CN205657414U - Board type current protection device - Google Patents

Abstract

The utility model provides a plate-type current protection device, which comprises a circuit support plate; a pair of conductive regions formed at corresponding end edges of the circuit carrier; a current lead formed between and electrically connected to the pair of conductive regions, a fusing region being defined at a middle position of the current lead; a melting aid material layer covering the melting region of the current lead. The utility model also provides a plate-type current protection device, which comprises a circuit substrate, a current protection device and a current protection device, wherein the circuit substrate is provided with a pair of through holes; a circuit carrier; a pair of conductive areas formed at the corresponding end edges of the circuit carrier board, the pair of conductive areas being respectively inserted into the pair of through holes of the circuit substrate, and then the pair of conductive areas being respectively soldered to the circuit substrate by solder; a current lead formed between the pair of conductive regions in a printed circuit manner and electrically connecting the pair of conductive regions.

Description

Board type current protection device

technical field

The utility model relates to a current protection device, in particular to a plate type current protection device.

Background technique

In prior art circuit designs, fuses or fuses are used as overcurrent protection components. Fuses are usually made of low melting point pewter, zinc, copper, silver wire or sheet materials. When the current on the circuit is too large, the fuse generates high temperature and blows, resulting in an open circuit and interrupting the current to protect the circuit.

According to different usage occasions, it may be made into various types such as glass tube, ceramic tube, cylinder, sheet, pin type, surface mount (SMD) type, etc. Each type of fuse product has its own advantages and application fields, but also has its own disadvantages. For example, glass tube-shaped and ceramic tube-shaped fuse products are not easy to assemble and are not suitable for rapid mass production. Chip, pin type, and surface mount (SMD) type fuse products are especially suitable for the use of current miniaturized electronic products, but it is not easy to combine low melting point materials with general circuit manufacturing processes during manufacturing. The manufacturing process steps It is relatively complicated and not suitable for the general printed circuit board manufacturing process (for example, yellow light process).

In today's industrial needs, it should meet the needs of rapid assembly, miniaturization, simple manufacturing, low cost, and fast processing. However, in the current various types of fuse products, although each has its own advantages and application fields, it is not easy to meet these conditions.

Utility model content

Therefore, in view of the lack of traditional fuse products, the main purpose of this utility model is to provide a plate-type current protection device to meet the needs of fast assembly, miniaturization, simple manufacturing, low cost, and fast processing.

The technical means adopted by the utility model to solve the problems of the prior art is to form a current wire between a pair of conductive regions of a circuit carrier, and define a fusing area on the current wire. A flux-aiding material layer covers the fusing area of the current lead. The melting point of the fusion-aiding material layer is lower than the melting point of the current wire when a current exceeding the rated current value passes through. When a current exceeding the rated current value passes through the current wire, the melting-aiding material layer is first melted, and the fusing area of the current wire covered by the melting-aiding material layer is heated by the melted melting-aiding material layer Then it is fused, and the current wire is disconnected to achieve the current protection function.

According to one aspect of the present utility model, a kind of plate current protection device is provided, it comprises:

a circuit carrier;

a pair of conductive areas formed at the corresponding end edges of the circuit carrier;

A current wire is formed between the pair of conductive areas and electrically connected to the pair of conductive areas, and a fusing area is defined at the middle section of the current wire;

A melting aid material layer covers the fusing area of the current lead.

According to another aspect of the present utility model, there is also provided a plate type current protection device, which includes:

A circuit substrate with a pair of through holes;

a circuit carrier;

A pair of conductive regions are formed on the corresponding edge of the circuit carrier board, the pair of conductive regions are respectively inserted in the pair of through holes of the circuit substrate, and then the pair of conductive regions are respectively fixed on the circuit board with solder Substrate;

A current wire is formed between the pair of conductive regions in the form of a printed circuit and electrically connects the pair of conductive regions.

Wherein, the current wire is made of one of copper wire and alloy wire.

Wherein, the current wire is one of a straight line structure and a bent structure.

Wherein, the fluxing material layer is made of one of alloy material and fluxing agent.

Wherein, the pair of conductive regions are respectively inserted into a pair of through holes opened on a circuit substrate, and then the pair of conductive regions are respectively welded and fixed on the circuit substrate with solder.

Wherein, the surfaces of the flux-aiding material layer, the current wire and the conductive region are also covered with a protective layer.

In effect, the utility model has the following advantages:

1. The cost of materials used in the plate-type current protection device of the present invention is low, which can reduce the material cost of the product.

2. During assembly, it can be easily completed by using the steps of general electronic component insertion and welding.

3. The utility model has a small body after commercialization, which is beneficial to the miniaturization of component products, and is especially suitable for electronic products that require lightness, thinness and shortness.

4. The utility model can be manufactured by using the general manufacturing process of printed circuit boards (for example, yellow light manufacturing process).

5. In terms of material selection, the utility model is not limited to low-melting-point pewter, zinc, copper, and silver wire-like or sheet-like materials currently used as fuses.

6. When the utility model is manufactured, a large circuit board can be used to manufacture multiple current protection elements at the same time, and then cut into individual current protection element products, so that the manufacture is simple and fast.

7. The thickness and width of the current wire used in the utility model can be determined according to the required rated current value during practical application. Therefore, it is easy to control various electrical characteristics (such as rated current value, rated voltage value, rated power value) and other values of the current protection element of the present invention during design and manufacture.

The specific technology adopted in the utility model will be further described through the following examples and accompanying drawings.

Description of drawings

Fig. 1 is a three-dimensional exploded view when some components of the plate-type current protection device of the present invention are separated.

Fig. 2 is a perspective view of the plate type current protection device of the present invention.

Fig. 3 is a sectional view of section A-A in Fig. 2 .

Fig. 4 is a sectional view of section B-B in Fig. 2 .

FIG. 5 is a perspective view of the plate-type current protection device of the present invention inserted and combined with a circuit substrate.

FIG. 6 shows a schematic side view of the plate-type current protection device of the present invention before being inserted and combined with a circuit substrate.

FIG. 7 shows a schematic side view of the plate-type current protection device of the present invention after it is inserted and combined with a circuit substrate.

detailed description

Referring to Fig. 1 and Fig. 2, Fig. 1 is a three-dimensional exploded view when some components of the plate-type current protection device of the present invention are separated, and Fig. 2 is a perspective view of the plate-type current protection device of the present invention. As shown in the figure, the plate-type current protection device 100 of the present invention prepares a roughly U-shaped circuit carrier 1, and forms a pair of corresponding conductive electrodes at the corresponding end edges 11 and 12 of the circuit carrier 1. District 21, 22. The conductive regions 21 and 22 are made of one of copper wires and alloy wires, and the conductive regions 21 and 22 can be formed by common prior art printed circuit boards, yellow light processes or coating methods.

Referring to Fig. 3 and Fig. 4 at the same time, the sectional views of the A-A section and the B-B section in Fig. 2 are shown respectively. As shown, a current wire 3 is formed between the pair of conductive regions 21 , 22 and electrically connects the pair of conductive regions 21 , 22 . The thickness and width of the current wire 3 can be determined according to the rated current value required in practical applications. However, values related to electrical characteristics (such as rated current value, rated voltage value, and rated power value) can be marked on selected positions of the circuit carrier board 1 by printing.

A fusing area 31 is defined at about the middle of the current wire 3 , and the fusing area 31 is covered with a melting aid material layer 4 . Preferably, the surfaces of the flux-aiding material layer 4 , the current wire 3 and the conductive regions 21 , 22 may be covered with a protection layer 5 .

The material of the melting-aiding material layer 4 can be made of one of alloy material or fluxing agent, the current wire 3 is made of one of copper wire and alloy wire, and the melting-aiding material layer 4 exceeds a rated The melting point of the current value for melting is lower than the melting point of the current wire 3 when the same current is passed.

In the embodiment shown in the figure, the current wire 3 is made into a straight line structure, but of course it can also be designed into a bent structure (S shape) or other types according to the required current size and the properties of the selected material.

Referring to FIG. 5 , it shows a perspective view of the plate-type current protection device 100 of the present invention inserted and combined in front of a circuit substrate 6 in practical application. FIG. 6 shows a schematic side view of the panel current protection device 100 of the present invention before being inserted and combined with a circuit substrate 6 . FIG. 7 shows a schematic side view of the panel current protection device 100 of the present invention after being inserted and combined with a circuit substrate 6 .

As shown in the figure, a pair of through holes 61 and 62 are opened at corresponding positions of the circuit board 6 . After the protruding pins of the plate-type current protection device 100 of the present invention are respectively inserted into the through holes 61 and 62 , the conductive regions 21 and 22 are soldered to the circuit substrate 6 with solders 71 and 72 respectively. When a current passes through the conductive regions 21 , 22 and the current wire 3 of the plate type current protection device 100 of the present invention, the current wire 3 acts as an overcurrent protection element.

When a current exceeding the rated current value passes through the current wire 3, the melting-aiding material layer 4 will first produce a molten state, and the fusing region 31 of the current wire 3 covered by the melting-aiding material layer 4 is affected by the melting The heating of the flux-aiding material layer 4 is further fused, so that the current wire 3 is disconnected, thereby achieving the purpose of protecting the circuit.

The above embodiments are described with only one current protection component product. In actual manufacturing, a large circuit board can be used to manufacture multiple current protection elements at the same time, and then cut into products of each current protection element.

The above-mentioned embodiments are only used to illustrate the utility model, and are not used to limit the scope of the utility model. Any other equivalent modification or replacement that does not deviate from the spirit disclosed in the utility model should be included in the claims within range.

Symbol Description

100 plate type current protection device

1 circuit board

11, 12 edge

21, 22 conductive area

3 current leads

31 Fusing zone

4 layer of fluxing material

5 layers of protection

6 Circuit board

61, 62 through holes

71, 72 Solder

Claims (9)

1. a board-like current protective device, including:

One circuit board；

Pair of conductive district, is formed at the corresponding ora terminalis of this circuit board；

One ampere wires, be formed at this to conduction region between, and electrically connect this to conduction region, at this ampere wires middle section position Definition has a fused area；

One helps and melts material layer, covers in this fused area of this ampere wires.

Board-like current protective device the most according to claim 1, wherein this ampere wires is made with one of copper cash, alloy wire Become.

Board-like current protective device the most according to claim 1, wherein this ampere wires be linear structure, bending structure it One.

Board-like current protective device the most according to claim 1, wherein this help melt material layer with alloy material, flux it Made by one.

Board-like current protective device the most according to claim 1, wherein this is plugged on a circuit substrate respectively to conduction region In a pair through hole offered, then with solder respectively by this to conduction region solid welding at this circuit substrate.

Board-like current protective device the most according to claim 1, wherein this helps and melts material layer, this ampere wires and this conduction The surface in district also covers a protective layer.

7. a board-like current protective device, including:

One circuit substrate, offers a pair through hole；

One circuit board；

Pair of conductive district, is formed at the corresponding ora terminalis of this circuit board, and this is plugged on this circuit substrate respectively to conduction region This in through hole, then with solder respectively by this to conduction region solid welding at this circuit substrate；

One ampere wires, with printed circuit mode be formed at this to conduction region between, and electrically connect this to conduction region.

Board-like current protective device the most according to claim 7, wherein this ampere wires is made with one of copper cash, alloy wire Become.

Board-like current protective device the most according to claim 7, wherein this ampere wires be linear structure, bending structure it One.