CN205644573U - Fingerprint sensor's sensing apparatus - Google Patents
Fingerprint sensor's sensing apparatus Download PDFInfo
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- CN205644573U CN205644573U CN201620176294.8U CN201620176294U CN205644573U CN 205644573 U CN205644573 U CN 205644573U CN 201620176294 U CN201620176294 U CN 201620176294U CN 205644573 U CN205644573 U CN 205644573U
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Abstract
The utility model discloses a fingerprint sensor's sensing apparatus. The device includes fingerprint input module and fingerprint identification module, fingerprint identification module includes fingerprint sensor and fingerprint control chip, fingerprint sensor includes dielectric layer, many capacitanc top crowns and many capacitanc bottom crowns, top crown and bottom crown lie in the surperficial relatively of dielectric layer respectively, the top crown passes through dielectric layer separation and a plurality of induction points of chiasma formation with the bottom crown, fingerprint control chip is coupled with bottom crown and fingerprint input module electrical property respectively, bottom crown and fingerprint input module receive the radiofrequency signal of fingerprint control chip transmission. The utility model discloses a when bipolar plate fingerprint sensor, radiofrequency signal beat on the driving electrode circuit, still beat in user and the contact point finger part of touch panel like glass, can obtain more clear fingerprint image information, improve discernment accuracy nature.
Description
Technical field
This utility model relates to biometrics identification technology, in particular to the sensing device of fingerprint sensor.
Background technology
Some biological characteristic of human body (such as fingerprint, palmmprint etc.) is the unique feature of human body, and their complexity can provide enough feature for identifying.
Finger print/palm print identification technology is the most ripe current and cheapest biometrics identification technology of price.Wherein, fingerprint identification technology is most widely used, as all can employing fingerprint identification technology on the electronic equipments such as gate inhibition, notebook computer, mobile phone, automobile, bank paying.
The rough lines of finger surface skin is made up of ridge line figure, fingerprint recognition be i.e. the feature utilizing fingerprint uniqueness and stability to realize identification, and fingerprint is remembered without user, and is easy to carry.Current fingerprint recognition mode mainly has characteristics of image identification, laser feature identification and slip capacitance sensing.Characteristics of image identification and laser feature identification are utilized respectively visible ray and laser approach and by fingerprint ridge line information retrieval and utilize algorithm to carry out feature analysis, identify Different Individual；Two kinds of methods are required to such as the more complicated space structures such as CCD photoreceptors, laser generator, are unsuitable for lightening application.Conventional slip capacitance sensor is common in notebook computer, scans finger print information by finger slide sensor sensitive surface.Fingerprint recognition speed and space simplification degree are better than the above two, but are unsuitable for that market is huge, it is highly integrated, flexible to require, the Future Consumption electronic applications of light-transmissive equally.
How to make fingerprint sensor be used in mobile electronic device, such as smart mobile phone etc., and the image sensed becomes apparent from and improves the efficiency of fingerprint recognition being the problem that industry is persistently studied.
Accordingly, it would be desirable to the sensing device of a kind of new fingerprint sensor.
Being only used for strengthening the understanding to background of the present utility model in information above-mentioned disclosed in described background section, therefore it can include not constituting the information to prior art known to persons of ordinary skill in the art.
Utility model content
This utility model provides the sensing device of fingerprint sensor, it is possible to strengthen sensing signal, improves resolution.Can be while by emission of radio frequency signals to induction electrode, by the contact point finger part of described emission of radio frequency signals to user Yu fingerprint input module.
Other characteristics of the present utility model and advantage will be apparent from by detailed description below, or the acquistion partially by practice of the present utility model.
According to one side of the present utility model, a kind of sensing device of fingerprint sensor, including fingerprint input module and fingerprint identification module, described fingerprint identification module farther includes fingerprint sensor and fingerprint control chip, described fingerprint sensor includes dielectric layer, a plurality of top crown and a plurality of bottom crown, described top crown and described bottom crown lay respectively on the apparent surface of described dielectric layer, described top crown extends in a first direction setting, described bottom crown is along extended with the second direction that described first direction intersects, described top crown separates and intersects to form multiple induction point with described bottom crown by described dielectric layer, described fingerprint control chip respectively with described bottom crown and described fingerprint input module electric property coupling, described bottom crown and described fingerprint input module receive the radiofrequency signal that described fingerprint control chip is launched.
According to an embodiment of the present utility model, described top crown includes that induction electrode, described bottom crown include drive electrode.
According to an embodiment of the present utility model, described dielectric layer uses transparent pressure sensitive adhesive.
According to an embodiment of the present utility model, described dielectric layer includes dielectric ceramic powder.
According to an embodiment of the present utility model, the span of the dielectric constant of described dielectric layer is more than 6F/m.
According to an embodiment of the present utility model, the span of described dielectric constant is 10-50F/m.
According to an embodiment of the present utility model, described fingerprint input module includes any one in glass, sapphire or ceramic material, and it is arranged on described fingerprint identification module.
According to an embodiment of the present utility model, porose on described fingerprint input module, and insert metal material formation wire in the hole, described wire connects described fingerprint input module and described fingerprint control chip.
According to another aspect of the present utility model, a kind of electronic equipment, including any of the above-described described sensing device.
Sensing device according to fingerprint sensor of the present utility model, it is possible to strengthen sensing signal, improves the resolution that fingerprint recognition is applied to the similar display screens such as glass.
It should be appreciated that it is only exemplary that above general description and details hereinafter describe, this utility model can not be limited.
Accompanying drawing explanation
[form language] describes its example embodiment in detail by referring to accompanying drawing, and above and other target of the present utility model, feature and advantage will become apparent from.
Fig. 1 schematically shows the structure chart of the sensing device of the fingerprint sensor according to this utility model example the first embodiment；
Fig. 2 schematically shows the flow chart of the method for sensing of the fingerprint sensor according to this utility model example the second embodiment.
Detailed description of the invention
It is described more fully with example embodiment referring now to accompanying drawing.But, example embodiment can be implemented in a variety of forms, and is not understood as limited to example set forth herein；On the contrary, it is provided that these embodiments make this utility model will more fully and completely, and the design of example embodiment is conveyed to those skilled in the art all sidedly.Accompanying drawing is only schematic illustrations of the present utility model, is not necessarily drawn to scale.Reference identical in figure represents same or similar part, thus will omit repetition thereof.
Additionally, described feature, structure or characteristic can be combined in one or more embodiment in any suitable manner.In the following description, it is provided that many details thus be given and embodiment of the present utility model fully understood.It will be appreciated, however, by one skilled in the art that the technical solution of the utility model can be put into practice and omit in described specific detail one or more, or other method, constituent element, device, step etc. can be used.In other cases, known features, method, device, realization, material or operation are not shown in detail or describe makes each side of the present utility model thicken to avoid that a presumptuous guest usurps the role of the host.
Some block diagrams shown in accompanying drawing are functional entitys, it is not necessary to must be corresponding with the most independent entity.Software form can be used to realize these functional entitys, or in one or more hardware modules or integrated circuit, realize these functional entitys, or in heterogeneous networks and/or processor device and/or microcontroller device, realize these functional entitys.
It should be noted that be referred to as " being fixed on " another element when element, it can be directly on another element or can also there is element placed in the middle.When an element is considered as " connection " another element, and it can be directly to another element or may be simultaneously present centering elements.Term as used herein " vertical ", " level ", "left", "right" and similar statement are for illustrative purposes only.Term as used herein " and/or " include the arbitrary and all of combination of one or more relevant Listed Items.
Fingerprint identification technology becomes widely used, and is usually used to provide electronic equipment and/or the secure access of data.In general, capacitive fingerprint sensing device can be used to the measurement electric capacity through each capacitive induction point of capacitance type sensor to determine fingerprint image.Electric capacity is the highest, and adjacent or above finger surface distance capacitive induction point is the nearest.Thus, compare the capacitive induction point below fingerprint valley, the capacitive induction point below fingerprint ridge provides higher electric capacity.
At least there is two kinds of forms, the most active and passive type in capacitive fingerprint sensing device.Actively capacitance type sensor is usually used in electronic equipment, to provide biometric secure and the identification of user.
Active electric capacity sensor initial excitation is sensed of the epidermis of finger.The electric capacity of epidermis is measured at each capacitive induction point.Such as, by measuring voltage and/or the electric charge of capacitive induction point during the low voltage stage of the modulating frequency in capacitive induction lattice array and high voltage stage, can measure or determine electric capacity.Voltage difference may be used to determine electric capacity.
Radiofrequency signal is sent to induction electrode and the drive electrode of fingerprint sensor by active fingerprint sensor of the prior art simultaneously, thus encourage finger, and owing to the voltage potential of finger changes along with modulation, therefore voltage and/or electric charge at each capacitive induction point of capacitive induction lattice array change.
In this sensor, the voltage applying extremely described fingerprint sensor is limited.Generally, the voltage P-to-P voltage less than 4 volts.Exceeding this voltage may be by finger excitation to too high voltage；And excessive excitation user's finger can produce " twinge " or uncomfortable sensation.Although the precise voltage that people can sense twinge changes along with the difference of people, but the P-to-P voltage of 4 volts is generally viewed as threshold value, exceedes this threshold value it could be noted that this sensation.
Owing to limiting for modulating the voltage of described fingerprint sensor to avoid user's perception, the thickness of the fingerprint input module such as glass therefore covering sensor is also limited.Glass between sensor and finger is the thickest, and the electric capacity of generation becomes more to decay and fingerprint image becomes the fuzzyyest.For there is the thickness of about 400 microns or the glass more than about 400 microns or for there is the thickness more than 100 microns or the ceramic material more than about 100 microns, fingerprint image may become unreliable, and fingerprint sensor is for the application of common electronic equipment, the thickness of its glass or ceramic material all has a lower limit, the display screen glass thickness of such as general mobile phone or panel computer is more than 0.4mm, if less than this lower limit, screen easily damages by pressure or breaks into pieces.
Thus, define the contradiction between a kind of fingerprint input module thickness and Fingerprint recognition definition, especially fingerprint identification technology is applied to full frame fingerprint occasion, need to strengthen its sensing signal, improve the resolution of touch screen.
Fig. 1 schematically shows the structure chart of the sensing device of the fingerprint sensor according to this utility model example the first embodiment.nullAs shown in Figure 1，This sensing device includes: fingerprint input module and fingerprint identification module，Described fingerprint identification module farther includes fingerprint sensor and fingerprint control chip 110 (such as，Can be integrated ASIC (Application Specific Integrated Circuits) CHIP，Dedicated IC chip)，Described fingerprint sensor includes dielectric layer 130、A plurality of top crown 140 and a plurality of bottom crown 120，Described top crown 140 and described bottom crown 120 lay respectively on the apparent surface of described dielectric layer 130，Described top crown 140 extends in a first direction setting，Described bottom crown 120 is along extended with the second direction that described first direction intersects，Described top crown 140 separates and intersects to form multiple induction point with described bottom crown 120 by described dielectric layer 130，Described fingerprint control chip 110 respectively with described bottom crown 120 and described fingerprint input module electric property coupling，Described bottom crown 120 and described fingerprint input module receive the radiofrequency signal that described fingerprint control chip 110 is launched.Wherein, electric capacity can be formed at induction point between described top crown 140 and bottom crown 120.Described dielectric layer 130 is transparent or opaque insulant, and has opposing two surface.
According to example embodiment, described top crown includes that induction electrode, described bottom crown include drive electrode.Wherein said induction electrode and described drive electrode electrically connect with described fingerprint control chip 110 respectively.
According to example embodiment, described drive electrode receives the radiofrequency signal for modulating its voltage and/or operation frequency that described fingerprint control chip 110 sends, simultaneously, user's finger contact point on described fingerprint input module electrically connects with described fingerprint control chip 110, described radiofrequency signal is sent to the finger of user, causes at the described higher detectable signal of fingerprint control chip.
By being electrically connected with described fingerprint control chip by described finger contact point, the Capacitance Coupled between fingerprint identification module and finger can compensate for the thickness of coating.By being electrically connected with described fingerprint control chip by described finger contact point, the electric capacity between the capacitive induction point of finger and described fingerprint control chip can increase, thus obtains more preferable resolution and the imaging of fingerprint.Here, described drive electrode can be a kind of radiofrequency signal, get to finger is again another kind of radiofrequency signal, and the described radiofrequency signal getting to finger can be to determine level signal, it is also possible to but high level signal, such as 0V-15V.
According to example embodiment, described top crown includes the induction electrode (RX Sensor) that multiple mutually insulated is distributed.Such as, parallel can be distributed between multiple described induction electrodes, and can equidistantly be distributed between multiple described induction electrode.
Described bottom crown includes the drive electrode (TX Sensor) that multiple mutually insulated is distributed.Such as, parallel can be distributed between multiple described drive electrodes, and can equidistantly be distributed between multiple described drive electrode.
Described capacitive fingerprint sensing device includes multiple capacitive induction points that described top crown and described bottom crown cross projection are formed.Described top crown can be identical with the conductive material of described bottom crown, it is also possible to different.Can be such as Graphene, CNT, or can also be the alloy of one or more in gold, silver, copper, aluminum and zinc, it is also possible to for the mixture of above-mentioned metal Yu organic binder bond.
The thickness of described top crown and/or described bottom crown can be 20nm～20um, and its processing technology can be to use the modes such as plated film, laser, gold-tinted technique, it would however also be possible to employ traditional mode of printing, such as intaglio plate or letterpress, this utility model is not limited to this.
According to example embodiment, described top crown and the plate material of bottom crown, high conductivity nano material such as Graphene can be used, thus the induction point utilizing five big physical characteristics of Graphene to be fabricated to fingerprint sensor has the advantage that electric conductivity forces the induction point impedance being made to be smaller than 0.1 ohm；Hardness is superpower, is suitable for finger pressing, and the induction point grid service life is long；Light transmission is strong, is produced on and does not affect its display effect on the display screen such as mobile phone or panel computer；Especially suitable making full frame fingerprint application, because grid circuit is intensive, Graphene heat conductivity is strong, does not results in thermal impedance effect；Surface area super large characteristic, can be made into high-resolution Graphene induction point grid.
According to example embodiment, described dielectric layer uses transparent pressure sensitive adhesive.
According to example embodiment, described dielectric layer includes dielectric ceramic powder.Described dielectric ceramic powder may be used for increasing the dielectric constant of described dielectric layer, such that it is able to the electric capacity increased between described top crown and described bottom crown.
According to example embodiment, the span of the dielectric constant of described dielectric layer is more than 6F/m.Such as, the value of described dielectric constant can be 10-50F/m.
According to example embodiment, described dielectric ceramic powder can include silicon oxide, aluminium oxide, it is also possible to has a small amount of sodium oxide, potassium oxide, calcium oxide, magnesium oxide, ferrum oxide, titanium oxide etc..
According to example embodiment, described dielectric layer uses transparent material.
According to example embodiment, described fingerprint input module includes any one in glass, sapphire or ceramic material, and it is arranged on described fingerprint identification module.It is for instance possible to use the glass of thickness more than 400 microns, it would however also be possible to employ the sapphire that thickness is more than 250 microns, or use the ceramic material of thickness more than 100 microns.Certainly, heretofore described display element uses any available material and any available thickness to be all permissible, in this no limit.But for prior art, the process yields of the thickness of this different materials and correspondence thereof is high, buy or make by oneself easily acquirement, such that it is able to reduce cost.
According to example embodiment, porose on described fingerprint input module, and insert metal material formation wire in the hole, described wire connects described fingerprint input module and described fingerprint control chip.
Described capacitive induction point can be modulated according to various frequencies.Capacitive induction point and can measure the voltage of all capacitive inductions point during high voltage again during low-voltage.It is to say, the voltage being supplied to the array of capacitive induction point can be generally similar to square wave, although in other embodiments, voltage can use other waveform.Described fingerprint control chip also includes manipulator, and described manipulator can control modulation or the vibration of capacitive induction point according to clock signal.During the height and lower part in radiofrequency signal cycle, difference measured, between capacitive induction point voltage and/or electric charge allows chip determine the electric capacity between each capacitive induction point and the lower part of finger and thus determine this electric capacity.From the electric capacity of each capacitive induction point, can sense, measure and rebuild fingerprint.
Signal difference at capacitive induction point can be used to map fingerprint.The resolution of fingerprint sensor can change along with capacitive induction dot density, distance between the surface of fingerprint sensor and finger and the thickness of the fingerprint input module covering fingerprint sensor.In general, along with fingerprint input module thickness increases, the electric capacity between finger and fingerprint sensor becomes increasingly to decay, and therefore signal difference can also decay.Can cause at the described higher detectable signal of fingerprint control chip by described finger contact point is electrically connected with described fingerprint control chip.
Each capacitive induction point can be coupled to the part on capacitive induction point of finger by electric capacity, i.e. finger and the finger contact point of described fingerprint control chip: the distance between finger part and capacitive induction point above determines the electric capacity between both and thus determines the signal of record at capacitive induction point.Along with distance reduces, signal increases.Each capacitive induction point also electric capacity is coupled to other neighbouring above finger part, and along with distance increases, this causes blur effect, and its resultant signal reducing direct capacitive induction point under finger ridge and finger paddy is poor.
According to example embodiment, described fingerprint input module and described fingerprint identification module are fitted by bonding coat.
Described fingerprint input module is the panel for fingerprint input.The shape of fingerprint input module can be set as required, can be other shapes such as square, rectangle, circle.
Described bonding coat is transparent optical cement, such as OCA optical cement or transparent UV glue etc..Using OCA optical cement in concrete the present embodiment, thickness 25 μm, to reduce the thickness of single unit system.
According to example embodiment, described fingerprint sensor also includes base material substrate and lead-in wire (such as, TX Line and RX Line).Described bottom crown and described top crown and described dielectric layer constitute the conducting channel of described fingerprint sensor, and described conducting channel is formed on described base material substrate.Such as, described lead-in wire may be located at the not visible region of the electronic equipment applying described fingerprint sensor.According to example embodiment, in order to reduce the integral thickness of described fingerprint identification module, the thickness of described base material substrate is not more than 200 μm, and the thickness of described dielectric layer is less than 50 μm.
According to example embodiment, described dielectric layer includes latticed groove.Described drive electrode and induction electrode are contained in described latticed groove, are filled with conductive material, such as metal or a combination thereofs such as silver, copper, gold, aluminum in described latticed groove.
Owing to people's fingerprint convex ridge (Valley) width and trench (Ridge) place width are the most substantially between 150-300 μm, in this utility model, the Breadth Maximum of drive electrode and induction electrode is not more than 100 μm, can sense when in can ensure that single induction point that the quantity of crestal line or trench is not more than 1, thus ensure that same detection coordinates can only a corresponding crestal line or the position of a trench；And the distance between distance and the adjacent induction electrode between adjacent driven electrode is no more than 100 μm.When hands is placed on fingerprint input module, distance between adjacent driven electrode and adjacent induction electrode is respectively less than 100 μm, distance between the most each adjacent induction point is less than 100 μm, so ensure to have 2-5 induction point to induce different capacitance signal to determine the position of crestal line or trench simultaneously, compare original individual unit reflection convex ridge or the pattern of trench position, the input signal of fingerprint be can accurately sense, degree of accuracy and the sensitivity of the other device of fingerprint improved.
For ensureing the precision of fingerprint recognition, in the present embodiment, the Breadth Maximum of bottom crown and top crown is 50 μm；Ultimate range between adjacent bottom crown or between adjacent top crown is 10 μm.
The fingerprint sensor of this utility model embodiment uses the metal mesh structure of groove-like, is filled in groove by conductive material, i.e. saves conductive material and can improve again the anti-scratch ability of anti-scratch of fingerprint sensor；And the conductive material filled is mainly argent etc., low price, reduce manufacturing cost.Additionally, this fingerprint sensor uses single layer of conductive structure to realize the identification of finger print information, reduce the thickness of fingerprint sensor；Simultaneously, in view of the average distance between fingerprint lines is 100 μm, therefore the width of bottom crown and top crown is no more than 100 μm, and the distance between the adjacent recognition unit that cooperatively forms of bottom crown and top crown is also not more than 100 μm, improves the precision of fingerprint recognition.
For coordinating fingerprint control chip, described bottom crown and top crown can be designed as different conductive patterns, such as rhombus, it is also possible to for other figures, this utility model is not limited.Preferably, described bottom crown is designed to horizontally disposed strip；Described top crown is designed to vertically disposed strip, is separated and vertical by described dielectric layer with described bottom crown.
The fingerprint sensor of the present embodiment, utilize top crown disconnected from each other to form electric capacity with bottom crown, sense formation fingerprint pattern according to capacitance variations, it is not necessary to utilize cmos semiconductor technique to form fingerprint sensor on silicon substrate substrate, such that it is able to avoid using monocrystalline silicon substrate, reduce cost.
Described lead-in wire is in order to be connected multiple described induction electrodes and multiple described drive electrode with fingerprint control chip.Offering latticed groove in the edge-invisible area of described dielectric layer, described lead-in wire is contained in latticed groove.Meanwhile, described lead-in wire can pass through silk screen printing or inkjet printing, to form protruding latticed conductor wire or conduction line segment in described dielectric layer surface.The minimum widith of protruding latticed conductor wire or conduction line segment can be 10 μm～200 μm, can be highly 5 μm～10 μm.
The width of latticed groove and latticed groove is 0.2 μm～5 μm, and the degree of depth is 2 μm～6 μm, and the ratio of depth and width is more than 1.The mesh shape of latticed groove is regularly or irregularly grid, and the mesh shape of latticed groove can be any one in regular hexagon, square, rhombus, rectangle, parallelogram, curvilinear boundary quadrilateral or random grid.Corresponding, the mesh shape of described drive electrode and described induction electrode can be regular hexagon, square, rhombus, rectangle, parallelogram, curvilinear boundary quadrilateral or random grid shape.
Above-mentioned bilayer conductive structure, each induction electrode and each drive electrode is used to connect a lead-in wire the most one by one.Because have employed lead-in wire connected mode, when the described fingerprint control chip being connected with described lead-in wire carries out judging fingerprint ridge or paddy to form fingerprint pattern by sensing the capacitance variations size of each induction point, induction point being positioned and calculates.
The described fingerprint control chip connected from described lead-in wire is when forming fingerprint pattern by the capacitance variation of different induction points, because electric capacity and induction point area positive correlation, therefore can go out the capacitance size of difference induction point by corresponding induction point areal calculation and each induction point is made a distinction.
When finger presses described fingerprint identification module, according to said method, different induction points corresponding during the pressing of location finger respectively, the most successively the capacitance variation at this difference induction point is calculated.
According to an embodiment of the present utility model, between described drive electrode and described induction electrode, form mutual capacitance.The place that the most described induction electrode and described drive electrode intersect will form electric capacity, namely described induction electrode and described drive electrode have respectively constituted the two poles of the earth of electric capacity.When finger is pressed into described fingerprint identification module, have impact on the coupling between the electrode of two, each cross point, thus change the capacitance between electrode.When detecting capacitance variations, described drive electrode sends driving signal successively, described induction electrode receives signal simultaneously, so can obtain the capacitance size at all induction electrodes and drive electrode joint, according to two dimension capacitance change data, can calculate the coordinate of each touch point, the variable quantity further according to capacitance judges that corresponding at each coordinate is ridge or the paddy of finger stricture of vagina simultaneously.Now its operation principle is:
Described induction electrode and described drive electrode are initially formed a capacitance C, when finger touches, finger takes away partition capacitance so that initial capacitance C is decreased to C ', and C ' ＜ C, further according to capacitance variation, described fingerprint control chip carries out judging that the fingerprint of correspondence position is ridge or paddy.Such as initial C1=1000, C2=1200；After finger touches, corresponding electric capacity becomes C1 '=100, C2 '=900, then △ C1=900, △ C2=300.Then fingerprint control chip can effectively distinguish C1 and C2, and if judge simultaneously △ C more than or equal to a threshold value, such as 500, then corresponding fingerprint is ridge；If △ C is less than this threshold value, then corresponding fingerprint is paddy.
Finger is when contacting with described fingerprint identification module, it is that the capacitance produced is different with actual range different manifestations at trench at convex ridge, and its value is in pico farad (pF) rank, thus its current signal transmitted there is also difference, these faint current signal differences are amplified by described fingerprint control chip, judge at the convex ridge of fingerprint and at trench with this, each induction point detects the current signal in this induction point, and these current signals are sent to described fingerprint control chip, difference according to current signal, detect the position of convex ridge and trench, thus sketch the contours of the lines venation of finger, then compared by the fingerprint with pre-stored, the qualification to user identity can be realized.
According to example embodiment, described fingerprint identification module also includes lead wire set, the IC process chip that lead wire set is externally connected.Described fingerprint identification module receives the fingerprint input signal that described fingerprint input module sends, it is possible to by lead wire set, fingerprint input signal is sent to exterior I C and processes chip.
The conductive material of a plurality of leads electrically connects with the conductive material in described latticed groove, and electrically connects with lead wire set；Each lead-in wire electrically connects with each bottom crown or each top crown respectively, and lead-in wire can be latticed groove structure, it is also possible to for the protruding latticed or conductor wire of strip or conduction line segment.
Bottom crown or top crown are connected with lead wire set by each lead-in wire, and each bottom crown or each top crown driving lead-in wire corresponding with one or sense lead electrically connect, insulation between adjacent bottom crown or adjacent top crown.
According to another aspect of the present utility model, a kind of electronic equipment, including any of the above-described described sensing device.
According to example embodiment, described electronic equipment also includes that display element, described fingerprint identification module are arranged under the described display element of described electronic equipment.Here described display element can serve as above-mentioned fingerprint input module.
According to example embodiment, described fingerprint identification module can be configured at the visible area of electronic equipment etc., i.e. with the display unit of electronic equipment with the use of, the authentication in electronic apparatus system running, such as bank account safety verification, then its dielectric layer is transparent insulant.
According to example embodiment, multiple fingerprint sensors can be applicable in Single Electron equipment.Preferably, the plurality of fingerprint sensor is arranged under the display element of described electronic equipment, and such as, fingerprint sensor can be disposed under glass or the outer surface of electronic equipment.Preferably, fingerprint sensor can be arranged according to array or other orderly pattern.Described fingerprint sensor can be placed under surface at random or semi-randomly.Within described fingerprint sensor is placed in the display lamination of the electronic equipment of combined display panel or under, this electronic equipment such as mobile phone, tablet computing device, computer display screens etc..In this embodiment, fingerprint sensor can be by the glass capacitive ground sensing fingerprint of display and/or display.
Described electronic equipment includes housing, and described housing can be shell or the panel of electronic equipment, and described housing can be metal material or isolation material.Described chip includes that grounding pin, described housing are electrically connected to described grounding pin.Can also include that FPC (flexible PCB), described fingerprint control chip are located on described FPC, described housing is electrically connected to the ground plane of described FPC.When fingerprint sensor has detected that similar finger thing touches or touches, fingerprint sensor makes described sensing device from low voltage (park mode voltage, such as 0.5V) be converted to high voltage (mode of operation voltage, such as 5V), so that be similar to the radiated electric field of finger thing charged generation sufficient intensity, the similar finger thing of described fingerprint control chip detection launches rf electric field, describes to form fingermark image according to the pixel internal electric field size of chip surface detection.
Additionally, described fingerprint identification module also includes a protective layer, protective layer is covered on described fingerprint identification module, and in order to protect fingerprint sensor and fingerprint control chip, protective layer can be UV glue, impressing glue or Merlon.
Fig. 2 schematically shows the flow chart of the method for sensing of the fingerprint sensor according to this utility model example embodiment.
As in figure 2 it is shown, the method includes:
In step S210, pressing signal detected, produce radiofrequency signal；
In step S220, described radiofrequency signal is sent to the bottom crown of described fingerprint sensor.
Meanwhile, in step S230, described radiofrequency signal is sent to the contact point finger part of user's pressing.
In this utility model embodiment, other content is with reference to the content in above-mentioned other embodiments, does not repeats them here.
The sensing device of fingerprint sensor disclosed in this utility model, have following technical effect that employing bipolar plates sensor, radiofrequency signal is beaten on driver circuit, the most also another kind radiofrequency signal is got on user's finger, can strengthen sensing signal, improve fingerprint application resolution when full frame.By perforate on glass, insert conductive material and form wire, can be by finger radiofrequency signal through more than 0.4mm glass.Additionally, the dielectric layer of this fingerprint sensor uses transparent and high dielectric constant material, the electric capacity between upper bottom crown can be increased, and the electric capacity between two-plate can be increased further by adding dielectric ceramic powder in this high dielectric constant material.
More than it is particularly shown and described illustrative embodiments of the present utility model.It should be appreciated that this utility model is not limited to detailed construction described herein, set-up mode or implementation method；On the contrary, this utility model is intended to contain the various amendments comprised in the spirit and scope of the appended claims and equivalence is arranged.
Claims (9)
1. the sensing device of a fingerprint sensor, it is characterised in that include fingerprint input module and
Fingerprint identification module, described fingerprint identification module farther includes fingerprint sensor and fingerprint controls core
Sheet, described fingerprint sensor includes under dielectric layer, a plurality of condenser type top crown and a plurality of condenser type
Pole plate, described top crown and described bottom crown lay respectively on the apparent surface of described dielectric layer,
Described top crown extends in a first direction setting, and described bottom crown edge is intersected with described first direction
Second direction is extended, and described top crown is separated also by described dielectric layer with described bottom crown
Intersect to form multiple induction point, described fingerprint control chip respectively with described bottom crown and described fingerprint
Input module electric property coupling, described bottom crown and described fingerprint input module receive described fingerprint and control
The radiofrequency signal of chip emission.
Sensing device the most according to claim 1, it is characterised in that described top crown includes
Induction electrode, described bottom crown includes drive electrode.
Sensing device the most according to claim 1, it is characterised in that described dielectric layer is adopted
With transparent pressure sensitive adhesive.
Sensing device the most according to claim 3, it is characterised in that described dielectric layer bag
Include dielectric ceramic powder.
Sensing device the most according to claim 3, it is characterised in that described dielectric layer
The span of dielectric constant is more than 6F/m.
Sensing device the most according to claim 5, it is characterised in that described dielectric constant
Span is 10-50F/m.
Sensing device the most according to claim 1, it is characterised in that described fingerprint input mould
Block includes any one in glass, sapphire or ceramic material, and it is arranged at described fingerprint recognition
On module.
Sensing device the most according to claim 1, it is characterised in that described fingerprint input mould
On block porose, and insert in the hole metal material formed wire, described wire connect described finger
Stricture of vagina input module and described fingerprint control chip.
9. an electronic equipment, it is characterised in that include arbitrary institute in the claims 1 to 8
State sensing device.
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| CN201620176294.8U CN205644573U (en) | 2016-03-07 | 2016-03-07 | Fingerprint sensor's sensing apparatus |
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| CN201620176294.8U CN205644573U (en) | 2016-03-07 | 2016-03-07 | Fingerprint sensor's sensing apparatus |
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| CN201620176294.8U Expired - Fee Related CN205644573U (en) | 2016-03-07 | 2016-03-07 | Fingerprint sensor's sensing apparatus |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110488175A (en) * | 2019-07-31 | 2019-11-22 | 广东利扬芯片测试股份有限公司 | Fingerprint chip testing component, method and computer readable storage medium |
| CN112395926A (en) * | 2019-08-19 | 2021-02-23 | 北京小米移动软件有限公司 | Screen module, fingerprint detection method and device and electronic equipment |
-
2016
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110488175A (en) * | 2019-07-31 | 2019-11-22 | 广东利扬芯片测试股份有限公司 | Fingerprint chip testing component, method and computer readable storage medium |
| CN110488175B (en) * | 2019-07-31 | 2024-04-26 | 广东利扬芯片测试股份有限公司 | Fingerprint chip test part, method and computer readable storage medium |
| CN112395926A (en) * | 2019-08-19 | 2021-02-23 | 北京小米移动软件有限公司 | Screen module, fingerprint detection method and device and electronic equipment |
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