CN205326154U - Plastic package mold - Google Patents
Plastic package mold Download PDFInfo
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- CN205326154U CN205326154U CN201620080091.9U CN201620080091U CN205326154U CN 205326154 U CN205326154 U CN 205326154U CN 201620080091 U CN201620080091 U CN 201620080091U CN 205326154 U CN205326154 U CN 205326154U
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- plastic package
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- package die
- plastic packaging
- spring
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Abstract
The utility model discloses a plastic package mold, including runner and shaping die cavity, the runner includes a plurality of main jiao dao and a plurality of minutes jiaodao, main jiao dao passes through divide jiao dao with the shaping die cavity is connected, be equipped with PCB installation position in the shaping die cavity, it is adjacent main glue is connected through connectivity structure between the way. Taking connectivity structure's plastic package mold, making each main jiao dao's plastic envelope glue compensate mutually, the balanced plastic envelope material that respectively remains is to the pressure circumstances of spring, the gas pocket that produces when alleviating the plastic envelope, overflows and the phenomenon such as glues, has improved the product yield.
Description
Technical field
This utility model relates to semiconductor plastic package field, espespecially a kind of plastic package die。
Background technology
The rising of semiconductor industry promotes the progress of domestic encapsulation technology, and semiconductor manufacturing industry just slowly enters the maturation period, packing forms also by traditional single-chip package to multi-chip package formal transformation。The transformation of packing forms, causes that encapsulating mould application technology improves constantly, and traditional single injection head plastic package die can not meet encapsulation requirement, therefore, the application of multi-gate pole plastic package die produces。
Multi-gate pole plastic package die is when plastic packaging, a plurality of circuit board can be carried out plastic packaging simultaneously, and for needing the circuit board of encapsulation, every circuit board generally all has a number of residual plate, these residual plates will not go up part for saving cost in FEOL, the circuit board that during injection moulding, residual plate is many can consume more plastic packaging glue, and the circuit board that residual plate is few then can consume less plastic packaging glue, and the consumption difference that makes of plastic packaging glue causes mold pressing inequality；Being in flow regime owing to plastic packaging glue can add heat fusing when plastic packaging, mold pressing inequality causes mould stream uneven, finally makes the circuit board of encapsulation produce pore and the excessive glue of injection moulding etc. bad。
Utility model content
The purpose of this utility model is to provide a kind of plastic package die, solves the problem that mold pressing inequality causes mould stream imbalance to make product bad, the problem solving the waste of plastic packaging glue material further, saves resource。
The technical scheme that this utility model provides is as follows:
A kind of plastic package die, including runner and forming recess；Described runner includes multiple Zhu Jiao road and multiple Fen Jiao road；Described Zhu Jiao road is connected with described forming recess by described Fen Jiao road；Described forming recess is provided with PCB installation position；Connected by connectivity structure between adjacent described Zhu Jiao road。
It is further preferred that the quantity of the described connectivity structure between adjacent described Zhu Jiao road is multiple。
It is further preferred that described connectivity structure is network structure, multiple Zhu Jiao roads are interconnected by described network structure。
It is further preferred that described connectivity structure is groove。
It is further preferred that described groove be shaped as the structure that both sides are parallel。
It is further preferred that the width of described groove is 2mm, it is highly 1mm。
It is further preferred that described groove be shaped as Venturi tube structure。
It is further preferred that described plastic package die, also include: multiple reinforced chambeies and multiple spring for cushioning；Described reinforced Qiang Yuzhujiao road connects, and described reinforced chamber is arranged on below Zhu Jiao road；The quantity of described spring is identical with the quantity in described reinforced chamber；Described reinforced chamber and described spring connect, and described spring is arranged at the lower section in described reinforced chamber。
Compared with prior art, of the present utility model have the technical effect that
1, between existing plastic package die Zhong Gezhujiao road it is independent, disconnected structure, plastic package die Zhong Gezhujiao road of the present utility model is connected by connectivity structure, the plastic packaging glue in runner can be made to compensate mutually, plastic packaging glue unnecessary in Shi Zhujiao road passes through connectivity structure stream to having in less plastic packaging Jiao Zhujiao road, to balance mould, reduce the unfavorable condition such as pore, excessive glue。
2, the connectivity structure between Ge Zhujiao road can be multiple, is complementary in order to quickly carry out mould stream, and by multiple connectivity structures, plastic packaging glue has enough spaces to circulate。
3, netted connectivity structure makes a Ge Zhujiao road can connect multiple Zhu Jiao road simultaneously, improves the speed that mould stream is complementary, and the effect of balance mold pressing is notable。
4, multi-gate pole encapsulating mould includes upper die and lower die, when connectivity structure is groove, when additionally the imposite structure of half is pressed together on groove, then defines pipeline configuration, it is possible to be smoothed out plastic packaging processing procedure；And the structure of groove also saves the production material of mould。
5, the groove structure that both sides are parallel, design is simple, it is simple to processing。
6, in production process, when width and the height of this groove, most effective, production effect is the most desirable。
7, Venturi tube structure makes the plastic packaging glue in groove accelerate circulation, compensate mutually, improves plastic packaging effect further。
8, because injection head each in multi-gate pole plastic package die is synchronous working, in each reinforced chamber, the difference of resin volume is likely to result in the problem that filling is loose, it is therefore desirable to be arranged with spring in each reinforced chamber and it is cushioned；Plastic packaging glue in reinforced chamber, after High Temperature High Pressure melts, is injected in forming recess by Zhu Jiao road, Fen Jiao road and product is carried out plastic packaging。
Plastic package die with connectivity structure in this utility model, the plastic packaging glue in Shi Gezhujiao road can compensate mutually, balances each residue plastic packaging material pressure condition to spring, the pore produced when alleviating plastic packaging, the phenomenons such as glue of overflowing, and improves product yield。
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, this utility model is described in further detail:
Fig. 1 is the generalized section of prior art plastic packaging processing procedure；
Fig. 2 is the top view of one embodiment of this utility model；
Fig. 3 is venturi structural representation in an embodiment of the present utility model。
Drawing reference numeral illustrates:
1. forming recess, 2. Zhu Jiao road, 3. Fen Jiao road, 4. reinforced chamber, 5. spring, 6.PCB plate, 7. part, 8. connectivity structure, 9. Venturi tube structure。
Detailed description of the invention
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings。
Referring to Fig. 1, during matched moulds, the pressurization of injection head (not shown) moves upward, plastic packaging material in reinforced chamber 4 melts at high temperature under high pressure and pours into each forming recess 1 along Nei Fenjiao road, Zhu Jiao road 23, if the pcb board 6 in forming recess 1 has residual plate, in order to save resource in FEOL, will not installing part 7 on residual plate, the plastic packaging material that therefore each forming recess 1 needs is probably different。Such as, in Fig. 1, the residual plate on left side pcb board 6 is more, and part 7 is less, it is therefore desirable to more plastic packaging material；And part on right side pcb board 6 is more, then need relatively small number of plastic packaging material；When the plastic packaging material that satisfied left side forming recess 1 requires flows into, right side also can obtain identical plastic packaging material, but these plastic packaging materials are more for right side forming recess 1, and the transmission speed of plastic packaging material is too fast, in groove, gas cannot all be discharged, it is possible to has pore and generates。Additionally, multi-gate pole encapsulating mould adopts multiple reinforced chambeies 4 to synchronize injection, each forming recess 1 needs the difference of plastic packaging material, cause that remaining plastic packaging material is also different, cause remaining plastic packaging material the pressure of spring 5 is different, thus causing mould stream uneven, it is easy to produce overflow glue and cavitations when matched moulds。
In an embodiment of the present utility model, referring to Fig. 1, Fig. 2, a kind of plastic package die, including runner and forming recess 1；Runner includes multiple Zhu Jiao road 2 and multiple Fen Jiao road 3；Zhu Jiao road 2 is connected with forming recess 1 by Fen Jiao road 3；Forming recess is provided with PCB installation position；Connected by connectivity structure 8 between adjacent Zhu Jiao road。
In plastic package die, having multiple reinforced chamber 4 and provide plastic packaging glue for each Zhu Jiao road 2, a Ge Zhujiao road 2 is responsible in a reinforced chamber 4, i.e. one piece of corresponding Ge Zhujiao road 2 of plastic packaging glue, and the forming recess 1 of equal number is responsible for by every piece of plastic packaging glue。During matched moulds, same motor applies same pressure to the spring 5 of each reinforced chamber 4 correspondence, and product situation in each forming recess 1 is different, the plastic packaging glue amount needed is also different, thus can there is certain block remaining comparison of plastic packaging glue many, and the pressure of spring 5 is relatively larger, certain block plastic packaging glue is remaining fewer, the situation that the pressure of spring 5 is smaller, and the situation of this pressure inequality result in mould stream imbalance, thus the problem causing a series of product defect, scrapping。This utility model adds connectivity structure 8 between Ge Zhujiao road 2, each plastic packaging glue is enable to compensate mutually, plastic packaging glue Duo Zhujiao road 2 is by connectivity structure 8 stream to plastic packaging Jiao Shaozhujiaodao, with reach balance each piece of plastic packaging glue make consumption, and then balance its pressure to spring 5, realize mould mobile equilibrium, reduce the generation of the problems such as pore, excessive glue；It addition, plastic packaging glue is disposable products, this structure can also reduce waste of material, and a few side is compensated by the plastic packaging glue that residue is many。
Preferably, the quantity of the adjacent connectivity structure 8 between Zhu Jiao road 2 is multiple。
When not affecting board running, connectivity structure 8 can be multiple, so can accelerate the mutual compensation between mould stream, promote the efficiency of balance mold pressing。
Preferably, connectivity structure 8 is network structure, and multiple Zhu Jiao roads 2 are interconnected by network structure。Such as, three or more Ge Zhujiao roads 2 are interconnected by network structure。
Network structure makes a Ge Zhujiao road 2 can connect with multiple Zhu Jiao roads 2, and mould stream has more space and flows, complementary speed faster, better effects if。
In another embodiment of the present utility model, referring to Fig. 2, connectivity structure 8 is groove。Groove be shaped as the structure that both sides are parallel。The width of groove is 2mm, is highly 1mm。
Plastic package die is divided into upper die and lower die, even groove structure, when other half is closed, the combination of its plane and groove is the formation of a pipeline configuration, it is ensured that the normal operation of matched moulds；And groove structure also saves the production material of mould。For the ease of producing, the design groove structure that both sides are parallel succinctly, intuitively can use to actual production widely, and width is 2mm, it is highly the parallel groove structures in the both sides of 1mm, while ensureing not affect board performance, greatly reduce the generation of defective product, improve product yield。
Preferably, referring to Fig. 3, groove be shaped as Venturi tube structure 9。Venturi tube structure 9 refers to according to Venturi effect, first shrinks the structure then expanded gradually, and the effect of this kind of structure is in that restricted flow is when passing through the flow section reduced, and the phenomenon that flow velocity increases occurs in fluid, and its flow velocity and flow section are inversely proportional to。Utilize the flowing of the structure accelerating liquid that this stage casing caves in the inside, make mould stream be quickly carried out complementary movement, improve the efficiency of mould mobile equilibrium。
In another embodiment of the present utility model, plastic package die also includes: multiple reinforced chambeies 4 and multiple spring 5 for cushioning；Reinforced chamber 4 is connected with Zhu Jiao road 2, and reinforced chamber 4 is arranged on below Zhu Jiao road 2；The quantity of spring 5 is identical with the quantity in reinforced chamber 4；Reinforced chamber 4 and spring 5 connect, and spring 5 is arranged at the lower section in reinforced chamber 4。
Because injection head each in multi-gate pole plastic package die is synchronous working, in each reinforced chamber, the difference of resin volume is likely to result in the problem that filling is loose, it is necessary to be arranged with spring in each reinforced chamber and it is cushioned；Plastic packaging glue in reinforced chamber, after High Temperature High Pressure melts, is injected in forming recess by Zhu Jiao road, Fen Jiao road and product is carried out plastic packaging。
Plastic package die of the present utility model, by carrying out complementation with the mould stream between connectivity structure Shi Gezhujiao road, to reach balance mold pressing, reduces the problem such as pore, excessive glue, improving product yield。
The above is only preferred implementation of the present utility model; it should be pointed out that, for those skilled in the art, under the premise without departing from this utility model principle; can also making some improvements and modifications, these improvements and modifications also should be regarded as protection domain of the present utility model。
Claims (8)
1. a plastic package die, it is characterised in that include runner and forming recess；
Described runner includes multiple Zhu Jiao road and multiple Fen Jiao road；
Described Zhu Jiao road is connected with described forming recess by described Fen Jiao road；
Described forming recess is provided with PCB installation position；
Connected by connectivity structure between adjacent described Zhu Jiao road。
2. plastic package die according to claim 1, it is characterised in that:
The quantity of the adjacent described connectivity structure between described Zhu Jiao road is multiple。
3. plastic package die according to claim 1, it is characterised in that:
Described connectivity structure is network structure, and multiple Zhu Jiao roads are interconnected by described network structure。
4. plastic package die according to claim 1, it is characterised in that:
Described connectivity structure is groove。
5. plastic package die according to claim 4, it is characterised in that:
Described groove be shaped as the structure that both sides are parallel。
6. plastic package die according to claim 5, it is characterised in that:
The width of described groove is 2mm, is highly 1mm。
7. plastic package die according to claim 4, it is characterised in that:
Described groove be shaped as Venturi tube structure。
8. according to the arbitrary described plastic package die of claim 1-7, it is characterised in that also include:
Multiple reinforced chambeies and multiple spring for cushioning；
Described reinforced Qiang Yuzhujiao road connects, and described reinforced chamber is arranged on below Zhu Jiao road；
The quantity of described spring is identical with the quantity in described reinforced chamber；
Described reinforced chamber and described spring connect, and described spring is arranged at the lower section in described reinforced chamber。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620080091.9U CN205326154U (en) | 2016-01-27 | 2016-01-27 | Plastic package mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620080091.9U CN205326154U (en) | 2016-01-27 | 2016-01-27 | Plastic package mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205326154U true CN205326154U (en) | 2016-06-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620080091.9U Active CN205326154U (en) | 2016-01-27 | 2016-01-27 | Plastic package mold |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109228127A (en) * | 2018-10-24 | 2019-01-18 | 安徽大华半导体科技有限公司 | Substrate class wrapper mold |
| CN111391243A (en) * | 2020-03-24 | 2020-07-10 | 环维电子(上海)有限公司 | Plastic packaging mold based on one-time double-sided plastic packaging technology and plastic packaging method thereof |
| CN111605139A (en) * | 2019-02-26 | 2020-09-01 | 日月光半导体制造股份有限公司 | Packaging mold and packaging method |
| CN113451160A (en) * | 2021-06-29 | 2021-09-28 | 扬州虹扬科技发展有限公司 | Multipurpose three-phase rectifier bridge product plastic package mould |
-
2016
- 2016-01-27 CN CN201620080091.9U patent/CN205326154U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109228127A (en) * | 2018-10-24 | 2019-01-18 | 安徽大华半导体科技有限公司 | Substrate class wrapper mold |
| CN111605139A (en) * | 2019-02-26 | 2020-09-01 | 日月光半导体制造股份有限公司 | Packaging mold and packaging method |
| CN111605139B (en) * | 2019-02-26 | 2023-08-25 | 日月光半导体制造股份有限公司 | Packaging mold and packaging method |
| CN111391243A (en) * | 2020-03-24 | 2020-07-10 | 环维电子(上海)有限公司 | Plastic packaging mold based on one-time double-sided plastic packaging technology and plastic packaging method thereof |
| CN113451160A (en) * | 2021-06-29 | 2021-09-28 | 扬州虹扬科技发展有限公司 | Multipurpose three-phase rectifier bridge product plastic package mould |
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