CN205508539U - Metal foil formula current detection resistor - Google Patents
Metal foil formula current detection resistor Download PDFInfo
- Publication number
- CN205508539U CN205508539U CN201620238588.9U CN201620238588U CN205508539U CN 205508539 U CN205508539 U CN 205508539U CN 201620238588 U CN201620238588 U CN 201620238588U CN 205508539 U CN205508539 U CN 205508539U
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- electrode
- insulated substrate
- resistance
- nickel coating
- copper plate
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- 239000011888 foil Substances 0.000 title claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 22
- 239000002184 metal Substances 0.000 title claims abstract description 22
- 238000001514 detection method Methods 0.000 title abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 70
- 239000000956 alloy Substances 0.000 claims abstract description 19
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 19
- 238000009413 insulation Methods 0.000 claims abstract description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 56
- 238000000576 coating method Methods 0.000 claims description 37
- 239000011248 coating agent Substances 0.000 claims description 35
- 239000010410 layer Substances 0.000 claims description 30
- 229910052759 nickel Inorganic materials 0.000 claims description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 24
- 239000010949 copper Substances 0.000 claims description 24
- 239000011241 protective layer Substances 0.000 claims description 18
- 238000007747 plating Methods 0.000 claims description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 238000007639 printing Methods 0.000 abstract description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 26
- 230000008569 process Effects 0.000 description 15
- 239000000047 product Substances 0.000 description 14
- 238000012545 processing Methods 0.000 description 10
- 239000007772 electrode material Substances 0.000 description 9
- 239000011265 semifinished product Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 239000002002 slurry Substances 0.000 description 5
- 238000011161 development Methods 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- 238000004064 recycling Methods 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000012937 correction Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 description 1
- YTAHJIFKAKIKAV-XNMGPUDCSA-N [(1R)-3-morpholin-4-yl-1-phenylpropyl] N-[(3S)-2-oxo-5-phenyl-1,3-dihydro-1,4-benzodiazepin-3-yl]carbamate Chemical compound O=C1[C@H](N=C(C2=C(N1)C=CC=C2)C1=CC=CC=C1)NC(O[C@H](CCN1CCOCC1)C1=CC=CC=C1)=O YTAHJIFKAKIKAV-XNMGPUDCSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001149 cognitive effect Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
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- Details Of Resistors (AREA)
Abstract
The utility model discloses a metal foil formula current detection resistor has the front electrode through symmetry printing on the both sides of following the extension of X axle direction on insulation substrate is positive to the symmetry printing has the back electrode on the insulation substrate back and along the both sides that X axle direction is extended on, back electrode and front electrode one -to -one and symmetrical arrangement, and the electrode that enables insulation substrate both ends side is full, guarantees the resistance integrality, promotes the power of chip resistor ware, the R portion of this external resistance realizes the resistance by alloy foil, can guarantee the stability of resistance value to can realize superior resistor temperature coefficient index, setting up the R portion of resistance on the insulation substrate back in addition, greatly improving heat dissipation path and radiating condition, the further promotion of chip resistor ware power is guaranteed on can be rapidly distributing the PCB board with the heat of resistance to resistance, consequently but this metal foil formula current detection resistor wide application is in power supply's preparation.
Description
Technical field
This utility model relates to resistor technologies field, a kind of tinsel of concrete offer
Formula current sensing resistor.
Background technology
Along with progress, the development in epoch and the people of science and technology are small-sized to electronic product
Changing the continuous lifting required, the thick film Chip-R of dependable performance and process stabilizing also should
The property requirements of electronic product presents diversified development trend, it is well known that each
Kind electronic product, in order to ensure stabilizing it work, all can make a power supply,
Guarantee its normal and stable work, and the steady operation of every kind of power supply is the most too busy to get away
A kind of low resistance resistance being connected on feedback circuit play current detecting effect, this electricity
Resistance is exactly the current sense resistor that people often say, along with adding of miniaturization of electronic products
Play, the current sense resistor of high power low resistance is increasingly pursued by market.Existing
Common low resistance Chip-R is had to generally include insulated substrate, back electrode, secondary or three
Secondary front electrode, resistive layer, the first protective layer, the second protective layer, character code, side
Electrode, nickel coating and tin coating, why power is the highest for this product, mainly because of
For there is also following shortcoming in product design and manufacturing process:
First, resistive layer is near the core of insulated substrate, distance side electrode
Farther out, the heat of resistance tends to collect in the centre of resistive layer, the heat of resistance from
Middle during two end electrodes and side electrode distribute, there is heat dissipation path
Long and make the bad problem of heat radiation.
Second, no matter common low resistance resistance, when carrying out radium-shine resistance correction, be
Use hilted broadsword cutting or use cutter cutting, its radium-shine resistance trimming damage to resistive layer
The biggest, and make the resistance to power capability of resistance reduce.
3rd, common low resistance resistance all uses the length reducing resistive layer, lengthens
The mode of two end electrodes length makes, and so, makes because two end electrodes length strengthens
Become the internal resistance increasing of two end electrodes (silver-colored), and make the temperature coefficient of resistance excessive.
Summary of the invention
In order to overcome drawbacks described above, this utility model provides a kind of metal forming chip electricity
Stream detection resistor, the resistance accuracy of this current sensing resistor is high, resistance integrity,
Good stability.
This utility model be the technical scheme is that one to solve its technical problem
Plant metal forming chip current sensing resistor, including the insulated substrate of a square bulk,
Described insulated substrate has front and back, placed in the middle on wherein said insulated substrate front
It is printed with product identification, two extended on described insulated substrate front and along X-direction
On side, also symmetry is printed with front electrode；On the described insulated substrate back side and also along X
On the both sides that direction of principal axis extends, symmetry is printed with backplate, and is positioned at described insulation base
Backplate in back is also electric with the front being positioned on described insulated substrate front
Pole one_to_one corresponding and being arranged symmetrically with；Alloy foil sheet is covered two by a bonding film location
In individual described backplate, and prolong on described alloy foil sheet outer surface and along X-direction
On the both sides stretched, also symmetrical rack plating has plated electrode, on described alloy foil sheet outer surface and be situated between
Position between two described plated electrodes is also printed with insulating protective layer；
Also on described insulated substrate and along two side elevations of X-direction extension
Each sputtering the most respectively has side electrode, described side electrode just, back of the body both sides take the most respectively
It is connected on the described front electrode and backplate edge being arranged symmetrically；Additionally in institute
State the most each plating respectively on the outer surface of side electrode and plated electrode and be provided with copper plate, and position
Copper plate on the described side electrode and plated electrode outer surface of homonymy is the most smoothed
Cross linking；Additionally the most each on the outer surface of described copper plate and front electrode plate respectively
It is provided with a nickel coating, and is positioned on described copper plate and the front electrode outer surface of homonymy
Nickel coating seamlessly transit linking, be also electroplate with on each described nickel coating outer surface
One layer of tin coating that can cover all described nickel coating.
As further improvement of the utility model, the positive side of each described copper plate is also
It is placed on described front electrode corresponding thereto；
Each described nickel coating can cover all described copper facing corresponding thereto
Layer and front electrode, and the positive side of each described nickel coating is also placed in described insulation
On substrate, the dorsal part of each described nickel coating is also placed in described insulating protective layer
On；
The dorsal part of each described tin coating is also placed on described insulating protective layer.
As further improvement of the utility model, described insulating protective layer is photosensitive
The type paste resin bed of material.
The beneficial effects of the utility model are: with thick film common power of the prior art
Low resistance patch resistor is compared, the metal forming chip electric current made by this utility model
Detection resistor has the advantage that 1. by insulated substrate front and along X
On the both sides that direction of principal axis extends, symmetry is printed with front electrode, and at the insulated substrate back side
Above and also along the both sides that X-direction extends symmetry is printed with backplate, and is positioned at
Backplate on the insulated substrate back side also with the front being positioned on insulated substrate front
Electrode one_to_one corresponding and being arranged symmetrically with, such being designed to makes insulated substrate both end sides
The electrode at place is full, it is ensured that the integrity of resistance, is conducive to promoting patch resistor
Power；2. the R portion of resistance is not to be completed by cream product, but is realized resistance by alloy foil sheet
Value, it can be ensured that the stability of resistance value, and superior resistor temperature system can be realized
Number (TCR) index, significantly improves and improves the index temperature coefficient of resistance；③
Use radium-shine mode that resistance is carried out resistance correction, it can be ensured that the precision of resistance value；
4. the R portion of resistance is arranged on the back side of insulated substrate, it is possible to significantly improve scattered
Hot path and radiating condition, the heat of resistance can be dispersed into PCB rapidly by resistance
On plate, so that it is guaranteed that the further lifting of patch resistor power；5. white exhausted
Print product mark in edge substrate front side, it is easy to identification.Therefore, this utility model institute
The metal forming chip current sensing resistor made can be widely used in power supply
Making in.
Accompanying drawing explanation
Fig. 1 is the structural representation of this utility model insulated substrate after step a processes
Figure；
Fig. 2 is the structure at this utility model insulated substrate back side after step b processes
Schematic diagram；
Fig. 3 is the structure in this utility model insulated substrate front after step c processes
Schematic diagram；
Fig. 4 is the structure at this utility model insulated substrate back side after step d processes
Schematic diagram；
Fig. 5 is the structure at this utility model insulated substrate back side after step e processes
Schematic diagram；
Fig. 6 is this utility model insulated substrate back side after step f aluminum coated steel
Structural representation；
Fig. 7 is this utility model insulated substrate back side after step f exposure-processed
Structural representation；
Fig. 8 is the structure at this utility model insulated substrate back side after step g processes
Schematic diagram；
Fig. 9 is this utility model insulated substrate back side after step h aluminum coated steel
Structural representation；
Figure 10 is this utility model insulated substrate after step h exposure imaging processes
The structural representation at the back side；
Figure 11 is the knot at this utility model insulated substrate back side after step j processes
Structure schematic diagram；
Figure 12 is the knot in this utility model insulated substrate front after step k processes
Structure schematic diagram；
Figure 13 is that this utility model obtains described strip semi-finished product after step l processes
Structural representation；
Figure 14 is that this utility model obtains described block semi-finished product after step m processes
Structural representation；
Figure 15 is that this utility model obtains described metal forming chip after step o processes
The structural representation of current sensing resistor；
Figure 16 is cuing open of metal forming chip current sensing resistor described in the utility model
Face structural representation.
In conjunction with accompanying drawing, make the following instructions:
1 insulated substrate 2 backplate
3 front electrode 4 bonding films
5 alloy foil sheet 6 light-sensitive surfaces
7 plated electrode 8 insulating protective layers
9 side electrode 10 product identifications
11 folding bar line 12 folding grain lines
13 copper plate 14 nickel coatings
15 tin coatings
Detailed description of the invention
Referring to figure, preferred embodiment of the present utility model is described in detail.
Embodiment 1: refering to shown in accompanying drawing 15 and 16, a kind of metal forming chip electric current
Detection resistor, including the insulated substrate 1 of a square bulk, described insulated substrate 1
There is front and back, wherein said insulated substrate 1 front is printed with product between two parties
Mark 10, marking materials is resin slurry, on described insulated substrate 1 front and along X
Also by silk screen printing symmetry printing on the both sides that direction of principal axis (i.e. width) extends
Having front electrode 3, the electrode material of front electrode is resin slurry；Described insulation base
Printed by silk screen printing symmetry on plate 1 back side and also along the both sides that X-direction extends
Being brushed with backplate 2, the electrode material of backplate is resin slurry, and is positioned at institute
State the backplate 2 on the insulated substrate back side also be positioned at described insulated substrate 1 front
On front electrode 3 one_to_one corresponding and be arranged symmetrically with；Alloy foil sheet 5 is by a bonding
Film 4 location covers in two described backplates 2, and described alloy foil sheet 5
Go back symmetrical rack plating on outer surface and along the both sides that X-direction extends and have plated electrode 7,
Position on described alloy foil sheet 5 outer surface and between two described plated electrodes 7
Place is printed with insulating protective layer 8 also by silk screen printing；
Also on described insulated substrate 1 and along two side elevations of X-direction extension
Each sputtering the most respectively has side electrode 9, described side electrode 9 just, back of the body both sides also divide
It is not overlapped on the described front electrode and backplate edge being arranged symmetrically；Additionally
On the outer surface of described side electrode 9 and plated electrode 7, the most each plating respectively is provided with copper facing
Layer 13, and be positioned on described side electrode 9 and plated electrode 7 outer surface of homonymy
Copper plate 13 also seamlessly transits linking；Additionally at described copper plate 13 and front electrode
On the outer surface of 3, the most each plating respectively is provided with a nickel coating 14, and is positioned at the described of homonymy
Nickel coating 14 on copper plate 13 and front electrode 3 outer surface seamlessly transits linking,
Also on each described nickel coating 14 outer surface, it is electroplate with one layer can cover all
The tin coating 15 of described nickel coating.
In the present embodiment, it is preferred that the positive side of each described copper plate 13 is also
It is placed on described front electrode 3 corresponding thereto；Each described nickel coating 14 energy
Enough cover all described copper plate 13 corresponding thereto and front electrode 3, and
The positive side of each described nickel coating 14 is also placed on described insulated substrate 1, often
The dorsal part of nickel coating 14 described in one is also placed on described insulating protective layer 8；Often
The dorsal part of tin coating 15 described in one is also placed on described insulating protective layer 8.
Preferably, described insulating protective layer 8 is the photosensitive type paste resin bed of material.
In this utility model, additionally provide a kind of metal forming chip current sense resistor
The preferred fabrication technique of device, is carried out as follows:
A, refering to shown in accompanying drawing 1, cut out a bulk of insulated substrate 1 by design,
Described insulated substrate 1 has front and back, in the front of described insulated substrate 1 and
On the back side, cut out some by radium-shine cutting mode the most respectively and prolong along X-direction
The folding bar line 11 stretched and the folding grain line 12 extended along Y direction, described folding bar line
11 intersect vertical with described folding grain line 12, make the front of described insulated substrate 1
Be respectively respectively formed with multiple square grid on the back side；
B, refering to shown in accompanying drawing 2, on described insulated substrate 1 back side and correspond to
The position of each described folding bar line 11 is printed with one layer the most respectively and prolongs along X-direction
The first electrode material layer stretched, forms backplate 2 after being dried and sintering, and
Each described backplate 2 along X-direction centrage also respectively relative with it respectively
The described folding bar line answered coincides；
C, refering to shown in accompanying drawing 3, multiple square in described insulated substrate 1 front
The center position of grid is printed with character code material the most respectively, is entered by described character code material
Row is dried and forms product identification 10 after sintering；
D, described insulation base refering to shown in accompanying drawing 4, after processing through step a～c
Cover one layer on plate 1 back side and can cover all the viscous of the described insulated substrate back side
Close film 4；
E, refering to shown in accompanying drawing 5, the alloy foil sheet 5 with certain resistivity is pasted
It is located on the outer surface of described bonding film 4, and carries out pressurization baking, to reach firm
In conjunction with；
F, refering to shown in accompanying drawing 6, described alloy foil sheet 5 outer surface covers one
Layer light-sensitive surface 6, and require on described light-sensitive surface, set out multiple and institute according to design
State the strip exposure area that backplate 2 is corresponding；
First with photoetching technique to the multiple strip exposure regions on described light-sensitive surface 6
Territory is exposed processing, so that the light-sensitive surface being positioned in the plurality of strip exposure area is solid
Change, as shown in Figure 7；Recycling photoetching technique is to the remainder on described light-sensitive surface 6
Region carries out development treatment, is positioned at the sense in described light-sensitive surface 6 remaining region to remove
Light film；Whole processing procedure uses gold-tinted processing procedure, and circuit is accurate, and resistance accuracy is high；
G, refering to shown in accompanying drawing 8, use rack plating technology to expose at above-mentioned multiple strips
Plate plated electrode 7 on alloy foil sheet 5 in region, use the most again and go membrane technology to incite somebody to action
Light-sensitive surface in the plurality of strip exposure area is removed；Use rack plating mode in Alloy Foil
Plated electrode is plated, it can be ensured that the stability of resistance on sheet；
Again cover on h, described alloy foil sheet 5 surface after processing through step a～g
Cover one layer of light-sensitive surface, as shown in Figure 9, and require at described light-sensitive surface according to design
Corresponding each square grid subregion sets an I shape exposure area；
First with photoetching technique to the multiple I shape exposure regions on described light-sensitive surface
Territory is exposed processing, so that the light-sensitive surface being positioned in this I shape exposure area is solid
Change；Remaining region on described light-sensitive surface is carried out at development by recycling photoetching technique
Reason, is positioned at the light-sensitive surface in described light-sensitive surface remaining region to remove；The most also utilize
The plurality of I shape exposure area is etched processing, will be located in this by etching technique
The alloy foil sheet of multiple I shape exposure areas all makes resistance, as shown in Figure 10；
Whole processing procedure uses gold-tinted processing procedure, and circuit is accurate, and resistance accuracy is high；
I, utilize radium-shine technology that the above-mentioned multiple resistance made that are etched are carried out resistance
Revise, to realize the precision of resistance；
J, refering to shown in accompanying drawing 11, (be ability at the middle part of each described resistance
The R portion of field technique personnel institute conventional cognitive) print one layer of insulating protective layer 8, go forward side by side
Row is dried；
K, refering to shown in accompanying drawing 12, on described insulated substrate 1 front and correspond to
The position of each described folding bar line 11 is printed with one layer the most respectively and prolongs along X-direction
The second electrode material layer stretched, and described second electrode material layer is dried and burns
Forming front electrode 3 after knot, each described front electrode 3 is along the center of X-direction
The also each described folding bar line corresponding with it respectively of line coincides, and is positioned at described insulation
Multiple described front electrode 3 on substrate 1 front also be positioned at described insulated substrate 1
Multiple described backplate 2 one_to_one corresponding on the back side and being arranged symmetrically with；
L, refering to shown in accompanying drawing 13, the folding bar line 11 along described insulated substrate will be through
Cross the insulated substrate after step a～k process and be converted into multiple strip semi-finished product successively；So
The side that each described strip semi-finished product are formed by rear recycling vacuum sputtering machines through folding bar
Face sputters, and forms side electrode 9, and the most described side electrode 9 also overlaps
On the described front electrode being arranged symmetrically and backplate；
M, refering to shown in accompanying drawing 14, the folding grain line along described strip semi-finished product will pass through
Strip semi-finished product after step a～l process are converted into multiple block semi-finished product successively；So
Rear recycling barrel plating mode is by the plated electrode 7 of each described block semi-finished product and side
All plate layer of metal copper on electrode 9, form copper plate 13；And the most described plating
Layers of copper 13 is also taken and is put on described front electrode 3；
N, employing barrel plating mode are on described copper plate 13 and front electrode 3 surface
On also plate layer of metal nickel, form one layer of nickel coating 14, and described nickel coating 14
Described copper plate 13 and front electrode 3 can also be covered all；
O, employing barrel plating mode are also electroplate with one layer of gold on described nickel coating 14 surface
Belong to stannum, form one layer of tin coating 15, and described tin coating can also cover all
Described nickel coating；Now described metal forming chip current sensing resistor has made
Become, the perspective view of described metal forming chip current sensing resistor and section
Structural representation is the most as shown in figs 15 and 16.
In the processing technology of above-mentioned metal forming chip current sensing resistor, preferably
, above-mentioned steps b is printed the mode of printing of the first electrode material layer, above-mentioned steps
C prints in the mode of printing of character code material, above-mentioned steps j and print insulating protective layer
Mode of printing and above-mentioned steps k in print the printing side of the second electrode material layer
Formula all uses silk screen printing；
Preferably, the first electrode material layer described in above-mentioned steps b is resin slurry
Layer；Character code material described in above-mentioned steps c is resin slurry；Above-mentioned steps j
Described in insulating protective layer be the photosensitive type paste resin bed of material；Described in above-mentioned steps k
The second electrode material layer be the paste resin bed of material.
In sum, the metal forming chip current sense resistor made by this utility model
Device has the advantage that 1. by insulated substrate front and along X-direction extension
Both sides on symmetry be printed with front electrode, and on the insulated substrate back side and also along X
On the both sides that direction of principal axis extends, symmetry is printed with backplate, and is positioned at the insulated substrate back of the body
Backplate on face also with the front electrode being positioned on insulated substrate front one a pair
Should and be arranged symmetrically with, such being designed to makes the electrode at insulated substrate both end sides satisfy
Full, it is ensured that the integrity of resistance, be conducive to promoting the power of patch resistor；2. electricity
The R portion of resistance is not to be completed by cream product, but is realized resistance by alloy foil sheet, it is possible to really
Protect the stability of resistance value, and superior resistor temperature coefficient (TCR) can be realized refer to
Mark, significantly improves and improves the index temperature coefficient of resistance；3. radium-shine side is used
Formula carries out resistance correction to resistance, it can be ensured that the precision of resistance value；4. by resistance
R portion is arranged on the back side of insulated substrate, it is possible to significantly improves heat dissipation path and dissipates
Heat condition, the heat of resistance can be dispersed on pcb board rapidly by resistance, thus really
Protect the further lifting of patch resistor power；5. on the insulated substrate front of white
Print product identifies, it is easy to identification.Therefore, the metal forming made by this utility model
Chip current sensing resistor can be widely used in the making of power supply.
The above is only preferred implementation of the present utility model, but is not used to limit
This utility model processed, it is noted that those skilled in the art are come
Say, on the premise of without departing from this utility model know-why, it is also possible to make some
Improving and modification, these improve and modification also should be regarded as at protection model of the present utility model
In enclosing.
Claims (3)
1. a metal forming chip current sensing resistor, it is characterised in that: include
The insulated substrate (1) of one square bulk, described insulated substrate (1) have front and
The back side, wherein said insulated substrate (1) front is printed with product identification (10) between two parties,
Symmetry is gone back on described insulated substrate (1) front and along the both sides that X-direction extends
It is printed with front electrode (3)；On described insulated substrate (1) back side and also along X-axis
On the both sides that direction extends, symmetry is printed with backplate (2), and is positioned at described insulation
Backplate (2) on substrate back also be positioned at described insulated substrate (1) front
On front electrode (3) one_to_one corresponding and be arranged symmetrically with；Alloy foil sheet (5) passes through
One bonding film (4) location covers on two described backplates (2) and described
On alloy foil sheet (5) outer surface and along the both sides that X-direction extends, also symmetry is hung
It is coated with plated electrode (7), on described alloy foil sheet (5) outer surface and between two institutes
State the position between plated electrode (7) and be also printed with insulating protective layer (8)；
Also upper at described insulated substrate (1) and extend along X-direction two are edge-on
On face, each sputtering the most respectively has side electrode (9), described side electrode (9) just,
Back of the body both sides are overlapped on the described front electrode and backplate being arranged symmetrically the most respectively
On edge；Additionally on the outer surface of described side electrode (9) and plated electrode (7)
Also each plating respectively is provided with copper plate (13), and is positioned at the described side electrode (9) of homonymy
Linking is also seamlessly transitted with the copper plate (13) on plated electrode (7) outer surface；Separately
The most each difference on the outer surface of external described copper plate (13) and front electrode (3)
Plating is provided with a nickel coating (14), and is positioned at the described copper plate (13) and just of homonymy
Nickel coating (14) on face electrode (3) outer surface seamlessly transits linking, also often
It is electroplate with one layer on nickel coating described in (14) outer surface and can cover all described
The tin coating (15) of nickel coating.
Metal forming chip current sensing resistor the most according to claim 1,
It is characterized in that: the positive side of each described copper plate (13) is also placed in corresponding thereto
On the described front electrode (3) answered；
It is described that each described nickel coating (14) can cover all corresponding thereto
Copper plate (13) and front electrode (3), and each described nickel coating (14) is just
Side is also placed on described insulated substrate (1), each described nickel coating (14)
Dorsal part be also placed on described insulating protective layer (8)；
The dorsal part of each described tin coating (15) is also placed in described insulating protective layer (8)
On.
Metal forming chip current sensing resistor the most according to claim 1,
It is characterized in that: described insulating protective layer (8) is the photosensitive type paste resin bed of material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620238588.9U CN205508539U (en) | 2016-03-25 | 2016-03-25 | Metal foil formula current detection resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620238588.9U CN205508539U (en) | 2016-03-25 | 2016-03-25 | Metal foil formula current detection resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205508539U true CN205508539U (en) | 2016-08-24 |
Family
ID=56732962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620238588.9U Active CN205508539U (en) | 2016-03-25 | 2016-03-25 | Metal foil formula current detection resistor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107230537A (en) * | 2016-03-25 | 2017-10-03 | 昆山厚声电子工业有限公司 | Metal foil chip current sensing resistor and its manufacture craft |
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2016
- 2016-03-25 CN CN201620238588.9U patent/CN205508539U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107230537A (en) * | 2016-03-25 | 2017-10-03 | 昆山厚声电子工业有限公司 | Metal foil chip current sensing resistor and its manufacture craft |
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