CN205864742U - Dynamic swage group and earphone - Google Patents

Abstract

This utility model relates to a kind of dynamic swage group and earphone.Including for the electric capacity of filtering and be fixed together and be respectively equipped with that the intermediate frequency of circuit board moves ferrum unit, high frequency moves ferrum unit and hyperfrequency moves ferrum unit, described electric capacity electrically connects with described circuit board.Intermediate frequency moves ferrum unit, high frequency moves ferrum unit and moves with hyperfrequency together with ferrum unit fixed Combination, simplify assemble flow, improve efficiency of assembling, and structure is compacter, position between each dynamic ferrum unit will not change, it is ensured that the concordance of the audio curve of dynamic ferrum unit.Under the filter action of electric capacity, intermediate frequency, high frequency and the most well-bedded accurate reproduction of hyperfrequency acoustical signal, the frequency range that the sound being reduced is comprised is abundanter, the great third dimension of sound making earphone send and stereovision, it be rich in emotion and vitality, it is ensured that the overall sound quality effect of sound.

Description

Moving iron module and earphone

technical field

The utility model relates to the technical field of loudspeakers, in particular to a moving iron module and earphones.

Background technique

Earphones receive electrical signals from media players or receivers, and use speakers close to the ears to convert them into audible sounds. They are commonly used audio equipment in people's lives and work. Traditional earphones are usually dynamic earphones. Dynamic earphones have low resolution for mid-to-high frequencies, and the sound lacks three-dimensionality. In order to improve the fidelity of the audio, the improved earphones added a moving iron unit to achieve the complementarity of the bass and the middle and high pitches. However, the moving iron earphones have the defect of low resolution of the intermediate frequency, high frequency and ultra-high frequency sound signals. It is difficult to form a more three-dimensional sound experience with rich frequency bands.

Utility model content

Based on this, it is necessary to provide a moving iron module capable of improving audio resolution and an earphone including the moving iron module.

A moving iron module, including a capacitor for filtering, and an intermediate frequency moving iron unit, a high frequency moving iron unit and an ultrahigh frequency moving iron unit fixed together and respectively provided with a circuit board, the capacitor and the circuit board electrical connection.

In one of the embodiments, the diaphragm front cavity surfaces of the high frequency moving iron unit and the ultra high frequency moving iron unit are closely connected to each other.

In one embodiment, the end faces of the high-frequency moving iron unit and the ultra-high frequency moving iron unit on which the nozzles are provided are flush with each other.

In one of the embodiments, the moving iron module is further provided with a metal sheet for fixing the high frequency moving iron unit and the ultra high frequency moving iron unit, and the intermediate frequency moving iron unit is fixed on the metal sheet away from the One end of the sound nozzle of the high-frequency moving iron unit and/or the ultra-high frequency moving iron unit.

In one of the embodiments, a metal sheet is respectively arranged on the high-frequency moving iron unit and the ultra-high frequency moving iron unit, and the metal sheet includes The cantilever end of the iron unit, the intermediate frequency moving iron unit is fixed between the two cantilever ends of the metal sheet.

In one of the embodiments, the intermediate frequency moving iron unit, the high frequency moving iron unit and the ultra high frequency moving iron unit respectively form a series group with one of the capacitors to form three series groups, between the three series groups connected in parallel.

In one of the embodiments, the intermediate frequency moving iron unit and one of the capacitors form a series group; the high frequency moving iron unit and the ultra high frequency moving iron unit are connected in parallel and then connected in series with one of the capacitors to form another series connection groups, and the one series group is connected in parallel with the other series group.

In one of the embodiments, the intermediate frequency moving iron unit and one capacitor form a series group; the high frequency moving iron unit and the ultra high frequency moving iron unit connect one capacitor in series to form another series group, The one series group is connected in parallel with the other series group.

An earphone, comprising any one of the moving iron module, a moving coil unit and a housing; the moving coil unit and the moving iron module are accommodated in the housing, and the housing includes a sound guide tube A base, and a top cover installed on the base, the high-frequency moving iron unit and the ultra-high frequency moving iron unit are arranged in the sound guide tube.

In one of the embodiments, the nozzles of the high-frequency moving iron unit and the ultra-high frequency moving iron unit are close to the sound hole of the sound guide tube; the nozzles of the intermediate frequency moving iron unit are arranged facing the On the side of the sound hole of the sound guide tube.

The moving iron module and the earphone provided by the utility model fixedly combine the intermediate frequency moving iron unit, the high frequency moving iron unit and the ultrahigh frequency moving iron unit, simplify the assembly process, improve the assembly efficiency, and have a more compact structure, each moving iron unit The position between the iron units will not change, ensuring the consistency of the audio curve of the moving iron unit. Under the filtering effect of the capacitor, each moving iron unit can accurately restore the intermediate frequency, high frequency and ultra-high frequency sound signals with clear layers, and the frequency bands contained in the restored sound are more abundant, making the sound from the earphones very three-dimensional and layered Feeling, full of emotion and vitality, to ensure the overall sound quality of the sound.

Description of drawings

Fig. 1 is the structural representation of moving iron module;

Fig. 2 is a circuit structure diagram of an embodiment of the moving iron module;

Fig. 3 is a circuit structure diagram of another embodiment of the moving iron module;

Fig. 4 is a circuit structure diagram of a moving iron module in another embodiment;

Fig. 5 is a schematic diagram of an exploded structure of the earphone;

6 is a schematic diagram of the overall assembly structure of the earphone;

Fig. 7 is a schematic diagram of a partial structure of the earphone.

detailed description

In order to facilitate the understanding of the utility model, the utility model will be described more fully below with reference to the relevant drawings. Preferred embodiments of the utility model are provided in the accompanying drawings. However, the invention may be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present utility model more thorough and comprehensive.

It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "inner", "outer", "left", "right" and similar expressions are used herein for the purpose of description only and do not represent the only embodiment.

Referring to FIGS. 1 to 4 at the same time, a moving iron module 10 includes a capacitor 400 , and an intermediate frequency moving iron unit 300 , a high frequency moving iron unit 100 and an ultra high frequency moving iron unit 200 fixedly combined. A circuit board is respectively arranged on one side of the intermediate frequency moving iron unit 300, the high frequency moving iron unit 100 and the ultrahigh frequency moving iron unit 200, and the capacitor 400 is electrically connected to the circuit board, and the number of the capacitor 400 can be two or can be Three, the capacitor 400 can be connected to the circuit board through wires, or can be directly fixed on the circuit board by laser welding.

Specifically, the intermediate frequency moving iron unit 300, the high frequency moving iron unit 100 or the ultra high frequency moving iron unit 200 are all cylindrical structures, and the diaphragm front cavity surface 110 of the high frequency moving iron unit 100 and the ultra high frequency moving iron unit 200 The front chamber surface 110 of the diaphragm is the side of the intermediate frequency moving iron unit 300, the high frequency moving iron unit 100 or the ultra high frequency moving iron unit 200 which is parallel to the diaphragm and has the shortest distance to the diaphragm. The sides are all rectangular surfaces, and the two diaphragm front cavity surfaces 110 of the high frequency moving iron unit 100 and the ultra high frequency moving iron unit 200 are fixedly connected by glue or welding.

When the moving iron module 10 is working, because the diaphragm front cavity surface 110 of the high frequency moving iron unit 100 and the ultra high frequency moving iron unit 200 are closely connected, so that the two diaphragms are set opposite to each other, when the diaphragm drives the high frequency moving When the iron unit 100 and the ultra-high frequency moving iron unit 200 vibrate, the vibrations of the two can cancel each other out, reducing the interference of the vibration of each moving iron unit to the sound, and improving the sound quality of the moving iron module 10 .

The end faces of the high frequency moving iron unit 100 and the UHF moving iron unit 200 perpendicular to the diaphragm front chamber surface 110 are respectively provided with sound nozzles 210, when the high frequency moving iron unit 100 and the UHF moving iron unit 200 are fixedly connected , the end faces where the sound nozzles 210 of the two are flush with each other, in other words, the two end faces are located in the same horizontal plane, which can ensure that the sound nozzles 210 are placed on the high-frequency moving iron unit 100 and the ultra-high frequency moving iron unit 200 respectively. The location is basically the same.

The high-frequency moving iron unit 100 and/or the ultra-high frequency moving iron unit 200 is provided with a strip-shaped metal sheet 310, the number of metal sheets 310 can be one or two, and one end of the metal sheet 310 is fixed on the high-frequency moving iron unit 100 and/or the UHF moving iron unit 200, the other end of the metal sheet 310 is the cantilever end (i.e. the free end), and the intermediate frequency moving iron unit 300 is fixed on the cantilever end of the metal sheet 310, that is, away from the sound outlet 210 at one end. The sound nozzle of the intermediate frequency moving iron unit 300 is located on the side facing the high frequency moving iron unit 100 or the ultra high frequency moving iron unit 200, so that the intermediate frequency moving iron unit 300, the high frequency moving iron unit 100 and the ultra high frequency moving iron unit 200 The pronunciation direction of the mouthpiece 210 on the top is basically consistent.

Referring to FIG. 2 , in one embodiment, the intermediate frequency moving iron unit 300 , the high frequency moving iron unit 100 and the ultra high frequency moving iron unit 200 respectively form a series group with a capacitor 400 , and the three series groups are connected in parallel. The three capacitors 400 can be respectively welded on the circuit boards of the intermediate frequency moving iron unit 300, the high frequency moving iron unit 100 and the ultrahigh frequency moving iron unit 200, and the capacitors 400 can be chip capacitors, so that the combined moving iron module 10 The structure is more compact, the control circuit of the moving iron module 10 is simplified, and the use is simpler and more convenient. Due to the filtering effect of the capacitor 400 , the intermediate frequency sound signal is restored by the intermediate frequency moving iron unit 300 , the high frequency sound signal is restored by the high frequency moving iron unit 100 , and the ultra high frequency sound signal is restored by the ultra high frequency moving iron unit 200 . When the low-frequency energy of the high-frequency moving-iron unit 100 and the ultra-high-frequency moving-iron unit 200 differ greatly, a capacitor 400 is connected in series with the high-frequency moving-iron unit 100 and the ultra-high-frequency moving-iron unit 200 to filter out the high-frequency The low frequency of the moving iron unit 100 and the low frequency of the UHF moving iron unit 200 make the low frequency of the high frequency moving iron unit 100 and the low frequency of the UHF moving iron unit 200 not interfere with each other, and the sound sounds more layered , with richer details, effectively enhancing the three-dimensionality and fidelity of the sound.

Referring to Fig. 3, in another embodiment, the intermediate frequency moving iron unit 300 and a capacitor 400 form a series group; the high frequency moving iron unit 100 and the ultra high frequency moving iron unit 200 are connected in parallel and then connected in series with a capacitor 400 to form another series connection group, the two series groups are connected in parallel. When the low-frequency energy of the high-frequency moving-iron unit 100 and the ultra-high-frequency moving-iron unit 200 is not much different, the high-frequency moving-iron unit 100 and the ultra-high-frequency moving-iron unit 200 are connected in parallel and then a capacitor 400 is connected in series to filter out high The low frequency of the high frequency moving iron unit 100 and the low frequency of the ultrahigh frequency moving iron unit 200. Because the low-frequency energy of the high-frequency moving iron unit 100 and the UHF moving iron unit 200 is similar, a capacitor of 400 can make the sound sound more layered and more detailed.

Referring to Fig. 4, in another embodiment, the intermediate frequency moving iron unit 300 and a capacitor 400 form a series group; the high frequency moving iron unit 100 and the ultrahigh frequency moving iron unit 200 connect a capacitor 400 in series to form another series group, Parallel connection between two series groups. After the high frequency moving iron unit 100 and the ultra high frequency moving iron unit 200 are connected in series, the voltage borne by the high frequency moving iron unit 100 and the ultra high frequency moving iron unit 200 will be reduced by half, so that the high frequency moving iron unit 100 and the ultra high frequency moving iron unit The distortion of the moving armature unit 200 will be reduced, making the high-frequency details in the sound richer.

Referring to Fig. 5, Fig. 6 and Fig. 7 at the same time, the utility model also provides a kind of earphone, and this earphone comprises above-mentioned moving iron module 10, and this earphone also comprises casing and moving coil unit 700, and moving coil unit 700 Both the moving iron module 10 and the moving iron module 10 are installed in the casing, the casing includes a base 500 and a top cover 600, the top cover 600 is fixed on the base 500, and the top cover 600 and the base 500 together form the inner cavity of the casing. The base 500 is provided with a sound guide tube 510, and the sound emitted by the moving iron module 10 and the moving coil unit 700 is input into the human ear through the sound guide tube 510, and the moving coil unit 700 is provided with an audio transmission line 800 connected to external equipment. The sound signal enters the casing from the audio transmission line 800 , and is restored by the moving iron module 10 and the moving coil unit 700 , and the restored sound enters the human ear through the sound outlet 511 of the sound guide tube 510 .

Before the earphone is assembled, the moving iron module 10 is manufactured separately. During the earphone assembly process, the moving iron module 10 is directly loaded into the casing as a whole, instead of being fixed and assembled individually in the casing, which can simplify the assembly process. On the basis of ensuring the assembly quality, the assembly efficiency is improved, and the position between the moving iron units will not change, ensuring better audio curve consistency of the moving iron units. Both the high-frequency moving iron unit 100 and the ultra-high-frequency moving-iron unit 200 are accommodated in the sound guide tube 510. Since the high-frequency and ultra-high-frequency sound signals are close to straight-line propagation, they are easily blocked by obstacles and the propagation distance is limited. Therefore, The sound outlet 210 of the high-frequency moving iron unit 100 and the ultra-high-frequency moving iron unit 200 is close to the sound outlet 511 of the sound guide tube 510, which can prevent high-frequency and ultra-high-frequency sound signals from being attenuated or attenuated due to reflection in the housing. Distortion phenomenon, to ensure the overall sound quality of the headset.

When the moving iron module 10 is assembled, the sound nozzle of the intermediate frequency moving iron unit 300 is located on the side facing the high frequency moving iron unit 100 or the ultra high frequency moving iron unit 200, when the moving iron module 10 is loaded into the earphone shell , the side where the sound outlet on the intermediate frequency moving iron unit 300 just faces the sound outlet hole 511 of the sound guide tube 510. The sound nozzles all face the sound outlet hole 511 of the sound guide tube 510, even if the sound outlet of the intermediate frequency moving iron unit 300 is far away from the sound outlet hole 511 of the sound guide tube 510, the intermediate frequency sound signal will not be attenuated by reflection .

The moving iron module 10 is installed in the earphone. The moving iron module 10 is responsible for restoring the intermediate frequency, high frequency and ultra-high frequency signals. The moving coil unit 700 restores the low frequency sound signals to ensure that the sound signals in each frequency band will not be distorted, and the restored sound The frequency bands included are more abundant, which improves the layering and three-dimensional sense of the earphone sound, and the sound is full of emotion and vitality, ensuring the overall sound quality of the sound.

The various technical features of the above-mentioned embodiments can be combined arbitrarily. For the sake of concise description, all possible combinations of the various technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the utility model, and the description thereof is relatively specific and detailed, but it should not be understood as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the scope of protection of the utility model patent should be based on the appended claims.

Claims (10)

1. A moving iron module, characterized in that, comprises a capacitor for filtering and is fixed together and is respectively provided with an intermediate frequency moving iron unit of a circuit board, a high frequency moving iron unit and an ultrahigh frequency moving iron unit, so The capacitor is electrically connected to the circuit board. 2 . The moving iron module according to claim 1 , wherein the diaphragm front cavity surfaces of the high-frequency moving iron unit and the ultra-high frequency moving iron unit are closely connected to each other. 3 . 3 . The moving iron module according to claim 1 , wherein the end faces of the high-frequency moving iron unit and the ultra-high frequency moving iron unit on which the nozzles are provided are flush with each other. 4 . 4. The moving iron module according to claim 3, characterized in that, a metal sheet for fixing the high-frequency moving iron unit and the ultra-high frequency moving iron unit is also provided, and the intermediate frequency moving iron unit is fixed on An end of the metal sheet away from the nozzle of the high frequency moving iron unit and/or the ultra high frequency moving iron unit. 5. The moving iron module according to claim 4, characterized in that, a metal sheet is respectively arranged on the high frequency moving iron unit and the ultra high frequency moving iron unit, and the metal sheet includes The frequency moving iron unit and the cantilever end of the ultra-high frequency moving iron unit, and the medium frequency moving iron unit is fixed between the cantilever ends of the two metal sheets. 6. The moving iron module according to claim 1, characterized in that, the intermediate frequency moving iron unit, the high frequency moving iron unit and the ultra high frequency moving iron unit respectively form a series group with one of the capacitors to form three series groups, the three series groups are connected in parallel. 7. The moving iron module according to claim 1, wherein the intermediate frequency moving iron unit and one capacitor form a series group; after the high frequency moving iron unit and the ultra high frequency moving iron unit are connected in parallel It is connected in series with one of the capacitors to form another series group, and the one series group is connected in parallel with the other series group. 8. The moving iron module according to claim 1, wherein the intermediate frequency moving iron unit and one capacitor form a series group; between the high frequency moving iron unit and the ultrahigh frequency moving iron unit One of the capacitors is connected in series to form another series group, and the one series group and the other series group are connected in parallel. 9. An earphone, characterized in that it comprises the moving iron module according to any one of claims 1 to 8, a moving coil unit and a housing; the moving coil unit and the moving iron module are accommodated in the housing In the body, the housing includes a base with a sound guide tube and a top cover installed on the base, and the high frequency moving iron unit and the ultra high frequency moving iron unit are arranged in the sound guide tube. 10. The earphone according to claim 9, characterized in that, the sound outlets of the high-frequency moving iron unit and the ultra-high frequency moving iron unit are close to the sound outlet of the sound guide tube; the intermediate frequency moving iron unit The sound nozzle is arranged on the side facing the sound hole of the sound guide tube.