CN206148438U - Crystalline silicon solar cell based on siNiOx heterojunction - Google Patents
Crystalline silicon solar cell based on siNiOx heterojunction Download PDFInfo
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- CN206148438U CN206148438U CN201621054524.XU CN201621054524U CN206148438U CN 206148438 U CN206148438 U CN 206148438U CN 201621054524 U CN201621054524 U CN 201621054524U CN 206148438 U CN206148438 U CN 206148438U
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- 229910021419 crystalline silicon Inorganic materials 0.000 title claims abstract description 27
- 230000005684 electric field Effects 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 8
- 238000002161 passivation Methods 0.000 claims description 7
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- 229910003087 TiOx Inorganic materials 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- HLLICFJUWSZHRJ-UHFFFAOYSA-N tioxidazole Chemical compound CCCOC1=CC=C2N=C(NC(=O)OC)SC2=C1 HLLICFJUWSZHRJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000006096 absorbing agent Substances 0.000 claims 2
- 238000006243 chemical reaction Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000002360 preparation method Methods 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 3
- 229910002026 crystalline silica Inorganic materials 0.000 abstract 3
- 235000012239 silicon dioxide Nutrition 0.000 abstract 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 17
- 229910052710 silicon Inorganic materials 0.000 description 17
- 239000010703 silicon Substances 0.000 description 17
- 239000000969 carrier Substances 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 8
- 238000005215 recombination Methods 0.000 description 6
- 230000006798 recombination Effects 0.000 description 6
- 229910005855 NiOx Inorganic materials 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000005036 potential barrier Methods 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 229910000314 transition metal oxide Inorganic materials 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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Abstract
Description
技术领域technical field
本实用新型属于太阳电池领域,也属于半导体器件领域,涉及硅太阳电池的结构。The utility model belongs to the field of solar cells, also belongs to the field of semiconductor devices, and relates to the structure of silicon solar cells.
背景技术Background technique
硅在地球上储量丰富,且硅的光学带隙与太阳光谱较为匹配,是制备太阳电池的理想材料之一。由于硅材料的提纯技术以及硅半导体器件的制备技术比较成熟,晶体硅太阳电池占据了当前太阳电池总产量的大部分份额。然而,随着工艺的进步,基于同质结结构的晶体硅太阳电池其光电转换效率已逐渐逼近极限。而异质结太阳电池可以充分利用两种不同半导体之间功函数和能带位置的差异,可以在不减小短路电流的情况下提高太阳电池的开路电压,从而提高太阳电池的光电转换效率。因此,基于异质结的晶体硅太阳电池有望在未来获得光电转换效率的进一步提升。Silicon is abundant on the earth, and its optical band gap matches the solar spectrum, so it is one of the ideal materials for preparing solar cells. Since the purification technology of silicon materials and the preparation technology of silicon semiconductor devices are relatively mature, crystalline silicon solar cells account for most of the current total output of solar cells. However, with the advancement of technology, the photoelectric conversion efficiency of crystalline silicon solar cells based on homojunction structure has gradually approached the limit. The heterojunction solar cell can make full use of the difference in work function and energy band position between two different semiconductors, and can increase the open circuit voltage of the solar cell without reducing the short-circuit current, thereby improving the photoelectric conversion efficiency of the solar cell. Therefore, crystalline silicon solar cells based on heterojunctions are expected to further improve the photoelectric conversion efficiency in the future.
为提高太阳电池的转换效率,必须尽可能地降低太阳电池内部光生载流子的复合。而在异质结太阳电池中,由于构成异质结的两种半导体材料晶格常数存在差异,异质结界面处往往存在缺陷态而导致光生载流子在异质结界面处大量复合。因此,在异质结太阳电池的设计中,必须采取措施抑制界面复合。In order to improve the conversion efficiency of solar cells, the recombination of photogenerated carriers inside solar cells must be reduced as much as possible. In heterojunction solar cells, due to the difference in the lattice constants of the two semiconductor materials that constitute the heterojunction, defect states often exist at the heterojunction interface, resulting in a large number of recombination of photogenerated carriers at the heterojunction interface. Therefore, in the design of heterojunction solar cells, measures must be taken to suppress interfacial recombination.
在异质结太阳电池中,选择性接触的使用被认为是减少界面复合的有效措施之一。所谓选择性接触,是利用形成异质结的半导体材料之间导带和价带位置的差异或者半导体内部的能带弯曲,在异质结界面形成对少数载流子的势垒。在所形成的势垒的影响下,少数载流子向选择性接触的输运被阻止但多数载流子的输运却不受影响。因此,少数载流子被阻止靠近界面态,从而抑制其与多数载流子经表面缺陷态形成复合。同时,异质结界面处形成的对少数载流子的势垒可以有效减小暗电流,提高开路电压。另一方面,对多数载流子而言,由于其传输并未受到显著影响,因此短路电流密度并不会减小。In heterojunction solar cells, the use of selective contacts is considered to be one of the effective measures to reduce interfacial recombination. The so-called selective contact is to use the difference in the conduction band and valence band position between the semiconductor materials forming the heterojunction or the energy band bending inside the semiconductor to form a barrier to minority carriers at the heterojunction interface. Under the influence of the formed potential barrier, the transport of minority carriers to the selective contact is blocked but the transport of majority carriers is not affected. Thus, minority carriers are prevented from approaching the interface states, thereby inhibiting their recombination with majority carriers via surface defect states. At the same time, the barrier to minority carriers formed at the heterojunction interface can effectively reduce the dark current and increase the open circuit voltage. On the other hand, for majority carriers, the short-circuit current density does not decrease since their transport is not significantly affected.
实用新型内容Utility model content
本实用新型的目的是提出一种基于Si/NiOx异质结的晶体硅太阳电池。The purpose of the utility model is to propose a crystalline silicon solar cell based on Si/ NiOx heterojunction.
本实用新型是通过以下技术方案实现的。The utility model is achieved through the following technical solutions.
本实用新型所述的一种基于Si/NiOx异质结的晶体硅太阳电池,包括前电极、NiOx层、晶体硅吸收层、背电场、背电极。其结构从迎光面开始依次为:前电极、NiOx层、晶体硅吸收层、背电场、背电极。A crystalline silicon solar cell based on a Si/NiO x heterojunction described in the utility model includes a front electrode, a NiO x layer, a crystalline silicon absorption layer, a back electric field, and a back electrode. Its structure starts from the light-facing surface in order: front electrode, NiO x layer, crystalline silicon absorption layer, back electric field, and back electrode.
所述的NiOx层为p型掺杂。The NiO x layer is p-type doped.
所述的晶体硅吸收层为n型或p型掺杂。The crystalline silicon absorbing layer is n-type or p-type doped.
所述的背电场使用但不限于以下三种形式:n型掺杂层加氮化硅钝化层,或者本征非晶硅钝化层加n型非晶硅重掺杂层,或者n型掺杂的TiOx层。The back electric field uses but is not limited to the following three forms: n-type doped layer plus silicon nitride passivation layer, or intrinsic amorphous silicon passivation layer plus n-type amorphous silicon heavily doped layer, or n-type Doped TiOx layer.
所述的前电极包含透明导电层和金属栅状电极。The front electrode includes a transparent conductive layer and a metal grid electrode.
所述的背电极包含透明导电层和金属栅状电极,或仅包含金属栅状电极。The back electrode includes a transparent conductive layer and a metal grid electrode, or only includes a metal grid electrode.
本实用新型使用p型掺杂的NiOx与晶体硅形成异质结并将其应用于太阳电池中。NiOx是一种过渡金属氧化物半导体,光学带隙约为3eV。NiOx的电子亲和能较小(约为-2.1eV),因此其导带往往高于其他半导体材料的导带,可作为对空穴的选择性接触材料应用在钙钛矿太阳电池中。与硅相比,NiOx的导带位置远高于硅的导带位置(~2eV),而价带位置略低于硅的价带位置(<0.3eV)。因此,若p型掺杂的NiOx与硅形成异质结,导带在异质结界面处的势垒差可阻止光生电子靠近异质结界面。价带在界面处虽然也会形成对空穴的势垒,但由于势垒能量较小,不会对光生空穴的传输产生显著影响。而且,界面处价带的势垒差会使硅在靠近异质结界面处的价带产生弯曲,有利于开路电压的提高。The utility model uses p-type doped NiO x to form a heterojunction with crystalline silicon and applies it to solar cells. NiOx is a transition metal oxide semiconductor with an optical bandgap of about 3eV. The electron affinity of NiO x is small (about -2.1eV), so its conduction band is often higher than that of other semiconductor materials, and it can be used as a selective contact material for holes in perovskite solar cells. Compared with silicon, the conduction band position of NiOx is much higher than that of silicon (~2eV), while the valence band position is slightly lower than that of silicon (<0.3eV). Therefore, if p-type doped NiO x forms a heterojunction with silicon, the barrier difference of the conduction band at the heterojunction interface can prevent photogenerated electrons from approaching the heterojunction interface. Although the valence band will also form a potential barrier to holes at the interface, due to the small barrier energy, it will not have a significant impact on the transport of photogenerated holes. Moreover, the barrier difference of the valence band at the interface will bend the valence band of silicon near the heterojunction interface, which is beneficial to the improvement of the open circuit voltage.
本实用新型所提出的Si/NiOx异质结太阳电池可使用不同的背电场,如由扩散工艺制备的n型硅掺杂层,或本征非晶硅钝化层和n型非晶硅重掺杂层,或n型掺杂的TiOx层。多种形式的背电场可充分利用现有的晶体硅太阳电池生产设备,避免对设备的重复投资。另外,本实用新型所提出的晶体硅异质结太阳电池为双面进光结构,可充分利用太阳光资源,提高光伏组件实际发电量。The Si/NiO x heterojunction solar cell proposed by the utility model can use different back electric fields, such as an n-type silicon doped layer prepared by a diffusion process, or an intrinsic amorphous silicon passivation layer and an n-type amorphous silicon heavily doped layer, or n-type doped TiOx layer. Various forms of back electric field can make full use of existing crystalline silicon solar cell production equipment, avoiding repeated investment in equipment. In addition, the crystalline silicon heterojunction solar cell proposed by the utility model has a double-sided light-incoming structure, which can make full use of sunlight resources and increase the actual power generation of photovoltaic modules.
本实用新型所提出的基于Si/NiOx异质结的晶体硅太阳电池,可以有效降低太阳电池内部光生载流子的复合,从而提高其光电转换效率。本实用新型所提出的晶体硅异质结电池的背电场结构可以充分利用已有晶体硅太阳电池生产设备进行生产,减少了设备方面的投入。另外,本实用新型所提出的晶体硅异质结电池采用双面进光结构,可更充分的利用太阳光,增加光伏组件实际发电量。The crystalline silicon solar cell based on the Si/ NiOx heterojunction proposed by the utility model can effectively reduce the recombination of photogenerated carriers inside the solar cell, thereby improving its photoelectric conversion efficiency. The back electric field structure of the crystalline silicon heterojunction cell proposed by the utility model can fully utilize the existing crystalline silicon solar cell production equipment for production, reducing investment in equipment. In addition, the crystalline silicon heterojunction cell proposed by the utility model adopts a double-sided light-incoming structure, which can make full use of sunlight and increase the actual power generation of photovoltaic modules.
附图说明Description of drawings
附图1为本实用新型的太阳电池结构示意图。Accompanying drawing 1 is the structure diagram of the solar cell of the present utility model.
具体实施方式detailed description
本实用新型将通过以下实施例作进一步说明。The utility model will be further illustrated by the following examples.
实施例1。Example 1.
(1)对硅片进行初步清洗,双面制绒。(1) Preliminary cleaning of silicon wafers, double-sided texturing.
(2)使用扩散工艺制备背面n型掺杂层。(2) Prepare the back n-type doped layer by using a diffusion process.
(3)背面沉积氮化硅或氧化铝钝化层,随后制备栅状Ag电极。(3) Deposit a silicon nitride or aluminum oxide passivation layer on the back, and then prepare a grid-shaped Ag electrode.
(4)对硅片正面进行二次清洗。(4) Perform secondary cleaning on the front side of the silicon wafer.
(5)在硅片正面使用原子层沉积制备NiOx层。(5) The NiO x layer was prepared on the front side of the silicon wafer using atomic layer deposition.
(6)沉积ITO透明导电层和Ag金属栅线,制备前电极。(6) Deposit the ITO transparent conductive layer and the Ag metal grid line to prepare the front electrode.
实施例2。Example 2.
(1)对硅片进行初步清洗,双面制绒。(1) Preliminary cleaning of silicon wafers, double-sided texturing.
(2)用氢氟酸去掉硅片表面氧化层,使用等离子增强化学气相沉积制备非晶硅钝化层和n型重掺杂非晶硅发射极。(2) Use hydrofluoric acid to remove the oxide layer on the surface of the silicon wafer, and use plasma-enhanced chemical vapor deposition to prepare an amorphous silicon passivation layer and an n-type heavily doped amorphous silicon emitter.
(3)沉积ITO作为透明导电层,沉积Ag金属栅线,制备背电极。(3) Deposit ITO as a transparent conductive layer, deposit Ag metal grid lines, and prepare the back electrode.
(4)硅片反转,使用化学气相沉积制备NiOx层。(4) The silicon wafer was reversed, and the NiO x layer was prepared by chemical vapor deposition.
(5)沉积ITO作为透明导电层,沉积Ag金属栅线,制备前电极。(5) Deposit ITO as a transparent conductive layer, deposit Ag metal grid lines, and prepare front electrodes.
实施例3。Example 3.
(1)对硅片进行初步清洗,双面制绒。(1) Preliminary cleaning of silicon wafers, double-sided texturing.
(2)使用蒸发工艺沉积NiOx层。(2) The NiOx layer is deposited using an evaporation process.
(3)沉积AZO作为透明导电层,沉积Cu金属栅线,制备前电极。(3) Deposit AZO as a transparent conductive layer, deposit Cu metal grid lines, and prepare front electrodes.
(4)硅片发转,使用原子层沉积制备TiOx层。(4) The silicon wafer is transferred, and the TiO x layer is prepared by atomic layer deposition.
(5)沉积ITO透明导电层和Ag金属栅线,制备背电极。(5) Deposit the ITO transparent conductive layer and the Ag metal grid line to prepare the back electrode.
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CN110444611A (en) * | 2019-07-09 | 2019-11-12 | 浙江师范大学 | A kind of solar battery and preparation method thereof of oxide passivation contact |
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