CN206098798U - Connector - Google Patents
Connector Download PDFInfo
- Publication number
- CN206098798U CN206098798U CN201620926957.3U CN201620926957U CN206098798U CN 206098798 U CN206098798 U CN 206098798U CN 201620926957 U CN201620926957 U CN 201620926957U CN 206098798 U CN206098798 U CN 206098798U
- Authority
- CN
- China
- Prior art keywords
- connector
- solder
- solder ball
- conductive terminal
- insulating body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Abstract
本实用新型公开一种连接器,包括:绝缘本体;导电端子,被保持在所述绝缘本体中;和焊球,焊接到对应的导电端子上。所述导电端子包括固定部、焊接垫和将所述焊接垫连接至所述固定部的、朝下弯曲的连接根部,在所述焊接垫的顶面上形成有一个凹坑,所述焊球适于被定位和焊接在所述凹坑中。所述导电端子还包括连接至所述焊接垫的、朝下弯曲的自由端部。在本实用新型中,当定位在凹坑中的焊球呈熔融的液态时,导电端子的连接根部和自由端部会从焊球的两侧同时朝相反的方向拉扯焊球,使得焊球的中心更趋向导电端子的凹坑的中心,从而提高了焊球在连接器上的位置精度。
The utility model discloses a connector, which comprises: an insulating body; conductive terminals held in the insulating body; and solder balls welded to the corresponding conductive terminals. The conductive terminal includes a fixing part, a welding pad, and a connecting root part that connects the welding pad to the fixing part and bends downward. A pit is formed on the top surface of the welding pad, and the solder ball Adapted to be positioned and welded in said pocket. The conductive terminal also includes a downwardly bent free end connected to the solder pad. In the present invention, when the solder ball positioned in the pit is in a molten liquid state, the connection root and the free end of the conductive terminal will pull the solder ball from both sides of the solder ball in opposite directions at the same time, so that the center of the solder ball More towards the center of the dimple of the conductive terminal, thus improving the positional accuracy of the solder ball on the connector.
Description
技术领域technical field
本实用新型涉及一种连接器,尤其涉及一种球栅阵列连接器。The utility model relates to a connector, in particular to a ball grid array connector.
背景技术Background technique
在现有技术中,球栅阵列(Ball Grid Array,BGA)连接器一般包括一个绝缘本体、保持在该绝缘本体中的多个导电端子和分别焊接在多个导电端子上的多个焊球(通常为锡球)。在现有技术中,每个导电端子包括固定在绝缘本体中的固定部、焊接垫和将该焊接垫连接至固定部的连接根部。通常,焊接垫沿水平方向延伸,固定部沿竖直方向延伸,连接根部为一个连接过渡段,其从焊接垫朝下弯曲并延伸至固定部。In the prior art, a Ball Grid Array (BGA) connector generally includes an insulating body, a plurality of conductive terminals held in the insulating body, and a plurality of solder balls ( usually solder balls). In the prior art, each conductive terminal includes a fixing part fixed in the insulating body, a welding pad and a connecting root part connecting the welding pad to the fixing part. Usually, the welding pad extends along the horizontal direction, the fixing part extends along the vertical direction, and the connection root is a connecting transition section, which bends downward from the welding pad and extends to the fixing part.
在现有技术中,在焊接垫的顶面上形成有一个凹坑,焊球适于被定位和焊接在凹坑中。在现有技术中,一般采用热熔融的方式将焊球焊接到焊接垫的凹坑中。首先,需要将固态的焊球放置到焊接垫的凹坑中,然后,加热焊球使之熔融并与焊接垫热熔接(请注意,焊球的熔点要远远低于导电端子的熔点),最后,焊球冷却固化。In the prior art, a dimple is formed on the top surface of the solder pad, and the solder ball is adapted to be positioned and soldered in the dimple. In the prior art, the solder balls are generally welded into the pits of the solder pads by thermal melting. First, it is necessary to place solid solder balls into the pits of the solder pads, then heat the solder balls to melt and fuse with the solder pads (please note that the melting point of the solder balls is much lower than that of the conductive terminals), Finally, the solder balls cool and solidify.
但是,在现有技术中,当定位在焊接垫的凹坑中的焊球呈熔融的液态时,前述连接根部会向焊球施加表面张力,导致焊球被向根部拉扯,这会导致液态的焊球整体上会偏向连接根部,从而导致焊球的中心偏移焊接垫的凹坑的中心,降低了焊球在连接器上的位置精度。However, in the prior art, when the solder balls positioned in the dimples of the solder pads are in a molten liquid state, the aforementioned connection roots will apply surface tension to the solder balls, causing the solder balls to be pulled toward the roots, which will result in a liquid state. The solder ball will be biased towards the connection root as a whole, so that the center of the solder ball will deviate from the center of the crater of the solder pad, reducing the accuracy of the position of the solder ball on the connector.
实用新型内容Utility model content
本实用新型的目的旨在解决现有技术中存在的上述问题和缺陷的至少一个方面。The purpose of this utility model is to solve at least one aspect of the above-mentioned problems and defects existing in the prior art.
根据本实用新型的一个方面,提供一种连接器,包括:绝缘本体;导电端子,被保持在所述绝缘本体中;和焊球,焊接到对应的导电端子上。所述导电端子包括固定部、焊接垫和将所述焊接垫连接至所述固定部的、朝下弯曲的连接根部,在所述焊接垫的顶面上形成有一个凹坑,所述焊球适于被定位和焊接在所述凹坑中。所述导电端子还包括连接至所述焊接垫的、朝下弯曲的自由端部。According to one aspect of the present invention, there is provided a connector, comprising: an insulating body; conductive terminals held in the insulating body; and solder balls soldered to corresponding conductive terminals. The conductive terminal includes a fixing part, a welding pad, and a connecting root part that connects the welding pad to the fixing part and bends downward. A pit is formed on the top surface of the welding pad, and the solder ball Adapted to be positioned and welded in said pocket. The conductive terminal also includes a downwardly bent free end connected to the solder pad.
根据本实用新型的一个实施例,所述自由端部的尺寸和朝下弯曲的角度被设置成:当定位在所述凹坑中的所述焊球呈熔融的液态时,所述自由端部向所述焊球施加的表面张力与所述连接根部向所述焊球施加的表面张力大小相同但方向相反,以便使所述焊球的中心位于所述凹坑的中心。According to an embodiment of the present invention, the size and the downward bending angle of the free end are set such that when the solder ball positioned in the dimple is in a molten liquid state, the free end The surface tension applied to the solder ball is the same in magnitude but opposite in direction to the surface tension applied to the solder ball by the connection root, so that the center of the solder ball is located at the center of the pit.
根据本实用新型的另一个实施例,所述自由端部和所述连接根部对称地设置在所述焊接垫的两侧。According to another embodiment of the present invention, the free end portion and the connection root portion are symmetrically arranged on two sides of the welding pad.
根据本实用新型的另一个实施例,所述焊接垫沿水平方向延伸,并且所述焊接垫的顶面从所述绝缘本体的顶部外露出。According to another embodiment of the present invention, the welding pads extend along the horizontal direction, and the top surfaces of the welding pads are exposed from the top of the insulating body.
根据本实用新型的另一个实施例,所述固定部沿竖直方向延伸,并且固定在所述绝缘本体中。According to another embodiment of the present invention, the fixing part extends along the vertical direction and is fixed in the insulating body.
根据本实用新型的另一个实施例,所述导电端子还包括弹性臂,所述弹性臂连接至所述固定部的下端,并在所述弹性臂的末端上形成有弹性接触部。According to another embodiment of the present invention, the conductive terminal further includes an elastic arm, the elastic arm is connected to the lower end of the fixing part, and an elastic contact part is formed on the end of the elastic arm.
根据本实用新型的另一个实施例,所述弹性臂从所述固定部倾斜向下延伸,并且所述弹性臂的弹性接触部从所述绝缘本体的底部外露出。According to another embodiment of the present invention, the elastic arm extends obliquely downward from the fixing portion, and the elastic contact portion of the elastic arm is exposed from the bottom of the insulating body.
根据本实用新型的另一个实施例,所述连接器包括多个所述导电端子和多个所述焊球,多个所述焊球分别焊接在多个所述导电端子的焊接垫的凹坑中。According to another embodiment of the present invention, the connector includes a plurality of conductive terminals and a plurality of solder balls, and the plurality of solder balls are welded to the pits of the solder pads of the plurality of conductive terminals respectively. middle.
根据本实用新型的另一个实施例,所述连接器为球栅阵列连接器,所述球栅阵列连接器上的多个所述焊球呈阵列分布。According to another embodiment of the present invention, the connector is a ball grid array connector, and the plurality of solder balls on the ball grid array connector are distributed in an array.
在根据本实用新型的前述各个实施例中,当定位在凹坑中的焊球呈熔融的液态时,导电端子的连接根部和自由端部会从焊球的两侧同时朝相反的方向拉扯焊球,使得焊球的中心更趋向导电端子的凹坑的中心,从而提高了焊球在连接器上的位置精度。In each of the foregoing embodiments according to the present invention, when the solder ball positioned in the dimple is in a molten liquid state, the connection root and the free end of the conductive terminal pull the solder ball from both sides of the solder ball in opposite directions simultaneously. , so that the center of the solder ball is closer to the center of the pit of the conductive terminal, thereby improving the position accuracy of the solder ball on the connector.
通过下文中参照附图对本实用新型所作的描述,本实用新型的其它目的和优点将显而易见,并可帮助对本实用新型有全面的理解。Through the following description of the utility model with reference to the accompanying drawings, other purposes and advantages of the utility model will be apparent, and can help to have a comprehensive understanding of the utility model.
附图说明Description of drawings
图1显示根据本实用新型的一个实施例的连接器的局部剖视图;Fig. 1 shows a partial sectional view of a connector according to an embodiment of the present invention;
图2显示图1所示的连接器的一个导电端子的立体示意图;和Fig. 2 shows a schematic perspective view of a conductive terminal of the connector shown in Fig. 1; and
图3显示图1所示的连接器的一个导电端子和一个对应的焊球的立体示意图。FIG. 3 shows a perspective view of a conductive terminal and a corresponding solder ball of the connector shown in FIG. 1 .
具体实施方式detailed description
下面通过实施例,并结合附图,对本实用新型的技术方案作进一步具体的说明。在说明书中,相同或相似的附图标号指示相同或相似的部件。下述参照附图对本实用新型实施方式的说明旨在对本实用新型的总体实用新型构思进行解释,而不应当理解为对本实用新型的一种限制。The technical solutions of the present utility model will be further specifically described below through the embodiments and in conjunction with the accompanying drawings. In the specification, the same or similar reference numerals designate the same or similar components. The following descriptions of the embodiments of the utility model with reference to the accompanying drawings are intended to explain the overall utility model concept of the utility model, and should not be construed as a limitation of the utility model.
另外,在下面的详细描述中,为便于解释,阐述了许多具体的细节以提供对本披露实施例的全面理解。然而明显地,一个或多个实施例在没有这些具体细节的情况下也可以被实施。在其他情况下,公知的结构和装置以图示的方式体现以简化附图。In addition, in the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a comprehensive understanding of the embodiments of the present disclosure. It may be evident, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are shown in diagrammatic form to simplify the drawings.
根据本实用新型的一个总体技术构思,提供一种连接器,包括:绝缘本体;导电端子,被保持在所述绝缘本体中;和焊球,焊接到对应的导电端子上。所述导电端子包括固定部、焊接垫和将所述焊接垫连接至所述固定部的、朝下弯曲的连接根部,在所述焊接垫的顶面上形成有一个凹坑,所述焊球适于被定位和焊接在所述凹坑中。所述导电端子还包括连接至所述焊接垫的、朝下弯曲的自由端部。According to a general technical concept of the present invention, a connector is provided, comprising: an insulating body; conductive terminals held in the insulating body; and solder balls welded to corresponding conductive terminals. The conductive terminal includes a fixing part, a welding pad, and a connecting root part that connects the welding pad to the fixing part and bends downward. A pit is formed on the top surface of the welding pad, and the solder ball Adapted to be positioned and welded in said pocket. The conductive terminal also includes a downwardly bent free end connected to the solder pad.
图1显示根据本实用新型的一个实施例的连接器的局部剖视图;图2显示图1所示的连接器的一个导电端子100的立体示意图;和图3显示图1所示的连接器的一个导电端子100和一个对应的焊球200的立体示意图。Fig. 1 shows a partial sectional view of a connector according to an embodiment of the present utility model; Fig. 2 shows a schematic perspective view of a conductive terminal 100 of the connector shown in Fig. 1; and Fig. 3 shows one of the connector shown in Fig. 1 A three-dimensional schematic diagram of a conductive terminal 100 and a corresponding solder ball 200 .
如图1、图2和图3所示,在图示的实施例中,该连接器主要包括:绝缘本体300、导电端子100和焊球200。导电端子100被保持在绝缘本体300中。焊球200焊接到对应的导电端子100上。As shown in FIG. 1 , FIG. 2 and FIG. 3 , in the illustrated embodiment, the connector mainly includes: an insulating body 300 , conductive terminals 100 and solder balls 200 . The conductive terminal 100 is held in the insulating body 300 . Solder balls 200 are soldered to corresponding conductive terminals 100 .
如图1、图2和图3所示,在图示的实施例中,导电端子100包括固定部130、焊接垫110和将焊接垫110连接至固定部130的、朝下弯曲的连接根部111。在焊接垫110的顶面上形成有一个凹坑113,焊球200适于被定位和焊接在凹坑113中。As shown in FIGS. 1 , 2 and 3 , in the illustrated embodiment, the conductive terminal 100 includes a fixing portion 130 , a soldering pad 110 and a downwardly bent connection root 111 connecting the soldering pad 110 to the fixing portion 130 . A dimple 113 is formed on the top surface of the solder pad 110 , and the solder ball 200 is adapted to be positioned and soldered in the dimple 113 .
在本实用新型的一个实施例中,如图1、图2和图3所示,导电端子100还包括连接至焊接垫110的、朝下弯曲的自由端部112。这样,在将焊球200热熔焊到导电端子100的焊接垫110上的过程中,当定位在凹坑113中的焊球200呈熔融的液态时,导电端子100的连接根部111和自由端部112会从焊球200的两侧同时朝相反的方向拉扯焊球200,使得焊球200的中心更趋向导电端子100的凹坑113的中心,从而提高了焊球200在连接器上的位置精度。In one embodiment of the present invention, as shown in FIG. 1 , FIG. 2 and FIG. 3 , the conductive terminal 100 further includes a free end portion 112 bent downwards connected to the welding pad 110 . In this way, in the process of soldering the solder ball 200 to the welding pad 110 of the conductive terminal 100, when the solder ball 200 positioned in the recess 113 is in a molten liquid state, the connection root 111 and the free end of the conductive terminal 100 The portion 112 will pull the solder ball 200 from both sides of the solder ball 200 in opposite directions at the same time, so that the center of the solder ball 200 is closer to the center of the recess 113 of the conductive terminal 100, thereby improving the position of the solder ball 200 on the connector. precision.
在本实用新型的一个实施例中,可以通过调节自由端部112的尺寸和朝下弯曲的角度使得焊接后焊球200的中心位于导电端子100的凹坑113的中心。In one embodiment of the present invention, the center of the solder ball 200 after soldering can be located at the center of the crater 113 of the conductive terminal 100 by adjusting the size of the free end 112 and the downward bending angle.
在本实用新型的一个实施例中,导电端子100的自由端部112的尺寸和朝下弯曲的角度被设置成:当定位在凹坑113中的焊球200呈熔融的液态时,自由端部112向焊球200施加的表面张力与连接根部111向焊球200施加的表面张力大小相同但方向相反,以便使焊球200的中心位于凹坑113的中心。In one embodiment of the present invention, the size and the downward bending angle of the free end 112 of the conductive terminal 100 are set such that when the solder ball 200 positioned in the dimple 113 is in a molten liquid state, the free end The surface tension applied by 112 to the solder ball 200 is the same in magnitude but opposite to the surface tension applied by the root portion 111 to the solder ball 200 , so that the center of the solder ball 200 is located at the center of the pit 113 .
在本实用新型的一个实施例中,如图1、图2和图3所示,自由端部112和连接根部111对称地设置在焊接垫110的两侧。这样,当定位在凹坑113中的焊球200呈熔融的液态时,自由端部112向焊球200施加的表面张力与连接根部111向焊球200施加的表面张力大小相同但方向相反,从而可以使焊球200的中心精确地位于凹坑113的中心。In one embodiment of the present invention, as shown in FIG. 1 , FIG. 2 and FIG. 3 , the free end portion 112 and the connecting root portion 111 are symmetrically arranged on both sides of the welding pad 110 . In this way, when the solder ball 200 positioned in the crater 113 is in a molten liquid state, the surface tension applied to the solder ball 200 by the free end 112 is the same in magnitude but opposite to the surface tension applied by the connection root 111 to the solder ball 200, thereby The center of the solder ball 200 can be precisely located at the center of the dimple 113 .
如图1、图2和图3所示,在图示的实施例中,焊接垫110沿水平方向延伸,并且焊接垫110的顶面从绝缘本体300的顶部外露出。As shown in FIG. 1 , FIG. 2 and FIG. 3 , in the illustrated embodiment, the soldering pad 110 extends along the horizontal direction, and the top surface of the soldering pad 110 is exposed from the top of the insulating body 300 .
如图1、图2和图3所示,在图示的实施例中,固定部130沿竖直方向延伸,并且固定在绝缘本体300中。As shown in FIG. 1 , FIG. 2 and FIG. 3 , in the illustrated embodiment, the fixing portion 130 extends vertically and is fixed in the insulating housing 300 .
如图1、图2和图3所示,在图示的实施例中,导电端子100还包括弹性臂120,弹性臂120连接至固定部130的下端,并在弹性臂120的末端上形成有弹性接触部121。As shown in FIGS. 1 , 2 and 3 , in the illustrated embodiment, the conductive terminal 100 further includes an elastic arm 120 , the elastic arm 120 is connected to the lower end of the fixing portion 130 , and formed on the end of the elastic arm 120 The elastic contact part 121 .
如图1、图2和图3所示,在图示的实施例中,弹性臂120从固定部130倾斜向下延伸,并且弹性臂120的弹性接触部121从绝缘本体300的底部外露出。As shown in FIG. 1 , FIG. 2 and FIG. 3 , in the illustrated embodiment, the elastic arm 120 extends obliquely downward from the fixing portion 130 , and the elastic contact portion 121 of the elastic arm 120 is exposed from the bottom of the insulating housing 300 .
如图1、图2和图3所示,在图示的实施例中,连接器包括多个导电端子100和多个焊球200,多个焊球200分别焊接在多个导电端子100的焊接垫110的凹坑113中。As shown in Fig. 1, Fig. 2 and Fig. 3, in the illustrated embodiment, the connector includes a plurality of conductive terminals 100 and a plurality of solder balls 200, and a plurality of solder balls 200 are respectively welded on the solder joints of the plurality of conductive terminals 100. In the dimple 113 of the pad 110.
如图1、图2和图3所示,在图示的实施例中,连接器为球栅阵列连接器,该球栅阵列连接器上的多个焊球200呈阵列分布。但是,请注意,本实用新型的连接器不局限于图示的球栅阵列连接器,也可以为具有焊球的其他类型的连接器。As shown in FIG. 1 , FIG. 2 and FIG. 3 , in the illustrated embodiment, the connector is a ball grid array connector, and a plurality of solder balls 200 on the ball grid array connector are distributed in an array. However, please note that the connector of the present invention is not limited to the BGA connector shown in the figure, and may also be other types of connectors with solder balls.
本领域的技术人员可以理解,上面所描述的实施例都是示例性的,并且本领域的技术人员可以对其进行改进,各种实施例中所描述的结构在不发生结构或者原理方面的冲突的情况下可以进行自由组合。Those skilled in the art can understand that the above-described embodiments are exemplary, and those skilled in the art can improve them, and the structures described in various embodiments do not conflict with each other in terms of structure or principle Can be combined freely.
虽然结合附图对本实用新型进行了说明,但是附图中公开的实施例旨在对本实用新型优选实施方式进行示例性说明,而不能理解为对本实用新型的一种限制。Although the utility model has been described in conjunction with the drawings, the embodiments disclosed in the drawings are intended to illustrate the preferred implementation of the utility model, and should not be construed as a limitation of the utility model.
虽然本总体实用新型构思的一些实施例已被显示和说明,本领域普通技术人员将理解,在不背离本总体实用新型构思的原则和精神的情况下,可对这些实施例做出改变,本实用新型的范围以权利要求和它们的等同物限定。While certain embodiments of the present general inventive concept have been shown and described, those of ordinary skill in the art will appreciate that changes may be made to these embodiments without departing from the principles and spirit of the present general inventive concept, the present invention The scope of the utility model is defined by the claims and their equivalents.
应注意,措词“包括”不排除其它元件或步骤,措词“一”或“一个”不排除多个。另外,权利要求的任何元件标号不应理解为限制本实用新型的范围。It should be noted that the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. Additionally, any element references in the claims should not be construed as limiting the scope of the present invention.
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620926957.3U CN206098798U (en) | 2016-08-23 | 2016-08-23 | Connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620926957.3U CN206098798U (en) | 2016-08-23 | 2016-08-23 | Connector |
Publications (1)
Publication Number | Publication Date |
---|---|
CN206098798U true CN206098798U (en) | 2017-04-12 |
Family
ID=58468955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201620926957.3U Expired - Fee Related CN206098798U (en) | 2016-08-23 | 2016-08-23 | Connector |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN206098798U (en) |
-
2016
- 2016-08-23 CN CN201620926957.3U patent/CN206098798U/en not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6290382B2 (en) | Rigid-flexible circuit interconnect | |
US9082766B2 (en) | Method to enhance reliability of through mold via TMVA part on part POP devices | |
JP5040746B2 (en) | Electronic component and manufacturing method thereof | |
JP2015170725A (en) | composite substrate | |
CN107978668A (en) | The method of the conductor wire of LED component, LED light and processing LED component | |
JP2011171427A (en) | Laminated semiconductor device | |
JP5078683B2 (en) | Printed circuit board and surface mount device mounting structure | |
TW200428702A (en) | Surface mounted socket assembly | |
CN206098798U (en) | Connector | |
TW201330203A (en) | Package structure and method of forming same | |
TWM307885U (en) | Electrical contact | |
JP5699610B2 (en) | MOUNTING STRUCTURE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE | |
CN108364920A (en) | Flip-chip assembly, flip-chip packaging structure and manufacturing method | |
WO2019105075A1 (en) | Led device, led light and method for processing conductor wire of led device | |
TWM444621U (en) | Electrical connector | |
CN104363698B (en) | The row leaded package and encapsulation design method and wiring board of wiring board | |
JP3168987B2 (en) | Mounting structure of surface mount type semiconductor device | |
CN2916984Y (en) | electrical connector terminal | |
CN204167284U (en) | Lay-flat thermistor with tripod | |
CN102355979B (en) | Contact with tubular solder member | |
CN203589005U (en) | Recessed welding point package | |
JPH08316619A (en) | Printed wiring board and its manufacture | |
CN204391096U (en) | Flip-chip packaged structure | |
CN222261422U (en) | Welding structure for improving reliability of connector | |
CN201112711Y (en) | electrical connector terminal |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170412 |