CN206165025U - Functional ceramic backplane - Google Patents

Abstract

The utility model provides a functional ceramic backboard, which includes at least two layers of ceramic structures, each layer of ceramic structure includes a ceramic layer, an adhesive layer and a functional layer; wherein, the functional layer and the adhesive layer are arranged on the same surface of the ceramic layer , and the adhesive layer is arranged on the edge of the ceramic layer or the vacant position where the functional layer is not arranged; and, the side of the ceramic structure provided with the adhesive layer is not bonded to the other ceramic structure Layers are bonded on one side. The utility model can get rid of the restriction on the selection of metal materials in the process of making the ceramic back plate, thereby reducing the cost, and the step-by-step sintering of the ceramic layer and the functional part layer can prevent the metal material from being oxidized.

Description

Functional ceramic backplane

technical field

The utility model relates to the technical field of functional backboards, in particular to a functional ceramic backboard.

Background technique

With the rapid development of 3C electronic products, the market has higher and higher requirements for the functions and performance of mobile phones, tablet computers and smart wearable products, such as the appearance quality, mechanical properties and backplane performance of the products. The functional ceramic backplane is a composite part with ceramic as the appearance part and metal material as the functional structural material. Ceramic and metal are two materials with different properties. The sintering temperature and sintering atmosphere of the two are different. It is difficult for the two materials to be simultaneously sintering. For example, zirconia ceramics are sintered in atmospheric conditions around 1500°C, while copper metals with good electrical conductivity are usually sintered in a reducing atmosphere at 800°C-1000°C.

The utility model patent with the patent application number 200720107762.7 discloses a LTCC multilayer ceramic antenna. The ceramic antenna is fired with LTCC (Low Temperature Co-fired Ceramic) technology, and the sintering temperature is between 850°C and 1100°C. The strength of low-temperature co-fired ceramics is very low, resulting in insufficient density of ceramic materials and metal materials, and does not have the high strength, high wear resistance and high polish required for appearance parts.

The utility model patent with the patent application number 201510777195.5 discloses a method for preparing a functional mobile phone backplane. In order to increase the sintering temperature of the metal, the utility model patent selects platinum slurry, ruthenium slurry, and rhodium slurry with higher sintering temperatures. The precious metal materials are sintered in an oxidizing environment around 1500°C to achieve high-temperature co-firing of ceramic materials and metal materials, but the use of precious metal materials will greatly increase the cost, and the precious metal materials used are sintered in an oxidizing environment It is easy to be oxidized, resulting in a decrease in the performance of the functional ceramic backplane.

From the above analysis, it can be seen that the performance of the functional ceramic backplane prepared by the co-firing process is not good enough.

Utility model content

In view of the above problems, the purpose of this utility model is to provide a functional ceramic backboard to solve the problem that the performance of the functional ceramic backboard fired by the co-firing process is not excellent enough.

The functional ceramic backboard provided by the utility model includes: at least two layers of ceramic structures, each layer of ceramic structure includes a ceramic layer, an adhesive layer and a functional layer; wherein, the functional layer and the adhesive layer are arranged on the same surface of the ceramic layer , and the adhesive layer is arranged on the edge of the ceramic layer or the vacant position where the functional layer is not arranged; and, the side of the ceramic structure provided with the adhesive layer is not bonded to the other ceramic structure Layers are bonded on one side.

In addition, the preferred structure is that the ceramic layer is one of zirconia ceramic layer, alumina ceramic layer, silicon nitride ceramic layer, boron carbide ceramic layer, and silicon oxide ceramic layer, and the thickness of the ceramic layer is 0.05 mm to 0.25 mm. .

In addition, it is preferable that the functional part layer includes a circuit layer, an antenna component layer and an NFC module layer.

Furthermore, the preferred structure is that the adhesive layer is a lamination of one or more of laser activated adhesive layers, UV adhesive layers, AB adhesive layers, quick-drying adhesive layers, foam adhesive layers, and VHB adhesive tape layers. The thickness is 0.03mm ~ 0.25mm.

Compared with the prior art, the beneficial effects of the utility model are:

1. The ceramic layer and the functional part layer are fired independently, which can get rid of the restrictions on the selection of materials used in the functional part layer. The functional part layer can choose aluminum, copper, silver, iron, nickel paste, etc. The temperature and price are relatively low and Metal paste with excellent electrical conductivity, thus reducing costs.

2. Realize the connection of different ceramic layers through the bonding layer, avoiding the dissolution of the functional part layer into the ceramic layer during the high-temperature co-firing process, causing defects in the ceramic layer, and reducing the performance of the functional ceramic backplane.

3. The adhesive layer has good shock resistance, which can effectively reduce the probability of damage to the functional ceramic backplane during the drop process.

Description of drawings

By referring to the following description in conjunction with the accompanying drawings, and with a more comprehensive understanding of the utility model, other objectives and results of the utility model will be more clear and easy to understand. In the attached picture:

Fig. 1 is a schematic diagram of an exploded structure of a functional ceramic backboard according to Embodiment 3 of the present invention;

Fig. 2 is the combined top view of Fig. 2;

Fig. 3 is the left side view after Fig. 2 is combined;

Fig. 4 is a schematic diagram of an exploded structure of a functional ceramic backboard according to Embodiment 4 of the present utility model;

Fig. 5 is the plan view after Fig. 4 is combined;

Fig. 6 is a left view after combining Fig. 4 .

detailed description

In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that these embodiments may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate describing one or more embodiments.

The functional ceramic backboard provided by the utility model can be applied to the back cover of electronic products such as mobile phones, tablet computers, and smart wearable devices.

The functional ceramic backboard provided by the utility model includes:

At least two layers of ceramic structure, each layer of ceramic structure includes a ceramic layer, an adhesive layer and a functional layer; wherein, the functional layer and the adhesive layer are arranged on the same surface of the ceramic layer, and the adhesive layer is arranged on the ceramic layer The part of the edge or the vacant part where the functional part layer is not provided; and, one side of the ceramic structure provided with the adhesive layer is bonded to the side of the other ceramic structure without the adhesive layer, until all the ceramic structures glued together.

Taking the three-layer ceramic structure as an example, the side of the bottom ceramic structure with an adhesive layer is bonded to the side of the ceramic structure of the middle layer without an adhesive layer, and the side of the ceramic structure of the middle layer with an adhesive layer is bonded to the bottom side of the ceramic structure. The side of the top layer that is not provided with an adhesive layer is bonded, and the side of the top layer with an adhesive layer is bonded to the inside of the product.

The ceramic layer, adhesive layer and functional component layer of each layer of ceramic structure will be described in detail below.

1. Ceramic layer

The ceramic layer is any one of zirconia ceramic layer, alumina ceramic layer, silicon nitride ceramic layer, boron carbide ceramic layer and silicon oxide ceramic layer or a stack of several of them, and the thickness of the ceramic layer is 0.05mm-0.25mm.

The above-mentioned ceramic layer is made from a ceramic green body, and the specific manufacturing method is as follows:

Step 100: putting the ceramic green body into a degreasing furnace for degreasing, and then putting the degreased ceramic green body into a sintering furnace for sintering to form a ceramic blank.

Making ceramic green body can adopt casting method, sol-gel method, injection molding method, any one in dry pressing method to make ceramic green body; Above-mentioned casting method, sol-gel method, injection molding method, dry pressing method all It is prior art, so it will not be repeated here.

The prepared ceramic green body can be one or more composites of zirconia ceramic green body, alumina ceramic green body, silicon nitride ceramic green body, boron carbide ceramic green body, and silicon oxide ceramic green body, preferably The zirconia ceramic green body is adopted as the ceramic green body of the utility model. The advantages of the zirconia ceramic green body include: high fracture toughness, low preparation cost and good appearance.

The purpose of degreasing the ceramic green body is to remove the bonded objects in the ceramic green body to form a clean ceramic layer with a certain shape, and then sinter the ceramic powder to form a ceramic green body.

The process of degreasing the ceramic green body in the degreasing furnace is as follows:

Step 1: Heat the temperature in the degreasing furnace from room temperature to 350°C in 11 hours;

Step 2: When the furnace temperature of the degreasing furnace reaches 350°C, keep the furnace temperature at 350°C for 5 hours;

Step 3: After 5 hours of heat preservation, heat the furnace temperature of the degreasing furnace from 350°C to 650°C in 10 hours;

Step 4: When the furnace temperature of the degreasing furnace reaches 650°C, keep the furnace temperature at 650°C for 5 hours;

Step 5: After keeping the furnace temperature at 650°C for 5 hours, cool the furnace temperature of the degreasing furnace from 650°C to room temperature in 18 hours to complete the degreasing process of the ceramic green body.

After the degreasing process of the ceramic green body is completed, the degreased ceramic green body is put into a sintering furnace for sintering, and the step of sintering the degreased ceramic green body in the sintering furnace includes:

Step 1: Heating the temperature in the sintering furnace from room temperature to 600°C takes 23 hours;

The second step: heating the temperature in the sintering furnace from 600°C to 1000°C, it takes 20 hours;

The third step: heating the temperature in the sintering furnace from 1000°C to 1600°C, the time spent is 25 hours;

The fourth step: the temperature in the sintering furnace is lowered from 1600°C to 800°C, which takes 11 hours;

Step 5: Cool the temperature in the sintering furnace from 800°C to room temperature with the furnace to form a ceramic blank.

Step 110: Grinding the ceramic blank to form a ceramic layer.

The ceramic blank meets the quality requirements of the product surface after plane grinding and polishing, and the thickness of the ceramic layer formed after grinding is 0.05mm-0.25mm.

Second, the functional layer

The functional part layer is composed of functional circuits, which are fired from metal paste, including functional modules such as circuits, antenna components and NFC modules. Among them, the circuit is the circuit board of the product, and the antenna component and the NFC module are connected to the inside of the product through holes on the ceramic layer.

The method for bonding the functional circuit to the ceramic layer includes screen printing method, radium engraved plating method, spraying method and 3D printing method, which can be any one of the above methods. In this embodiment, the screen printing method is preferably used to bond the functional circuit on the ceramic layer. The screen printing method has the advantages of high production efficiency, simple preparation process and low production cost.

The metal paste material used in the screen printing method can be aluminum, copper, silver, tin and other metal pastes with a sintering temperature below 1400°C, and can be one or more of the above metal materials. Screen printing The metal paste material used in the method can also be a mixture of one or more of tungsten, molybdenum, palladium, platinum, ruthenium, rhodium, and gold among noble metals with higher melting points, and it can also be sintered at a temperature below 1400°C. The metal paste is made by mixing the metal with the higher melting point of the noble metal.

Only one functional circuit can be bonded on each ceramic layer to realize one function, and different functional circuits can be bonded on different ceramic layers to realize different functions.

3. Adhesive layer

The adhesive layer is one or a combination of laser activated adhesive layer, UV adhesive layer, AB adhesive layer, quick-drying adhesive layer, foam adhesive layer, VHB tape layer, and the thickness of the adhesive layer is 0.03mm～0.25mm .

Here, lamination refers to covering another adhesive layer on one adhesive layer, for example: first, a UV adhesive layer is bonded on the ceramic layer, and then an AB adhesive layer is bonded on the UV adhesive layer. Since the functional ceramic backplane is used in relatively thin electronic products such as mobile phones, considering the overall thickness of the functional ceramic backplane, the overall thickness of the laminated adhesive layer is 0.03mm-0.25mm. The bonding processes of the above-mentioned several kinds of glues are the prior art in this field, so they will not be repeated here.

After the functional circuits are bonded to the ceramic layer, the final functional ceramic backplane can be produced in two ways.

the first way

First, each ceramic layer printed with functional circuits is sintered separately, and then the sintered ceramic layers are bonded together according to a preset sequence to form a ceramic backplane.

In this way, the process of sintering the ceramic layer printed with functional circuits includes the atmosphere protection microwave sintering method and the atmosphere protection furnace sintering method. The atmosphere protection microwave sintering method is to microwave the ceramic layer printed with functional circuits in a microwave sintering furnace. Sintering: In the process of sintering the ceramic layer, a reducing atmosphere or an inert gas protective atmosphere is introduced into the microwave sintering furnace to prevent the functional circuits made of metal materials from being oxidized. For functional circuits made of tungsten, molybdenum, palladium, platinum, ruthenium, rhodium, and gold, the heating time is 3-5 minutes in a microwave sintering furnace, and the heating temperature is 1400°C-1500°C; For functional circuits made of copper or silver, the heating time is 3-5 minutes in a microwave sintering furnace, and the heating temperature is 900°C-1000°C.

The sintering method in the atmosphere protection furnace is to put the ceramic layer printed with functional circuits into the atmosphere furnace, introduce a reducing atmosphere or an inert gas protection atmosphere into the atmosphere furnace, and sinter the ceramic layer at the same time. In the process of sintering the ceramic layer, if the functional circuit is Made of tin, aluminum, copper or silver, the sintering process is as follows: First, heat the temperature of the atmosphere furnace from room temperature to 300°C for 6 hours; then keep it warm for 1 hour, and then heat the furnace temperature from 300°C It took 6 hours to reach 900°C, and then kept the temperature for 0.5 hours. Finally, the furnace temperature was cooled to room temperature along with the furnace.

In the process of sintering the ceramic layer, if the functional circuit is made of tungsten, molybdenum, palladium, platinum, ruthenium, rhodium, gold, the sintering process is as follows: First, heat the temperature of the atmosphere furnace from room temperature to 300°C for 6 hours ; Then keep it warm for 1 hour, after 1 hour of heat preservation, heat the furnace temperature from 300°C to 1500°C for 6 hours, then keep it warm for 1 hour, and finally cool the furnace temperature to room temperature with the furnace;

The atmosphere-protected microwave sintering method and the atmosphere-protected furnace sintering method actually sinter the metal paste to make the metal paste in a molten state to form the conduction of the circuit without affecting the fired ceramic layer.

In the present invention, the atmosphere-protected microwave sintering method is preferably used. The atmosphere-protected furnace sintering method has a slight impact on the performance of the ceramic layer, while the atmosphere-protected microwave sintering method will not have any impact on the performance of the ceramic layer.

the second way

Firstly, all the ceramic layers printed with functional circuits are bonded together according to a preset sequence, and then the bonded ceramic layers are sintered as a whole to form a ceramic backplane.

In this way, since the ceramic layers are bonded together through the adhesive layer, if the atmosphere furnace sintering method is used, the adhesive layer will be melted at high temperature. Therefore, it is not suitable to use the atmosphere furnace sintering method to print ceramic layers with functional circuits. For sintering, only the atmosphere protected microwave sintering method can be used to sinter the ceramic layer printed with functional circuits.

No matter which way is mentioned above, the ceramic layer needs to be bonded, and the sequence of bonding does not affect the functions realized by each functional circuit.

For example, if the circuit is printed on the first ceramic layer, the antenna assembly is printed on the second ceramic layer, and the NFC module is printed on the third ceramic layer, the bonding sequence of the ceramic layer from top to bottom includes the following six types:

The first ceramic layer (the highest layer)→the second ceramic layer (the middle layer)→the third ceramic layer (the bottom layer);

The first ceramic layer → the third ceramic layer → the second ceramic layer;

The second ceramic layer → the first ceramic layer → the third ceramic layer;

The second ceramic layer → the third ceramic layer → the first ceramic layer;

The third ceramic layer→the first ceramic layer→the second ceramic layer;

Third ceramic layer→second ceramic layer→first ceramic layer.

In the process of bonding the various ceramic layers according to the preset order, one side of each ceramic layer is printed with a functional circuit, and an adhesive layer is placed on the edge of the ceramic layer or the vacant part of the non-printed functional circuit. Specifically, the The bottom ceramic layer is bonded with the side of the bonding layer and the side of the ceramic layer of the middle layer that is not provided with the bonding layer, and so on, all the ceramic layers are bonded, and the top ceramic layer is provided with One side of the adhesive layer is bonded to the product.

The functional ceramic backplane provided by the utility model will be further described below with two specific embodiments.

Embodiment one

As shown in Figures 1-3, the ceramic backplane provided by the third embodiment of the present invention includes: a two-layer ceramic structure, the first layer of ceramic structure includes a ceramic layer 11, an adhesive layer 12 and a functional layer 13, and the ceramic layer 11 is an alumina ceramic layer, the functional part layer 13 is a circuit layer, the adhesive layer 12 and the functional part layer 13 are arranged on the same surface of the ceramic layer 11, and the adhesive layer 12 is a foam viscose layer, which is arranged on The edge position on the ceramic layer 11 or the vacant position where the functional part layer 13 is not provided; the second layer of ceramic structure includes a ceramic layer 21, an adhesive layer 22 and a functional part layer 23, and the ceramic layer 21 is also an alumina ceramic layer, and the functional part Layer 23 is the antenna component layer, the antenna component layer is connected to the inside of the product through the hole on the alumina ceramic layer, the adhesive layer 22 and the functional part layer 23 are arranged on the same surface of the ceramic layer 21, and the adhesive layer 22 is also The foam viscose layer is disposed on the edge position on the ceramic layer 21 or the vacant position where the functional component layer 23 is not disposed.

The thicknesses of the ceramic layer 11 and the ceramic layer 21 are 0.5 mm and 0.2 mm respectively, the thicknesses of the circuit layer and the antenna assembly layer are both 0.03 mm, and the heights of the two foam viscose layers are both 0.1 mm.

The ceramic layer 11 is bonded to the side of the ceramic layer 21 that is not provided with the adhesive layer 21 through the adhesive layer 12 to realize the combination of the first layer ceramic structure and the second layer ceramic structure to form a functional ceramic backplane, and the ceramic layer 21 is provided with bonding One side of layer 22 is bonded to the interior of the product.

The total thickness of the formed ceramic backplane is 0.75mm, and the first layer of ceramic structure is used as the appearance surface of the functional ceramic backplane, and the second layer of ceramic structure is used as the inner surface connected with the interior of the product.

Embodiment two

As shown in Figures 4-6, the ceramic backplane provided by the third embodiment of the present invention includes: a three-layer ceramic structure, the first layer of ceramic structure includes a ceramic layer 110, an adhesive layer 120 and a functional layer 130, and the ceramic layer 110 is a zirconia ceramic layer, the functional part layer 130 is a circuit layer, the adhesive layer 120 and the functional part layer 130 are arranged on the same surface of the ceramic layer 110, and the adhesive layer 120 is a laser glue layer, which is arranged on the ceramic layer 110 or the vacant position where the functional layer 130 is not provided; the second ceramic structure includes a ceramic layer 210, an adhesive layer 220 and a functional layer 230, the ceramic layer 210 is also a zirconia ceramic layer, and the functional layer 230 It is the antenna component layer, the antenna component layer is connected to the inside of the product through the hole on the zirconia ceramic layer, the adhesive layer 220 and the functional part layer 230 are arranged on the same surface of the ceramic layer 210, and the adhesive layer 220 is also laser glue Layer, which is arranged on the edge position on the ceramic layer 210 or the vacant position where the functional layer 230 is not provided; the third layer of ceramic structure includes a ceramic layer 310, an adhesive layer 320 and a functional layer 330, and the ceramic layer 310 is also zirconia The ceramic layer, the functional part layer 330 is the NFC module layer, the NFC module layer is connected to the inside of the product through the holes on the zirconia ceramic layer, the adhesive layer 320 and the functional part layer 330 are arranged on the same surface of the ceramic layer 310, and the adhesive The bonding layer 320 is also a laser adhesive layer, which is arranged at the edge position on the ceramic layer 310 or at a vacant position where the functional layer 330 is not provided

The thicknesses of ceramic layer 110, ceramic layer 210 and ceramic layer 310 are 0.3mm, 0.1mm and 0.1mm respectively, the thicknesses of circuit layer, antenna component layer and NFC module layer are all 0.03mm, and the heights of the three laser adhesive layers are 0.05mm, the width is 0.5mm, the ceramic layer 110 is bonded to the side of the ceramic layer 210 not provided with the bonding layer 220 through the bonding layer 120, and the side of the ceramic layer 210 provided with the bonding layer 220 is bonded to the ceramic layer 310 not provided with the bonding layer 220. One side of the bonding layer 320 is bonded, and the ceramic layer 310 is provided with one side of the bonding layer 320 for internal bonding to realize the combination of the first layer of ceramic structure, the second layer of ceramic structure, and the third layer of ceramic structure to form a functional ceramic backplane, forming The total thickness of the ceramic backplane is 0.56mm, and the first layer of ceramic structure is used as the appearance surface of the functional ceramic backplane.

The above is only a specific embodiment of the present utility model, but the scope of protection of the present utility model is not limited thereto. Anyone familiar with the technical field can easily think of changes or changes within the technical scope disclosed by the utility model Replacement should be covered within the protection scope of the present utility model. Therefore, the protection scope of the present utility model should be based on the protection scope of the claims.

Claims (4)

1. a kind of function ceramics backboard, including：At least two-layer ceramic structure, every layer of ceramic structure include ceramic layer, adhesive linkage and Functor layer；Wherein, the functor layer is arranged on the same face of the ceramic layer with the adhesive linkage, and the adhesive linkage It is arranged on the ceramic layer and is located at the position at edge or is not provided with the vacant position of the functor layer；And,

One layer of ceramic structure be provided with tack coat when the while bonding connection that adhesive linkage is not provided with another layer of ceramic structure.

2. function ceramics backboard as claimed in claim 1, wherein, the ceramic layer is zirconia ceramic layer, aluminium oxide ceramics One kind in layer, silicon nitride ceramics layer, boron carbide ceramics layer, silicon oxide ceramics layer, the thickness of the ceramic layer be 0.05mm～ 0.25mm。

3. function ceramics backboard as claimed in claim 1, wherein, the functor layer include circuit layer, antenna module layer and NFC module layer.

4. function ceramics backboard as claimed in claim 1, wherein, the adhesive linkage is laser activation glue-line, UV glue-lines, AB glue One or several stacking in layer, quick-drying glue-line, foam glue-line, VHB adhesive tape layers, the thickness of the adhesive linkage be 0.03mm～ 0.25mm。