CN205680702U - A kind of integration packaging long afterglow LED luminescence chip - Google Patents
A kind of integration packaging long afterglow LED luminescence chip Download PDFInfo
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- CN205680702U CN205680702U CN201620517604.8U CN201620517604U CN205680702U CN 205680702 U CN205680702 U CN 205680702U CN 201620517604 U CN201620517604 U CN 201620517604U CN 205680702 U CN205680702 U CN 205680702U
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- 238000004020 luminiscence type Methods 0.000 title claims abstract description 33
- 230000010354 integration Effects 0.000 title claims abstract description 26
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 25
- 239000003292 glue Substances 0.000 claims abstract description 39
- 239000010410 layer Substances 0.000 claims description 117
- 239000000463 material Substances 0.000 claims description 48
- 239000002346 layers by function Substances 0.000 claims description 23
- 230000003287 optical effect Effects 0.000 claims description 23
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- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 48
- 229920005989 resin Polymers 0.000 description 23
- 239000011347 resin Substances 0.000 description 23
- 230000005540 biological transmission Effects 0.000 description 10
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- 238000009795 derivation Methods 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
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- 238000005286 illumination Methods 0.000 description 5
- 239000010453 quartz Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000005084 Strontium aluminate Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- FNWBQFMGIFLWII-UHFFFAOYSA-N strontium aluminate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Sr+2].[Sr+2] FNWBQFMGIFLWII-UHFFFAOYSA-N 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
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- 239000013530 defoamer Substances 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 230000005764 inhibitory process Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- -1 type Substances 0.000 description 3
- 241001062009 Indigofera Species 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
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- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 1
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- 238000002834 transmittance Methods 0.000 description 1
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Abstract
Integration packaging long afterglow LED luminescence chip, it is characterised in that include circuit base plate layer (1), LED wafer layer (2), long-persistence luminous layer (5), fence (6)；Circuit base plate layer (1) is arranged above with one or more LED wafer layers (2), circuit base plate layer (1) periphery of LED wafer layer (2) surrounding is arranged above with fence (6), and the LED wafer layer (2) in fence (6) is arranged above with long-persistence luminous layer (5).Described a kind of integration packaging long afterglow LED luminescence chip, comprises the following steps: expand crystalline substance, die bond, bonding wire, it is characterised in that also include the long-persistence luminous layer of the cast (5) after fixing and pour into a mould LED fluorescent glue layer (4).The characteristics of luminescence of the existing common LED of this utility model has again Characteristics of Long Luminosity, light-emitting area integration packaging big, low cost long afterglow LED luminescence chip.
Description
Technical field
This utility model belongs to LED luminescence chip field, is specifically related to a kind of integration packaging long afterglow LED luminescence chip.
Background technology
Many performances such as LED product has long working life, and power consumption low-light level is high, are the most significantly used in various illumination and show
The field such as show.Seek the device with long-life function that more economizes on electricity, be the mission of luminous industry, especially reducing greenhouse emissions
And under the main trend of low-carbon (LC) concept.But, in some applications, it is often necessary to the long luminescent device of some low-light levels,
Such as the traffic mark in road markings, tunnel, outdoor billboard etc..Thus have people expect utilizing the characteristic of long-afterglow material with
The product that LED junction closes, Chinese patent publication No. CN101140971 discloses a kind of LED single vertical encapsulation (lamp) and pushes up
The method of end parcel long after glow luminous material manufactures long afterglow LED；Same Chinese Patent Application No. 201410096331.X is public
A kind of similar surfaces of cloth attachment (SMD) method is above single LEDs or side is equipped with long-afterglow material.These way operations
Difficult control, later stage installation cost is high, and particularly large area long-afterglow luminescent panel cost of manufacture is high, and later stage goods manufacturing process is numerous
Trivial, integrated cost is high.Long-persistence luminous part is uneven.The most commercially it is difficult to obtain actual application.
Utility model content
The technical problems to be solved in the utility model is to provide the characteristics of luminescence of a kind of existing common LED and has again long afterglow
The characteristics of luminescence, light-emitting area are big, luminous uniform, the integration packaging long afterglow LED luminescence chip of post-production low cost.
The technical solution of the utility model is:
A kind of integration packaging long afterglow LED luminescence chip, it is characterised in that include circuit base plate layer (1), LED wafer layer
(2), long-persistence luminous layer (5), fence (6)；Circuit base plate layer (1) is arranged above with one or more LED wafer layers (2),
Circuit base plate layer (1) periphery of LED wafer layer (2) surrounding is arranged above with fence (6), on the LED wafer layer (2) in fence (6)
Face is provided with long-persistence luminous layer (5).
Further, it is provided with optical functional layer (3) between long-persistence luminous layer (5) two adjacent LED wafer layer (2) below
Or LED fluorescent glue layer (4), or, long-persistence luminous layer (5) is arranged below LED fluorescent glue layer (4), under LED fluorescent glue layer (4)
It is provided with optical functional layer (3) between two adjacent LED wafer layer (2) in face.
Further, LED wafer layer (2) is:
On the substrate of the direct paster of multiple LED wafer online roadbed flaggy；Can install as required circle, square or
Other shaped formation；LED wafer is by bonding line and the connection on circuit base plate.LED wafer selects the indigo plant that wavelength is shorter
The wafer of light, purple light or ultraviolet light.
Optical functional layer (3):
The Coating Materials that this layer of employing has excellent reflective function is made.This layer i.e. can be designed to sky as required
The bowl-shape dead ahead that reflexed to by light-ray condensing in chamber, improves the brightness of dead ahead；Can also directly be completely spread out, so that front reaches
Maximum luminous visible angle.This layer is not the most essential.
Long-persistence luminous layer (5):
Long-persistence luminous layer plays the effect of LED wafer power-off follow-up supervention light.Swash when LED wafer luminescence when simultaneously
Sending out long-afterglow material, the long after glow luminous material using different-grain diameter is mutually mixing cured with transparent resin, or, use different-grain diameter
Long after glow luminous material, transparent resin mutually mixing cured with anaclasis medium, the selection of anaclasis medium: preferably anaclasis is situated between
Matter is quartz particles that the good printing opacity of refractive transmission performance is good or the good glass particle of the good printing opacity of refractive transmission performance, it is therefore intended that shape
Become microchannel beneficially long after glow luminous material fully excites the derivation with light.By control long-persistence luminous layer thickness and
The size of luminescent material controls the luminosity after LED penetrates long-persistence luminous layer.
By long after glow luminous material and resin according to being cast in after certain ratio mix homogeneously on LED fluorescent glue layer (4),
Can also cast directly on optical functional layer (3) and LED wafer layer (2).
Above-mentioned a kind of integration packaging long afterglow LED luminescence chip comprises the following steps: expanding crystalline substance, die bond, bonding wire, its feature exists
In, also include the long-persistence luminous layer of the cast (5) after fixing and pour into a mould LED fluorescent glue layer (4)；Described fixing refer to optics
Functional layer (3), uses glue to be fixed between circuit base plate layer (1) wafer (2) by optical functional layer (3)；
The long-persistence luminous layer of described cast (5) is:
A, the selection of long-afterglow material: the strontium aluminate long-afterglow luminescent materials that prioritizing selection luminescent properties is high；As required
Selecting glow color is yellowish green or bluish-green luminescent material.
B, the selection of glue: glue needs to select that transparency percent of pass high, light is high, contractility is little, good weatherability, water-fast
Good, the color inhibition of property, liquid resin；Resin can be one-component can also be many components.Such as: organosilicon, PU type, acrylic acid
The various resins such as type, epoxy type, unsaturated-resin.
C, the selection of anaclasis medium: preferably anaclasis medium is the quartz particles or folding that the good printing opacity of refractive transmission performance is good
Penetrate the glass particle that the good printing opacity of transmission performance is good, it is therefore intended that form fully exciting of microchannel beneficially long after glow luminous material
Derivation with light.
The long-afterglow material that will choose: transparent resin: refractive medium is according to the ratio that mass ratio is 1:0.2～8:0～0.3
Pour into a mould after example mixing.Additionally can add the examinations such as appropriate levelling agent, defoamer, fire retardant, age resister according to actual needs
One or several of agent, thus improve the planarization of luminous body, or make luminous body goods have certain anti-flammability, anti-ageing
The property changed.
The long afterglow integration packaging LED chip using this utility model to make has the advantage that
The characteristics of luminescence of existing common LED has again Characteristics of Long Luminosity, controls existing power saving function by circuit, again
The dazzle sense when being interrupted luminous can be reduced.
The long afterglow LED luminescence chip of integration mode encapsulation, can make large-area long afterglow LED luminescence chip, energy
Enough degree that is stimulated improving long-afterglow material the most to greatest extent, it is high, luminous that whole long afterglow partially-excited sends out luminosity rear
Uniformly.
It is suitable for mass, modularized production, the welding in later stage and the encapsulation link of long-afterglow material are greatly reduced, thus
Reduce the cost of manufacture of the finished product long persistence light-emitting lamp in later stage.
This integration packaging mode is directly or indirectly cast in LED wafer due to long afterglow layer, thus overall fastness with
Sealing property is the best, and the service life therefore using the luminescent device of this utility model making is long, and application is broader.
Accompanying drawing explanation
Fig. 1 is the sectional structure schematic diagram that this utility model is created.
Detailed description of the invention
It is a kind of integration packaging long afterglow LED luminescence chip for the demand, such as our utility model of Fig. 1, its feature
It is, including circuit base plate layer (1), LED wafer layer (2), optical functional layer (3), LED fluorescent glue layer (4), long-persistence luminous layer
(5), fence (6)；Circuit base plate layer (1) is arranged above with one or more LED wafer layers (2), LED wafer layer (2) surrounding
Circuit base plate layer (1) periphery be arranged above with fence (6), the LED wafer layer (2) in fence (6) is arranged above with long-persistence luminous
Layer (5).
It is provided with optical functional layer (3) between long-persistence luminous layer (5) two adjacent LED wafer layer (2) below or LED is glimmering
Light glue-line (4), or, long-persistence luminous layer (5) is arranged below LED fluorescent glue layer (4), LED fluorescent glue layer (4) below two
Optical functional layer (3) it is provided with between adjacent LED wafer layer (2).
Circuit base plate layer (1):
Circuit base plate layer mainly plays support and conducting function, and this layer mainly includes substrate layer and line layer.Base
Plate can use the metal materials such as copper aluminum, it is possible to uses ceramic material.Substrate can be circular, square or other shape.Root
Series, parallel or series connection and the pattern of parallel combination can be used according to the circuit needed on circuit base plate layer.
LED wafer layer (2):
On the substrate of the direct paster of multiple LED wafer online roadbed flaggy；Can install as required circle, square or
Other shaped formation；LED wafer is by bonding line and the connection on circuit base plate.LED wafer selects the indigo plant that wavelength is shorter
The wafer of light, purple light or ultraviolet light.
Optical functional layer (3):
Optical functional layer mainly plays the effect of reflection light.This layer uses the Coating Materials just having excellent reflective function
It is made.This layer i.e. can be designed to the bowl-shape dead ahead that reflexed to by light-ray condensing of cavity as required, improves dead ahead
Brightness；Can also directly be completely spread out, so that front reaches maximum luminous visible angle.This layer can have according to actual needs can
Nothing.
LED fluorescent glue layer (4):
It is cast on optical functional layer and LED core lamella (2) after this layer of LED fluorescent powder using high-quality and glue mixing,
LED fluorescent powder can be selected according to the needs of luminous wavelength, and fluorescent material and the matched proportion density of glue.This layer of basis
It is actually needed not essential.
Long-persistence luminous layer (5):
Long-persistence luminous layer plays the effect of LED wafer power-off follow-up supervention light.Swash when LED wafer luminescence when simultaneously
Sending out long-afterglow material, the long after glow luminous material using different-grain diameter is mutually mixing cured with transparent resin, or, use different-grain diameter
Long after glow luminous material, transparent resin mutually mixing cured with anaclasis medium, the selection of anaclasis medium: preferably anaclasis is situated between
Matter is quartz particles that the good printing opacity of refractive transmission performance is good or the good glass particle of the good printing opacity of refractive transmission performance, it is therefore intended that shape
Become microchannel beneficially long after glow luminous material fully excites the derivation with light.
The size of thickness and luminescent material by controlling long-persistence luminous layer controls LED and penetrates long-persistence luminous
Luminosity after Ceng.
According to light transmittance, luminosity, the needs of glow color, long after glow luminous material preferred luminosity high twilight sunset is good
Aluminate or the long after glow luminous material of the material such as silicate.
Resin can select the material that the transparencys such as PU, PVC, epoxy, unsaturated-resin are high, weather resistance is good.
By long after glow luminous material and resin according to being cast in after certain ratio mix homogeneously on LED fluorescent glue layer (4),
Can also cast directly on optical functional layer (3) and LED wafer layer (2).
Fence (6):
Use and can form good box dam shape, do not subside；With substrate be respectively provided with excellence the enclosure wall glue point of adhesive force
Glue forms, and plays fence effect.
The manufacture method of a kind of integration packaging long afterglow LED luminescence chip comprises the following steps:
1 expands crystalline substance: the stacked wafers sorting bought is come, it is simple to next step die bond uses.
2 die bonds: wafer uses glue be fixed on circuit base plate layer (1), and short time baking allows glue curing.
3 bonding wires: the circuit of wafer with circuit base plate layer (1) is welded with by bonding line, and the test welding situation that is energized.
4 by optical functional layer (3), use glue optical functional layer (3) is fixed on circuit base plate layer (1) wafer (2) it
Between.
5 cast LED fluorescent glue layer (4): be cast in optical function after the LED fluorescent powder of this layer of employing high-quality and glue mixing
On layer and LED core lamella (2).
The 6 long-persistence luminous layer of cast (5):
The selection of A long-afterglow material: the strontium aluminate long-afterglow luminescent materials that prioritizing selection luminescent properties is high；Select as required
Select
Glow color is yellowish green or bluish-green granularity luminescent material about 100～300 mesh.
The selection of B glue: glue needs to select that transparency percent of pass high, light is high, contractility is little, good weatherability, water-fast
Good, the color inhibition of property, liquid resin；Resin can be one-component can also be many components.Such as: organosilicon, PU type, acrylic acid
The various resins such as type, epoxy type, unsaturated-resin.
The selection of C anaclasis medium: preferably anaclasis medium is the quartz particles or folding that the good printing opacity of refractive transmission performance is good
Penetrate the glass particle that the good printing opacity of transmission performance is good, it is therefore intended that form fully exciting of microchannel beneficially long after glow luminous material
Derivation with light.
The long-afterglow material that will choose: transparent resin: refractive medium is according to the ratio that mass ratio is 1:0.2～8:0～0.3
Pour into a mould after example mixing.Additionally can add the examinations such as appropriate levelling agent, defoamer, fire retardant, age resister according to actual needs
One or several of agent, thus improve the planarization of luminous body, or make luminous body goods have certain anti-flammability, anti-ageing
The property changed.
7 is long roasting: allows glue curing.
Survey after 8: whether bright test energy is and electrical property is the most up to standard.
This utility model has the integration packaging LED luminescence chip of long afterglow performance, has phase when i.e. can be energized by LED
Luminous to high brightness, utilize the light-decay characteristic of long-afterglow material to keep relatively low-brightness luminous after power-off simultaneously.
The long afterglow integration packaging LED chip that this utility model makes can be fabricated directly into various long-persistence luminous lamp
Tool, is applied to need the place of emergency lighting or instruction, and after running into emergency power failure, what this product can also continue sends out
Light, can play certain illumination and indicative function when having a power failure when.
Long afterglow integration packaging LED chip of the present utility model can also be used integrated mode, be fabricated to large-area
Luminescent screen.For industries such as outdoor advertisings.
Owing to this utility model product has long afterglow function, between this utility model product and power supply, therefore add one
The individual switch power controller with sequential packet output, presses the power supply of some cycles interval by it to this product, when energising
In the case of LED chip luminescence simultaneously inspired long-lasting luminescent layer, when layer continuous illumination long-persistence luminous after power-off, so circulation is past
Multiple.I.e. can be with retainer member continuous luminous, it is also possible on the premise of ensureing certain brightness, save electric energy.Decrease LED luminous
The working time of body, substantially prolongs the service life of device.
Example one, a kind of square long afterglow LED luminescence chip
Such as Fig. 1, to be 81 LEDs wafers take advantage of 9 square arrangement according to 9, then uses long after glow luminous material direct
LED chip to LED crystal integration packaging.
Circuit base plate layer (1): use and be compounded with the aluminium sheet of line layer as circuit base plate layer.Substrate can use copper
The metal materials such as aluminum, it is possible to use ceramic material.Line layer substantially uses paralleling model, accordingly even when individual wafer occurs
Problem is not to affect very much Integral luminous performance.
LED wafer layer (2): on the substrate of 81 the direct paster of LED wafer online roadbed flaggies, then by bonding line with
Connection on circuit base plate.Being parallel connection between each LED wafer, LED wafer selects wavelength high compared with bob brightness
Blue light wafer.
Optical functional layer (3): use and just have the plated film PET material of excellent reflective function to be made.It is designed to cavity bowl
Shape, the corresponding cavity of each LED wafer, light-ray condensing can be reflexed to dead ahead by this cavity, improves the brightness of dead ahead.
Fence (6): use and can form good box dam shape, the epoxy glue not subsided is formed at substrate front side peripheral point glue
One foursquare fence dam.
Long-persistence luminous layer (5): use the yellowish green long after glow luminous material of strontium aluminate and epoxies LED packaging plastic according to
After 1:1 mixing, directly it is poured on LED wafer and optical functional layer solidification.
Long-persistence luminous layer (5) is arranged below LED fluorescent glue layer (4).
This square long afterglow LED luminescence chip can be fabricated to need green light and have the light fixture of long afterglow function.Use
The light fixture that this long afterglow LED luminescence chip makes can directly use civil power to be used for various building interior, tunnel, underpass etc.
The illumination of underground, after occurring suddenly emergency to have a power failure, this flat lamp can also keep one longer period persistently to send out
Light, guides people to evacuate.Can also be applied on various military engineering and naval vessel, illuminating effect is played in energising at ordinary times, works as entrance
The when of combat situation, after stopping power supply, the effect of low illumination can be played and also can guarantee that and be difficult to be realized by enemy.
The manufacture method of a kind of square long afterglow LED luminescence chip comprises the following steps:
1 expands crystalline substance: the stacked wafers sorting bought is come, it is simple to next step die bond uses.
2 die bonds: wafer uses glue be fixed on circuit base plate layer (1), and short time baking allows glue curing.
3 bonding wires: the circuit of wafer with circuit base plate layer (1) is welded with by bonding line, and the test welding situation that is energized.
4 by optical functional layer (3), use glue optical functional layer (3) is fixed on circuit base plate layer (1) wafer (2) it
Between.
5 cast LED fluorescent glue layer (4): be cast in optical function after the LED fluorescent powder of this layer of employing high-quality and glue mixing
On layer and LED core lamella (2).
The 6 long-persistence luminous layer of cast (5):
The selection of A long-afterglow material: the strontium aluminate long-afterglow luminescent materials that prioritizing selection luminescent properties is high；Select as required
Select
Glow color is yellowish green or bluish-green granularity luminescent material about 100～300 mesh.
The selection of B glue: glue needs to select that transparency percent of pass high, light is high, contractility is little, good weatherability, water-fast
Good, the color inhibition of property, liquid resin；Resin can be one-component can also be many components.Such as: organosilicon, PU type, acrylic acid
The various resins such as type, epoxy type, unsaturated-resin.
The selection of C anaclasis medium: preferably anaclasis medium is the quartz particles or folding that the good printing opacity of refractive transmission performance is good
Penetrate the glass particle that the good printing opacity of transmission performance is good, it is therefore intended that form fully exciting of microchannel beneficially long after glow luminous material
Derivation with light.
The long-afterglow material that will choose: transparent resin: refractive medium is according to the ratio that mass ratio is 1:0.2～8:0～0.3
Pour into a mould after example mixing.Additionally can add the examinations such as appropriate levelling agent, defoamer, fire retardant, age resister according to actual needs
One or several of agent, thus improve the planarization of luminous body, or make luminous body goods have certain anti-flammability, anti-ageing
The property changed.
7 is long roasting: allows glue curing.
Survey after 8: whether bright test energy is and electrical property is the most up to standard.
This utility model has the integration packaging LED luminescence chip of long afterglow performance, has phase when i.e. can be energized by LED
Luminous to high brightness, utilize the light-decay characteristic of long-afterglow material to keep relatively low-brightness luminous after power-off simultaneously.
The long afterglow integration packaging LED chip using this utility model to make has the advantage that；
The characteristics of luminescence of existing common LED has again Characteristics of Long Luminosity, controls existing power saving function by circuit, again
The dazzle sense when being interrupted luminous can be reduced.
The long afterglow LED luminescence chip of integration mode encapsulation, it is possible to improve being stimulated of long-afterglow material to greatest extent
Degree, whole long afterglow partially-excited sends out luminosity rear high, luminous uniformly.
It is suitable for mass, modularized production, the welding in later stage and the encapsulation link of long-afterglow material are greatly reduced, thus
Reduce the cost of manufacture of the finished product long persistence light-emitting lamp in later stage.
This integration packaging mode is directly or indirectly cast in LED wafer due to long afterglow layer, thus overall fastness with
Sealing property is the best, and the service life therefore using the luminescent device of this utility model making is long, and application is broader.
Claims (4)
1. an integration packaging long afterglow LED luminescence chip, it is characterised in that include circuit base plate layer (1), LED wafer layer
(2), long-persistence luminous layer (5), fence (6)；Circuit base plate layer (1) is arranged above with more than one LED wafer layer (2), LED wafer
Circuit base plate layer (1) periphery of layer (2) surrounding is arranged above with fence (6), and the LED wafer layer (2) in fence (6) is arranged above with long
Afterglow layer (5).
2. an integration packaging long afterglow LED luminescence chip, it is characterised in that include circuit base plate layer (1), LED wafer layer
(2), long-persistence luminous layer (5), fence (6)；Circuit base plate layer (1) is arranged above with more than one LED wafer layer (2), LED wafer
Circuit base plate layer (1) periphery of layer (2) surrounding is arranged above with fence (6), and the LED wafer layer (2) in fence (6) is arranged above with long
Afterglow layer (5)；It is provided with optical functional layer (3) between long-persistence luminous layer (5) two adjacent LED wafer layer (2) below
Or LED fluorescent glue layer (4), or, long-persistence luminous layer (5) is arranged below LED fluorescent glue layer (4), under LED fluorescent glue layer (4)
It is provided with optical functional layer (3) between two adjacent LED wafer layer (2) in face.
A kind of integration packaging long afterglow LED luminescence chip the most according to claim 1 and 2, it is characterised in that described
LED wafer layer (2) is on the substrate of the direct paster of multiple LED wafer online roadbed flaggy；LED wafer layer (2) is generally circular in shape,
Square or other spread geometry；Described LED wafer is the LED wafer of shorter blue light, purple light or the ultraviolet light of wavelength.
A kind of integration packaging long afterglow LED luminescence chip the most according to claim 2, it is characterised in that described optics
Functional layer (3) material is the Coating Materials of excellent reflective function；It is bowl-shape or be completely spread out shape that optical functional layer (3) is shaped as cavity
Shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620517604.8U CN205680702U (en) | 2016-05-31 | 2016-05-31 | A kind of integration packaging long afterglow LED luminescence chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620517604.8U CN205680702U (en) | 2016-05-31 | 2016-05-31 | A kind of integration packaging long afterglow LED luminescence chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205680702U true CN205680702U (en) | 2016-11-09 |
Family
ID=57437036
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620517604.8U Expired - Fee Related CN205680702U (en) | 2016-05-31 | 2016-05-31 | A kind of integration packaging long afterglow LED luminescence chip |
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| Country | Link |
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| CN (1) | CN205680702U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870306A (en) * | 2016-05-31 | 2016-08-17 | 浙江明辉发光科技有限公司 | Integrated package long-afterglow LED light-emitting chip and manufacturing method thereof |
| CN107816644A (en) * | 2017-11-20 | 2018-03-20 | 中山驰马灯饰照明设计工程有限公司 | A Warm Tone White Light Long Afterglow LED Lamp |
-
2016
- 2016-05-31 CN CN201620517604.8U patent/CN205680702U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870306A (en) * | 2016-05-31 | 2016-08-17 | 浙江明辉发光科技有限公司 | Integrated package long-afterglow LED light-emitting chip and manufacturing method thereof |
| CN107816644A (en) * | 2017-11-20 | 2018-03-20 | 中山驰马灯饰照明设计工程有限公司 | A Warm Tone White Light Long Afterglow LED Lamp |
| CN107816644B (en) * | 2017-11-20 | 2019-08-20 | 中山驰马灯饰照明设计工程有限公司 | Warm tone white light long afterglow LED lamp |
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