CN205522539U - Synergistic flexible electron of multistation preparation system - Google Patents

Abstract

The utility model discloses a multi-station coordinated flexible electronic preparation system, which comprises a rotating disk module, upper and lower substrate modules distributed around it, a substrate electrospray module, a 3D printing bottom insulating layer module, an electrospinning module, 3D printing top insulating layer module, laser stripping module and reclaiming module, rotating disk module is used to fix substrate and station conversion; upper and lower substrate module is used to pick up and transfer substrate; substrate electrospray module is used to prepare substrate; 3D printing bottom layer and The top insulating layer module is used to print the insulating layer of the bottom layer and the top layer respectively; the electrospinning module is used to spin the circuit; the laser stripping module is used to ablate the substrate to automatically separate the substrate from the flexible electronics; the reclaiming module is used to separate the The flexible electronics are removed from the substrate. The whole system of the utility model can be cycled repeatedly, and has high production efficiency, low cost and high precision.

Description

A multi-station collaborative flexible electronic fabrication system

technical field

The utility model belongs to the field of flexible device manufacturing, and more specifically relates to a multi-station coordinated flexible electronic preparation system.

Background technique

Flexible Electronics (Flexible Electronics) is a general term for a technology, also known as plastic electronics, printed electronics, organic electronics, etc. Flexible electronics can be summarized as an emerging electronic technology that manufactures electronic devices made of organic or inorganic materials on flexible, ductile plastic or thin metal substrates. Medical, national defense and other fields have broad application prospects, such as flexible electronic displays, organic light-emitting diodes (OLEDs), printed RFID, thin-film solar panels, and electronic skin patches.

Like traditional IC technology, manufacturing process and equipment are also the main driving force for the development of flexible electronic technology. The technical level indicators of flexible electronics manufacturing include chip feature size and substrate area size. The key is how to manufacture flexible electronic devices with smaller feature sizes on larger substrates at lower cost. In recent years, the rapid development of flexible electronic devices and wearable devices has led to the continuous expansion of the demand for flexible electronics. Traditional preparation methods have been difficult to meet the increasing demand. A popular research point.

Utility model content

Aiming at the above defects or improvement needs of the prior art, the utility model provides a multi-station collaborative flexible electronic preparation system, which adopts a fully automatic production mode, and utilizes advanced electrospray, electrospinning, and 3D printing additive materials The combination of manufacturing and laser stripping and the method of rotating station conversion greatly improves production efficiency. The entire system can be cycled repeatedly, with high production efficiency, low cost, and high precision.

In order to achieve the above purpose, the utility model proposes a multi-station coordinated flexible electronic preparation system, which includes a rotating disk module, an upper and lower substrate module, a substrate electrospray module, a 3D printing bottom insulating layer module, an electrospinning module, 3D printing top insulation layer module, laser stripping module and reclaiming module, of which:

The rotary disk module includes a rotary disk and several clamps distributed on the circumference of the rotary disk, the clamps are used to fix the substrate, and the rotary disk is used for station conversion;

The upper and lower substrate modules, the base electrospray module, the 3D printing bottom insulating layer module, the electrospinning module, the 3D printing top insulating layer module, the laser stripping module and the reclaiming module are sequentially distributed around the rotating disk module; the upper and lower substrate The module is used to pick up the substrate and place it on the fixture, and to retrieve the substrate from the fixture and put it into the waste bin; the substrate electrospray module is used to electrospray a layer of sticky substrate on the substrate; The 3D printing bottom insulating layer module is used to print the bottom insulating layer on the substrate; the electrospinning module is used to spin a circuit on the bottom insulating layer; the 3D printing top insulating layer module is used to print the bottom insulating layer on the circuit Print out the insulating layer of the top layer; the laser lift-off module is used to ablate the substrate printed by the substrate electrospray module, so that the substrate and the flexible electronics are automatically separated; the reclaiming module is used to remove the separated flexible electronics from the substrate Take it off.

As a further preference, the 3D printing bottom insulating layer module (400) and the electrospinning module (500) form a set of printing electrospinning modules, and the printing electrospinning modules are one or more sets, all of which can realize Preparation of single-layer or multi-layer flexible electronics; when a set is arranged, if multi-layer flexible electronics are to be prepared, the rotating disk needs to be reversed from time to time during the preparation process, and when multiple sets are arranged, it does not need to be reversed. The layers are connected by electrodes spun by electrospinning.

As a further preference, the upper and lower substrate modules include a robot arm, a material box and a waste box, the robot arm is used for picking up and transferring the substrate, and it has three degrees of freedom, and the material box and the waste box are used for storage and use respectively Substrates before and after use.

As a further preference, the substrate electrospray module includes an electrospray motion unit and a spray nozzle installed thereon, the spray nozzle is driven by the electrospray motion unit to move in the XYZ direction, and it is connected to a spray solution container, The spray solution container is used to provide the material solution for preparing the base structure, and a spray high-voltage generator is arranged between the spray nozzle and the clamp for forming a high-voltage electric field between the spray nozzle and the clamp; Equipped with an electrospray down-looking camera for visual localization.

As a further preference, the 3D printing bottom insulating layer module includes a bottom motion unit and a bottom print head, and the bottom print head is installed on the bottom motion unit, which realizes movement in the XYZ direction driven by the bottom motion unit; A bottom-view camera is installed on the bottom-floor motion unit, and the bottom-floor bottom-view camera is used for visual positioning.

As a further preference, the electrospinning module includes an electrospinning movement unit and a spinning nozzle installed thereon, and the spinning nozzle is driven by the electrospinning movement unit to move in the XYZ direction, which is consistent with the spinning The solution container is connected, and the spinning solution container is used to provide a material solution for preparing a circuit, and a spinning high-voltage generator is arranged between the spinning nozzle and the clamp; the electrospinning movement unit is also provided with a visual positioning Spinning down looking camera.

As a further preference, the 3D printing top insulation layer module includes a top motion unit and a top print head, the top print head is installed on the top motion unit, and it moves in the XYZ direction driven by the top motion unit; A top-level downward-looking camera is installed on the top-level motion unit, and the top-level downward-looking camera is used for visual positioning.

As a further preference, the laser peeling module includes a peeling motion unit and a laser, the laser is installed on the peeling motion unit, and is driven by the peeling motion unit to move in the XYZ direction, which is used to generate laser light to ablate the substrate, The substrate is automatically separated from the flexible electronics; the peeling motion unit is equipped with a peeling down camera and a photoelectric distance sensor, the peeling down camera is used for visual positioning, and the photoelectric distance sensor is used to detect whether the substrate is completely separated from the flexible electronics.

As a further preference, the reclaiming module includes a reclaiming motion unit and a rotating pick-up head, the revolving pick-up head is installed on the reclaiming motion unit, and it realizes movement in the XYZ direction driven by the reclaiming motion unit, the Vacuum adsorption holes are provided on the outer surface of the circular arc of the cavity of the rotating pick-up head; the reclaiming motion unit is also provided with a retrieving downward-looking camera for visual positioning.

Generally speaking, compared with the prior art, the above technical solution conceived by the utility model mainly has the following technical advantages:

1. The substrate of the utility model is placed on a fixture of a rotating disk. The rotating disk rotates at a certain angle each time to reach a station, and stays for a period of time. After all the modules are completed, they continue to rotate at a certain angle and enter the next station. , so the reciprocating cycle greatly improves the production efficiency.

2. The turntable of the rotary disk module of the present utility model can not only rotate around a single direction to switch stations, but also can choose to reverse the angle of one or several stations during the process of rotating around one direction, so as to realize the Repeated production at each station, and the 3D printing bottom insulating layer module and electrospinning module can be repeatedly arranged to prepare multi-layer or more complex flexible electronics.

3. The substrate spraying module of the present utility model uses electrospray technology to spray a layer of substrate on the substrate. The substrate can be reliably connected to the substrate, and the material for manufacturing the substrate can be ablated by laser, thus realizing the realization of substrate spraying and laser ablation. Used in conjunction with stripping.

4. There are marking points for visual positioning on the substrate used in the utility model; base electrospray module, 3D printing bottom insulating layer module, electrospinning module, 3D printing top insulating layer module, laser stripping module and material reclaiming module All are equipped with a vision system. Before each module works, the vision system first recognizes the marking points on the substrate and has a common positioning point, so as to achieve high-precision positioning in the manufacturing process.

5. The laser stripping module of this utility model is equipped with a photoelectric distance sensor. Since the ablated part of the substrate printed by the substrate spray module is separated from the substrate, the flexible electronics will be slightly lifted, and the photoelectric distance sensor is used to capture this The change of the distance is used to determine whether the substrate is completely ablated, so as to ensure that the substrate can be completely separated from the flexible electronics.

6. Both electrospray and electrospinning of the present utility model apply voltages between respective nozzles and metal fixtures through high-voltage generators, and the electric field formed by the applied voltages can destroy the surface tension of the solution itself at the nozzle, thereby dissolving the solution Spray onto substrate.

7. The fixture of the utility model adopts the form of vacuum adsorption. There are many small holes for vacuum adsorption on the fixture panel, which overcomes the difficult problem that the flexible film is not easy to clamp; and the small holes for vacuum adsorption can be used as a reference feature for visual positioning. for faster positioning.

Description of drawings

Fig. 1 is the assembly diagram of the multi-station coordinated flexible electronic preparation system of the present invention;

Fig. 2 is a schematic structural view of the upper and lower substrate modules of the utility model;

Fig. 3 is a schematic structural view of the substrate electrospray module of the present invention;

Fig. 4 is a structural schematic diagram of the 3D printing bottom insulating layer module of the present invention;

Fig. 5 is a schematic structural view of the electrospinning module of the present invention;

Fig. 6 is a schematic structural view of the 3D printing top insulating layer module of the present invention;

Fig. 7 is a structural schematic diagram of the laser stripping module of the present invention;

Fig. 8 is a schematic structural view of the utility model reclaiming module;

Figure 9(a)-(h) is a schematic diagram of the fabrication process of the flexible electronics of the present invention.

detailed description

In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not intended to limit the utility model. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute conflicts with each other.

As shown in Figure 1, a multi-station coordinated flexible electronic preparation system provided by the embodiment of the utility model mainly includes a rotating disk module 100, an upper and lower substrate module 200, a base electrospray module 300, and a 3D printing bottom insulating layer module 400, the electrospinning module 500, the 3D printing top insulating layer module 600, the laser stripping module 700, and the reclaiming module 800, wherein the rotating disk module 100 is used to switch between stations, the upper and lower substrate modules 200, and the base electrospray module 300 , the 3D printing bottom insulating layer module 400, the electrospinning module 500, the 3D printing top insulating layer module 600, the laser stripping module 700, and the retrieving module 800 are evenly distributed around the rotating disk module 100 in sequence; the upper and lower substrate modules 200 are used for The bin picks up the substrate and puts it on the fixture 102, and is used to retrieve the substrate from the fixture and put it into the waste bin. There are marking points for visual positioning on the substrate; the substrate electrospray module 300 is used for electrospraying out A layer of adhesive substrate; 3D printing bottom insulating layer module 400 is used to print the bottom insulating layer on the substrate; electrospinning module 500 is used to spin out the circuit on the bottom insulating layer; 3D printing top insulating layer The module 600 is used to print the top insulation layer on the circuit; the laser lift-off module 700 is used to ablate the substrate printed by the substrate electrospray module, so that the substrate and the flexible electronics are automatically separated; the reclaiming module 800 is used to separate The flexible electronics are removed from the substrate and put into the bin. In this system, the base plate is placed on the rotating disk module. The rotating disk module reaches a station every time it rotates, and stays for a period of time. When the module work of this station is completed, it continues to rotate at a certain angle to enter the next station, and so on. Circulation, to achieve fully automatic production, greatly improving production efficiency.

Each module will be explained and described in detail below.

The rotating disk module 100 is mainly used for fixing the substrate and switching between stations. It includes a rotating disk 101 and several clamps 102 distributed on the circumference of the rotating disk 101. The clamps 102 are used to fix the substrate during the entire preparation process. The rotating disk 101 is used for For station conversion, the upper and lower substrate modules 200, base electrospray module 300, 3D printing bottom insulating layer module 400, electrospinning module 500, 3D printing top layer insulating layer module 600, laser stripping module 700 and reclaiming module 800 are in a certain position. The intervals are evenly distributed around the rotating disk 101 in order to form the upper and lower substrate stations, base electrospray station, 3D printing bottom insulating layer station, electrospinning station, 3D printing top insulating layer station, laser Stripping and reclaiming stations. Among them, the 3D printing bottom insulating layer module and the electrospinning module can be repeatedly arranged, that is, the 3D printing bottom insulating layer module 400 and the electrospinning module 500 are multiple, and they are arranged at intervals in sequence. Firstly, the 3D printing bottom insulating layer module is arranged. Then arrange the electrospinning module, then arrange the 3D printing bottom insulating layer mold, and so on, so as to realize the printing of multi-layer flexible electronics or more complex flexible electronics. The electrodes are connected. Among them, the first 3D printing bottom insulating layer module is used to print the bottom insulating layer on the substrate, and the subsequent 3D printing bottom insulating layer module is used to print the middle insulating layer on the circuit, which can be called 3D printing intermediate layer insulation layer module. The 3D printing described above is a kind of rapid prototyping technology based on digital model files and using powdered gold. It belongs to adhesive materials such as or plastic, and is constructed by layer-by-layer printing. object technology.

Specifically, the rotary disk 101 of the rotary disk module 100 can not only rotate around a single direction to switch stations, but also can choose to reverse the angle of one or several stations during the rotation around one direction, so as to realize the Repeated production at each station to prepare multi-layer or more complex flexible electronics.

Further, the clamp 102 of the rotary disk module 100 adopts the form of vacuum adsorption to fix the substrate, and the range of adsorption can be changed by adjusting the X-direction and Y-direction baffles in the suction cup so as to realize the fixation of substrates of different sizes and shapes .

As shown in Figure 2, the upper and lower substrate module 200 is used to pick up the substrate from the material box and place it on the fixture of the turntable and to retrieve the substrate from the fixture and put it into the waste box. Composed of waste bin 203, wherein the mechanical arm can have degrees of freedom around the Z axis, degrees of freedom around the X1 axis and X2 axis, for realizing the movement of the mechanical arm in the spatial position, and the output end of the mechanical arm 201 can be a vacuum chuck , used to pick up and place the substrates; the bin 202 and the waste bin 203 are used to store the substrates before use and after use, respectively.

As shown in FIG. 3 , the substrate electrospray module 300 is used to electrospray a layer of viscous substrate on the substrate, including an electrospray motion unit 301 and a spray nozzle 304 installed thereon. Driven by the motion unit 301 to move in the XYZ direction, it is connected with a spray solution container 303, which is used to provide a material solution for preparing the base structure, and the solution can be polarized by a high-voltage field and sprayed. Out speed and flow are controlled by flow pump; Spray nozzle 304 and fixture 102 are provided with spray high pressure generator 305, and one end wire of spray high pressure generator 305 links to each other with spray nozzle 304, and the other end wire links to each other with metal fixture 102, for A high-voltage electric field is formed between the spray nozzle 304 and the fixture 102; the electrospray motion unit 301 is also provided with an electrospray downward-looking camera 302 for visual positioning.

As shown in FIG. 4 , the 3D printing bottom insulating layer module 400 is used to print the bottom insulating layer on the substrate, which includes the bottom moving unit 401 and the bottom printing head 403, and the bottom printing head 403 is installed on the bottom moving unit 401, which The movement in the XYZ direction is realized under the drive of the bottom motion unit 401, which is used to spray solution to make an insulating layer; the bottom motion unit 401 is equipped with a bottom-view camera 402, which is used for visual positioning.

As shown in Figure 5, the electrospinning module 500 is used to spin out the circuit on the insulating layer of the bottom layer, and it comprises the electrospinning movement unit 501 and the spinning nozzle 504 that is installed on it, and the spinning nozzle 504 is in electrospinning Driven by the silk movement unit 501 to move in the XYZ direction, it is connected to the spinning solution container 503, which is used to provide the material solution for preparing the circuit. The solution can be polarized by the high-voltage field and sprayed. The ejection speed and flow rate are controlled by a flow pump; a spinning high-pressure generator 505 is set between the spinning nozzle 504 and the clamp 102, and one end of the spinning high-voltage generator 505 is connected to the spinning nozzle 504, and the other end of the wire is connected to the metal clamp. 102 connected to form a high-voltage electric field between the spinning nozzle 504 and the metal fixture 102; the electrospinning movement unit 501 is also provided with a spinning down-view camera 502 for visual positioning. The structure of the electrospinning module 500 is similar to that of the electrospray, the difference lies in the solution material, the size of the electric field, and the distance between the nozzle and the substrate. By changing these parameters, electrospray and electrospinning can be realized.

As shown in FIG. 6 , the 3D printing top insulation layer module 600 is used to print the top insulation layer on the circuit, which has the same structure as the 3D printing bottom insulation layer module 400, which includes a top motion unit 601 and a top print head 603, The top-layer print head 603 is installed on the top-layer motion unit 601, and it is driven by the top-layer motion unit 601 to realize the movement in the XYZ direction, which is used to spray solution to make an insulating layer; the top-layer motion unit 601 is equipped with a top-layer down-view camera 602, The top-level down-looking camera 602 is used for visual positioning.

As shown in Figure 7, the laser peeling module 700 is used to ablate the substrate printed by the substrate spray module, so that the substrate and the flexible electronics are automatically separated, which includes a peeling motion unit 701 and a laser 703, and the laser 703 is installed on the peeling motion unit 701, and is driven by the stripping motion unit 701 to move in the XYZ direction, which is used to generate laser light to ablate the substrate, so that the substrate and the flexible electronics are automatically separated; the stripping motion unit 701 is equipped with a peeling down camera 702 and a photoelectric distance The sensor 704, the peel-off down-view camera 702 is used for visual positioning, and the photoelectric distance sensor 704 is used to detect whether the substrate is completely separated from the flexible electronics. The laser lift-off technology is to irradiate the corresponding area with laser light without damaging the substrate and the product, so that the special material layer in the middle is ablated and loses its viscosity, so that the substrate and the flexible electronics are automatically separated.

As shown in FIG. 8 , the retrieving module 800 is used to remove the separated flexible electronics from the substrate and put them into the bin, which includes a retrieving motion unit 801 and a rotating pick-up head 803, which is installed on the pick-up On the motion unit 801, it is driven by the reclaiming motion unit 801 to move in the XYZ direction; the rotating pick-up head 803 has a degree of freedom around the Z-axis, which is used to realize the rotation of the pick-up head around the Z-axis, and the arc of the cavity Vacuum adsorption holes arrayed in the axial and radial directions are processed on the outer surface, and the pickup head can independently adjust the spatial posture of the pickup device and the size of the adsorption working section according to the size and position of the flexible electronics to achieve accurate adsorption transfer; The material moving unit 801 is also provided with a reclaiming down-view camera 802 for visual positioning.

Figure 9(a)-(h) is a schematic diagram of the flexible electronics fabrication process, where A represents the substrate, B represents the base, C1 represents the bottom insulating layer, D1 represents the circuit, C2 represents the middle insulating layer, D2 represents the circuit, and C3 represents the top layer of insulation Layer and E represent electrodes. The specific process of using the system of the present invention to prepare double-layer flexible electronics will be described below in conjunction with Figure 9 (a)-(h), which mainly includes the following steps:

1) The upper and lower substrate modules 100 pick up the substrate A and correctly place it on the fixture 102 of the rotating disk;

2) The rotating disk rotates at a certain angle to reach the substrate electrospray module 300, and this module electrosprays a layer of substrate B on the substrate A;

3) The rotating disc rotates at a certain angle to reach the 3D printing bottom insulating layer module 400, which prints the bottom insulating layer C1 on the substrate B;

4) The rotating disc rotates at a certain angle to reach the electrospinning module 500, which spins the required circuit D1 on the insulating layer C1;

5) The rotating disc rotates at a certain angle to reach the 3D printing interlayer insulating layer module, which prints the interlayer insulating layer C2 on the circuit layer;

6) The rotating disk rotates at a certain angle to reach the electrospinning module, which spins the required circuit D2 on the insulating layer C2;

7) The rotating disc rotates at a certain angle to reach the 3D printed top insulating layer module 600, which prints the top insulating layer C3 on the circuit layer D2;

8) The rotating disk rotates at a certain angle to reach the laser lift-off module 700, which ablates the substrate B electrosprayed by the substrate electrospray module, so that the substrate A is automatically separated from the prepared flexible electronics;

9) The rotating disk rotates at a certain angle to reach the retrieving module 800, which removes the separated flexible electronics from the substrate A and puts them into the bin;

10) The rotating disc rotates at a certain angle to return to the upper and lower substrate modules 200, which removes the used substrate A and puts it into the waste bin;

This process is a preparation process of double-layer flexible electronics. For the preparation of single-layer or multi-layer flexible electronics, it is only necessary to increase or decrease the number of repetitions of the 3D printing intermediate insulating layer and the electrospinning module.

Those skilled in the art can easily understand that the above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements and modifications made within the spirit and principles of the present utility model Improvements and the like should all be included within the protection scope of the present utility model.

Claims (9)

1. the flexible electronic preparation system that a multistation is collaborative, it is characterised in that this system includes rotation Turntable module (100), upper and lower base plate module (200), substrate electron spray module (300), 3D beat Print bottom insulating barrier module (400), Electrospun module (500), 3D print top insulating layer module (600), laser lift-off module (700) and feeding module (800), wherein:

Described rotating disk module (100) include a rotating disk (101) and several be distributed in rotation Fixture (102) on dish (101) circumference, described fixture (102) is used for fixing substrate, described rotation Rotating disk (101) is used for carrying out station conversion；

Described upper and lower base plate module (200), substrate electron spray module (300), 3D print bottom exhausted Edge layer module (400), Electrospun module (500), 3D printing top insulating layer module (600), Laser lift-off module (700) and feeding module (800) are sequentially distributed in rotating disk module (100) Around；Described upper and lower base plate module (200) is used for picking up substrate and being seated to fixture (102), And put in ash can for fetching substrate from fixture；

Described substrate electron spray module (300) goes out one layer of base with stickiness for electron spray on substrate The end；Described 3D prints bottom insulating barrier module (400) for printing the insulation of bottom in substrate Layer；Described Electrospun module (500) is for spinning out circuit on bottom insulating barrier；Described 3D beats Print top insulating layer module (600) is for printing the insulating barrier of top layer on circuit；Described laser is shelled From module (700) for the substrate ablation that substrate electron spray module spray printing is gone out so that substrate is with flexible Electronics is automatically separated；Described feeding module (800) is for taking the flexible electronic separated from substrate Under.

2. the flexible electronic preparation system that multistation as claimed in claim 1 is collaborative, it is characterised in that Described 3D prints bottom insulating barrier module (400) and Electrospun module (500) forms a set of printing electricity Spin block, described printing Electrospun module is one or more sets, all can realize single or multiple lift flexible Prepared by electronics；When arranging a set of, to prepare layer flexible electronics, rotating disk need to be made to prepare Frequently inverting in journey, then need not reversion when arranging many sets, flexible electronic is between layers by electricity The spun electrode of spinning is connected.

3. the flexible electronic preparation system that multistation as claimed in claim 1 or 2 is collaborative, its feature Being, described upper and lower base plate module (200) includes mechanical arm (201), hopper (202) and waste material Case (203), described mechanical arm (201) is for pickup and transfer base substrate, and it has three degree of freedom, Substrate before described hopper (202) and ash can (203) are respectively used to deposit use and after use.

4. the flexible electronic preparation system that multistation as claimed in claim 3 is collaborative, it is characterised in that Described substrate electron spray module (300) includes electron spray moving cell (301) and mounted thereto Spray nozzle (304), the described spray nozzle (304) drive in electron spray moving cell (301) The lower movement realizing XYZ direction, its connection has spray solution container (303), this spray solution container (303) for providing the material solution of preparation underlying structure, described spray nozzle (304) and fixture (102) spraying high tension generator (305) it is provided with between, at spray nozzle (304) and fixture (102) high voltage electric field is formed between；It is additionally provided with for regarding on described electron spray moving cell (301) Camera (302) is regarded under the electron spray of feel location.

5. the flexible electronic preparation system that multistation as claimed in claim 4 is collaborative, it is characterised in that Described 3D prints bottom insulating barrier module (400) and includes that basic motion unit (401) and bottom print Head (403), described bottom printhead (403) is arranged on basic motion unit (401), its The movement in XYZ direction is realized under the drive of basic motion unit (401)；Described basic motion unit (401) On be provided with under bottom and regard camera (402), regard camera (402) under this bottom for vision localization.

6. the flexible electronic preparation system that multistation as claimed in claim 5 is collaborative, it is characterised in that Described Electrospun module (500) includes Electrospun moving cell (501) and spinning mounted thereto Nozzle (504), described spinning-nozzle (504) realizes under Electrospun moving cell (501) drives The movement in XYZ direction, it is connected with spinning solution container (503), this spinning solution container (503) The material solution of circuit is prepared, between described spinning-nozzle (504) and fixture (102) for offer It is provided with spinning high tension generator (505)；It is additionally provided with use on described Electrospun moving cell (501) Camera (502) is regarded under the spinning of vision localization.

7. the flexible electronic preparation system that multistation as claimed in claim 6 is collaborative, it is characterised in that Described 3D prints top insulating layer module (600) and includes that top layer moving cell (601) and top layer print Head (603), described top layer printhead (603) is arranged on top layer moving cell (601), its The movement in XYZ direction is realized under the drive of top layer moving cell (601)；Described top layer moving cell (601) On be provided with under top layer and regard camera (602), regard camera (602) under this top layer for vision localization.

8. the flexible electronic preparation system that multistation as claimed in claim 7 is collaborative, it is characterised in that Described laser lift-off module (700) includes peeling motion unit (701) and laser instrument (703), institute State laser instrument (703) to be arranged on peeling motion unit (701), and in peeling motion unit (701) Drive under realize XYZ direction and move, it is used for producing laser by substrate ablation so that substrate is with soft Property electronics is automatically separated；Stripping is installed lower regarding camera (702) on described peeling motion unit (701) With optoelectronic distance sensor (704), regard camera (702) under this stripping for vision localization, photoelectricity Range sensor (704) is used for detecting whether substrate is kept completely separate with flexible electronic.

9. the flexible electronic preparation system that multistation as claimed in claim 8 is collaborative, it is characterised in that Described feeding module (800) includes feeding moving cell (801) and rotating lift head (803), institute Stating rotating lift head (803) to be arranged on feeding moving cell (801), it is at feeding moving cell (801) movement in XYZ direction, the circle of described rotating lift head (803) cavity are realized under drive Arc outer surface is provided with vacuum absorption holes；It is additionally provided with for vision on described feeding moving cell (801) Camera (802) is regarded under the feeding of location.