CN205584691U - Heat radiation structure and water-cooled heat radiation device comprising same - Google Patents
Heat radiation structure and water-cooled heat radiation device comprising same Download PDFInfo
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- CN205584691U CN205584691U CN201620204678.6U CN201620204678U CN205584691U CN 205584691 U CN205584691 U CN 205584691U CN 201620204678 U CN201620204678 U CN 201620204678U CN 205584691 U CN205584691 U CN 205584691U
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- 239000012530 fluid Substances 0.000 claims description 16
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- 239000007788 liquid Substances 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 2
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- 230000017525 heat dissipation Effects 0.000 abstract description 74
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- 229910052802 copper Inorganic materials 0.000 description 2
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- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
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Abstract
Description
技术领域 technical field
本实用新型涉及散热技术,尤指一种用于电子发热组件的散热结构及包含该结构的水冷式散热装置。The utility model relates to heat dissipation technology, in particular to a heat dissipation structure for electronic heating components and a water-cooled heat dissipation device comprising the structure.
背景技术 Background technique
随着电子组件的运算速度不断提升,其所产生的热量亦越来越高,为了有效地解决此高发热量的问题,业界已对铝、铜等合金的散热器、热管或均温板进行广泛性的应用,但是此等散热结构不论是其导热效能和制作容易度等皆存在有尚待加以改善的空间。 As the calculation speed of electronic components continues to increase, the heat generated by them is getting higher and higher. In order to effectively solve the problem of high heat generation, the industry has conducted extensive research on radiators, heat pipes or vapor chambers made of aluminum, copper and other alloys. However, there is still room for improvement in these heat dissipation structures in terms of their heat conduction performance and ease of manufacture.
现有的散热器,主要包括一底板及自底板延伸出的散热鳍片所构成,此种散热器虽然具有良好散热特性,但其导热效能却无法有效的获得提升。于是有包括均温板和前述散热器的散热结构被开发出来,其是将散热器透过锡膏等焊接材料固定在均温板上,均温板则包括一上壳板和一下壳板,并在上壳板和下壳板的内部空间分别装设有毛细组织,其后再将上壳板和下壳板对应焊合,再将工作流体填入上壳板和下壳板内部,最后施以除气封口等制程而完成。 The existing heat sink mainly includes a base plate and heat dissipation fins extending from the base plate. Although this type of heat sink has good heat dissipation characteristics, its heat conduction performance cannot be effectively improved. Therefore, a heat dissipation structure including a vapor chamber and the aforementioned radiator has been developed. The radiator is fixed on the vapor chamber through welding materials such as solder paste, and the vapor chamber includes an upper shell and a lower shell. Capillary structures are respectively installed in the inner space of the upper shell and the lower shell, and then the upper shell and the lower shell are welded together, and then the working fluid is filled into the upper shell and the lower shell, and finally It is completed by degassing and sealing processes.
然而,现有的散热结构,虽然具有导热和散热效能,但在实际使用上却存在以下的问题点,由于其均温板受限于空间的限制,仅能够以横向的气体流动方式来进行热量的导离,因而导致其导、散热效能不易有效地被提升。另在均温板和散热器的界面之间所涂覆的焊接材料,极易造成热量传递的阻碍,亟待加以改善。 However, although the existing heat dissipation structure has heat conduction and heat dissipation efficiency, there are the following problems in actual use. Due to the space limitation of the vapor chamber, heat can only be carried out in the form of lateral gas flow Therefore, it is difficult to effectively improve the conduction and heat dissipation performance. In addition, the welding material applied between the vapor chamber and the radiator interface can easily hinder heat transfer, which needs to be improved urgently.
发明内容 Contents of the invention
本实用新型的目的在于提供一种散热结构及包含该结构的水冷式散热装置,其是利用均温板和热管的连通及散热构件和均温板的组配,进而可提升散热结构和水冷式散热装置的导、散热效能。 The purpose of this utility model is to provide a heat dissipation structure and a water-cooled heat dissipation device including the structure, which utilizes the communication between the vapor chamber and the heat pipe and the combination of the heat dissipation component and the vapor chamber, thereby improving the heat dissipation structure and the water-cooled heat dissipation device. The conduction and heat dissipation performance of the heat sink.
为了达成上述之目的,本实用新型提供一种散热结构,包括一均温板、复数热管及一散热构件,该均温板设有贯穿该均温板的一镂空槽,该均温板具有一容腔;各热管分别立设在该均温板并且与该容腔连通;该散热构件包含一基板及自该基板一体延伸出的复数鳍片,该散热构件以该基板封闭该镂空槽。 In order to achieve the above object, the utility model provides a heat dissipation structure, including a temperature chamber, a plurality of heat pipes and a heat dissipation member, the temperature chamber is provided with a hollow groove through the temperature chamber, the temperature chamber has a The cavity; the heat pipes are respectively arranged on the uniform temperature plate and communicated with the cavity; the heat dissipation component includes a base plate and a plurality of fins extending integrally from the base plate, and the heat dissipation component closes the hollow groove with the base plate.
优选地,上述基板具有一底面,上述均温板具有一受热面,该基板的该底面与该受热面形成一共面结构。 Preferably, the above-mentioned substrate has a bottom surface, the above-mentioned temperature chamber has a heating surface, and the bottom surface of the substrate and the heating surface form a coplanar structure.
优选地,散热结构更包括多数散热鳍片,各散热鳍片开设有相互对应的多数穿孔,于各穿孔的周缘分别延伸有一环墙,各散热鳍片以各穿孔套接各热管,并且透过各环墙的相互迭接,从而在任二相邻的该散热鳍片之间形成有一流体通道。 Preferably, the heat dissipation structure further includes a plurality of heat dissipation fins, each heat dissipation fin is provided with a plurality of corresponding perforations, and a ring wall extends from the periphery of each perforation, and each heat dissipation fin is socketed with each heat pipe through each through hole, and through The overlapping of the surrounding walls forms a fluid channel between any two adjacent cooling fins.
优选地,上述镂空槽形成在该均温板的中间区域。 Preferably, the above-mentioned hollow groove is formed in the middle area of the temperature chamber.
优选地,在上述镂空槽外周缘的均温板顶部设有一上承接段,上述基板包含一基底段、自该基底段两侧分别朝上弯折延伸的一立板段及自该立板段朝水平方向弯折延伸的一搭接段,该底面形成在该基底段的外部,该基底段封闭该镂空槽的底端,各搭接段分别对应各上承接段贴接。 Preferably, an upper receiving section is provided on the top of the uniform temperature plate at the outer periphery of the hollow groove, and the above-mentioned base plate includes a base section, a vertical plate section bent upwards from both sides of the base section, and a vertical section from the vertical plate section. An overlapping section bent and extended in the horizontal direction, the bottom surface is formed on the outside of the base section, the base section closes the bottom end of the hollow groove, and each overlapping section is attached to each upper receiving section.
优选地,上述各立板段分别贴接于该镂空槽的内壁面。 Preferably, each of the above-mentioned vertical plate segments is attached to the inner wall surface of the hollow groove respectively.
优选地,上述各鳍片以挤制或铲削加工而间隔形成在该基底段和各搭接段上。 Preferably, the above-mentioned fins are formed on the base segment and each overlapping segment at intervals by extrusion or skiving.
优选地,在上述镂空槽外周缘的该均温板底部设有一下承接段,上述基板包含一基底段及自该基底段两侧朝水平方向延伸的一搭接段,该底面形成在该基底段的外部,该基底段封闭该镂空槽的底端,各搭接段分别对应各下承接段贴接。 Preferably, a lower receiving section is provided at the bottom of the temperature chamber at the outer periphery of the hollow groove, the above-mentioned substrate includes a base section and an overlapping section extending horizontally from both sides of the base section, and the bottom surface is formed on the base section. outside the segment, the base segment closes the bottom end of the hollow groove, and each overlapping segment corresponds to each lower receiving segment to be bonded.
优选地,上述基板包含一基底段,该底面形成在该基底段的外部,该基底段封闭该镂空槽的底端,各鳍片分别贴接于该镂空槽的内壁面。 Preferably, the substrate includes a base segment, the bottom surface is formed outside the base segment, the base segment closes the bottom end of the hollow groove, and the fins are attached to the inner wall of the hollow groove respectively.
为了达成上述之目的,本实用新型提供一种水冷式散热装置,包括一散热结构及一盖体,该散热结构包括一均温板、复数热管及一散热构件,该均温板设有贯穿该均温板的一镂空槽,该均温板具有一容腔;各热管分别立设在该均温板并且与该容腔连通;该散热构件包含一基板及自该基板一体延伸出的复数鳍片,该散热构件以该基板封闭该镂空槽;该盖体罩盖在该均温板上并于该盖体和该均温板之间形成有一液体腔室,各热管和各鳍片形成在该液体腔室内,该盖体开设有连通该液体腔室的一进水口及一出水口。 In order to achieve the above object, the utility model provides a water-cooled heat dissipation device, including a heat dissipation structure and a cover, the heat dissipation structure includes a uniform temperature plate, a plurality of heat pipes and a heat dissipation component, A hollow groove of the uniform temperature plate, the uniform temperature plate has a cavity; each heat pipe is respectively erected on the uniform temperature plate and communicated with the cavity; the heat dissipation component includes a base plate and a plurality of fins extending integrally from the base plate sheet, the heat dissipation member closes the hollow groove with the base plate; the cover covers the chamber and forms a liquid chamber between the cover and the chamber, and each heat pipe and each fin are formed on the In the liquid chamber, the cover is provided with a water inlet and a water outlet which communicate with the liquid chamber.
优选地,上述基板具有一底面,该均温板具有一受热面,该基板的该底面与该受热面形成一共面结构。 Preferably, the above-mentioned substrate has a bottom surface, the temperature chamber has a heating surface, and the bottom surface of the substrate and the heating surface form a coplanar structure.
优选地,上述散热结构更包含多数散热鳍片,各散热鳍片开设有相互对应的多数穿孔,于各穿孔的周缘分别延伸有一环墙,各散热鳍片以各穿孔套接各热管,并且透过各环墙的相互迭接,从而在任二相邻的该散热鳍片之间形有一流体通道。 Preferably, the above-mentioned heat dissipation structure further includes a plurality of heat dissipation fins, and each heat dissipation fin is provided with a plurality of corresponding perforations, and a ring wall is respectively extended around the periphery of each perforation, and each heat dissipation fin is socketed with each heat pipe through each through hole, and through A fluid passage is formed between any two adjacent heat dissipation fins through the overlapping of the surrounding walls.
优选地,上述镂空槽形成在该均温板的中间区域,在该镂空槽外周缘的该均温板顶部设有一上承接段,该基板包含一基底段、自该基底段两侧分别朝上弯折延伸的一立板段及自该立板段朝水平方向弯折延伸的一搭接段,该底面形成在该基底段的外部,该基底段封闭该镂空槽的底端,各搭接段分别对应各上承接段贴接。 Preferably, the above-mentioned hollow groove is formed in the middle area of the temperature chamber, and an upper receiving section is provided on the top of the temperature chamber at the outer periphery of the hollow groove. A vertical plate section bent and extended and an overlapping section bent and extended horizontally from the vertical plate section, the bottom surface is formed on the outside of the base section, the base section closes the bottom end of the hollow groove, each overlapping The segments correspond to the joints of the upper receiving segments.
优选地,上述各立板段分别贴接于该镂空槽的内壁面。 Preferably, each of the above-mentioned vertical plate segments is attached to the inner wall surface of the hollow groove respectively.
优选地,上述各鳍片以挤制或铲削加工而间隔形成在该基底段和各搭接段上。 Preferably, the above-mentioned fins are formed on the base segment and each overlapping segment at intervals by extrusion or skiving.
优选地,上述镂空槽形成在该均温板的中间区域,在该镂空槽外周缘的该均温板底部设有一下承接段,该基板包含一基底段及自该基底段两侧朝水平方向延伸的一搭接段,该底面形成在该基底段的外部,该基底段封闭该镂空槽的底端,各搭接段分别对应各下承接段贴接。 Preferably, the above-mentioned hollow groove is formed in the middle area of the temperature chamber, and a lower receiving section is provided at the bottom of the temperature chamber on the outer periphery of the hollow groove. An extended overlapping section, the bottom surface is formed outside the base section, the base section closes the bottom end of the hollow groove, and each overlapping section is respectively attached to each lower receiving section.
优选地,上述基板包含一基底段,该底面形成在该基底段的外部,该基底段封闭该镂空槽的底端,各鳍片分别贴接于该镂空槽的内壁面。 Preferably, the substrate includes a base segment, the bottom surface is formed outside the base segment, the base segment closes the bottom end of the hollow groove, and the fins are attached to the inner wall of the hollow groove respectively.
优选地,上述均温板顶面设有一环形插沟,该盖体的底缘对应于该插沟嵌入封合。 Preferably, an annular slot is provided on the top surface of the above-mentioned temperature chamber, and the bottom edge of the cover body is embedded and sealed corresponding to the slot.
优选地,水冷式散热装置更包括一进水管及至少一出水管,其特征在于上述进水管对应该进水口连接,该出水管对应该出水口连接。 Preferably, the water-cooled heat dissipation device further includes a water inlet pipe and at least one water outlet pipe, wherein the water inlet pipe is connected to the water inlet, and the water outlet pipe is connected to the water outlet.
优选地,水冷式散热装置更包括一隔板,该隔板夹掣在各热管和该盖体之间,在该隔板对应该进水管的位置设有一液体信道。 Preferably, the water-cooled heat dissipation device further includes a baffle plate clamped between each heat pipe and the cover, and a liquid channel is provided at a position of the baffle plate corresponding to the water inlet pipe.
本实用新型还具有以下功效,藉由均温板和热管的连通,使得内部的工作流体能够以横向和纵向的气体流动方式来进行热量的导离。利用均温板和基板同时与发热源做热传递,得以低热阻的特性来快速地传递热量。藉助散热构件形成在均温板的中间区域以与发热源的最大热区做传递,进而能够有效地将发热源的热量快速地导离散逸出。 The utility model also has the following effects, through the communication between the vapor chamber and the heat pipe, the internal working fluid can conduct heat conduction in the horizontal and vertical gas flow modes. Using the vapor chamber and the base plate to conduct heat transfer with the heat source at the same time, the heat can be transferred quickly with the characteristics of low thermal resistance. The heat dissipation member is formed in the middle area of the vapor chamber to communicate with the maximum heat area of the heat source, so that the heat of the heat source can be effectively conducted and dissipated quickly.
附图说明 Description of drawings
图1 是本实用新型散热结构第一实施例的立体分解图。 Fig. 1 is a three-dimensional exploded view of the first embodiment of the heat dissipation structure of the present invention.
图2 是本实用新型散热结构第一实施例的组合外观图。 Fig. 2 is a combined appearance view of the first embodiment of the heat dissipation structure of the present invention.
图3 是本实用新型散热结构第一实施例的组合剖视图。 Fig. 3 is a combined cross-sectional view of the first embodiment of the heat dissipation structure of the present invention.
图4 是本实用新型散热结构第二实施例的分解剖视图。 Fig. 4 is an exploded cross-sectional view of the second embodiment of the heat dissipation structure of the present invention.
图5 是本实用新型散热结构第二实施例的组合剖视图。 Fig. 5 is a combined cross-sectional view of the second embodiment of the heat dissipation structure of the present invention.
图6 是本实用新型散热结构第三实施例的分解剖视图。 Fig. 6 is an exploded cross-sectional view of the third embodiment of the heat dissipation structure of the present invention.
图7 是本实用新型散热结构第三实施例的组合剖视图。 Fig. 7 is a combined cross-sectional view of the third embodiment of the heat dissipation structure of the present invention.
图8 是本实用新型水冷式散热装置的组合剖视图。 Fig. 8 is a combined cross-sectional view of the water-cooled heat sink of the present invention.
【主要部件符号说明】 【Description of main component symbols】
1、1a、1b…散热结构 1, 1a, 1b... heat dissipation structure
10…均温板 10...Vapor chamber
11…容腔 11...cavity
12…第一毛细组织 12…first capillary
13…工作流体 13…working fluid
14…受热面 14...Heating surface
15…镂空槽 15...hollow slot
16…上承接段 16... Upper undertaking section
17…插沟 17...Guttering
18…下承接段 18...The lower undertaking section
20…热管 20…heat pipe
21…腔室 21…Chamber
22…第二毛细组织 22…second capillary
30、30a、30b…散热构件 30, 30a, 30b...radiating member
31…基板 31...Substrate
311…底面 311…bottom
312…基底段 312…basal segment
313…立板段 313... Riser section
314…搭接段 314... lap section
32…鳍片 32…fins
40…散热鳍片 40…radiating fins
41…穿孔 41…perforation
42…环墙 42…ring wall
43…流体通道 43…fluid channel
A…共面结构 A...coplanar structure
5…盖体 5…Cover body
51…进水口 51...Water inlet
52…出水口 52...Water outlet
6…进水管 6...Water inlet pipe
7…出水管 7…Outlet pipe
8…隔板 8...partition
81…液体通道 81…fluid channel
B…液体容腔。 B... Liquid chamber.
具体实施方式 detailed description
有关本实用新型之详细说明及技术内容,配合附图说明如下,然而所附附图仅提供参考与说明用,并非用来对本实用新型加以限制。 The detailed description and technical content of the present utility model are described below with accompanying drawings. However, the attached drawings are only for reference and illustration, and are not intended to limit the present utility model.
请参阅图1至图3所示,本实用新型提供一种散热结构,此散热结构1主要包括一均温板10(Vapor Chamber)、复数热管20(Heat Pipe)及一散热构件30。 Please refer to Fig. 1 to Fig. 3, the utility model provides a heat dissipation structure, this heat dissipation structure 1 mainly includes a uniform temperature plate 10 (Vapor Chamber), a plurality of heat pipes 20 (Heat Pipe) and a cooling member 30.
均温板10内部具有一容腔11,在容腔11内部布设有由编织网、烧结金属物等组成的一第一毛细组织12、由螺旋弹簧或柱体等构成的一支撑体(图未示出)等组件,并且填注有纯水等的一工作流体13,藉以利用工作流体13的汽液相变化来达成导热效能,本实施例的均温板10大致呈一矩形体,但不以此种形状为限,其亦可为圆形或其它形状,在均温板10的外部底面具有一受热面14,在均温板10的中间区域开设有贯穿均温板10的一镂空槽15,并在此镂空槽15外周缘的均温板10顶部设有一阶梯状上承接段16。 There is a chamber 11 inside the chamber 10, and a first capillary structure 12 composed of braided mesh, sintered metal objects, etc., and a support body composed of a coil spring or a cylinder (not shown in the figure) are arranged inside the chamber 11. Shown) and other components, and filled with a working fluid 13 such as pure water, so as to use the vapor-liquid phase change of the working fluid 13 to achieve heat conduction performance, the chamber 10 of this embodiment is roughly rectangular, but not Limited to this shape, it can also be circular or other shapes. There is a heating surface 14 on the outer bottom surface of the temperature chamber 10, and a hollow groove penetrating through the temperature chamber 10 is opened in the middle area of the temperature chamber 10. 15, and a stepped upper receiving section 16 is provided on the top of the vapor chamber 10 on the outer periphery of the hollow groove 15.
热管20的内部具有一腔室21,在腔室21内部布设有由编织网、槽沟、烧结金属物等组成的一第二毛细组织22,本实施例的各热管20是分别立设在前述均温板10上并且各腔室21与前述容腔11相互连通,且各第二毛细组织22分别连接于前述第一毛细组织12,进而能够达成内部工作流体13的良好循环效果。 The inside of the heat pipe 20 has a chamber 21, and a second capillary structure 22 composed of braided nets, grooves, sintered metal objects, etc. is arranged inside the chamber 21. The heat pipes 20 of this embodiment are respectively erected on the aforementioned The chambers 21 on the vapor chamber 10 are in communication with the cavity 11 , and the second capillary structures 22 are respectively connected to the first capillary structures 12 , so that a good circulation effect of the internal working fluid 13 can be achieved.
散热构件30可为铜、铝或其合金所制成,其主要包括一矩形基板31及复数鳍片32,基板31具有一底面311,本实施例的基板31主要包含一基底段312、自基底段312两侧分别朝上弯折延伸的一立板段313及自立板段313朝水平方向弯折延伸的一搭接段314,前述底面311形成在基底段312的外部。各鳍片32可以挤制或铲削等加工方式来间隔形成在基底段312和搭接段314上。 The heat dissipation member 30 can be made of copper, aluminum or its alloys, and it mainly includes a rectangular substrate 31 and a plurality of fins 32. The substrate 31 has a bottom surface 311. The substrate 31 of this embodiment mainly includes a base segment 312, from the base Two sides of the section 312 are respectively a vertical section 313 bent upwards and an overlapping section 314 bent horizontally from the vertical section 313 . The bottom surface 311 is formed outside the base section 312 . The fins 32 can be formed on the base section 312 and the overlapping section 314 at intervals by processing methods such as extrusion or chipping.
散热构件30对应于均温板10的镂空槽15位置装设,其中基底段312封闭镂空槽15的底端,搭接段314分别对应于上承接段16贴接,立板段313贴接于镂空槽15的内壁面,在搭接段314与上承接段16之间及立板段313与镂空槽15的内壁面之间可透过导热介质(图未示出)予以固接,从而使基板31的底面311与受热面14形成一共面结构A,此共面结构A是用以与一发热源(图未示出)贴附接触。 The heat dissipation member 30 is installed corresponding to the hollow groove 15 of the temperature chamber 10, wherein the base section 312 closes the bottom end of the hollow groove 15, the overlapping sections 314 are respectively attached to the upper receiving section 16, and the vertical plate section 313 is attached to the The inner wall surface of the hollow groove 15 can be affixed through a heat-conducting medium (not shown) between the lap joint section 314 and the upper receiving section 16 and between the vertical plate section 313 and the inner wall surface of the hollow groove 15, so that The bottom surface 311 of the substrate 31 and the heat receiving surface 14 form a coplanar structure A, and the coplanar structure A is used for attaching and contacting with a heat source (not shown).
此外,散热结构1更包括多数散热鳍片40,各散热鳍片40开设有彼此相互对应的多数穿孔41,并于各穿孔41的周缘分别延伸有一环墙42,散热鳍片40是以其穿孔41套接在前述热管20上,且各散热鳍片40彼此相互堆栈,并且藉助各环墙42的迭接而令任二相邻的散热鳍片40之间形有一流体通道43。 In addition, the heat dissipation structure 1 further includes a plurality of heat dissipation fins 40, and each heat dissipation fin 40 is provided with a plurality of through holes 41 corresponding to each other, and a ring wall 42 is respectively extended around the periphery of each through hole 41, and the heat dissipation fins 40 are formed by the through holes. 41 is sleeved on the aforementioned heat pipe 20 , and the cooling fins 40 are stacked on each other, and a fluid channel 43 is formed between any two adjacent cooling fins 40 by virtue of the overlapping of the ring walls 42 .
使用时利用基板31的底面311和均温板10的受热面14同时与发热源热接触,其中一部分的热量可沿着基底段312直接传递给鳍片32而予以散逸出去,另一部分的热量则由均温板10的汽液相变化来快速导离,并且透过各热管20再经由各散热鳍片40再予以散逸出去,进而提升其散热效能。 When in use, the bottom surface 311 of the substrate 31 and the heating surface 14 of the vapor chamber 10 are in thermal contact with the heat source at the same time, a part of the heat can be directly transferred to the fins 32 along the base section 312 to be dissipated, and the other part of the heat can be dissipated. The vapor-liquid phase change of the vapor chamber 10 is quickly conducted away, and dissipated through the heat pipes 20 and then through the heat dissipation fins 40 , thereby improving its heat dissipation performance.
请参阅图4及图5所示,本实用新型的散热结构除了可为上述实施例外,本实施例的散热结构1a在镂空槽15外周缘的均温板10底部设有一阶梯状下承接段18,散热构件30a的基板31包含一基底段312及自基底段312两侧朝水平方向延伸的一搭接段314,其中基底段312封闭镂空槽15的底端,各搭接段314分别对应于各下承接段18贴接,在搭接段314与下承接段18之间可透过导热介质予以固接,从而使基板31的底面311与受热面14形成一共面结构A。 Please refer to Fig. 4 and Fig. 5, except that the heat dissipation structure of the present invention can be the above-mentioned embodiment, the heat dissipation structure 1a of this embodiment is provided with a stepped lower receiving section 18 at the bottom of the uniform temperature plate 10 on the outer periphery of the hollow groove 15 The substrate 31 of the heat dissipation member 30a includes a base section 312 and an overlapping section 314 extending horizontally from both sides of the base section 312, wherein the base section 312 closes the bottom end of the hollow groove 15, and each overlapping section 314 corresponds to The lower receiving sections 18 are bonded together, and the overlapping sections 314 and the lower receiving sections 18 can be fixed through a heat-conducting medium, so that the bottom surface 311 of the substrate 31 and the heating surface 14 form a coplanar structure A.
请参阅图6及图7所示,本实施例的散热结构1b以其基底段312封闭镂空槽15的底端,利用两侧的鳍片32与镂空槽15的内壁贴接,在鳍片32与镂空槽15的内壁之间可透过导热介质予以固接,从而使基板31的底面311与受热面14形成一共面结构A。 6 and 7, the heat dissipation structure 1b of this embodiment closes the bottom end of the hollow groove 15 with its base section 312, and uses the fins 32 on both sides to stick to the inner wall of the hollow groove 15, and the fins 32 The inner wall of the hollow groove 15 can be fixed through a heat conducting medium, so that the bottom surface 311 of the substrate 31 and the heating surface 14 form a coplanar structure A.
请参阅图8所示,本实用新型更提供一种包含前述散热结构的水冷式散热装置,主要包括一散热结构1及一盖体5,其中盖体5罩盖在均温板10上,以盖体5的底缘对应于前述的插沟17嵌入封合,而在盖体5和均温板10之间形成有一液体腔室B,各热管20、各鳍片32和各散热鳍片40分别形成在液体腔室B内,另在盖体5开设有连通液体腔室B的一进水口51及二出水口52。 Please refer to Fig. 8, the utility model further provides a water-cooled heat dissipation device including the aforementioned heat dissipation structure, which mainly includes a heat dissipation structure 1 and a cover body 5, wherein the cover body 5 is covered on the uniform temperature plate 10, so as to The bottom edge of the cover body 5 is embedded and sealed corresponding to the aforementioned socket groove 17, and a liquid chamber B is formed between the cover body 5 and the uniform temperature plate 10, and each heat pipe 20, each fin 32 and each heat dissipation fin 40 They are respectively formed in the liquid chamber B, and a water inlet 51 and two water outlets 52 communicating with the liquid chamber B are opened on the cover body 5 .
此外,本实用新型的水冷式散热装置进一步包括一进水管6、二出水管7及一隔板8,其中进水管6对应于前述进水口51连接,各出水管7则分别对应于前述出水口52连接,隔板8夹掣在各热管20与各鳍片22的顶端和盖体5的顶板之间,并在对应进水管6的隔板8中间处设有一流体通道81。当流体从进水管6进入液体腔室B后将直接冲击各鳍片32和基底段312,并将各鳍片32和基底段312所产生的主热量带离,继之流经两侧的各热管20和各散热鳍片40并将次热量带离,其后再沿着隔板8与盖体5的顶板所形成的通道而从各出水管7流出,如此以达成水冷式散热装置内部流体的流动过程。 In addition, the water-cooled heat dissipation device of the present utility model further includes a water inlet pipe 6, two water outlet pipes 7 and a partition 8, wherein the water inlet pipe 6 is connected to the aforementioned water inlet 51, and the water outlet pipes 7 are respectively corresponding to the aforementioned water outlets. 52 connection, the partition 8 is clamped between each heat pipe 20 and the top of each fin 22 and the top plate of the cover 5 , and a fluid channel 81 is provided in the middle of the partition 8 corresponding to the water inlet pipe 6 . When the fluid enters the liquid chamber B from the water inlet pipe 6, it will directly impact the fins 32 and the base section 312, and take away the main heat generated by the fins 32 and the base section 312, and then flow through each of the fins 32 and the base section 312. The heat pipe 20 and each heat dissipation fin 40 will take the secondary heat away, and then flow out from each outlet pipe 7 along the channel formed by the partition plate 8 and the top plate of the cover body 5, so as to achieve the internal fluidity of the water-cooled heat sink. flow process.
综上所述,本实用新型之散热结构及包含该结构的水冷式散热装置,确可达到预期之使用目的,而解决习知之缺失,又因极具新颖性及进步性,完全符合新型专利申请要件,依专利法提出申请,敬请详查并赐准本案专利,以保障申请人之权利。 In summary, the heat dissipation structure of the present utility model and the water-cooled heat dissipation device including the structure can indeed achieve the expected purpose of use, and solve the lack of conventional knowledge, and because of its novelty and progress, it is completely in line with the new patent application The essential requirement is to file an application in accordance with the Patent Law. Please check carefully and grant the patent of this case to protect the rights of the applicant.
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107567248A (en) * | 2017-09-08 | 2018-01-09 | 中微冷却技术(深圳)有限公司 | Liquid-cooling heat radiator |
CN110017713A (en) * | 2018-01-10 | 2019-07-16 | 迈萪科技股份有限公司 | Temperature-uniforming plate heat radiation module |
CN110993593A (en) * | 2019-12-13 | 2020-04-10 | 复旦大学 | Radiator and ultraviolet LED light source adopting same |
CN113966136A (en) * | 2020-07-20 | 2022-01-21 | 双鸿电子科技工业(昆山)有限公司 | Heat sink device |
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2016
- 2016-03-17 CN CN201620204678.6U patent/CN205584691U/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107567248A (en) * | 2017-09-08 | 2018-01-09 | 中微冷却技术(深圳)有限公司 | Liquid-cooling heat radiator |
CN107567248B (en) * | 2017-09-08 | 2020-04-17 | 中微冷却技术(深圳)有限公司 | Liquid cooling heat radiator |
CN110017713A (en) * | 2018-01-10 | 2019-07-16 | 迈萪科技股份有限公司 | Temperature-uniforming plate heat radiation module |
CN110993593A (en) * | 2019-12-13 | 2020-04-10 | 复旦大学 | Radiator and ultraviolet LED light source adopting same |
CN110993593B (en) * | 2019-12-13 | 2025-04-15 | 复旦大学 | Radiator and ultraviolet LED light source using the radiator |
CN113966136A (en) * | 2020-07-20 | 2022-01-21 | 双鸿电子科技工业(昆山)有限公司 | Heat sink device |
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