CN205584499U - Package structure and microphone - Google Patents

Abstract

The utility model relates to a packaging structure and microphone. This packaging structure includes: PCB board and become sealed cavity's shell with the PCB plate -type is provided with cyclic annular conducting layer on the PCB board, the shell is fixed on the PCB board through this ring -type conducting layer, the PCB inboard is provided with the earthing terminal, and the position that lies in cyclic annular conducting layer on the PCB board is provided with a plurality of plated -through holes that have a perfect understanding cyclic annular conducting layer and earthing terminal, and a plurality of plated -through holes distribute on the extending direction of cyclic annular conducting layer, and cyclic annular conducting layer links together through plated -through hole and earthing terminal electricity. This microphone is equipped with above -mentioned packaging structure. This packaging structure is equipped with a plurality of plated -through holes, and these a plurality of plated -through holes make the shell realize electromagnetic shield's effect on not only can being electrically connected to the earthing terminal with the shell, but also can be in PCB plate thickness orientation form effective shielding to the electromagnetism noise of external communication.

Description

Package structure and microphone

technical field

The utility model relates to the technical field of acoustic energy conversion, more specifically, the utility model relates to a packaging structure and a microphone using the packaging structure.

Background technique

The microphone is easily affected by external electromagnetic noise during use, causing noise and reducing the user experience. At present, the packaging structure of the microphone realizes the shielding of external electromagnetic noise by connecting the ground terminal with the shell. Generally, a hole is punched on the PCB first, and then the lead wire is passed through the hole to electrically connect the shell to the ground terminal on the PCB to prevent electromagnetic noise. is eliminated through the ground terminal. However, this packaging structure has a low level of integration. In addition, the structure has poor shielding effect, and electromagnetic noise can enter the microphone through the thickness direction of the PCB.

Utility model content

One purpose of the utility model is to provide a new technical solution for the packaging structure.

According to a first aspect of the present invention, a packaging structure is provided. The packaging structure includes: a PCB board and a shell forming a sealed inner cavity with the PCB board, the PCB board is provided with a ring-shaped conductive layer, and the shell is fixed on the PCB board through the ring-shaped conductive layer; The PCB board is provided with a ground terminal, and the position of the annular conductive layer on the PCB board is provided with a plurality of metallized through-holes passing through the annular conductive layer and the ground terminal, and the plurality of metallized through-holes Distributed in the extension direction of the ring-shaped conductive layer, the ring-shaped conductive layer is electrically connected to the ground terminal through metallized through holes.

Preferably, the plurality of metallized through holes are evenly distributed in the annular conductive layer.

Preferably, the shell is electrically connected to the ring-shaped conductive layer through conductive glue.

Preferably, the metalized through hole includes a conductor layer located on the inner wall of the metalized through hole.

Preferably, the material of the conductor layer is gold, silver, copper or aluminum.

Preferably, fillers are provided in the metallized through holes.

Preferably, the filler is a non-conductive material.

Preferably, the non-conductive material is resin.

Preferably, the filler is a conductive material, and the conductive material is integrated with the conductor layer.

According to the second aspect of the present invention, a microphone is provided. The microphone includes: a receiver and the packaging structure provided by the utility model, the receiver is arranged in the inner cavity, and the receiver is signal-connected with the PCB board.

A technical effect of the utility model is that the packaging structure is provided with a plurality of metallized through holes, and the plurality of metallized through holes can not only electrically connect the shell to the ground terminal, so that the shell can achieve the effect of electromagnetic shielding; In the thickness direction of the PCB board, it forms an effective shield against the electromagnetic noise transmitted from the outside. The microphone has the characteristics of anti-interference, low noise and good sound effect.

Other features and advantages of the present invention will become clear from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings.

Description of drawings

The accompanying drawings, which constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.

Figure 1: A cross-sectional view of the packaging structure of the embodiment of the present invention.

Fig. 2: Schematic diagram of the structure of the PCB board of the embodiment of the utility model.

Figure 3: Partial enlarged view of Figure 1.

detailed description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

The following description of at least one exemplary embodiment is merely illustrative in nature, and in no way serves as any limitation of the invention and its application or use.

Techniques and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques and devices should be considered part of the description.

In all examples shown and discussed herein, any specific values should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have different values.

It should be noted that like numerals and letters denote like items in the following figures, therefore, once an item is defined in one figure, it does not require further discussion in subsequent figures.

Referring to Fig. 1-2, the utility model provides a packaging structure, which can be used in electronic equipment such as microphones and earphones. The package structure includes: a shell 1 and a PCB board 2 . The shell 1 and the PCB board 2 are fixed together to form a sealed inner cavity 3 .

Specifically, a ring-shaped conductive layer 21 is provided at the position where the upper surface of the PCB 2 is used to connect with the shell 1 , and the shell 1 is fixed on the PCB 2 through the ring-shaped conductive layer 21 . The lower end of the housing 1 can be fixedly connected to the ring-shaped conductive layer 21 by methods known to those skilled in the art, such as conductive adhesive bonding, soldering and the like. It can be understood that the shape of the ring-shaped conductive layer 21 matches the shape of the housing 1 , such as a rectangular ring, a circular ring, an elliptical ring, and the like.

Referring to FIG. 1 , the PCB board 2 is provided with a ground terminal 4 . A plurality of metallized through holes 211 penetrating through the annular conductive layer 21 and the ground terminal 4 are provided on the PCB board 2 at the position of the annular conductive layer 21, and the plurality of metallized through holes 211 are formed on the annular conductive layer 21. The ring-shaped conductive layer 21 is distributed along the extending direction, and the ring-shaped conductive layer 21 is electrically connected to the ground terminal 4 through the metallized through hole 211 .

In a specific embodiment of the present utility model, the metallized through hole 211 includes a conductor layer 212 located on the inner wall of the metallized through hole, which belongs to the common knowledge of those skilled in the art. The hole 211 has a conductive function to realize the electrical connection between the annular conductive layer 21 and the ground terminal 4 .

Further, the material of the conductor layer 212 can be selected from conductive metals such as gold, silver, copper, or aluminum, or can be selected from materials such as conductive ceramics, conductive glass, and conductive graphite. In a specific implementation of the present invention, for example, the conductive layer 212 may be formed on the inner wall of the metallized through hole 211 by electroplating. The electroplating method has the characteristics of easy operation. In addition, the electroplating method can form a coating with a set thickness according to actual needs, and the coating has strong adhesion to the inner wall. The coating is controllable and not easy to cause waste of raw materials. It can be understood that the thicker the coating, the better the conductivity, and conversely, the thinner the coating, the worse the conductivity.

In another specific embodiment of the present invention, the conductor layer 212 may be formed on the inner wall of the metallized through hole 211 by electroless plating. The electroless plating method also has the characteristics of convenient operation, controllable coating thickness and strong adhesion. Of course, the conductor layer 212 may also use existing aluminum foil, copper foil, etc., which are fixedly connected to the inner wall of the metallized through hole 211 by bonding. This method is widely used and will not be repeated here.

Referring to FIG. 3 , those skilled in the art can set the position of the ground terminal 4 according to actual needs. If it is set on the lower surface of the PCB board 2, then the metallized through hole 211 should be set to penetrate the thickness of the PCB board 2 at this time. Direction, so as to realize the conduction between the annular conductive layer 21 and the ground terminal 4 . It is also possible to arrange the ground terminal 4 inside the base material of the PCB board 2 through a stacking technique.

In the packaging structure provided by the utility model, a plurality of metallized through holes 211 distributed along the extending direction of the annular conductive layer 21 are arranged on the position of the annular conductive layer 21 on the PCB board 2, through which the plurality of metallized through holes 211 are arranged. The hole 211 can not only electrically connect the shell 1 to the ground terminal, so that the shell 1 can achieve the effect of electromagnetic shielding; but also can effectively shield the electromagnetic noise propagating from the outside in the thickness direction of the PCB board 2 . The packaging structure also has the characteristics of high integration and convenient installation.

It can be understood that factors such as the number, distribution density, coverage area, and uniformity of the metallized through holes 211 have an important impact on the shielding effect of external electromagnetic noise transmitted along the thickness direction of the PCB board 2 . The more uniform the distribution of the metallized through holes 211 , the larger the number, the greater the distribution density, and the larger the coverage area of a single metallized through hole 211 , the better the shielding effect of the entire PCB 2 .

In order to achieve a better shielding effect, in some examples, a plurality of metallized through holes 211 are evenly distributed in the extending direction of the annular conductive layer 21 . This distribution form can form a good shield against the electromagnetic noise propagating along the thickness direction of the PCB board 2 . Those skilled in the art can design the number of metallized through holes 211 , spacing of metallized through holes 211 , distribution density, coverage area, etc. according to actual needs, which is not limited by the present invention.

In a preferred embodiment of the present invention, since a plurality of metallized through holes 211 are arranged on the PCB board 2, when the package structure is applied in an acoustic package structure, the metallized through holes 211 may form an acoustic package The resonant cavity of the structure, thereby affecting its acoustic performance.

In order to solve this problem, in a preferred embodiment of the present utility model, referring to FIG. 3 , the metallized through hole 211 is provided with a filler 22, thereby preventing the formation of a resonant cavity and greatly reducing the generation of noise. , improving the acoustic effect of the encapsulation structure.

Further, the filler 22 can be a conductive material or a non-conductive material. Wherein, when a conductive material is used as the filler 22, the same material as the conductor layer 212 can be selected to form the filler 22 while metallizing the metallized through hole 211; this structure can also improve the metallized through hole 211. The conductivity of the hole, so that the package structure has a better shielding effect on external electromagnetic noise. The filler 22 can also be made of non-conductive materials, including but not limited to resin, foam, rubber, plastic and other materials.

The utility model also provides a microphone, which includes: a receiver and the above-mentioned packaging structure, the receiver is arranged in the inner cavity 3 , and the receiver is connected to the PCB board 2 for signals. The microphone has the characteristics of anti-interference, low noise and good sound effect.

Although some specific embodiments of the present utility model have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration, rather than limiting the scope of the present utility model. It should be understood by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the present invention. The scope of the invention is defined by the appended claims.

Claims (10)

1. A packaging structure, characterized in that it comprises: a PCB board (2) and a housing (1) forming a sealed inner cavity (3) with the PCB board (2), the PCB board (2) is provided with a ring Conductive layer (21), the shell (1) is fixed on the PCB board (2) through the ring-shaped conductive layer (21); the PCB board (2) is provided with a ground terminal (4), so A plurality of metallized through holes (211) penetrating through the ring-shaped conductive layer (21) and the ground terminal (4) are provided on the PCB board (2) at the position of the ring-shaped conductive layer (21), and the A plurality of metallized through holes (211) are distributed in the extension direction of the ring-shaped conductive layer (21), and the ring-shaped conductive layer (21) is electrically connected with the ground terminal through the metallized through holes (211). 2. The package structure according to claim 1, characterized in that, the plurality of metallized through holes (211) are evenly distributed in the annular conductive layer (21). 3. The packaging structure according to claim 1, characterized in that, the housing (1) is electrically connected to the annular conductive layer (21) through conductive glue. 4. The package structure according to claim 1, characterized in that, the metallized through hole (211) comprises a conductor layer (212) located on an inner wall of the metallized through hole. 5. The package structure according to claim 4, characterized in that, the material of the conductor layer (212) is gold, silver, copper or aluminum. 6. The package structure according to claim 5, characterized in that, a filler (22) is arranged in the metallized through hole (211). 7. The packaging structure according to claim 6, characterized in that, the filler (22) is a non-conductive material. 8. The package structure according to claim 7, wherein the non-conductive material is resin. 9. The package structure according to claim 6, characterized in that the filler is a conductive material, and the conductive material is integrated with the conductor layer (212). 10. A microphone, characterized in that it comprises: a receiver and the packaging structure as claimed in any one of claims 1-9, the receiver is arranged in the inner cavity (3), the receiver and the PCB Board (2) signal connections.