CN205985064U - Supplementary frock clamp who is used for preceding dewax of gaAs base LED chip attenuate - Google Patents
Supplementary frock clamp who is used for preceding dewax of gaAs base LED chip attenuate Download PDFInfo
- Publication number
- CN205985064U CN205985064U CN201621005499.6U CN201621005499U CN205985064U CN 205985064 U CN205985064 U CN 205985064U CN 201621005499 U CN201621005499 U CN 201621005499U CN 205985064 U CN205985064 U CN 205985064U
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- Prior art keywords
- bearing
- base
- frock clamp
- led chip
- load plate
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- 239000000919 ceramic Substances 0.000 claims description 53
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 28
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 210000002435 tendon Anatomy 0.000 claims description 3
- 239000012188 paraffin wax Substances 0.000 abstract description 18
- 238000000034 method Methods 0.000 abstract description 11
- 238000002360 preparation method Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 241000251468 Actinopterygii Species 0.000 abstract 1
- 239000011148 porous material Substances 0.000 abstract 1
- 239000001993 wax Substances 0.000 description 26
- 238000000227 grinding Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model relates to a supplementary frock clamp who is used for preceding dewax of gaAs base LED chip attenuate belongs to semiconductor thinning process technical field, and fixture base, swivel bearing, year chuck table that the device links to each other including from the bottom up, swivel bearing carry the chuck table center and are equipped with pottery dish anchor post including locating the bearing base of lower extreme and the bearing retainer of upper end. Link to each other the bearing base with fixture base, it is continuous with swivel bearing's bearing retainer to carry chuck table, to treat the accurate pottery dish anchor post of pottery dish back card pore pair of dewax paper, place on carrying chuck table, the operator rotates and carries a chuck table with the aid of swivel bearing, makes pottery dish up time needle or counter -clockwise turning, recycles the blade and removes unnecessary paraffin paper along the wafer edge. The utility model discloses the frock clamp of preparation, the simple structure, low cost, it is easy and simple to handle, can effectively improve dewax paper efficiency, when preventing the operation of dewax paper blade fish tail, draw and split the wafer and damage the chip edge even, reduce the loss rate of chip.
Description
Technical field
This utility model is related to a kind of frock clamp assisting and removing wax for GaAs base LED chip before thinning, belongs to and partly leads
Body reduction process technical field.
Background technology
With the continuous development of technical matters, LED chip is constantly to high density, high-performance, miniaturization and lightening development.
Wherein, the sheet of device is one of prior development direction of power device and photovoltaic device in recent years.On the one hand, thin slice is permissible
Reduce conducting resistance and the pressure drop of device, thus the conduction loss of device is greatly reduced, and boost device is in terms of radiating
Performance, prevents the too high temperature rise of LED chip active area from producing impact to its light output characteristic and life-span；On the other hand, for meeting
The requirement of the subsequent process such as scribing, sliver in LED chip manufacturing process, needs also exist for for chip substrate thickness being thinned to certain journey
Degree；Another further aspect, thin slice advantageously reduces the space of device encapsulation, thus realizing the miniaturization of whole package module and frivolous
Change.Therefore, in LED chip preparation technology, chip thickness is thinning to be a very important manufacturing process.
In semicon industry, the thickness of GaAs base LED chip is thinning, mainly carries out mechanical lapping using grinder to chip
(GRINDING), most of semiconductor chip makers are owned by comparing the equipment of automatization chip are carried out with batch at present
Change thinning.When grinding thinning, chip is attached on ceramic disk and passes through vacuum suction piece and adsorb in mechanical swing arm, mechanical arm and grinding
Disk contacts by the spin of respective track, is ground thinning.
Further, chip is attached on ceramic disk, generally protects chip front side electrode, has two kinds of guard methods, a kind of
It is, between chip and ceramic disk, a paraffin paper is covered by the adhesiveness of wax, existing also have a kind of way to be that chip passes through rod wax
It is adhered directly on ceramic disk after thawing.Two methods are compared, although second method is simple to operate, examine from product quality
Consider, chip is adhered directly on ceramic disk by wax, and in follow-up tabletting operation process, the slip being susceptible to chip causes core
Piece surface rub wound, when serious, full wafer rubs wound and scraps, and by paraffin paper as the dielectric layer between chip and ceramic disk, it is to avoid
The chip causing in follow-up tableting processes slides, and effectively solves chip and rubs the generation of wound it is ensured that product quality, is chip
A kind of method for optimizing of thinning front paster improvement of operation.
Therefore smear one layer of photoresist in advance or cover coating of wax paper, can avoid grinding in thinning process to chip front side
Electrode causes to rub the effect that wound plays shield electrode.Due to photoresist high cost, and chip grinds thinning rear removal front electrode
On photoresist clean loaded down with trivial details difficulty, easily cause bad products, attach paraffin paper and carry out the operation that electrode protection has become main
Trend.Corresponding, need before grinding is thinning to remove unnecessary paraffin paper on the ceramic disk outside chip coverage totally to expose
Ceramic panel surface, using the ceramic panel surface exposed as the benchmark zero point of thickness measure during chip thinning, also avoids not simultaneously
Remove paraffin paper or remove that totally not cause in thinning process the paraffin paper of residual to be ground into unqualified, be blended in lapping liquid and formed
Black powder, pollutes the fresh face after chip is ground, the effect of impact chip back evaporation metal.Therefore, before chip grinds
Wax is gone to be also an extremely important crucial step.Existing wax way of typically going is that ceramic disk is placed on work top, uses blade
The outward-dipping rotating blade of profile blade (ceramic disk maintains static) along chip removes paraffin paper.Blade warp in rotation process
Often occur lateral sliding to cause knife edge angular to change, touch chip and lead to chip rupture, cause chip loss, and do not remove wax also not
Thoroughly.At present, Patents, the reported literature of paraffin paper operation is temporarily removed before thinning independent of GaAs base LED chip.
Utility model content
Wax way is gone to easily cause chip rupture and not easy-operating problem for existing, this utility model provides one kind
Assist the frock clamp for removing wax before thinning, to solve the chip rupture that causes and to go the halfway problem of wax.
The technical solution of the utility model is as follows：
A kind of assist the frock clamp removing wax for GaAs base LED chip before thinning, include connected frock from top to bottom
Base, swivel bearing, load plate platform, swivel bearing includes the support of bearing of bearing base located at lower end and upper end, in load plate platform
The heart is provided with ceramic disk and fixes pillar.
According to this utility model preferably, described tooling base is provided with least one bolt hole.
It is further preferred that bearing base is provided with least one bolt hole, bearing base passes through bolt hole and frock bottom
Seat is connected.
It is further preferred that the support of bearing is provided with least one bolt hole.
It is further preferred that load plate platform is provided with least one bolt hole, load plate platform passes through bolt hole and support of bearing phase
Even.
It is further preferred that on tooling base, on bearing base, on the support of bearing, the load plate platform bolt hole that is provided with
Quantity is 25, makes the fixation of bolt hole and stress more uniform.
It is further preferred that the aperture of bolt hole is 5 8mm.
According to this utility model preferably, tooling base is disc-shaped base, a diameter of 16 20cm, and thickness is 0.5
2.5cm；A diameter of 5 8cm of bearing base, thickness is 0.5 1.5cm；A diameter of 5 10cm of the support of bearing, thickness is 0.5
1.0cm；Swivel bearing height is 1.0 2.0cm；A diameter of 15.0 16.5cm of load plate platform, thickness is 0.4 1.1cm；Ceramic disk
Fixing strut height (face on the basis of load plate platform) is 3 6mm, a diameter of 6.5 9.5mm.Frock size of the present utility model sets
Surely leave certain size range, one is that the chip product that advance reservation has changes the suitability after size, and two is other
The Fixture Design of size is included within this utility model.
According to this utility model preferably, it is provided with boss at load plate platform surrounding edge.Ceramic disk is being placed on load plate platform
Afterwards, load plate platform is played and act on further.
It is further preferred that being radially provided with locating slot on load plate platform, in locating slot, it is provided with positioning baffle.Make load plate platform permissible
Adapt to the ceramic disk of different size size, by locating slot and positioning baffle, be easy to further fixed dimension and be less than load plate platform
Ceramic disk, is easy to operate ceramic disc spins.
According to this utility model preferably, the fixing pillar of ceramic disk is Rotary-table, and ceramic disk fixing abutment surface injection sets
Elasticity layer.So, fall with ceramic disk, ceramic disk back side hole clipping gradually carries out interference fit, to reach with fixing pillar
Ceramic disk is fixed on the effect on load plate platform, it is to avoid relatively slide.
According to this utility model preferably, load plate platform bottom is radially provided with least one convex tendon.Facilitate operator to hold, revolve
Reprint dish platform.
When being worked using above-mentioned frock clamp, as follows including step：
(1) bearing base of swivel bearing is connected with tooling base, by the support of bearing phase of load plate platform and swivel bearing
Even；
(2) by face-up for the ceramic disk of paraffin paper the to be gone, back side down, back side hole clipping be aligned ceramic disk fix pillar, put
It is placed on load plate platform；
(3) operator, by means of swivel bearing, rotates load plate platform, makes ceramic disk clockwise or counterclockwise, grasps on the other hand
Make terrine rotation, a hand-held blade removes unnecessary paraffin paper along Waffer edge.After having removed unnecessary paraffin paper, then ceramic disk is placed in grinds
Carry out next step operation in grinding machine：Chip thinning is ground.
The beneficial effects of the utility model are as follows
The frock clamp that this utility model makes, simple structure, it is easy to accomplish, with low cost, easy and simple to handle, can effectively carry
Height goes paraffin paper efficiency it is often more important that can preventing blade during paraffin paper operation from scratching, drawing and split chip or even damage chip edge, fall
The loss rate of low chip, reduces economic loss to a certain extent.
Brief description
Fig. 1 is the structural representation of this utility model frock clamp.
Fig. 2 is the structural representation of this utility model frock clamp and ceramic disk rear-face contact.
Fig. 3 is the structural representation that this utility model frock clamp carries during ceramic disk work.
Wherein 1, ceramic disk fixes pillar, and 2, load plate platform, 3, swivel bearing, 4, tooling base, 5, ceramic disk back side hole clipping,
6th, the ceramic disk back side, 7, paraffin paper, 8, treat thinned die, 9, the direction of rotation (two-way) of frock clamp.
Specific embodiment
With reference to embodiment and Figure of description, this utility model is described further, but not limited to this.
As shown in Fig. 13.
Embodiment 1
A kind of assist the frock clamp removing wax for GaAs base LED chip before thinning, include connected frock from top to bottom
Base, swivel bearing, load plate platform, swivel bearing includes the support of bearing of bearing base located at lower end and upper end, in load plate platform
The heart is provided with ceramic disk and fixes pillar.
Tooling base is disc-shaped base, a diameter of 18cm, and thickness is 2cm, arranges 4 bolts on tooling base simultaneously
Hole, the aperture of tooling base upper bolt hole is 6mm；
The a diameter of 7cm of bearing base, thickness is 1cm, and bearing base arranges 4 bolt fixing hole, and aperture is 6mm；Axle
Holding stent diameter is 6cm, and thickness is 0.8cm, and the support of bearing arranges 4 bolt fixing hole, and aperture is 6mm；
Swivel bearing height is 1.8cm；The a diameter of 16.5cm of load plate platform, thickness is 1.1cm, and load plate platform is provided with 4 spiral shells
Bolt fixing hole, aperture 6mm；Ceramic disk fixes strut height (face on the basis of load plate platform) as 4mm, a diameter of 7mm.Bearing base
It is connected with tooling base by bolt hole, load plate platform is connected with the support of bearing by bolt hole.
When utilizing the auxiliary described in the present embodiment to be used for before GaAs base LED chip is thinning going the frock clamp of wax to work, bag
Include step as follows：
(1) bearing base of swivel bearing is connected with tooling base, by the support of bearing phase of load plate platform and swivel bearing
Even；
(2) face-up for the ceramic disk of paraffin paper to be gone, back side hole clipping be aligned ceramic disk are fixed pillar, be positioned over load plate platform
On；
(3) operator, by means of swivel bearing, rotates load plate platform, makes ceramic disk clockwise or counterclockwise, grasps on the other hand
Make terrine rotation, a hand-held blade removes unnecessary paraffin paper along Waffer edge.After having removed unnecessary paraffin paper, then ceramic disk is placed in grinds
Carry out next step operation in grinding machine：Chip thinning is ground.
Embodiment 2
A kind of assist the frock clamp removing wax for GaAs base LED chip before thinning, its structure as described in Example 1, area
It is not, a diameter of 16cm of tooling base, thickness 1.5cm, 4 bolts hole, aperture 5mm are set in tooling base simultaneously.
Bearing base diameter 5.5cm, thickness 0.6cm, arrange 4 bolts hole, aperture 5mm on bearing base simultaneously；Axle
Hold stent diameter 5cm, thickness 0.6cm, 4 bolts hole, aperture 5mm are arranged on the support of bearing, swivel bearing whole height is
1.2cm.
Load plate platform diameter is set to 15.5cm, thickness 0.6cm, arranges 4 bolts hole, aperture 5mm on load plate platform.
The centrally disposed ceramic disk of load plate platform fixes strut height (face on the basis of load plate platform) as 3mm, diameter 6.5mm.
Embodiment 3
A kind of assist the frock clamp removing wax for GaAs base LED chip before thinning, its structure as described in Example 1, area
It is not, tooling base is disc-shaped base, a diameter of 16cm, thickness is 0.5cm；The a diameter of 5cm of bearing base, thickness is
0.5cm；The a diameter of 5cm of the support of bearing, thickness is 0.5cm；Swivel bearing height is 1.0cm；The a diameter of 15.0cm of load plate platform is thick
Spend for 0.4cm；Ceramic disk fixes strut height (face on the basis of load plate platform) as 3mm, a diameter of 6.5mm.
Embodiment 4
A kind of assist the frock clamp removing wax for GaAs base LED chip before thinning, its structure as described in Example 1, area
It is not, tooling base is disc-shaped base, a diameter of 20cm, thickness is 2.5cm；The a diameter of 8cm of bearing base, thickness is
1.5cm；The a diameter of 10cm of the support of bearing, thickness is 0.5cm；Swivel bearing height is 2.0cm；The a diameter of 16.5cm of load plate platform,
Thickness is 1.1cm；Ceramic disk fixes strut height (face on the basis of load plate platform) as 6mm, a diameter of 9.5mm.
Embodiment 5
A kind of assist the frock clamp removing wax for GaAs base LED chip before thinning, its structure as described in Example 4, area
It is not, tooling base is disc-shaped base, a diameter of 20cm, thickness is 2.5cm；The a diameter of 8cm of bearing base, thickness is
1.0cm；The a diameter of 10cm of the support of bearing, thickness is 1.0cm；Swivel bearing height is 2.0cm；The a diameter of 16.5cm of load plate platform,
Thickness is 1.1cm；Ceramic disk fixes strut height (face on the basis of load plate platform) as 6mm, a diameter of 9.5mm.
Embodiment 6
A kind of assist the frock clamp removing wax for GaAs base LED chip before thinning, its structure as described in Example 1, area
It is not, be equipped with 3 bolts hole on tooling base, on bearing base, on the support of bearing, on load plate platform, bolt hole aperture is
7mm, bearing base is connected with tooling base by bolt hole, and load plate platform is connected with the support of bearing by bolt hole, 3 bolts hole
It is uniformly distributed on the circumferential surface, uniform force, contribute to fixing.
Embodiment 7
A kind of assist the frock clamp removing wax for GaAs base LED chip before thinning, its structure as described in Example 1, area
It is not, be equipped with 2 bolts hole on tooling base, on bearing base, on the support of bearing, on load plate platform, bolt hole aperture is
8mm, bearing base is connected with tooling base by bolt hole, and load plate platform is connected with the support of bearing by bolt hole, 2 bolts hole
It is uniformly distributed on the circumferential surface, uniform force, contribute to fixing.
Embodiment 8
A kind of assist the frock clamp removing wax for GaAs base LED chip before thinning, its structure as described in Example 1, area
It is not, be equipped with 5 bolts hole on tooling base, on bearing base, on the support of bearing, on load plate platform, bolt hole aperture is equal
For 5mm.
Embodiment 9
A kind of assist the frock clamp removing wax for GaAs base LED chip before thinning, its structure as described in Example 1, area
It is not, at load plate platform surrounding edge, be provided with boss.After ceramic disk is placed on load plate platform, load plate platform is risen and makees further
With.
Embodiment 10
A kind of assist the frock clamp removing wax for GaAs base LED chip before thinning, its structure as described in Example 1, area
It is not, load plate platform is radially provided with locating slot, in locating slot, be provided with positioning baffle.Load plate platform is made to be adapted to different size big
Little ceramic disk, by locating slot and positioning baffle, is easy to the ceramic disk that further fixed dimension is less than load plate platform, is easy to operate
Ceramic disc spins.
Embodiment 11
A kind of assist the frock clamp removing wax for GaAs base LED chip before thinning, its structure as described in Example 1, area
It is not, the fixing pillar of ceramic disk is Rotary-table, ceramic disk fixing abutment surface injection is provided with elastic layer.So, with pottery
Disk falls, and ceramic disk back side hole clipping gradually carries out interference fit with fixing pillar, with reaching, ceramic disk is fixed on load plate platform
Effect, it is to avoid relatively slide.
Embodiment 12
A kind of assist the frock clamp removing wax for GaAs base LED chip before thinning, its structure as described in Example 1, area
It is not, load plate platform bottom is radially provided with two convex tendons.Facilitate operator's holding, rotating platen platform.
Claims (10)
1. a kind of auxiliary removes the frock clamp of wax it is characterised in that including phase from top to bottom for GaAs base LED chip before thinning
Tooling base even, swivel bearing, load plate platform, swivel bearing includes the support of bearing of bearing base located at lower end and upper end,
Load plate platform center is provided with ceramic disk and fixes pillar.
2. according to claim 1 assist the frock clamp removing wax for GaAs base LED chip before thinning, its feature exists
In described tooling base is provided with least one bolt hole；Bearing base is provided with least one bolt hole, and bearing base passes through
Bolt hole is connected with tooling base.
3. according to claim 1 assist the frock clamp removing wax for GaAs base LED chip before thinning, its feature exists
In the support of bearing is provided with least one bolt hole；Load plate platform is provided with least one bolt hole, load plate platform pass through bolt hole with
The support of bearing is connected.
4. according to claim 1 assist the frock clamp removing wax for GaAs base LED chip before thinning, its feature exists
In, on tooling base, on bearing base, on the support of bearing, the quantity of bolt hole that is provided with of load plate platform be 25.
5. according to claim 4 assist the frock clamp removing wax for GaAs base LED chip before thinning, its feature exists
In the aperture of bolt hole is 5 8mm.
6. according to claim 1 assist the frock clamp removing wax for GaAs base LED chip before thinning, its feature exists
In tooling base is disc-shaped base, a diameter of 16 20cm, and thickness is 0.5 2.5cm；A diameter of 5 8cm of bearing base are thick
Spend for 0.51.5cm；A diameter of 5 10cm of the support of bearing, thickness is 0.51.0cm；Swivel bearing height is 1.0 2.0cm；Carry
A diameter of 15.0 16.5cm of dish platform, thickness is 0.4 1.1cm；The fixing strut height of ceramic disk is 3 6mm, a diameter of 6.5
9.5mm.
7. according to claim 1 assist the frock clamp removing wax for GaAs base LED chip before thinning, its feature exists
In being provided with boss at load plate platform surrounding edge.
8. according to claim 1 assist the frock clamp removing wax for GaAs base LED chip before thinning, its feature exists
In locating slot being radially provided with load plate platform, is provided with positioning baffle in locating slot.
9. according to claim 1 assist the frock clamp removing wax for GaAs base LED chip before thinning, its feature exists
In the fixing pillar of ceramic disk is Rotary-table, and ceramic disk fixing abutment surface injection is provided with elastic layer.
10. according to claim 1 assist the frock clamp removing wax for GaAs base LED chip before thinning, its feature exists
In load plate platform bottom is radially provided with least one convex tendon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621005499.6U CN205985064U (en) | 2016-08-31 | 2016-08-31 | Supplementary frock clamp who is used for preceding dewax of gaAs base LED chip attenuate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621005499.6U CN205985064U (en) | 2016-08-31 | 2016-08-31 | Supplementary frock clamp who is used for preceding dewax of gaAs base LED chip attenuate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205985064U true CN205985064U (en) | 2017-02-22 |
Family
ID=58038856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621005499.6U Expired - Fee Related CN205985064U (en) | 2016-08-31 | 2016-08-31 | Supplementary frock clamp who is used for preceding dewax of gaAs base LED chip attenuate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205985064U (en) |
-
2016
- 2016-08-31 CN CN201621005499.6U patent/CN205985064U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170222 Termination date: 20200831 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |