CN205488212U - High -efficient light -emitting LED packaging structure - Google Patents
High -efficient light -emitting LED packaging structure Download PDFInfo
- Publication number
- CN205488212U CN205488212U CN201620335515.1U CN201620335515U CN205488212U CN 205488212 U CN205488212 U CN 205488212U CN 201620335515 U CN201620335515 U CN 201620335515U CN 205488212 U CN205488212 U CN 205488212U
- Authority
- CN
- China
- Prior art keywords
- lens
- side plate
- connecting plate
- groove
- storage tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 239000003292 glue Substances 0.000 claims abstract description 25
- 238000005538 encapsulation Methods 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims description 17
- 238000007598 dipping method Methods 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- 238000009738 saturating Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 10
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 239000000741 silica gel Substances 0.000 description 6
- 229910002027 silica gel Inorganic materials 0.000 description 6
- 238000009434 installation Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 206010023126 Jaundice Diseases 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model provides a high -efficient light -emitting LED packaging structure belongs to LED encapsulation field, it has solved the poor problem of current LED encapsulation light -emitting effect. The utility model discloses a base plate, LED chip and lens, lens are plano -convex lens, and be the segment form, the mount pad that still includes elasticity platelike structure, the mount pad is including circle annular connecting plate and tubaeform curb plate, curb plate bottom diameter is less than curb plate top diameter, along wall connection bottom the curb plate in the connecting plate, inner wall of the side panel is equipped with the fluorescent glue, the connecting plate is fixed mutually with the base plate, and form the storage tank between inner wall of the side panel and the base plate, be equipped with the LED chip on the base plate that the storage tank corresponds, the formation turn -ups turns up at the curb plate top, lens bottom surface edge is equipped with annular convex ring, along having ring groove in the bulge loop, and the lens cap closes on the storage tank notch, and turn -ups tip card is in the draw -in groove, the annular rubber groove is deepened to be equipped with by the draw -in groove tank bottom, gluey inslot is equipped with to bond and glues. This LED packaging structure simple to operate to can improve the light -emitting effect.
Description
Technical field
This utility model belongs to LED encapsulation technology field, relates to a kind of high-efficiency bight-dipping LED encapsulation structure.
Background technology
LED, as new generation of green light source, has the advantages such as light efficiency height, life-span length, energy-saving and environmental protection, and it is
It is widely used at numerous areas.For protecting the LED chip as light source, it usually needs it is packaged.
High-efficiency bight-dipping LED encapsulation structure of the prior art is such that on substrate arranging storage tank, and LED chip is put
In storage tank, lens cover is together on storage tank, and lens and substrate are sealed bonding by recycle silicon glue.Existing
When having the LED chip luminescence of high-efficiency bight-dipping LED encapsulation structure, a part of light is incident upon on silica gel, silica gel quilt
Easily jaundice after light long-term irradiation, aging, brittle, destroy the sealing of silica gel, shorten high-efficiency bight-dipping
The service life of LED encapsulation structure.
Summary of the invention
The purpose of this utility model is for the above-mentioned problems in the prior art, it is provided that a kind of structure is tight
Gather, light-out effect more preferable high-efficiency bight-dipping LED encapsulation structure.
The purpose of this utility model can be realized by following technical proposal: a kind of high-efficiency bight-dipping LED encapsulation knot
Structure, including substrate, LED chip and lens, lens are planoconvex lens, and in segment shape, lens have bottom surface
And curved surface, bottom surface is plane, it is characterised in that: also include the mounting seat of resiliency slabstock structure, mounting seat bag
Including the annular connecting plate and tubaeform side plate being coaxially disposed, side plate bottom diameter is less than side plate top diameter,
Along being connected with side plate bottom outer wall in connecting plate, side plate inwall is provided with fluorescent glue, and connecting plate fixes with substrate,
And between side plate inwall and substrate, form storage tank, the substrate that storage tank is corresponding is provided with described LED chip,
Turn up formation flange at described side plate top, and flared end portions tilts to bend down, and lens base edge is provided with
Annular convex ring, along having annular slot in bulge loop, and lens cover is combined on storage tank notch, and flared end portions
Being stuck in draw-in groove, draw-in groove bottom land is deepened to be provided with annular glue groove, is provided with adhesive glue in glue groove.
During installation, in glue groove, first coat adhesive glue, afterwards lens cover is combined on storage tank notch, pushes away
Dynamic lens, make flared end portions can be fixed in being stuck in draw-in groove, therefore avoid silica gel to cause LED chip
Impact, improves light-out effect, and due to side plate flare, and side plate inwall is provided with fluorescent glue, therefore can enter
One step improves the light-out effect of LED chip.
As preferably, described connecting plate outer has some v notch vs, and breach radially sets along connecting plate
Put, and circumferentially distributed along connecting plate, and make connecting plate outer form some and baseplate-laminating bar by breach
Shape radiating ribs.
Therefore can strengthen radiating effect by radiating ribs, and avoid storage tank is impacted.
As preferably, described connecting plate and side plate are structure as a whole.
As preferably, described lens are that quartz material is made.
Compared with prior art, this utility model has the advantage that
During installation, in glue groove, first coat adhesive glue, afterwards lens cover is combined on storage tank notch, pushes away
Dynamic lens, make flared end portions can be fixed in being stuck in draw-in groove, therefore avoid silica gel to cause LED chip
Impact, improves light-out effect, and due to side plate flare, and side plate inwall is provided with fluorescent glue, therefore can enter
One step improves the light-out effect of LED chip.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model；
Fig. 2 is the upward view of mounting seat in this utility model.
Coding in figure is respectively as follows:
1, substrate；11, LED chip；2, lens；21, bulge loop；22, draw-in groove；23, glue groove；3、
Mounting seat；31, connecting plate；32, radiating ribs；33, side plate；34, storage tank；35, flange.
Detailed description of the invention
The following is specific embodiment of the utility model and combine accompanying drawing, the technical solution of the utility model is made
Further description, but this utility model is not limited to these embodiments.
As depicted in figs. 1 and 2, this high-efficiency bight-dipping LED encapsulation structure, including substrate 1, LED chip 11
And lens 2, lens 2 are planoconvex lens 2, and in segment shape, lens 2 have bottom surface and curved surface, and bottom surface is
Plane, also includes the mounting seat 3 of resiliency slabstock structure, and mounting seat 3 includes the annular connecting plate being coaxially disposed
31 and tubaeform side plate 33, side plate 33 base diameter is less than side plate 33 top diameter, edge in connecting plate 31
Being connected with side plate 33 bottom outer wall, side plate 33 inwall is provided with fluorescent glue, and connecting plate 31 fixes with substrate 1,
And between side plate 33 inwall and substrate 1, forming storage tank 34, the substrate 1 of storage tank 34 correspondence is provided with LED
Chip 11, turn up formation flange 35 at side plate 33 top, and flange 35 sloped-end bends down, lens 2
Bottom edge is provided with annular convex ring 21, and along having annular slot 22 in bulge loop 21, and lens 2 cover and holding
Putting on groove 34 notch, and flange 35 end is stuck in draw-in groove 22, draw-in groove 22 bottom land is deepened to be provided with annular glue
Groove 23, is provided with adhesive glue in glue groove 23.
Further, connecting plate 31 outer has some v notch vs, and breach radially sets along connecting plate 31
Put, and circumferentially distributed along connecting plate 31, and make connecting plate 31 outer form some and substrate 1 by breach
The bar shaped radiating ribs 32 of laminating.Connecting plate 31 and side plate 33 are structure as a whole.Lens 2 are quartz material system
Become.
During installation, in glue groove 23, first coat adhesive glue, afterwards lens 2 are covered at storage tank 34 groove
On mouth, promote lens 2, make flange 35 end can be fixed in being stuck in draw-in groove 22, therefore avoid silica gel
LED chip 11 is impacted, improves light-out effect, due to side plate 33 flare, and in side plate 33
Wall is provided with fluorescent glue, therefore can improve the light-out effect of LED chip 11 further.
Claims (4)
1. a high-efficiency bight-dipping LED encapsulation structure, including substrate (1), LED chip (11) and lens (2),
Lens (2) are planoconvex lens (2), and in segment shape, lens (2) have bottom surface and curved surface, and bottom surface is
Plane, it is characterised in that: also including the mounting seat (3) of resiliency slabstock structure, mounting seat (3) includes same
The annular connecting plate (31) of axle setting and tubaeform side plate (33), side plate (33) base diameter is less than
Side plate (33) top diameter, along being connected with side plate (33) bottom outer wall in connecting plate (31), side plate (33)
Inwall is provided with fluorescent glue, and connecting plate (31) fixes with substrate (1), and side plate (33) inwall and substrate
(1) forming storage tank (34) between, the substrate (1) that storage tank (34) is corresponding is provided with described LED
Chip (11), turn up and form flange (35) in described side plate (33) top, and flange (35) end
Tilting to bend down, lens (2) bottom edge is provided with annular convex ring (21), along having in bulge loop (21)
Annular slot (22), and lens (2) cover on storage tank (34) notch, and flange (35) end
Being stuck in draw-in groove (22), draw-in groove (22) bottom land is deepened to be provided with in annular glue groove (23), glue groove (23)
It is provided with adhesive glue.
High-efficiency bight-dipping LED encapsulation structure the most according to claim 1, it is characterised in that: described company
Fishplate bar (31) outer has some v notch vs, and breach is radially arranged along connecting plate (31), and along even
Fishplate bar (31) is circumferentially distributed, and makes connecting plate (31) outer form some and substrate (1) patch by breach
The bar shaped radiating ribs (32) closed.
High-efficiency bight-dipping LED encapsulation structure the most according to claim 1, it is characterised in that: described company
Fishplate bar (31) and side plate (33) are structure as a whole.
High-efficiency bight-dipping LED encapsulation structure the most according to claim 1, it is characterised in that: described is saturating
Mirror (2) is that quartz material is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620335515.1U CN205488212U (en) | 2016-04-16 | 2016-04-16 | High -efficient light -emitting LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620335515.1U CN205488212U (en) | 2016-04-16 | 2016-04-16 | High -efficient light -emitting LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205488212U true CN205488212U (en) | 2016-08-17 |
Family
ID=56641097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620335515.1U Expired - Fee Related CN205488212U (en) | 2016-04-16 | 2016-04-16 | High -efficient light -emitting LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205488212U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110088978A (en) * | 2016-12-27 | 2019-08-02 | 华为技术有限公司 | Resonators and communication devices |
| CN112713232A (en) * | 2019-10-25 | 2021-04-27 | 秀尔半导体(深圳)有限公司 | Lens module |
-
2016
- 2016-04-16 CN CN201620335515.1U patent/CN205488212U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110088978A (en) * | 2016-12-27 | 2019-08-02 | 华为技术有限公司 | Resonators and communication devices |
| US10840577B2 (en) | 2016-12-27 | 2020-11-17 | Huawei Technologies Co., Ltd. | Resonator and communications apparatus |
| CN110088978B (en) * | 2016-12-27 | 2021-01-29 | 华为技术有限公司 | Resonator and communication device |
| CN112713232A (en) * | 2019-10-25 | 2021-04-27 | 秀尔半导体(深圳)有限公司 | Lens module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Meng Bin Inventor before: Chen Chunhong |
|
| CB03 | Change of inventor or designer information | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170330 Address after: 361100 Xiamen, Tongan District, Fujian province with the Shing Road, No. 506 Patentee after: IDEAL JACOBS (XIAMEN) CORPORATION Address before: 362400 Fujian County, Anxi County, Chengxiang town cents after the Village Court House No. 1 Patentee before: Chen Chunhong |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160817 Termination date: 20190416 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |