CN206040618U - Photosensitive assembly and module of making a video recording - Google Patents
Photosensitive assembly and module of making a video recording Download PDFInfo
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- CN206040618U CN206040618U CN201620590779.1U CN201620590779U CN206040618U CN 206040618 U CN206040618 U CN 206040618U CN 201620590779 U CN201620590779 U CN 201620590779U CN 206040618 U CN206040618 U CN 206040618U
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- wiring board
- sensitive chip
- photosensory assembly
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- board main
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Abstract
A photosensitive assembly and module of making a video recording, wherein photosensitive assembly includes: a circuit board main part, a sense optical chip and a connecting media, wherein it passes through to feel optical chip connecting media attached in the circuit board main part, just connecting media with sense optical chip's shape phase -match, so that feel optical chip levelly and smoothly connect in the circuit board main part.
Description
Technical field
This utility model is related to camera module field, further, is related to a photosensory assembly and camera module and its manufacture
Method.
Background technology
The concordance of optical axis is a key factor for affecting camera module image quality, and the concordance of optical axis is mainly
Refer to that the central axis of sensitive chip is coaxial with the primary optical axis of camera lens, therefore D/A (attaching of Die/Attach chips) technique is to take the photograph
As an important procedure in module group assembling, manufacture process.
It is chip and wiring board during tradition is imaged after D/A techniques with reference to Figure 1A and 1B.In traditional camera module, lead to
It is often that a chip 1P is pasted on a wiring board 2P, that is, D/A processes, i.e. first by spy in PCB surface 2P
Setting shape coating thermosetting conducting resinl or insulating cement, is such as drawn a little or cross or X-type in mode for dispensing glue, then will be described
Chip 1P is attached on the wiring board 2P.Glue is spread out by the push action during attaching, so as to adhere to the core
Piece 1P.Glue dries solidification is carried out finally by heated baking so that the chip 1P is fixed on the wiring board 2P surfaces.
Significantly can recognize from here, due to, during stickup, being coated with colloid 3P on the wiring board 2P,
So that the two combines by way of subsequently pressing the chip 1P, it is thus impossible to be coated with too many glue on the wiring board 2P
Body 3P, overflows wiring board side with anti-extrusion, pollutes the wiring board 2P or described chip 1P, that is to say, that this process
The amount and shape of colloid 3P is all difficult to be controlled.Reservation shape is typically pressed, less amount of colloid 3P is coated with, to ensure colloid not
The chip 1P edges can be overflowed.Make a reservation for and less colloid 3P on the wiring board 2P, the result of bonding is in the core
There is a suspension area 4P in the marginal area relative with the wiring board 2P of piece 1P, and generally surrounding is the suspension area 4P.
The presence of hanging region 4P, it is easy to so that tilt phenomenon occurs in the chip 1P, such as described chip 1P and the wiring board
There is an angle theta ° in 2P, as shown in fig. 1b, on the other hand, the colloid 3P skewness after pressing, flatness are poor, than
If error is at 20 μm or so, these situations can all affect the concordance of system optical axis, affect the image quality of camera module.
In addition, the bonding less stable of the chip 1P and the wiring board 2P of such bonding, that is to say, that the chip 1P is easy to
Depart from the wiring board 2P in the presence of external force, reliability is poor.
Further, reference picture 1C, MOC (Molding On Chip, be molded into chip) technique is the one kind that grows up in the recent period
Important chip packaging technology, the main flow of this technique are the chip 1P to be attached at the wiring board 2P first, then
Beat gold thread 5P, mold then support 6P in the wiring board 2P and chip 1P, by the edge of the chip 1P with
The join domain of the wiring board 2P carries out molded packages.In this technical process, carry out molding and form the molding support
During 6P, the marginal area of the chip 1P can be subject to the pressing of mould to act on, and the chip 1P by traditional D/A techniques
There is the suspension area 4P and the wiring board 2P between, this pressing is easy to so that tilt problem occurs in the chip 1P,
The chip 1P edges broken is caused due to the uneven of stress even.Therefore in order to ensure preferable light axis consistency and core
The reliability of piece, on the one hand needs the chip and the wiring board bonding smooth, on the other hand for the pressing of moulding technology
Process Precision wants which higher, but these can not still be fully solved traditional D/A techniques and bring possible light to camera module
Axle is inconsistent, parsing is bad, curve abnormality, motor CODE abnormal the problems such as.
Utility model content
A purpose of the present utility model is to provide a photosensory assembly and camera module and its manufacture method, described photosensitive
Component includes a sensitive chip and a wiring board main body, and the sensitive chip is connected to the wiring board master by a connection medium
Body, and the connection medium and the sensitive chip mating shapes.
A purpose of the present utility model is to provide a photosensory assembly and camera module and its manufacture method, described photosensitive
Between chip and the circuit, region is filled up completely with by the connection medium, there is no hanging region, so as to improve the sense
The flatness of optical chip, reduces the tilt phenomenon for the relatively described wiring board main body of the sensitive chip occur.
A purpose of the present utility model is to provide a photosensory assembly and camera module and its manufacture method, described photosensitive
Chip has a front and a back side, when the photosensory assembly is manufactured, can spray the company at the sensitive chip back side
Medium is connect, and cuts off the unnecessary connection medium so that the mating shapes of the connection medium and the sensitive chip.
A purpose of the present utility model is to provide a photosensory assembly and camera module and its manufacture method, in manufacture institute
When stating photosensory assembly, apply the connection medium by way of rolling in the back side of the sensitive chip, and cut off unnecessary
The connection medium so that the connection medium is entirely attached at the sensitive chip back side, it is ensured that the sensitive chip and
The bonding planarization of the wiring board main body.
A purpose of the present utility model is to provide a photosensory assembly and camera module and its manufacture method, the connection
Medium includes a wiring board film, and the wiring board film is attached at the wiring board main body, the wiring board film and the photosensitive core
Plate shape matches.
A purpose of the present utility model is to provide a photosensory assembly and camera module and its manufacture method, wherein in system
When making the photosensory assembly, the connection medium can be set in a justifying chip back, then imposite chip is cut
Multiple individually sensitive chips are formed, multiple sensitive chips are attached at the corresponding wiring board master by progressive one respectively
Body, suitable batch metaplasia are produced, and shorten the assembling man-hour of the photosensory assembly, are lifted chip and are attached production efficiency.
A purpose of the present utility model is to provide a photosensory assembly and camera module and its manufacture method, wherein described
Photosensory assembly includes moulding bodies, is shaped in the wiring board and the sensitive chip, and the chip is entirely attached at
The wiring board main body, so that when the moulding bodies are formed, the sensitive chip will not be caused to produce inclination, to ensure
The concordance of camera module optical axis.
For other purposes realizing above utility model and of the present utility model and advantage, a side of the present utility model
Face provides a photosensory assembly, and which includes a wiring board main body, a sensitive chip and a connection medium, and the sensitive chip passes through institute
State connection medium and be attached at the wiring board main body, and the connection medium and the sensitive chip mating shapes, so that
The sensitive chip is entirely connected to the wiring board main body.
According to an embodiment of the present utility model, the photosensory assembly includes an at least connecting line, and the connection that can be powered is described
Sensitive chip and the wiring board main body.
According to an embodiment of the present utility model, connecting line described in described photosensory assembly is combination：Gold thread, silver wire,
One of which in copper cash and aluminum steel.
According to an embodiment of the present utility model, described photosensory assembly includes moulding bodies, the moulding bodies one into
Type is in the sensitive chip and the wiring board main body.
According to an embodiment of the present utility model, described photosensory assembly includes an at least component, protrudes from described
Wiring board main body, and coated by the moulding bodies.
According to an embodiment of the present utility model, connect medium described in described photosensory assembly by combination：Spraying, rotation
A kind of mode in painting, round brush, printing and attaching puts on a back side of the sensitive chip.
According to an embodiment of the present utility model, connect medium described in described photosensory assembly by combination：Spray, scrape
A kind of mode in glue, wiper and printing puts on the wiring board main body.
According to an embodiment of the present utility model, connect medium described in described photosensory assembly for combination：UV glued membranes, heat
One of which in solid glue film and UV thermosetting glued membranes.
Another aspect of the present utility model provides a camera module, and which includes described photosensory assembly and a camera lens；Wherein
The camera lens is located on the photosensitive path of the photosensory assembly.
According to an embodiment of the present utility model, the camera module includes a motor, and the camera lens is installed in described
Motor.
According to an embodiment of the present utility model, the camera module includes an optical filter, and the optical filter is located at described
The photosensitive path of photosensory assembly.
According to an embodiment of the present utility model, the camera module includes a support, and the support is installed in described
Photosensory assembly.
Another aspect of the present utility model provides a photosensory assembly manufacture method, and which includes step：
(A) one semi-solid connection medium of attachment is in the back side of a sensitive chip；
(B) sensitive chip is attached in a wiring board main body by the connection medium；
(C) solidify the connection medium so that the sensitive chip and the wiring board main body are smooth, be stably connected with；With
(D) arrange an at least connecting line in the sensitive chip and the wiring board main body so that the sensitive chip and
The wiring board main body can be powered connection.
According to an embodiment of the present utility model, described in the manufacture method of described photosensory assembly, step (A) includes step
Suddenly：
The attachment connection medium is in the back side of a wafer；
Adhere to a cutting film in the outside of the connection medium
Connect medium described in semi-solid preparation；With
The wafer is cut, is obtained with the sensitive chip for connecting medium described in semisolid.
According to an embodiment of the present utility model, step (A) described in described photosensory assembly includes step：
The attachment connection medium is in a cutting film；
Connect medium described in semi-solid preparation；
The attachment connection medium is in a wafer；With
The chip wafer is cut, is obtained with the sensitive chip for connecting medium described in the semisolid.
According to an embodiment of the present utility model, step (B) described in described photosensory assembly includes step：Cleaning is described
Sensitive chip.
According to an embodiment of the present utility model, adhering mode described in described photosensory assembly is combination：Spraying, rotation
One way in which in painting, round brush, printing and attaching.
According to an embodiment of the present utility model, semi-solid preparation process described in described photosensory assembly can pass through ultraviolet photograph
Penetrate or mode of heating is realized.
According to an embodiment of the present utility model, the curing mode in step (C) described in described photosensory assembly can be with
For combination：One or more of which in pressing, heating and baking.
According to an embodiment of the present utility model, the set-up mode in step (D) described in described photosensory assembly is to beat
The mode of gold thread.
According to an embodiment of the present utility model, connect medium described in described photosensory assembly for combination：UV glued membranes, heat
One of which in solid glue film or UV thermosetting glued membranes.
Another aspect of the present utility model provides the manufacture method of a photosensory assembly, and which includes step：
A () adheres to the connection medium of a reservation shape in a wiring board main body；
B () attaches the sensitive chip in a wiring board main body by the connection medium；
C () solidifies connected medium so that the sensitive chip and the wiring board main body are smooth, be stably connected with；With
(d) arrange an at least connecting line in the sensitive chip and the wiring board main body so that the sensitive chip and
The wiring board main body can be powered connection.
According to an embodiment of the present utility model, step (a) described in described photosensory assembly includes step：
The attachment connection medium is in the wiring board main body；With
Connect medium described in semi-solid preparation.
According to an embodiment of the present utility model, semi-solid preparation process described in described photosensory assembly can pass through ultraviolet photograph
Penetrate or mode of heating is realized.
According to an embodiment of the present utility model, the mode adhered to described in described photosensory assembly is combination：Spray, scrape
One of which in glue, wiper, printing and attaching.
According to an embodiment of the present utility model, the curing mode described in described photosensory assembly in step (c) can be with
For combination：One or more of which in pressing, heating and baking.
According to an embodiment of the present utility model, the set-up mode described in described photosensory assembly in step (d) is to beat
The mode of gold thread.
Description of the drawings
Figure 1A, 1B, 1C are the chips and wiring board of traditional D/A techniques assembling.
Fig. 2 is the photosensory assembly cross-sectional schematic according to first preferred embodiment of the present utility model.
Fig. 3 is photosensory assembly the first the manufacture process schematic diagram according to first preferred embodiment of the present utility model.
Fig. 4 is photosensory assembly the first the manufacture method block diagram according to first preferred embodiment of the present utility model.
Fig. 5 is the second manufacture process schematic diagram of photosensory assembly according to first preferred embodiment of the present utility model.
Fig. 6 is the second manufacture method block diagram of photosensory assembly according to first preferred embodiment of the present utility model.
Fig. 7 A are photosensory assembly the third manufacture process schematic diagrams according to first preferred embodiment of the present utility model.
Fig. 7 B are that the 4th kind of manufacture process of the photosensory assembly according to first preferred embodiment of the present utility model is illustrated
Figure.
Fig. 8 is the third manufacture method block diagram of the photosensory assembly according to first preferred embodiment of the present utility model.
Fig. 9 is the camera module section view of the application photosensory assembly according to first preferred embodiment of the present utility model
Schematic diagram.
Figure 10 is the photosensory assembly cross-sectional schematic according to second preferred embodiment of the present utility model.
Figure 11 is that the camera module of the application photosensory assembly according to second preferred embodiment of the present utility model is cutd open
Depending on schematic diagram.
Specific embodiment
Hereinafter describe for disclosing this utility model so that those skilled in the art can realize this utility model.Hereinafter retouch
Preferred embodiment in stating is only used as citing, it may occur to persons skilled in the art that other obvious modifications.Retouch following
The ultimate principle of the present utility model defined in stating can apply to other embodiments, deformation program, improvement project, etc. Tongfang
Case and the other technologies scheme without departing from spirit and scope of the present utility model.
It will be understood by those skilled in the art that in exposure of the present utility model, term " longitudinal direction ", " horizontal ", " on ",
The orientation of the instruction such as D score, "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outward " or position are closed
System is that, based on orientation shown in the drawings or position relationship, which is for only for ease of description this utility model and simplifies description, and not
Be indicate or imply indication device or element must have specific orientation, with specific azimuth configuration and operation, therefore on
Term is stated it is not intended that to restriction of the present utility model.
As shown in Figures 1 to 9, it is according to the photosensory assembly of first preferred embodiment of the present utility model and shooting mould
Group.The photosensory assembly 10 includes a wiring board main body 11, a sensitive chip 12 and a connection medium 13.
The sensitive chip 12 is attached at the wiring board main body 11 by the connection medium 13.
The sensitive chip 12 has a front 121 and a back side 122.The front 121 towards outside, i.e., with the line
The opposite direction of road plate main body 11, the front 121 are used for photosensitive.The back side 122 towards 11 direction of wiring board main body,
The connection medium 13 is arranged between the back side 122 of the sensitive chip 12 and the wiring board main body 11, by institute
State sensitive chip 12 and be fixed on the wiring board main body 11.
It is noted that the shape of the connection medium 13 and the sensitive chip 12 match, so that described
Sensitive chip 12 stably, is entirely attached at the wiring board main body 11.The institute that mode is obtained is attached different from traditional D/A
The wiring board of chip is stated, from the foregoing it will be appreciated that with reference to Figure 1A, 1B, the chip 1P that traditional D/A modes are obtained and described
, generally there is the hanging region 4P between the wiring board 2P and the chip 1P so that the chip 1P in wiring board 2P
Bonding is unstable, planarization is poor, and easily occurs inclining.And according to preferred embodiment of the present utility model, the connection is situated between
Matter 13 is distributed evenly between the sensitive chip 12 and the wiring board main body 11 so that 12 back side of the sensitive chip
Region between 122 and the wiring board main body 11 is fully filled by the connection medium 13, improves the connection medium
, there is no the hanging region in 13 area coverage, so that the sensitive chip 12 is smooth, be stably connected to the line
Road plate main body 11.
According to this embodiment of the present utility model, specifically, the connection medium 13 is UV glued membranes, thermosetting glued membrane or UV
One of which in thermosetting glued membrane.
According to this embodiment of the present utility model, the photosensory assembly 10 includes an at least connecting line 14, each company
Wiring 14 electrically connects the sensitive chip 12 and the wiring board main body 11.The connecting line 14 can be, citing ground but not limit
In gold thread, silver wire, copper cash, aluminum steel.That is, causing the sensitive chip 12 and the line by each connecting line 14
11 electric signal communication of road plate main body, when the sensitive chip 12 carries out photosensitive, converts light signals into the signal of telecommunication, by connection
The signal of telecommunication described in line 14 is transferred to the wiring board main body 11.
With reference to shown in Fig. 3 and Fig. 4, the first manufacture process of the photosensory assembly 10 is illustrated.In this manufacture method,
When the photosensory assembly 10 is manufactured, first adhere to one layer of connection medium at the back side 122 of the sensitive chip 12
13 so that the connection medium 13 is attached at the back side 122 of the sensitive chip 12.Wherein described adhering mode can be led to
Cross the modes such as spraying, spin coating, round brush or printing to realize.The connection medium 13 can be UV glued membranes, thermosetting glued membrane or UV thermosettings
One of which in glued membrane.
And then by way of UV or thermosetting mode cause it is described connection medium 13 be in semi-cured state so that the company
The shape for connecing medium 13 is difficult change.UV modes, i.e. ultra-vioket radiation mode.The mode of thermosetting, that is, the mode being heating and curing.
It is noted that when the sensitive chip 12 is obtained, typically carrying out cutting to a wafer 130 and obtaining
Arrive, therefore, in order to carry out cutting technique, need to attach a cutting film 140 on the connection medium 13, further, to carrying
The wafer 130 of the connection medium 13 and the cutting film 140 is cut so that the wafer 130 forms many
The individual sensitive chip 12, that is to say, that wafer 130 described in cutting by way of cutting so that the connection medium 13
It is consistent with the shape of the sensitive chip 12.
Further, the cutting film 140 is removed, the sensitive chip 12 with the connection medium 13 is attached at
The wiring board main body 11, that is to say, that by the medium 13 that connects by the sensitive chip 12 and the wiring board main body
11 are connected to a fixed, and the connection medium 13 are solidified by pressing, heating or baking process, so that institute
State sensitive chip 12 to be stably connected with the wiring board main body 11.Especially, in an embodiment of the present utility model, described
Before sensitive chip 12 is attached at the wiring board main body 11, also include the cleaning step to the sensitive chip 12, i.e. cleaning
The sensitive chip 12, removes the dust being infected with the sensitive chip 12.
Further, each connecting line 14 is set in the sensitive chip 12 and the wiring board main body 11 so that described
Sensitive chip 12 and the wiring board main body 11 can be powered connection.Such as, by W/B (Wired/Bond, chip bonding) technique,
Gold thread is beaten on the sensitive chip 12 and the wiring board main body 11.
It is noted that in traditional D/A modes, generally dispensing is carried out on the wiring board 2P surfaces, then by institute
State chip 1P and be placed directly in dispensing region, by the effect for pressing so that glue extends, therefore the shape of colloid 3P has pole
Big uncertainty, that is to say, that possible skewness, and it is wayward.And according to preferred embodiment of the present utility model,
The connection medium 13 is attached at the back side 122 of the sensitive chip 12, and causes uniform point of the connection medium 13
The back side 122 of the sensitive chip 12 is distributed in, in the form of continuous surface, rather than the form of discrete point or line segment is deposited
, it is ensured that the connection planarization of the sensitive chip 12 and the wiring board main body 11.Further, the sensitive chip 12 is in patch
Before investing the wiring board main body 11, in the form of semisolid, own form is relative to be determined, therefore when described photosensitive
When chip 12 is attached at the wiring board main body 11 by the connection medium 13, the change of shape of the connection medium 13 compared with
It is little, less is affected on the connection planarization of the sensitive chip 12 and the wiring board, such as the sensitive chip 12 is smooth
Degree can reach 2 μm.Additionally, according to preferred embodiment of the present utility model, improving 13 pairs, the medium of the connection photosensitive core
The area coverage at the back side 122 of piece 12, it is to avoid the suspension area 4P around occur, therefore reduce what W/B operations chip was damaged
Risk, that is to say, that, it is easier to the connecting line 14 is set in the sensitive chip 12 and the wiring board main body 11.
Correspondingly, this utility model provides the manufacture method 1000 of a photosensory assembly, and which includes step：
1100：Adhere to a semi-solid connection medium 13 in the back side 122 of a sensitive chip 12：
1200：The sensitive chip 12 is attached in a wiring board main body 11 by the connection medium 13；
1300：The solidification connection medium 13 so that the sensitive chip 12 and the wiring board main body 11 are smooth, stable
Connection；With
1400：An at least connecting line 14 is set in the sensitive chip 12 and the wiring board main body 11 so that the sense
Optical chip 12 and the wiring board main body 11 can be powered connection.
Wherein described step 1100 can further be decomposed into：
1110：The attachment connection medium 13 is in the back side 122 of a wafer 130；
1120：Adhere to a cutting film 140 in the outside of the connection medium 13；
1130：Connect medium 13 described in semi-solid preparation；With
1140：The wafer 130 is cut, is obtained with the sensitive chip 12 for connecting medium 13 described in semisolid.
The step 1110,1120,1130 and 1140 are suitably applied photosensory assembly 10 described in mass production, when independent
When the sensitive chip 12 being provided and being used for manufacturing the photosensory assembly 10, can be at the back side of the sensitive chip 12
The 122 attachments connection medium 13, then carries out semi-solid preparation to the connection medium 13, further, by the sensitive chip 12
The wiring board main body 11 is attached at by the connection medium 13.That is, the cutting film 140 and described cutting
Journey is not necessary to the step of performing.
Adhering mode in the step 1110, can be the one of which in spraying, spin coating, round brush or printing.Institute
It is the one of which in UV glued membranes, thermosetting glued membrane or UV thermosetting glued membranes to state connection medium 13.
Semi-solid preparation process in the step 1130 can be realized by modes such as ultra-vioket radiation, heating.
The step 1200 includes step 1210：Clean the sensitive chip 12.
Curing mode in the step 1300, can be the modes such as pressing, heating or baking.
Set-up mode in the step 1400 is the mode for beating gold thread.
It is noted that the manufacture method of the photosensory assembly of the present utility model 10 is suitable to mass production, such as
Adhere to the connection medium 13 in 122 entirety of the back side of the wafer 130, and then the wafer 130 is carried out into wafer and cut
Cut, obtain multiple sensitive chips 12, and then each sensitive chip 12 is attached at into each wiring board main body 11 respectively,
So as to once form multiple photosensory assemblies 10, improve production efficiency.Different from traditional mode, independent dispensing is needed, it is single
Solely bonding, less efficient.
With reference to shown in Fig. 5 and Fig. 6, second manufacture method of the photosensory assembly 10.In this manufacture method, in system
It is when making the photosensory assembly 10, first to adhere to one layer of connection medium 13 in cutting film 140, and to the connection medium 13
Carry out semi-solid preparation.The mode of the attachment can be the modes such as spraying, spin coating, round brush or printing, and the connection medium 13 is UV
One of which in glued membrane, thermosetting glued membrane or UV thermosetting glued membranes.Especially, connected medium 13 is shaped as reservation shape, than
Shape such as with the matching of the sensitive chip 12.
During generally producing, the acquisition pattern of the sensitive chip 12 is typically cut to the wafer 130
And obtain, therefore the cutting film 140 with the connection medium 13 is attached at into the wafer 130, then to described
Wafer 130 carries out cutting, and so as to obtain the single sensitive chip 12, and the sensitive chip 12 carries semi-solid institute
State connection medium 13.
That is, the connection medium 13 being attached at described in the wafer 130 by the cutting film 140
The back side 122 so that the connection medium 13 is connected to the back side 122 of sensitive chip 12.Especially, can be by rolling
The chip is attached at mode the back side 122 of the wafer 130.
It is noted that after the connection medium 13 is attached to the cutting film 140, needing to the connection
Medium 13 carries out semi-solid preparation, by way of UV or heat fixation, such as cause the connection medium 13 to cause institute in semi-cured state
The shape for stating connection medium 13 is difficult change.UV modes, i.e. ultra-vioket radiation mode.The mode of thermosetting, that is, the mode being heating and curing.
Further, the sensitive chip 12 with the connection medium 13 is attached at into the wiring board main body 11,
That is, the sensitive chip 12 and the wiring board main body 11 are connected to a fixed by the connection medium 13, and are led to
Cross pressing, heating or baking process so that it is described connection medium 13 solidified so that the sensitive chip 12 with it is described
Wiring board main body 11 is stably connected with.Especially, in an embodiment of the present utility model, institute is attached in the sensitive chip 12
Before stating wiring board main body 11, also include the cleaning step to the sensitive chip 12, remove
Dust.
Further, each connecting line 14 is set in the sensitive chip 12 and the wiring board main body 11 so that described
Sensitive chip 12 and the wiring board main body 11 can be powered connection.
Correspondingly, this utility model provides the manufacture method 2000 of a photosensory assembly, and which includes step：
2100：Adhere to a semi-solid connection medium 13 in the back side 122 of a sensitive chip 12：
2200：The sensitive chip 12 is attached in a wiring board main body 11 by the connection medium 13；
2300：The connected medium of solidification 13 so that the sensitive chip 12 and the wiring board main body 11 are smooth, stably
Connection；With
2400：An at least connecting line 14 is set in the sensitive chip 12 and the wiring board main body 11 so that the sense
Optical chip 12 and the wiring board main body 11 can be powered connection.
Wherein described step 2100 can further be decomposed into：
2110：The attachment connection medium 13 is in a cutting film 140；
2120：Connect medium 13 described in semi-solid preparation；
2130：The attachment connection medium 13 is in a wafer 130；With
2140：The chip wafer is cut, is obtained with the sensitive chip for connecting medium 13 described in the semisolid
12。
The step 2110,2120,2130 and 2140 are suitably applied photosensory assembly 10 described in mass production.
Adhering mode in the step 2110, can be the one of which in spraying, spin coating, round brush or printing.Institute
The adhering mode in step 2120 is stated, can be the mode of rolling.
The connection medium 13 is the one of which in UV glued membranes, thermosetting glued membrane or UV thermosetting glued membranes.
Semi-solid preparation process in the step 2120 can be realized by modes such as ultra-vioket radiation, heating.
The step 2200 includes step：Clean the sensitive chip 12.
Curing mode in the step 2300, can be the modes such as pressing, heating or baking.
Set-up mode in the step 2400 is the mode for beating gold thread.
Shown in reference picture 7A and Fig. 8, the third manufacture process of the photosensory assembly 10 is illustrated.In this manufacture method
In, when the photosensory assembly 10 is manufactured, first adhere to the connection medium 13 in the wiring board main body 11 so that institute's circuit
Plate main body 11 provides connectable position.
According to this embodiment of the present utility model, the connection medium 13 is carried out into semi-solid preparation, such as by the side of UV
It is in semi-cured state that the mode of formula or thermosetting causes the connection medium 13 so that the shape of the connection medium 13 is not variable
Change.UV modes, i.e. ultra-vioket radiation mode.The mode of thermosetting, that is, the mode being heating and curing.
And in another embodiment of the present utility model, semi-solid preparation process can not be carried out, that is to say, that in this side
In method, the semi-solid preparation it is not necessary to the step of.
And then the sensitive chip 12 is attached at into the wiring board main body 11, finally the connection medium 13 is carried out solid
Change, form stable, the smooth photosensory assembly 10.The connection medium 13 can be with UV glued membranes, thermosetting glued membrane or UV hot-setting adhesives
One of which in film.
It is noted that in this manufacture process, the adhering mode of the connection medium 13 can be by spraying, scraping
The modes such as glue, wiper or printing are realized, so as to the position of the corresponding sensitive chip 12 in the wiring board main body 11 is formed
One layer be uniformly distributed, with certain thickness thin film, it is as the bonding agent of D/A pasters and solid to the connection medium 13 half
Change, the sensitive chip 12 is attached at into the wiring board main body 11 then, by pressing, pressing or baking process is heated by institute
State sensitive chip 12 and wiring board main body 11 is stablized, is reliably connected.Different from traditional dispensing bonding way, improve in this method
The area coverage of the connection medium 13 so that be not in outstanding between the sensitive chip 12 and the wiring board main body 11
Dummy section, improves planarization.And be attached between the wiring board main body 11 in the sensitive chip 12, to the connection medium
13 carry out semi-solid preparation so that the shape of the connection medium 13 is relatively stable, and not malleable, so as to subsequently will be described photosensitive
Chip 12 is attached at the wiring board main body 11 when carrying out pressing, heating pressing or the technical process such as toast, the connection medium
13 deformation two is less, so as to ensure the connection planarization of the sensitive chip 12 and the wiring board main body 11.
Further, each connecting line 14 is set in the sensitive chip 12 and the wiring board main body 11 so that described
Sensitive chip 12 and the wiring board main body 11 can be powered connection.Such as, by W/B (Wired/Bond chip bondings) technique,
Gold thread is beaten on the sensitive chip 12 and the wiring board main body 11.
Reference picture 7B, is the 4th kind of manufacture process of photosensory assembly according to a preferred embodiment of the invention.In this system
Make in method, when the photosensory assembly 10 is manufactured, first adhere to the connection medium 13 in the wiring board main body 11 so that
Institute wiring board main body 11 provides connectable position.And different above-mentioned the third manufacture process, in this manufacture process, institute
It is by way of attaching to be attached to the wiring board main body 11 to state connection medium 13.Such as, in 11 table of wiring board main body
Face precalculated position attaches the two-sided glued membrane of reservation shape, and shape and the sensitive chip 12 of the two-sided glued membrane match, from
And cause the sensitive chip 12 it is smooth, be seamlessly attached at the wiring board main body 11.
Further, in one embodiment, after the connection medium 13 is attached, precuring institute can be irradiated by UV
Connection medium 13 is stated, and the sensitive chip 12 is then attached to the connection medium 13, then the connection medium 13 is entered
Row thermosetting so that the sensitive chip 12 and the wiring board main body 11 are stably connected with.That is, in this fashion, institute
State connection medium 13 to choose the material with UV curing performances and carry out bonding.
In another embodiment, after attaching the connection medium 13, can not carry out connecting described in UV irradiation precuring
Medium 13 being connect, but the sensitive chip 12 directly being attached to the connection medium 13, then the connection medium 13 is entered
Row thermosetting so that the sensitive chip 12 and the wiring board main body 11 are stably connected with.That is, in this fashion, institute
Stating connection medium 13 and can choosing does not carry out bonding with the material of UV curing performances.
Correspondingly, according to above two manufacture process of the present utility model, this utility model provides a photosensory assembly 10
Manufacture method 3000, which includes step：
3100：Adhere to the connection medium 13 of a reservation shape in a wiring board main body 11；
3200：The sensitive chip 12 is attached in a wiring board main body 11 by the connection medium 13；
3300：The connected medium of solidification 13 so that the sensitive chip 12 and the wiring board main body 11 are smooth, stably connect
Connect；With
3400：An at least connecting line 14 is set in the sensitive chip 12 and the wiring board main body 11 so that the sense
Optical chip 12 and the wiring board main body 11 can be powered connection.
Wherein described step 3100 can further be decomposed into：
3110：The attachment connection medium 13 is in the wiring board main body 11；With
3120：Connect medium 13 described in semi-solid preparation.
Adhering mode in the step 3110, can spray, frictioning, wiper, the one of which in printing and attaching.
The connection medium 13 is the one of which in UV glued membranes, thermosetting glued membrane or UV thermosetting glued membranes.And the reservation shape with it is described
The mating shapes of sensitive chip 12, so that the sensitive chip 12 is entirely attached at the wiring board main body 11, no
The suspension area 4P occurs.And passing through semi-solid preparation process so that the shape of connection medium 13 is relatively fixed, and is not likely to produce change
Change.It is noted that the semi-solid preparation process it is not necessary to the step of, that is to say, that in other embodiments, Ke Yizhi
The coating connection medium 13 corresponding with the sensitive chip 12 is connect, bonding is then carried out.
Curing mode in the step 3300, can be the modes such as pressing, heating or baking.
Set-up mode in the step 3400 is the mode for beating gold thread.
It is the camera module according to first preferred embodiment of the present utility model with reference to Fig. 9.The camera module includes
Photosensory assembly 10, a support 20, an optical filter 30, a camera lens 40 and a motor 50 described in one.The support 20 is installed in institute
Photosensory assembly 10 is stated, the optical filter 30 is installed in the support 20, positioned at the sensitive chip of the photosensory assembly 10
On 12 photosensitive path, the camera lens 40 is installed in the motor 50, in order to adjust the shooting by the motor 50
The focal length of module, the motor 50 by by being installed on the support 20 so that the camera lens 40 is located at the sensitive chip 12
Photosensitive path on.
It is noted that application of the photosensory assembly 10 in the camera module so that the sensitive chip 12 has
There is preferable flatness, so as to be easier to adjust the sensitive chip 12 and the optical filter 30 and 40 optical axis of the camera lens
Concordance, so that the camera module has more preferable image quality, solves the camera module and goes out in test process
Existing parsing is bad, curve abnormality, the problems such as motor 50CODE is abnormal.
It is noted that in this embodiment of the present utility model, being said by taking dynamic Jiao camera module AFM as an example
It is bright, and in other embodiment of the present utility model, the camera module can also be and focus module FF, that is to say, that do not wrap
The motor 50 is included, those skilled in the art is not it should be appreciated that the concrete shape of the camera module and type are
Restriction of the present utility model.
As shown in Figure 10 and Figure 11, it is according to the photosensory assembly 10 of second preferred embodiment of the present utility model and shooting
Module.Different from above preferred embodiment, the photosensory assembly 10 includes moulding bodies 15,15 one of the moulding bodies into
The type ground wiring board main body 11 and the sensitive chip 12.
It is noted that in traditional D/A modes, due to the marginal zone that the chip and the wiring board connect
Domain, it will usually the hanging region occur, forms the moulding bodies 15 so as to after D/A techniques are carried out, carry out molding, needs
The edge of the chip is pressed by mould, therefore, because the presence in the hanging region, it is easy to so that the sense
Optical chip 12 occurs inclining or damages, and so as to be unfavorable for the formation of the moulding bodies 15, and is unfavorable for assembling the camera module.
And according to this embodiment of this utility model, the sensitive chip 12 is entirely connected to institute by the connection medium 13
Wiring board main body 11 is stated, and there is no the hanging region, therefore be easier to form the moulding bodies 15, and cause the molding
Body 15 keeps smooth.
With reference to Figure 11, it is the camera module of the photosensory assembly using this embodiment of the present utility model, it is described to take the photograph
As module includes a photosensory assembly 10, an optical filter 30, a camera lens 40 and a motor 50.
The optical filter 30 is installed in the moulding bodies 15 of the photosensory assembly 10, positioned at the photosensory assembly 10
On the photosensitive path of the sensitive chip 12, the camera lens 40 is installed in the motor 50, in order to pass through the motor 50
Adjust the focal length of the camera module, the motor 50 by by the moulding bodies 15 are installed on so that the camera lens 40 is located at
On the photosensitive path of the sensitive chip 12.
It is noted that application of the photosensory assembly 10 in the camera module so that 12 He of the sensitive chip
The moulding bodies 15 all have preferable flatness, so as to be easier to adjust the sensitive chip 12 and the optical filter 30 and
The concordance of 40 optical axis of the camera lens, solution form the chip tilt problem brought during the moulding bodies 15, so that described
Camera module has more preferable image quality, and the parsing that the solution camera module occurs in test process is bad, and curve is different
Often, the problems such as motor CODE is abnormal.Therefore the photosensory assembly of the present utility model 10 is particularly suited for the described of moulding type and takes the photograph
As module.
The photosensory assembly 10 includes an at least component 16, protrudes from the wiring board main body 11, and by the mould
Plastomer 15 is coated.
15 integral packaging of the moulding bodies in the non-photo-sensing area in the front 121 of the sensitive chip 12 so that
The sensitive chip 12 and the wiring board main body 11 connect more firm.
It is noted that in this embodiment of the present utility model, being said by taking dynamic Jiao camera module AFM as an example
It is bright, and in other embodiment of the present utility model, the camera module can also be and focus module FFM, that is to say, that do not wrap
The motor 50 is included, those skilled in the art is not it should be appreciated that the concrete shape of the camera module and type are
Restriction of the present utility model.
It should be understood by those skilled in the art that the embodiment of the present utility model shown in foregoing description and accompanying drawing is only used as
Illustrate and be not intended to limit this utility model.The purpose of this utility model completely and is effectively realized.Work(of the present utility model
Energy and structural principle in embodiment show and illustrate, under without departing from the principle, embodiment of the present utility model
Can there are any deformation or modification.
Claims (19)
1. a photosensory assembly, it is characterised in that include：
One wiring board main body；
One sensitive chip；With
One connection medium；Wherein described sensitive chip is attached at the wiring board main body, and the company by the connection medium
The mating shapes of medium and the sensitive chip are connect, so that the sensitive chip is entirely connected to the wiring board master
Body.
2. photosensory assembly according to claim 1, wherein described photosensory assembly include an at least connecting line, and can be powered connection
The sensitive chip and the wiring board main body.
3. photosensory assembly according to claim 2, wherein described connecting line are combination：In gold thread, silver wire, copper cash and aluminum steel
One of which.
4. photosensory assembly according to claim 1, wherein described photosensory assembly include moulding bodies, the moulding bodies one
Take shape in the sensitive chip and the wiring board main body.
5. photosensory assembly according to claim 4, wherein described photosensory assembly include an at least component, protrude from institute
Wiring board main body is stated, and is coated by the moulding bodies.
6., according to the arbitrary described photosensory assembly of claim 1 to 5, wherein described connection medium is by combination：Spraying, spin coating,
A kind of mode in round brush, printing and attaching puts on a back side of the sensitive chip.
7., according to the arbitrary described photosensory assembly of claim 1 to 5, wherein described connection medium is by combination：Spraying, frictioning,
A kind of mode in wiper, printing and attaching puts on the wiring board main body.
8., according to the arbitrary described photosensory assembly of claim 1 to 5, wherein described connection medium is combination：UV glued membranes, hot-setting adhesive
One of which in film and UV thermosetting glued membranes.
9. a camera module, it is characterised in that include：
One photosensory assembly；With
One camera lens, the camera lens are located on the photosensitive path of the photosensory assembly；Wherein described photosensory assembly includes a wiring board
Main body, a sensitive chip and a connection medium；Wherein described sensitive chip is attached at the wiring board by the connection medium
Main body, and the mating shapes of the connection medium and the sensitive chip, so that the sensitive chip is entirely connected to
The wiring board main body.
10. camera module according to claim 9, wherein described photosensory assembly include an at least connecting line, can the company of energization
Connect the sensitive chip and the wiring board main body.
11. camera modules according to claim 10, wherein described connecting line are combination：Gold thread, silver wire, copper cash and aluminum steel
In one of which.
12. camera modules according to claim 9, wherein described photosensory assembly include moulding bodies, the moulding bodies one
It is body formed in the sensitive chip and the wiring board main body.
13. camera modules according to claim 12, wherein described photosensory assembly include an at least component, protrude from
The wiring board main body, and coated by the moulding bodies.
14. according to the arbitrary described camera module of claim 9 to 13, and wherein described connection medium is by combination：Spraying, rotation
A kind of mode in painting, round brush, printing and attaching puts on a back side of the sensitive chip.
15. according to the arbitrary described camera module of claim 9 to 13, and wherein described connection medium is by combination：Spray, scrape
A kind of mode in glue, wiper, printing and attaching puts on the wiring board main body.
16. is combination according to the arbitrary described camera module of claim 9 to 13, wherein described connection medium：UV glued membranes, thermosetting
One of which in glued membrane and UV thermosetting glued membranes.
17. include a motor, the mirror according to the arbitrary described camera module of claim 9 to 13, wherein described camera module
Head is installed in the motor.
18. according to the arbitrary described camera module of claim 9 to 13, and wherein described camera module includes an optical filter, described
Optical filter is located at the photosensitive path of the photosensory assembly.
19. according to the arbitrary described camera module of claim 9 to 13, and wherein described camera module includes a support, described
Frame is installed in the photosensory assembly.
Priority Applications (18)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620590779.1U CN206040618U (en) | 2016-06-16 | 2016-06-16 | Photosensitive assembly and module of making a video recording |
| JP2018548099A JP7071926B2 (en) | 2016-03-12 | 2017-03-09 | Camera module and its photosensitive parts and their manufacturing method |
| US16/082,533 US20190148429A1 (en) | 2016-03-12 | 2017-03-09 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| PCT/CN2017/076041 WO2017157211A1 (en) | 2016-03-12 | 2017-03-09 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| KR1020187029304A KR20180132684A (en) | 2016-03-12 | 2017-03-09 | Camera module, its photosensitive part and method of manufacturing the same |
| KR1020217005344A KR102294537B1 (en) | 2016-03-12 | 2017-03-09 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| KR1020217005352A KR102360319B1 (en) | 2016-03-12 | 2017-03-09 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| EP17765753.3A EP3429183B1 (en) | 2016-03-12 | 2017-03-09 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| TW108135674A TW202019155A (en) | 2016-03-12 | 2017-03-13 | Camera module and its photosensitive element and manufacturing method |
| TW108135672A TWI742441B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| TW108135670D TWI758644B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| TW106203507U TWM559558U (en) | 2016-03-12 | 2017-03-13 | Camera module and its photosensitive component |
| TW108135670A TW202017356A (en) | 2016-03-12 | 2017-03-13 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| TW106108217A TWI754632B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| TW108135671A TWI769403B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| TW108135674D TWI758645B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| PCT/CN2017/088696 WO2017215651A1 (en) | 2016-06-16 | 2017-06-16 | Photosensor, camera module and manufacturing method thereof |
| US17/847,569 US12021097B2 (en) | 2016-03-12 | 2022-06-23 | Camera module, and photosensitive component thereof and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620590779.1U CN206040618U (en) | 2016-06-16 | 2016-06-16 | Photosensitive assembly and module of making a video recording |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206040618U true CN206040618U (en) | 2017-03-22 |
Family
ID=58313372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620590779.1U Active CN206040618U (en) | 2016-03-12 | 2016-06-16 | Photosensitive assembly and module of making a video recording |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206040618U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107483792A (en) * | 2017-09-20 | 2017-12-15 | 信利光电股份有限公司 | A kind of camera module and preparation method thereof |
| WO2017215651A1 (en) * | 2016-06-16 | 2017-12-21 | 宁波舜宇光电信息有限公司 | Photosensor, camera module and manufacturing method thereof |
| CN107516651A (en) * | 2016-06-16 | 2017-12-26 | 宁波舜宇光电信息有限公司 | Photosensory assembly and camera module and its manufacture method |
| CN110662994A (en) * | 2017-06-02 | 2020-01-07 | 宁波舜宇光电信息有限公司 | Optical lens, optical assembly, optical module and manufacturing method |
| CN111345021A (en) * | 2017-10-20 | 2020-06-26 | 宁波舜宇光电信息有限公司 | Photosensitive assembly and camera module based on metal support |
| CN115295456A (en) * | 2022-08-24 | 2022-11-04 | 陇芯微(西安)电子科技有限公司 | Vacuum film sticking machine |
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2016
- 2016-06-16 CN CN201620590779.1U patent/CN206040618U/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017215651A1 (en) * | 2016-06-16 | 2017-12-21 | 宁波舜宇光电信息有限公司 | Photosensor, camera module and manufacturing method thereof |
| CN107516651A (en) * | 2016-06-16 | 2017-12-26 | 宁波舜宇光电信息有限公司 | Photosensory assembly and camera module and its manufacture method |
| CN107516651B (en) * | 2016-06-16 | 2023-08-08 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module and manufacturing method thereof |
| CN110662994A (en) * | 2017-06-02 | 2020-01-07 | 宁波舜宇光电信息有限公司 | Optical lens, optical assembly, optical module and manufacturing method |
| TWI716689B (en) * | 2017-06-02 | 2021-01-21 | 大陸商寧波舜宇光電信息有限公司 | Optical lens, optical element, optical module and manufacturing method thereof |
| CN107483792A (en) * | 2017-09-20 | 2017-12-15 | 信利光电股份有限公司 | A kind of camera module and preparation method thereof |
| CN107483792B (en) * | 2017-09-20 | 2020-11-06 | 信利光电股份有限公司 | Camera module and manufacturing method thereof |
| CN111345021A (en) * | 2017-10-20 | 2020-06-26 | 宁波舜宇光电信息有限公司 | Photosensitive assembly and camera module based on metal support |
| CN115295456A (en) * | 2022-08-24 | 2022-11-04 | 陇芯微(西安)电子科技有限公司 | Vacuum film sticking machine |
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