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 311800 Zhejiang city of Shaoxing province Zhuji City Tao Street LITE-ON Road No. 1 Patentee after: Zhejiang Yuanji New Material Co.,Ltd. Address before: 311800 Zhejiang city of Shaoxing province Zhuji City Tao Street LITE-ON Road No. 1 Patentee before: ZHEJIANG YUANJI NEW MATERIAL TECHNOLOGY CO.,LTD. |
|
CP01 | Change in the name or title of a patent holder | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170606 |
|
CF01 | Termination of patent right due to non-payment of annual fee |