CN205642678U - Multi -seal type pressure sensor - Google Patents
Multi -seal type pressure sensor Download PDFInfo
- Publication number
- CN205642678U CN205642678U CN201620406916.1U CN201620406916U CN205642678U CN 205642678 U CN205642678 U CN 205642678U CN 201620406916 U CN201620406916 U CN 201620406916U CN 205642678 U CN205642678 U CN 205642678U
- Authority
- CN
- China
- Prior art keywords
- sealing layer
- sealant
- core base
- pressure sensor
- core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007789 sealing Methods 0.000 claims abstract description 30
- 239000011521 glass Substances 0.000 claims abstract description 4
- 239000012212 insulator Substances 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 4
- 229920002545 silicone oil Polymers 0.000 claims description 3
- 239000000428 dust Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 2
- 239000003921 oil Substances 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 239000000565 sealant Substances 0.000 description 42
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 15
- 238000005516 engineering process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000012812 sealant material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
本实用新型涉及一种多密封型压力传感器，包括芯体基座，所述芯体基座一侧上设置有波纹片，所述芯体基座与波纹片之间设置有硅油，所述芯体基座上设置有压阻力敏芯片，所述压阻力敏芯片与支撑块相接触，所述压阻力敏芯片两端分别通过连接导线与引脚相连接，所述每一个引脚与芯体基座之间设置有玻璃绝缘子，所述芯体基座一侧上设置有油孔螺钉，所述芯体基座内部从上至下依次设置有第一密封层、第二密封层与第三密封层。本实用新型的第一密封层、第二密封层、第三密封层可以有效的实现多级密封，提高密封效果，有效的避免了灰尘对传感器的影响，有效的延长了传感器的使用寿命。
The utility model relates to a multi-seal type pressure sensor, which comprises a core base, a corrugated sheet is arranged on one side of the core base, silicon oil is arranged between the core base and the corrugated sheet, the core The body base is provided with a pressure resistance sensitive chip, the pressure resistance sensitive chip is in contact with the support block, the two ends of the pressure resistance sensitive chip are respectively connected to the pins through connecting wires, each of the pins is connected to the core A glass insulator is arranged between the bases, an oil hole screw is arranged on one side of the core base, and a first sealing layer, a second sealing layer and a third sealing layer are sequentially arranged inside the core base from top to bottom. Sealing layer. The first sealing layer, the second sealing layer and the third sealing layer of the utility model can effectively realize multi-stage sealing, improve the sealing effect, effectively avoid the influence of dust on the sensor, and effectively prolong the service life of the sensor.
Description
Technical field
This utility model relates to sensor technical field, particularly relates to a kind of many closed types pressure transducer.
Background technology
Pressure transducer is a kind of sensor the most commonly used in industrial practice.General common many closed types
Pressure transducer is output as analogue signal, and analogue signal refers to that information parameter shows in given range
For continuous print signal.Or in one section of continuous print time interval, the characteristic quantity of its representative information can be
Arbitrarily moment is rendered as the signal of any number.And normally used many closed types pressure transducer is main
Utilizing piezoelectric effect to be fabricated by, such sensor is also referred to as piezoelectric transducer.
Pressure transducer is the most widely used a kind of sensor.Traditional many closed types pressure sensing
Device is based on the device of frame for movement type, with the deformation instruction pressure of flexible member, but this structure chi
Very little big, quality weight, it is impossible to electricity output is provided.Along with the development of semiconductor technology, multichip semiconductor is close
Envelope type pressure transducer also arises at the historic moment.It is characterized in that volume is little, light weight, accuracy high, temperature
Characteristic is good.In particular with the development of MEMS technology, semiconductor transducer towards miniaturization, and
And its power consumption is little, reliability is high.
Existing pressure transducer after installing and using due to use environment difference, more when being in dust
In the environment of time dust be easily accessible sensor internal, thus affect the service life of sensor.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, it is provided that a kind of many closed types
Pressure transducer.
This utility model is to be achieved through the following technical solutions:
A kind of many closed types pressure transducer, including core body pedestal, described core body pedestal side is arranged
There is corrugated plate, between described core body pedestal and corrugated plate, be provided with silicone oil, described core body pedestal is arranged
The quick chip of pressure resistance, the quick chip of described pressure resistance is had to contact with a bracer, the quick chip of described pressure resistance
Two ends are connected with pin by connection wire respectively, set between each pin described and core body pedestal
It is equipped with glass insulator, described core body pedestal side is provided with oil-hole screw, in described core body pedestal
Portion is disposed with the first sealant, the second sealant and the 3rd sealant from top to bottom.
As optimal technical scheme of the present utility model, described first sealant, the second sealant and
Three sealant thickness are identical.
As optimal technical scheme of the present utility model, described first sealant, the second sealant and
Three sealant materials are identical.
As optimal technical scheme of the present utility model, described first sealant, the second sealant and
Three sealant materials are different.
As optimal technical scheme of the present utility model, described first sealant, the second sealant and
Fixing connection between three sealants.
As optimal technical scheme of the present utility model, described first sealant, the second sealant,
Fix between three sealants with core body pedestal and be connected.
Compared with prior art, the beneficial effects of the utility model are: this utility model is by arranging
First sealant, the second sealant, the 3rd sealant, the first sealant of such pressure transducer,
Second sealant, the 3rd sealant can effectively realize multi-stage sealed, improve sealing effectiveness, effectively
Avoid the dust impact on sensor, effectively extend the service life of sensor.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Detailed description of the invention
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with
Drawings and Examples, are further elaborated to this utility model.Should be appreciated that this place is retouched
The specific embodiment stated, only in order to explain this utility model, is not used to limit this utility model.
Referring to Fig. 1, Fig. 1 is structural representation of the present utility model.
A kind of many closed types pressure transducer, including core body pedestal 1, described core body pedestal 1 side sets
It is equipped with corrugated plate 2, between described core body pedestal 1 and corrugated plate 2, is provided with silicone oil 3, described core body base
Being provided with the quick chip of pressure resistance 4 on seat 1, the quick chip of described pressure resistance 4 contacts with a bracer 5, institute
State pressure resistance quick chip 4 two ends respectively by connect wire 6 be connected with pin 7, described each
It is provided with glass insulator 8 between pin 7 and core body pedestal 1, described core body pedestal 1 side is arranged
Have an oil-hole screw 9, described core body pedestal 1 is internal be disposed with from top to bottom the first sealant 10,
Second sealant 11 and the 3rd sealant 12, wherein said first sealant the 10, second sealant 11
Identical with the 3rd sealant 12 thickness, described first sealant the 10, second sealant 11 is close with the 3rd
Sealing 12 material is identical or material is different, selects according to practical situation.
Fix between described first sealant the 10, second sealant 11 and the 3rd sealant 12 and be connected,
Wherein said first sealant the 10, second sealant the 11, the 3rd sealant 12 and core body pedestal 1 it
Between fixing connect, so can realize the first sealant the 10, second sealant 11 and the 3rd sealant
The connection of 12.So first sealant the 10, second sealant the 11, the 3rd sealant of pressure transducer
12 can effectively realize multi-stage sealed, improve sealing effectiveness, effectively avoid dust to sensor
Impact, effectively extend the service life of sensor.
In description of the present utility model, unless otherwise clearly defined and limited, term " install ",
" be connected ", " connection ", " fixing " should be interpreted broadly, and connect for example, it may be fixing,
Can also be to removably connect, or integral；Can be to be mechanically connected, it is also possible to be electrical connection；Can
Being to be joined directly together, it is also possible to be indirectly connected to by intermediary, can be the company of two element internals
Lead to or the interaction relationship of two elements.For the ordinary skill in the art, can have
Body situation understands above-mentioned term concrete meaning in this utility model.
The foregoing is only preferred embodiment of the present utility model, not new in order to limit this practicality
Type, all any amendment, equivalent and improvement made within spirit of the present utility model and principle
Deng, within should be included in protection domain of the present utility model.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620406916.1U CN205642678U (en) | 2016-05-06 | 2016-05-06 | Multi -seal type pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620406916.1U CN205642678U (en) | 2016-05-06 | 2016-05-06 | Multi -seal type pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205642678U true CN205642678U (en) | 2016-10-12 |
Family
ID=57050460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620406916.1U Expired - Fee Related CN205642678U (en) | 2016-05-06 | 2016-05-06 | Multi -seal type pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205642678U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106430085A (en) * | 2016-12-09 | 2017-02-22 | 苏州美仑凯力电子有限公司 | Protection method for MEMS pressure sensor packaging |
| CN106644238A (en) * | 2016-11-11 | 2017-05-10 | 中国电子科技集团公司第四十八研究所 | Thin film differential pressure core |
-
2016
- 2016-05-06 CN CN201620406916.1U patent/CN205642678U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106644238A (en) * | 2016-11-11 | 2017-05-10 | 中国电子科技集团公司第四十八研究所 | Thin film differential pressure core |
| CN106644238B (en) * | 2016-11-11 | 2020-04-03 | 中国电子科技集团公司第四十八研究所 | A film pressure differential core |
| CN106430085A (en) * | 2016-12-09 | 2017-02-22 | 苏州美仑凯力电子有限公司 | Protection method for MEMS pressure sensor packaging |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108871652B (en) | A miniaturized high temperature resistant high dynamic pressure sensor | |
| JP4014006B2 (en) | Pressure sensor | |
| CN202382900U (en) | Absolute pressure packaging structure for strain pressure transducer and strain pressure transducer | |
| CN101226092A (en) | SOI complete silicon structure silicone-oil-filling high-temperature-resistance pressure sensor | |
| CN102944353B (en) | Capacitance film type pressure sensor capable of resisting thermal distortion | |
| BR112012030407B1 (en) | GENERAL PRESSURE SENSOR FOR AUTOMOBILE | |
| WO2011131045A1 (en) | Package structure for silicon pressure sensor | |
| CN103453833B (en) | A kind of long gauge-length carbon fiber strain sensing devices and method of testing thereof | |
| CN205642678U (en) | Multi -seal type pressure sensor | |
| CN104204755B (en) | The pressure sensor of micromechanics | |
| CN102313617B (en) | Micro-electronics pressure sensor and preparation process thereof | |
| CN207689061U (en) | A kind of capacitive pressure transducer | |
| CN117269561A (en) | Clamp for wafer test | |
| CN101241030A (en) | MOS force sensor | |
| CN211954508U (en) | SMD MEMS transmission line monitoring sensor | |
| JP6156233B2 (en) | Pressure sensor | |
| CN103196593A (en) | Resonance type micro-machinery pressure sensor and low-stress assembling method of resonance type micro-mechanical pressure sensor chip | |
| CN115235681B (en) | Packaging structure and method of MEMS pressure sensor | |
| CN114136528B (en) | SOI pressure sensitive chip | |
| CN202049999U (en) | Piezoelectric ceramic-based driver device | |
| CN203324300U (en) | Double-cantilever-beam-type micro mechanical acceleration sensor | |
| JP2020502476A (en) | A kind of integrated stress sensor | |
| CN108394855B (en) | MEMS sensor suspension beam structure | |
| JPH0979928A (en) | Semiconductor pressure sensor device | |
| CN205482780U (en) | Quick strainometer of quantum dot power |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161012 Termination date: 20170506 |