CN205491423U - Reinforcement structure of flexible line way board - Google Patents
Reinforcement structure of flexible line way board Download PDFInfo
- Publication number
- CN205491423U CN205491423U CN201620018836.9U CN201620018836U CN205491423U CN 205491423 U CN205491423 U CN 205491423U CN 201620018836 U CN201620018836 U CN 201620018836U CN 205491423 U CN205491423 U CN 205491423U
- Authority
- CN
- China
- Prior art keywords
- stiffening plate
- circuit board
- plate
- foam sheet
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000002787 reinforcement Effects 0.000 title claims abstract description 11
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 5
- 239000010959 steel Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims abstract description 4
- 239000006260 foam Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 2
- 239000010963 304 stainless steel Substances 0.000 claims 1
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 claims 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract description 2
- 230000037303 wrinkles Effects 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 235000012054 meals Nutrition 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model relates to a reinforcement structure of flexible line way board, including circuit board body, chip resistor electric capacity and the IC of setting on the circuit edition of books body, resistance capacitance and IC all laminate at the circuit edition of books body openly, the circuit board body back is equipped with the stiffening plate, the stiffening plate is located under the IC, the stiffening plate material is arbitrary kind PI, FR -4, steel sheet, the IC pin is in the last projector distance IC edge 0.5 -0.7mm of IC, the IC pin is in the last projection of IC is located the stiffening plate. The utility model discloses because of the low pin rosin joint problem of bringing of face roughness when the laminating of the circuit board body back under the IC has the stiffening plate to solve SMT, the IC pin is in the last projector distance IC edge 0.5 -0.7mm of IC for the reinforcement of each other of IC and stiffening plate is peeled off when preventing stiffening plate and gate edition of books body pincher trees.
Description
Technical field
This utility model relates to flexible circuit board technical field, particularly to a kind of flexible circuitry
The reinforced structure of plate.
Background technology
Along with TFT LCD module is more and more thinner, resolution is more and more higher, and size is increasing,
The TFT LCD of substantially more than HD is typically necessary extension POWER IC and drives energy to increase load
Power, but owing to flexible circuit board is different from rigid wiring board, plate face planarization is bad, and this just gives
The SMT of the patch particular components such as IC brings certain bad.
Utility model content
For the deficiencies in the prior art, the purpose of this utility model is to provide a kind of flexible wires
The reinforced structure of road plate.
This utility model solves its technical problem and be the technical scheme is that a kind of flexible circuitry
The reinforced structure of plate, including wiring board body, be arranged on wiring board body Chip-R electricity
Holding and IC, described resistance capacitance and IC are all fitted in wiring board body front, described line
The plate body back side, road is provided with stiffening plate, and described stiffening plate is positioned at immediately below described IC, described benefit
Strong sheet material matter is PI, FR-4, steel disc any one, the throwing on described IC of the described IC pin
Shadow distance IC edge 0.5-0.7mm, the projection on described IC of the described IC pin is positioned at reinforcement
In plate.
In above-mentioned design, the wiring board body back side immediately below IC is fitted with stiffening plate solution
The pin problem of faulty soldering brought because plate surface evenness is low during SMT；Described IC pin is at described IC
On projector distance IC edge 0.5-0.7mm so that IC and the mutual reinforcement of stiffening plate, prevent
Peel off when stiffening plate and wiring board body wrinkle.
As the further improvement of the design, described stiffening plate is the PI plate that 0.3-0.4mm is thick
Or FR-4 plate, the good handling ease of intensity.
As the further improvement of the design, described stiffening plate be thick for 0.1-0.2mm 304 not
Rust steel disc, intensity is high, and bearing capacity is big.
As the further improvement of the design, described stiffening plate edge is cambered surface, prevents stiffening plate
Edge scratches the stiffening plate caused and peels off.
As the further improvement of the design, bottom described stiffening plate, it is fitted with foam sheet, described
Foam sheet is identical with described stiffening plate base area with stiffening plate one area of laminating, and foam sheet has
There is buffering insulating effect.
As the further improvement of the design, described foam sheet side is domatic, described foam sheet
Top surface area is less than described foam sheet bottom area, it is simple to wrap up stiffening plate edge during assembling, absolutely
Edge is good, protection effective to stiffening plate.
The beneficial effects of the utility model are: this utility model wiring board immediately below IC is originally
The pin rosin joint that the body back side is brought because plate surface evenness is low when being fitted with reinforcement meal solution SMT is asked
Topic；Described IC pin projector distance IC edge 0.5-0.7mm on described IC so that
IC and the mutual reinforcement of stiffening plate, prevent from peeling off when stiffening plate and wiring board body wrinkle.
Accompanying drawing explanation
With embodiment, this utility model is further illustrated below in conjunction with the accompanying drawings.
Fig. 1 is structural representation of the present utility model.
1. wiring board body, 2. resistance capacitance in the drawings, 3.IC, 4. stiffening plate, 5. foam
Sheet.
Detailed description of the invention
This utility model is described in detail, wherein below in conjunction with accompanying drawing and specific embodiment
Illustrative examples and explanation be only used for explaining this utility model, but be not intended as this reality
With novel restriction.
Embodiment: the reinforced structure of a kind of flexible circuit board, including wiring board body 1, is arranged
Chip-R electric capacity 2 and IC3 on wiring board body 1, described resistance capacitance 2 and
IC3 is all fitted in wiring board body 1 front, and described wiring board body 1 back side is provided with stiffening plate
4, described stiffening plate 4 is positioned at immediately below described IC3, described reinforcement slope 4 material is PI, FR-4,
Steel disc any one, described IC3 pin projector distance IC3 edge on described IC3
0.5-0.7mm, the projection on described IC3 of the described IC3 pin is positioned at stiffening plate 4.
In above-mentioned design, wiring board body 1 back side immediately below IC3 is fitted with stiffening plate 4 and solves
The pin problem of faulty soldering certainly brought because plate surface evenness is low during SMT；Described IC3 pin is in institute
State the projector distance IC3 edge 0.5-0.7mm on IC3 so that IC3 and stiffening plate 4 are mutual
Reinforcement, prevents from peeling off when stiffening plate 4 and wiring board body 1 wrinkle.
As the further improvement of the design, described stiffening plate 4 is the PI that 0.3-0.4mm is thick
Plate or FR-4 plate, the good handling ease of intensity.
As the further improvement of the design, described stiffening plate 4 is 304 that 0.1-0.2mm is thick
Stainless steel substrates, intensity is high, and bearing capacity is big.
As the further improvement of the design, described stiffening plate 4 edge is cambered surface, prevents reinforcement
Plate 4 edge scratches the stiffening plate 4 caused and peels off.
As the further improvement of the design, bottom described stiffening plate 4, it is fitted with foam sheet 5,
Described foam sheet 5 and stiffening plate 4 are fitted an area and described stiffening plate 4 base area phase
With, foam sheet 5 has buffering insulating effect.
As the further improvement of the design, described foam sheet 5 side is domatic, described foam
Sheet 5 top surface area is less than described foam sheet 5 bottom area, it is simple to wrap up stiffening plate 4 during assembling
Edge, good insulating, stiffening plate 4 is effectively protected.
The foregoing is only embodiment of the present utility model, not thereby limit this utility model
The scope of the claims, every utilize the equivalence knot that this utility model description and accompanying drawing content made
Structure or equivalence flow process conversion, or directly or indirectly it is used in other relevant technical fields, all
In like manner it is included in scope of patent protection of the present utility model.
Claims (6)
1. a reinforced structure for flexible circuit board, including wiring board body, is arranged on wiring board originally
Chip-R electric capacity on body and IC, it is characterised in that described resistance capacitance and IC are equal
Being fitted in wiring board body front, the described wiring board body back side is provided with stiffening plate, described reinforcement
Plate is positioned at immediately below described IC, described stiffening plate material is PI, FR-4, steel disc any one,
Described IC pin projector distance IC edge 0.5-0.7mm, described IC pipe on described IC
Foot projection on described IC is positioned at stiffening plate.
The reinforced structure of a kind of flexible circuit board the most according to claim 1, is characterized in that,
Described stiffening plate is PI plate thick for 0.3-0.4mm or FR-4 plate.
The reinforced structure of a kind of flexible circuit board the most according to claim 1, is characterized in that,
Described stiffening plate is 304 stainless steel substrates that 0.1-0.2mm is thick.
The reinforced structure of a kind of flexible circuit board the most according to claim 1, is characterized in that,
Described stiffening plate edge is cambered surface.
The reinforced structure of a kind of flexible circuit board the most according to claim 1, is characterized in that,
Be fitted with foam sheet bottom described stiffening plate, described foam sheet and stiffening plate fit an area with
Described stiffening plate base area is identical.
The reinforced structure of a kind of flexible circuit board the most according to claim 5, is characterized in that,
Described foam sheet side is domatic, and described foam sheet top surface area is less than described foam sheet bottom faces
Long-pending.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620018836.9U CN205491423U (en) | 2016-01-08 | 2016-01-08 | Reinforcement structure of flexible line way board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620018836.9U CN205491423U (en) | 2016-01-08 | 2016-01-08 | Reinforcement structure of flexible line way board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205491423U true CN205491423U (en) | 2016-08-17 |
Family
ID=56665257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620018836.9U Expired - Fee Related CN205491423U (en) | 2016-01-08 | 2016-01-08 | Reinforcement structure of flexible line way board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205491423U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455386A (en) * | 2016-10-17 | 2017-02-22 | 青岛海信移动通信技术股份有限公司 | Mobile terminal device |
| CN106550537A (en) * | 2016-12-07 | 2017-03-29 | 友达光电（苏州）有限公司 | Flexible circuit plate module |
| CN109997418A (en) * | 2016-11-28 | 2019-07-09 | 三井金属矿业株式会社 | The manufacturing method of multiwiring board |
| CN110267454A (en) * | 2019-06-26 | 2019-09-20 | 深圳市新宇腾跃电子有限公司 | A kind of FPC production technology and structure |
| CN110677999A (en) * | 2019-10-12 | 2020-01-10 | 珠海景旺柔性电路有限公司 | Alignment and lamination method for FPC (Flexible printed Circuit) adhered reinforced steel sheet |
| CN113286417A (en) * | 2021-05-28 | 2021-08-20 | 昆山工研院新型平板显示技术中心有限公司 | Flexible printed circuit board and display device |
| US20230021798A1 (en) * | 2021-07-23 | 2023-01-26 | Chicony Power Technology Co., Ltd. | Backlight module |
-
2016
- 2016-01-08 CN CN201620018836.9U patent/CN205491423U/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455386A (en) * | 2016-10-17 | 2017-02-22 | 青岛海信移动通信技术股份有限公司 | Mobile terminal device |
| CN106455386B (en) * | 2016-10-17 | 2019-11-08 | 青岛海信移动通信技术股份有限公司 | A kind of mobile terminal device |
| CN109997418A (en) * | 2016-11-28 | 2019-07-09 | 三井金属矿业株式会社 | The manufacturing method of multiwiring board |
| CN106550537A (en) * | 2016-12-07 | 2017-03-29 | 友达光电（苏州）有限公司 | Flexible circuit plate module |
| CN106550537B (en) * | 2016-12-07 | 2018-12-18 | 友达光电（苏州）有限公司 | Flexible circuit plate module |
| CN110267454A (en) * | 2019-06-26 | 2019-09-20 | 深圳市新宇腾跃电子有限公司 | A kind of FPC production technology and structure |
| CN110677999A (en) * | 2019-10-12 | 2020-01-10 | 珠海景旺柔性电路有限公司 | Alignment and lamination method for FPC (Flexible printed Circuit) adhered reinforced steel sheet |
| CN113286417A (en) * | 2021-05-28 | 2021-08-20 | 昆山工研院新型平板显示技术中心有限公司 | Flexible printed circuit board and display device |
| US20230021798A1 (en) * | 2021-07-23 | 2023-01-26 | Chicony Power Technology Co., Ltd. | Backlight module |
| US11599203B2 (en) * | 2021-07-23 | 2023-03-07 | Chicony Power Technology Co., Ltd. | Backlight module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160817 Termination date: 20170108 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |