CN205545576U - Imaging module and electronic device - Google Patents

Abstract

The utility model discloses an imaging module and electron device. The imaging module comprises a flexible circuit board and at least two camera modules. The flexible circuit board comprises at least two module installation parts arranged at intervals and a connector installation part connected with the at least two module installation parts. At least two modules of making a video recording set up respectively on two at least module installation departments, and two at least modules of making a video recording set up at the interval. The utility model discloses among embodiment's the formation of image module, two at least modules intervals of making a video recording set up and make and have sufficient space between two at least modules of making a video recording, can conveniently adjust the optical axis of two at least modules of making a video recording to the parallel position, guarantee the shooting quality of formation of image module.

Description

Imaging module and electronic device

priority information

This application claims the priority and benefit of patent application numbers 201511025532.1, 201521132821.7, 201511024922.7, and 201521131513.2 filed with the State Intellectual Property Office of China on December 30, 2015, and is hereby incorporated by reference in its entirety.

technical field

The utility model relates to the technical field of photography, in particular to an imaging module and an electronic device.

Background technique

With the improvement of people's requirements for the quality of captured images, multi-cameras, such as dual-cameras, camera technology has emerged as the times require. In order to ensure the quality of photographing, the optical axes of the multiple camera modules of the multi-camera module are arranged in parallel. Therefore, in the production process of the multi-camera module, how to conveniently adjust the optical axes of the multiple cameras to parallel positions has become an urgent problem to be solved.

Utility model content

The utility model aims at at least solving one of the technical problems existing in the prior art. Therefore, the utility model provides an imaging module and an electronic device.

The imaging module of the embodiment of the utility model includes a flexible circuit board and at least two camera modules. The flexible circuit board includes at least two module installation parts arranged at intervals and a connector installation part connecting the at least two module installation parts. At least two camera modules are respectively arranged on at least two module mounting parts, and at least two camera modules are arranged at intervals.

In the imaging module of the embodiment of the present utility model, at least two camera modules are arranged at intervals so that there is enough space between the at least two camera modules, and the optical axes of the at least two camera modules can be easily adjusted to parallel position to ensure the shooting quality of the imaging module.

In some embodiments, the number of the module installation part and the number of the camera modules are both two.

In some embodiments, the flexible circuit board includes at least two connecting parts arranged at intervals, and each of the connecting parts is respectively connected to the corresponding module mounting part and the connector mounting part.

In some embodiments, each of the camera modules includes a printed circuit board and an image sensor disposed on the printed circuit board and electrically connected to the printed circuit board, and the printed circuit board is disposed on the on the module installation part and electrically connected with the module installation part.

In some embodiments, the module mounting part includes a first electrical connection pad, and the printed circuit board includes a second electrical connection pad correspondingly connected to the first electrical connection pad, and the printed circuit board The board is electrically connected to the module installation part through the second electrical connection pad and the first electrical connection pad.

In some embodiments, the shape and size of the printed circuit board correspond to the corresponding module mounting portion.

In some embodiments, the camera module includes a lens module disposed on the printed circuit board and above the image sensor.

In some embodiments, the lens module includes a lens and a voice coil motor, the lens is arranged in the voice coil motor, the voice coil motor includes a housing, and the at least two camera modules At least two of the casings are arranged at intervals.

In some embodiments, the imaging module includes a connector assembly, the connector assembly includes a substrate and a connector disposed on the substrate, the substrate is disposed on the connector mounting portion and is connected to the The above-mentioned connector installation part is electrically connected.

In some embodiments, the imaging module includes colloid, and the colloid bonds two adjacent camera modules.

In some embodiments, each of the camera modules includes a connection side opposite to the adjacent camera modules, and two adjacent camera modules are fixedly connected by welding the connection sides.

In some embodiments, the imaging module includes a cover, and the at least two camera modules are arranged in the cover and fixedly connected with the cover.

In some embodiments, the cover includes a frame surrounding the two camera modules and a top cover connected to the top of the frame, and the frame and the top cover are connected to the two camera modules through glue. A camera module is fixedly connected.

An electronic device according to an embodiment of the present invention includes the aforementioned imaging module.

In the above-mentioned electronic device, at least two camera modules are arranged at intervals so that there is enough space between the at least two camera modules, and the optical axes of the at least two camera modules can be easily adjusted to a parallel position to ensure the stability of the electronic device. Shooting quality.

Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present utility model will become apparent and easy to understand from the description of the embodiments in conjunction with the following drawings, wherein:

FIG. 1 is a schematic structural diagram of an imaging module according to an embodiment of the present invention.

FIG. 2 is another structural schematic diagram of the imaging module according to the embodiment of the present invention.

FIG. 3 is a perspective view of an imaging module according to an embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view of the imaging module in FIG. 3 along the IV-IV direction.

FIG. 5 is an enlarged schematic diagram of a V portion of the imaging module in FIG. 4 .

FIG. 6 is an exploded schematic view of the imaging module according to the embodiment of the present invention.

FIG. 7 is another exploded schematic view of the imaging module according to the embodiment of the present invention.

FIG. 8 is a schematic perspective view of the cover of the imaging module according to the embodiment of the present invention.

FIG. 9 is a schematic structural diagram of the flexible circuit board of the imaging module according to the embodiment of the present invention.

detailed description

Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present utility model, but should not be construed as limiting the present utility model.

In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", Orientation indicated by "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. Or the positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be configured in a specific orientation, and operation, and therefore cannot be construed as a limitation of the utility model. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the present utility model, "plurality" means two or more, unless otherwise specifically defined.

In the description of the present utility model, it should be noted that, unless otherwise clearly stipulated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a flexible connection. Detachable connection, or integral connection; it can be mechanical connection, electrical connection or mutual communication; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components or the mutual communication of two components role relationship. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present utility model according to specific situations.

In the present invention, unless otherwise clearly specified and limited, a first feature being "on" or "below" a second feature may include direct contact between the first and second features, and may also include the first and second features being in direct contact with each other. The features are not in direct contact but through another feature between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "below" and "under" the first feature to the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is less horizontal than the second feature.

The disclosure below provides many different implementations or examples for realizing different structures of the present invention. To simplify the disclosure of the present invention, components and arrangements of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the utility model. Furthermore, the present disclosure may repeat reference numerals and/or reference letters in different instances, such repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, various specific process and material examples are provided herein, but one of ordinary skill in the art may recognize the use of other processes and/or the use of other materials.

FIG. 1 is a schematic structural diagram of an imaging module according to an embodiment of the present invention. FIG. 2 is another structural schematic diagram of the imaging module according to the embodiment of the present invention. Neither FIG. 1 nor FIG. 2 shows the cover body of the imaging module.

The imaging module 100 shown in FIG. 1 includes two camera modules 20 arranged at intervals. The imaging module 200 shown in FIG. 2 includes three camera modules 204 arranged at intervals.

Referring to FIG. 1 , an imaging module 100 according to an embodiment of the present invention includes a flexible circuit board 10 and two camera modules 20 .

The flexible circuit board 10 includes two module mounting portions 11 and a connector mounting portion 12 . The two module mounting parts 11 are arranged at intervals. The connector installation part 12 connects the two module installation parts 11 . The two camera modules 20 are arranged on the two module mounting parts 11 respectively, and the two camera modules 20 are arranged at intervals.

In the imaging module 100 of the embodiment of the present utility model, the two camera modules 20 are arranged at intervals so that there is enough space between the two camera modules 20, and the optical axes of the two camera modules 20 can be easily adjusted to be parallel. position to ensure the shooting quality of the imaging module 100 .

Specifically, in one example, when assembling the imaging module 100, first fix the two camera modules 20 to the module installation part 11 respectively, and then clamp and fix one of the camera modules 20 with a manipulator, and then use the manipulator Adjust the position of the other camera module 20 so that the optical axes of the two camera modules 20 are parallel, and the two camera modules 20 face the same side.

Please refer to FIG. 2 , an imaging module 200 according to another embodiment of the present invention includes a flexible circuit board 202 and three camera modules 204 . The flexible circuit board 202 includes three module mounting portions 202a and a connector mounting portion 202b. The three module installation parts 202a are arranged at intervals. The connector mounting portion 202b is connected to the three module mounting portions 202a. The three camera modules 204 are respectively arranged on the three module mounting parts 202a, and the three camera modules 204 are arranged at intervals.

It can be understood that in other embodiments, the number of module mounting parts and camera modules can be more than three, and more than three camera modules can be arranged along the same straight line, and can also be arranged to form other shapes, such as Triangle, square and other shapes.

For the convenience of description, the following will further describe an embodiment in which both the number of module mounting parts and the number of camera modules are two, but this should not be construed as a limitation of the present invention.

Referring to FIG. 9 , in this embodiment, the flexible circuit board 10 includes two connecting portions 13 arranged at intervals, and each connecting portion 13 connects each module mounting portion 11 and the connector mounting portion 12 .

The distance between the two connecting parts 13 can further facilitate the deformation of the flexible circuit board 10 , thereby facilitating the adjustment of the positions of the two camera modules 20 so that the optical axes of the two camera modules 20 are parallel.

Referring to FIGS. 3-5 , in this embodiment, each camera module 20 includes a printed circuit board 21 (Printed Circuit Board, PCB) and an image sensor 22 . The sensing surfaces of the two image sensors 22 face the same side. The printed circuit board 21 is disposed on the module installation part 11 and is electrically connected to the module installation part 11 . The image sensor 22 is disposed on the printed circuit board 21 and is electrically connected to the printed circuit board 21 .

In this way, the image sensor 22 can acquire the image of the object, and transmit the image to the external device through the printed circuit board 21 and the flexible circuit board 10 .

Specifically, the image sensor 22 may be a complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor, CMOS) image sensor or a charge-coupled device (Charge-coupled Device, CCD) image sensor.

In this embodiment, the module mounting part 11 includes a first electrical connection pad 111, the printed circuit board 21 includes a second electrical connection pad 211 correspondingly connected to the first electrical connection pad 111, and the printed circuit board 21 passes through the second electrical connection pad 111. The electrical connection pad 211 and the first electrical connection pad 111 are electrically connected to the module installation portion 11 .

In this way, the first electrical connection pad 111 and the second electrical connection pad 211 realize the electrical connection and communication between the flexible circuit board 10 and the camera module 20 . For example, both the first electrical connection pad 111 and the second electrical connection pad 211 use conductive glue.

In this embodiment, the printed circuit board 21 corresponds to the shape and size of the corresponding module mounting portion 11 .

In this way, the structure of the imaging module 100 can be made more compact, which is beneficial to reduce the volume of the imaging module 100 . When the imaging module 100 is applied to an electronic device, the volume of the electronic device can be further reduced.

In this embodiment, as an example, the shape of each printed circuit board 21 and the corresponding module mounting portion 11 is flat. In other embodiments, the shape of each printed circuit board and the corresponding module mounting portion can be specifically set according to actual needs.

Please refer to FIG. 6 and FIG. 7 , in this embodiment, the camera module 20 includes a lens module 23 disposed on the printed circuit board 21 and above the image sensor 22 .

In this way, the lens module 23 can enable the image sensor 22 to obtain better quality images, thereby improving the shooting quality of the imaging module 100 .

In this embodiment, the lens module 23 includes a lens 231 and a voice coil motor 232, the lens 231 is arranged in the voice coil motor 232, the voice coil motor 232 includes a housing 2321, and the two housings in the two camera modules 20 2321 interval setting.

The voice coil motor 232 can drive the lens 231 to move along the optical axis direction of the lens 231 to adjust the distance between the lens 231 and the image sensor 22, thereby realizing the autofocus of the imaging module 100, so that the imaging module 100 can obtain images with better quality .

Further, a filter 24 is disposed between the lens 231 and the image sensor 22 . The filter 24 can filter light with a preset frequency, so that the image sensor 22 can form a better image according to the filtered light.

Preferably, the filter 24 is an infrared cut filter. In this way, the infrared cut-off filter 24 can filter infrared light to avoid image distortion of the image sensor 22 .

Specifically, the lens module 23 further includes a base 233 , the base 233 defines a groove 2331 , and the bottom surface of the groove 2331 defines a through hole 2332 . The optical filter 24 is disposed in the groove 2331 and supported on the bottom surface of the groove 2331 , and the light filtered by the optical filter 24 can reach the image sensor 22 through the through hole 2332 .

In order to take the filter 24 conveniently, a connection groove 2333 is defined on the base 233 , and the connection groove 2333 communicates with the groove 2331 .

In this embodiment, the imaging module 100 includes a connector assembly 30 , and the connector assembly 30 includes a substrate 31 and a connector 32 disposed on the substrate 31 . The substrate 31 is disposed on the connector mounting portion 12 and electrically connected to the connector mounting portion 12 .

In this way, the connector 32 can quickly install the imaging module 100 on the electronic device.

Preferably, the base plate 31 corresponds to the shape and size of the connector mounting portion 12 . This can make the structure of the connector 32 and the flexible circuit board 10 more compact.

In this embodiment, the imaging module 100 includes glue 40 , and the glue 40 bonds two camera modules 20 .

After the optical axes of the two camera modules 20 are adjusted to be parallel to each other, glue 40 is injected between the two camera modules 20 . The colloid 40 can ensure that the two camera modules 20 are relatively fixed. The colloid 40 can increase the connection strength of the two camera modules 20 and can reduce the probability of optical axis deviation of the two camera modules 20 .

It should be noted that, in this embodiment, as shown by the orientation in FIG. 4 , the colloid 40 is located at the lower part of the gap between the two camera modules 20 . In other embodiments, the glue can fill the gap between the two camera modules.

The glue 40 can be, for example, UV glue (Ultraviolet Glue) and other viscous glue.

In some embodiments, each camera module includes a connection side opposite to another camera module, and two adjacent camera modules are fixedly connected by welding the connection side.

In this way, the two camera modules can be firmly fixed together by welding. For example, the connection side of each camera module can be fixedly connected to another camera module by laser spot welding or solder paste or tin wire welding.

In this embodiment, the imaging module 100 includes a cover body 50 , and the two camera modules 20 are arranged in the cover body 50 and fixedly connected with the cover body 50 .

For example, the cover body 50 and the two camera modules 20 can be fixedly connected by welding or glue.

In this way, the cover body 50 can further fix the positions of the two camera modules 20, reduce the impact force on the camera module 20 in the process of falling or shaking, increase the structural stability of the imaging module 100, and improve the imaging performance. Mod 100 quality.

Please refer to FIG. 8. In this embodiment, the cover body 50 includes a frame body 51 surrounding the two camera modules 20 and a top cover 52 connected to the top of the frame body 51. The frame body 51 and the top cover 52 are connected to the two camera modules through colloid. Module 20 is fixedly connected.

In this way, the frame body 51 and the top cover 52 of the cover body 50 are connected to the two camera modules 20 through colloid, which can increase the connection area between the cover body 50 and the two camera module groups 20, so that the cover body 50 is connected to the two camera modules 20. The camera module 20 is connected more firmly.

Specifically, the top cover 52 is provided with two light holes 251 , and the two camera modules 20 are respectively exposed through the two light holes 251 . The light passes through the aperture 251 , the lens 231 and the filter 24 in sequence and then reaches the image sensor 22 , so that the image sensor 22 can collect images of the outside world.

It should be noted that, in this embodiment, the two light holes 251 are both cylindrical. In other implementation manners, the shapes of the two light holes can be determined respectively. Therefore, the shape of the light hole in this embodiment cannot be construed as a limitation of the present invention.

In this embodiment, preferably, the optical hole 251 is coaxially arranged with the optical axis of the lens 231 .

Further, the imaging module 100 also includes a reinforcing plate 60 , on which the two module installation parts 11 are fixed.

In this way, the reinforcing plate 60 can further fix the positions of the two camera modules 20, improve the anti-collision capability of the imaging module 100, and further improve the shooting quality.

In this embodiment, the imaging module 100 further includes an anti-electromagnetic interference member 70 , and the reinforcing plate 60 is disposed on the anti-electromagnetic interference member 70 . The anti-electromagnetic wave interference component 70 can prevent the imaging module 100 from being interfered by electromagnetic waves, so as to ensure that the imaging module 100 obtains images with better quality. The anti-electromagnetic wave interference member 70 can be made of metal material, for example.

The electronic device according to the embodiment of the present invention includes the aforementioned imaging module 100 .

Therefore, the electronic device can conveniently adjust the optical axes of at least two camera modules 20 to a parallel position to ensure the shooting quality of the electronic device.

In the description of this specification, reference to the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific examples", or "some examples" etc. The specific features, structures, materials or features described in the embodiments or examples are included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes, modifications, substitutions and modifications, the scope of the present invention is defined by the claims and their equivalents.

Claims (14)

1. An imaging module, characterized in that, comprising: A flexible circuit board, the flexible circuit board including at least two module installation parts arranged at intervals and a connector installation part connecting the at least two module installation parts; and At least two camera modules, the at least two camera modules are respectively arranged on the at least two module mounting parts, and the at least two camera modules are arranged at intervals. 2 . The imaging module according to claim 1 , wherein the number of the module mounting parts and the number of the camera modules are both two. 3. The imaging module according to claim 1, wherein the flexible circuit board comprises at least two connecting parts arranged at intervals, and each connecting part is respectively connected to the corresponding module mounting part and the Connector mounting section described above. 4. The imaging module according to claim 1, wherein each camera module includes a printed circuit board and an image sensor disposed on the printed circuit board and electrically connected to the printed circuit board , the printed circuit board is disposed on the module installation part and is electrically connected with the module installation part. 5. The imaging module according to claim 4, wherein the module mounting portion includes a first electrical connection pad, and the printed circuit board includes a first electrical connection pad that is correspondingly connected to the first electrical connection pad. Two electrical connection pads, the printed circuit board is electrically connected to the module installation part through the second electrical connection pad and the first electrical connection pad. 6 . The imaging module according to claim 4 , wherein the shape and size of the printed circuit board correspond to the corresponding module mounting portion. 7 . 7. The imaging module according to claim 4, wherein the camera module comprises a lens module disposed on the printed circuit board and above the image sensor. 8. The imaging module according to claim 7, wherein the lens module includes a lens and a voice coil motor, the lens is arranged in the voice coil motor, and the voice coil motor includes a housing, At least two of the housings in the at least two camera modules are arranged at intervals. 9. The imaging module according to claim 1, wherein the imaging module includes a connector assembly, the connector assembly includes a substrate and a connector arranged on the substrate, and the substrate is arranged on The connector installation part is on and electrically connected with the connector installation part. 10 . The imaging module according to claim 1 , wherein the imaging module comprises glue, and the glue bonds two adjacent camera modules. 11 . 11. The imaging module according to claim 1, wherein each of the camera modules includes a connection side opposite to the adjacent camera modules, and two adjacent camera modules pass through Solder the connection side to secure the connection. 12 . The imaging module according to claim 1 , wherein the imaging module comprises a cover, and the at least two camera modules are arranged in the cover and fixedly connected to the cover. 13 . 13. The imaging module according to claim 12, wherein the cover comprises a frame surrounding the at least two camera modules and a top cover connected to the top of the frame, the frame And the top cover is fixedly connected with the at least two camera modules through colloid. 14. An electronic device, comprising the imaging module according to any one of claims 1-13.