CN205200700U

CN205200700U - Ultra -thin saw bit of brazing

Info

Publication number: CN205200700U
Application number: CN201520795710.8U
Authority: CN
Inventors: 李和鑫
Original assignee: Funik Ultrahard Material Co Ltd
Current assignee: Funik Ultrahard Material Co Ltd
Priority date: 2015-10-15
Filing date: 2015-10-15
Publication date: 2016-05-04
Anticipated expiration: 2025-10-15

Abstract

The utility model discloses an ultra -thin saw bit of brazing. The grit layer of saw bit is in the featheredge part of base member, and the most advanced terminal surface of following the mid portion of base member of the part on the ring terminal surface of featheredge part on grit layer exposes. In fact this is the grit of having got rid of the mid portion of base member, and the granularity that the featheredge part went up the grit has been increaseed, the incision that the grit layers cutting removed in the feasible cutting operation is after the heat expansion, the mid portion of notched width ratio base member is big, the incision just can not press from both sides the mid portion of tight base member like this, the mid portion that has just also avoided base member jamming and the mid portion in the incision is to the cutting of notched secondary, therefore the too big problem of incision of cutting the operation among the prior art of having solved, also make simultaneously cutting process's speed accelerate, improved efficiency.

Description

A kind of ultra-thin brazing saw blade

Technical field

The utility model relates to a kind of ultra-thin brazing saw blade.

Background technology

At present, thin saw blades a lot of again in commercially available cast-cutting saw slice, ultra-thin brazing saw blade, but because after the thickness of matrix self of these saw blades adds the thickness of abrasive material on top edge, the thickness at the edge of whole saw blade is just larger, so when cutting workpiece, traditional thin saw blade, the otch of ultra-thin brazing saw blade on workpiece are still larger, so that in cutting operation, the cutting loss of workpiece can increase, and the efficiency of cutting operation also can decrease.

The Chinese patent literature CN203778882U(day for announcing is on August 20th, 2014) disclose " multi-functional braze diamond saw disc ", comprise discoidal substrate, the edge of substrate has the thin edge portions thinner than mid portion, and soldering is fixed with the first abrasive grain layer on this thin edge portions, position soldering on the end face of substrate within the first abrasive grain layer is fixed with the second abrasive grain layer, the wear particle size of the first abrasive grain layer is less than the wear particle size of the second abrasive grain layer, like this when cutting operation, first abrasive grain layer first carries out otch on workpiece, second abrasive grain layer carries out polishing removal to incision site again.But by thermal stress effect in work piece cut operation, the otch that the first abrasive grain layer excises can clamp the position residing for the second abrasive grain layer, so not only increases the power needed for cutting operation, improves energy loss; And in the otch of heat expansion, the words of secondary cut operation are carried out by the second abrasive grain layer, can make reduce the cutting processing precision of workpiece, otch also can increase thereupon, and the heat that the middle part of substrate is assembled also can significantly increase, so that the efficiency of cutting operation and precision reduce.Simultaneously, cutting operation because of this cast-cutting saw slice need rely on first and second abrasive grain layer acting in conjunction to realize, so in actual cutting operation, first and second abrasive grain layer can simultaneously loss in cutting operation, also just makes this cast-cutting saw slice also there is short problem in service life.

Utility model content

The purpose of this utility model is to provide a kind of ultra-thin brazing saw blade, is intended to solve the problem that the otch of cutting operation in prior art is excessive.

In order to realize above object, in the utility model, the technical scheme of ultra-thin brazing saw blade is as follows:

Ultra-thin brazing saw blade, comprise the abrasive grain layer that discoid matrix and upper soldering thereof are fixing, the position, edge of matrix has the thin edge portions thinner than mid portion, abrasive grain layer is on the thin edge portions of matrix, and the tip being in the part on the ring end face of thin edge portions of abrasive grain layer is exposed from the end face of the mid portion of matrix.

The abrasive particle of abrasive grain layer is 0.6-0.7mm from root to most advanced and sophisticated height, the ring end face of the thin edge portions of matrix to mid portion end face between thickness difference be 0.15-0.17mm.

Abrasive particle is the diamond individual particle of granularity 30/40.

Thickness difference between the corresponding end face of two ring tip to face distance mid portions of the thin edge portions of matrix is equal.

Drop between thin edge portions and the end face of mid portion equals the thickness of the solder layer between abrasive grain layer and thin-walled portion.

The thickness of solder layer equals 25% ~ 30% of Abrasive Particle Size, and abrasive particle equals 75% ~ 70% of particle diameter from the height of protrusion that solder layer exposes.

Matrix is rosette.

In the utility model, the abrasive grain layer of saw blade is on the thin edge portions of matrix, and the tip being in the part on the ring end face of thin edge portions of abrasive grain layer is exposed from the end face of the mid portion of matrix.This is actually the abrasive particle of the mid portion eliminating matrix, and increase the granularity of abrasive particle on thin edge portions, make the otch of abrasive grain layer excision in cutting operation after heat expansion, the width of otch is larger than the mid portion of matrix, such otch would not clamp the mid portion of matrix, also the clamping stagnation of the mid portion just avoiding matrix in otch and mid portion are to the secondary cut of otch, thus solve the problem that in prior art, the otch of cutting operation is excessive, also make that the speed of cutting processing is accelerated, efficiency raising simultaneously.

Accompanying drawing explanation

Fig. 1 is the structural representation of saw blade cross section in embodiment of the present utility model;

Fig. 2 is the structural representation of matrix in Fig. 1.

Detailed description of the invention

The embodiment of ultra-thin brazing saw blade in the utility model: as depicted in figs. 1 and 2, this ultra-thin brazing saw blade is a kind of superthin diamond brazing saw blade, and the abrasive material fixed primarily of matrix 1 and upper soldering thereof is formed.Matrix 1 is the disc of metal material, and the position, edge of matrix 1 has the circle thin edge portions 2 thinner than mid portion 3, and the thickness difference between the corresponding end face of two ring tip to face distance mid portions 3 of this thin edge portions 2 is 0.15-0.17mm.In abrasive grain layer 4, abrasive particle selects the diamond individual particle of granularity 30/40, abrasive particle is 0.6-0.7mm from root to most advanced and sophisticated height, the height of protrusion of abrasive particle is 75% of individual particle, abrasive grain layer 4 is on the thin edge portions 2 of matrix 1, on the two side ring end faces that abrasive grain layer 4 is wrapped in thin edge portions 2 and edge, the tip being in the part on the ring end face of thin edge portions 2 of abrasive grain layer 4 is exposed from the end face of the mid portion 3 of matrix 1.Drop between thin edge portions and the end face of mid portion equals the thickness of the solder layer between abrasive grain layer and thin-walled portion, and the thickness of solder layer equals 25% ~ 30% of Abrasive Particle Size, and abrasive particle equals 75% ~ 70% of particle diameter from the height of protrusion that solder layer exposes.

In the present embodiment, the main mode of ameliorating of ultra-thin brazing saw blade is thinning in matrix 1 cylindrical two working face turning modes, and the height that car falls and the abrasive material height that saw blade uses match.Although the thin edge portions 2 of matrix 1 is very thin, add the abrasive material of matrix 1 both sides, the working lining thickness of saw blade adds much in fact.Height as 30/40 diamond individual particle is 0.6-0.7mm, brazed diamond tool requires that abrasive material height of protrusion is 75% of individual particle, so just can by matrix 1 working lining to the 0.15-0.17mm that gets off, because saw blade two sides all wants car to fall identical height, so the thickness of whole saw blade working lining is equivalent to decrease 0.3-0.34mm.By this improvement, the thinning degree of braze diamond saw disc effectively can improve 10%-15%, accomplishes thin slice saw blade truly.In using, neither affect the normal performance of abrasive material as cutting edge, the width cutting mouth can be reduced again.Its direct result is exactly the loss reducing processing work, improves saw blade operating efficiency simultaneously.

In the present embodiment, two side ring end faces of the thin edge portions of matrix are the same by the height cut down, and in other embodiments, two side ring end faces of thin edge portions also can be different by the height cut down.

Claims

1. ultra-thin brazing saw blade, comprise the abrasive grain layer that discoid matrix and upper soldering thereof are fixing, the position, edge of matrix has the thin edge portions thinner than mid portion, it is characterized in that, abrasive grain layer is on the thin edge portions of matrix, and the tip being in the part on the ring end face of thin edge portions of abrasive grain layer is exposed from the end face of the mid portion of matrix.

2. ultra-thin brazing saw blade according to claim 1, is characterized in that, the abrasive particle of abrasive grain layer is 0.6-0.7mm from root to most advanced and sophisticated height, the ring end face of the thin edge portions of matrix to mid portion end face between thickness difference be 0.15-0.17mm.

3. ultra-thin brazing saw blade according to claim 2, is characterized in that, abrasive particle is the diamond individual particle of granularity 30/40.

4. the ultra-thin brazing saw blade according to claim 1 or 2 or 3, is characterized in that, the thickness difference between the corresponding end face of two ring tip to face distance mid portions of the thin edge portions of matrix is equal.

5. the ultra-thin brazing saw blade according to claim 1 or 2 or 3, it is characterized in that, the drop between thin edge portions and the end face of mid portion equals the thickness of the solder layer between abrasive grain layer and thin-walled portion.

6. ultra-thin brazing saw blade according to claim 5, is characterized in that, the thickness of solder layer equals 25% ~ 30% of Abrasive Particle Size, and abrasive particle equals 75% ~ 70% of particle diameter from the height of protrusion that solder layer exposes.

7. the ultra-thin brazing saw blade according to claim 1 or 2 or 3, is characterized in that, matrix is rosette.