CN205192027U - Refrigerating device - Google Patents

Abstract

The utility model discloses a refrigeration device, which includes a refrigeration chamber, a refrigeration cavity, a first air duct, a second air duct, an air supply unit, a spoiler and at least one refrigeration chip. The refrigerator compartment has an air inlet and an air outlet. The refrigeration cavity has an air inlet and an air outlet. The first air duct is used to connect the air inlet of the refrigerator compartment and the air outlet of the refrigeration cavity. The second air duct is used to connect the air outlet of the refrigerator compartment and the air inlet of the refrigeration cavity. The air supply unit is connected with the first air duct and the second air duct to generate an air flow. The spoiler device is installed in the refrigeration cavity to increase the wind resistance of the air flow through the refrigeration cavity to prolong the heat exchange time of the air flow in the refrigeration cavity. The refrigeration chip has a cooling surface and a heating surface. The heating surface is exposed outside the refrigeration cavity, and the cooling surface is placed in the refrigeration cavity.

Description

refrigeration unit

technical field

The utility model relates to a refrigeration device, in particular to a refrigeration device with fresh-keeping and refrigeration functions.

Background technique

At present, refrigeration technology can be divided into three types: vapor compression type, heat absorption type, and refrigeration chip type. Both vapor compression type and heat absorption type require the use of refrigerants, such as ordinary refrigerators and air conditioners. The refrigerant will pollute the environment, and a compressor must be used to drive the refrigerant, so the overall volume cannot be reduced. The cooling chip type is to generate cooling and heating effects by passing current through the cooling chip, so it is different from the vapor compression type and heat absorption type refrigeration technology, it can effectively reduce the size, and it is not easy to generate noise. The use of refrigerants, environmental protection and other advantages, but the current cooling chip technology is used for cooling design, mainly for small refrigerated spaces, because the cooling surface of the cooling chip is prone to condensation water and the heat dissipation of the heating surface is not easy, resulting in refrigeration The cooling efficiency of the chip is not significant.

Utility model content

The purpose of the utility model is to provide a refrigeration device, which can reduce the temperature of the refrigeration chamber by circulating the cold air and discharging the hot air through the refrigeration chamber connected with the refrigeration chamber, so as to maintain the freshness and storage time of the refrigerated items.

Another object of the present utility model is to provide a refrigeration device, which can quickly take away the waste heat through the heating surface of the refrigeration chip exposed outside the refrigeration chamber, so as to effectively improve the heat dissipation capacity of the heating surface and improve the cooling efficiency of the refrigeration chip .

In order to achieve the above purpose, the utility model proposes a refrigeration device, which includes a refrigerating chamber, a refrigeration chamber, a first air guide pipe, a second air guide pipe, an air supply unit, a flow turbulence device and at least one Cooling chip. The refrigerator compartment has an air inlet hole and an air outlet hole. The cooling chamber has an air inlet and an air outlet. The first air guide pipe is used for connecting the air inlet hole of the refrigerating chamber and the air outlet hole of the refrigeration cavity. The second air guide pipe is used for connecting the air outlet hole of the refrigerating chamber and the air inlet hole of the refrigeration cavity. The air supply unit communicates with the first air guide pipe and the second air guide pipe for generating an air flow. The turbulence device is arranged in the refrigerating chamber, and the turbulent device increases the air resistance of the airflow passing through the refrigerating chamber, so as to prolong the heat exchange time of the airflow in the refrigerating chamber. At least one cooling chip has a cooling surface and a heating surface, the heating surface is exposed outside the cooling cavity, and the cooling surface is accommodated in the cooling cavity.

The cooling chamber also includes at least one fin connected to the cooling surface of the cooling chip.

The air supply unit is arranged at the air inlet hole or the air outlet hole in the refrigeration cavity.

The air supply unit is arranged at the air inlet hole or the air outlet hole in the refrigerating chamber.

The air supply unit is arranged in the first air guide pipe or the second air guide pipe.

The heating surface of the cooling chip uses a water cooling system to dissipate heat. The water cooling system includes: at least one water cooling head with a water outlet and a water inlet, the water cooling head is connected to the heating surface of the cooling chip; water cooling device , having a water outlet and a water inlet for accommodating a coolant; a first conduit for connecting the water outlet of the water-cooling device and the water inlet of the water-cooling head; and at least one second conduit for Connect the water inlet of the water cooling device with the water outlet of the water cooling head.

The cooling liquid flows from the water inlet of the water cooling head to the heating surface of the cooling chip, and the cooling liquid flows in a direction perpendicular to the heating surface.

The air inlet hole of the cooling cavity is set on a first orifice plate, the air outlet hole of the cooling cavity is set on a second orifice plate, and the turbulence device includes a set on the first orifice plate and the There are at least two baffles between the second orifice plates, and the airflow is allowed to pass between the at least two baffles unevenly.

The at least two baffles are provided with a plurality of holes through which the airflow can pass.

The at least two baffles are arranged in parallel and staggered, so that the airflow passes between the at least two baffles in an S-shape.

A drainage channel is arranged in the refrigeration cavity, and the drainage channel is connected obliquely downwards from the first orifice plate to the second orifice plate.

The drainage channel is provided with at least one drainage hole for discharging condensed water.

The utility model has the advantage that the temperature of the refrigerating room can be lowered to keep the freshness and storage time of the refrigerated items by circulating the cold air and discharging the hot air through the refrigerating cavity connected with the refrigerating room; The heating surface of the cooling chip exposed outside the cooling chamber and the water cooling system quickly take away the waste heat to effectively improve the heat dissipation capacity of the heating surface and improve the cooling efficiency of the cooling chip.

In order to have a better understanding of the above and other aspects of the present utility model, the preferred embodiments are specifically cited below, and in conjunction with the accompanying drawings, the detailed description is as follows:

Description of drawings

Fig. 1 is the schematic diagram of the refrigeration device of one embodiment of the utility model;

Fig. 2 is a schematic configuration diagram of a cooling chip according to an embodiment of the present invention;

Fig. 3 and Fig. 4 are respectively the schematic diagrams of the cooling cavity of an embodiment of the utility model;

Figure 5 and Figure 6 are schematic diagrams of the configuration of the fins and at least two baffles in the cooling cavity;

Fig. 7 is a schematic diagram of flow channel design in the cooling chamber.

Symbol Description

100: refrigeration unit

110: Refrigerator

112: Air inlet hole

114: Air outlet

120: Cooling cavity

121: The first orifice plate

122: Air inlet hole

123: Second orifice plate

124: Air outlet

125: Drainage channel

126: drainage hole

130: The first air duct

140: Second air duct

150: air supply unit

160: Refrigeration chip

162: cooling surface

164: heating surface

165: fins

170: Spoiler

172, 173: Baffle

174: Holes

200: water cooling system

210: water block

212: water inlet

214: water outlet

220: water cooling device

222: water inlet

224: water outlet

230: First Conduit

240: Second Conduit

A: area

B: area

F: Airflow

F1: Airflow

Q: coolant

T: Vortex

detailed description

The following embodiments are provided for detailed description, and the embodiments are only used as examples for illustration, and are not intended to limit the protection scope of the present utility model.

Please refer to FIG. 1 , which shows a schematic diagram of a refrigeration device 100 according to an embodiment of the present invention. The refrigeration device 100 of this embodiment includes a refrigerating chamber 110, a refrigeration cavity 120, a first air duct 130, a second air duct 140, an air supply unit 150, at least one refrigeration chip 160, and a spoiler device 170 (not shown in FIG. 1 ). For further description of the spoiler 170 , please refer to FIG. 6 and FIG. 7 .

The refrigerator compartment 110 has an air inlet 112 and an air outlet 114 . The refrigerator compartment 110 is used for storing or keeping fresh objects. The refrigeration cavity 120 has an air inlet 122 and an air outlet 124 . The first air duct 130 is used to connect the air inlet 112 of the refrigerating chamber 110 and the air outlet 124 of the cooling cavity 120 . The second air duct 140 is used to connect the air outlet 114 of the refrigerating chamber 110 with the air inlet 122 of the cooling cavity 120 . In one embodiment, the air supply unit 150 can be arranged inside the cooling cavity 120 (or outside the cooling cavity 120). The air supply unit 150 is, for example, a blower or a fan. The pipe 140 is connected to generate a flow F. The cooling chip 160 has a cooling surface 162 and a heating surface 164 , the heating surface 164 is exposed outside the cooling cavity 120 , and the cooling surface 162 is accommodated in the cooling cavity 120 .

The air flow F generated by the air supply unit 150 can discharge the hot air (relatively high temperature gas) in the refrigerating chamber 110 into the refrigerating chamber 120, and perform heat exchange in the refrigerating chamber 120 (hot air and temperature The cooling surfaces 162 of the relatively low cooling chips 160 perform heat exchange to form cold air), and then the cold air is discharged through the cooling cavity 120 and enters the refrigerating chamber 110 . Therefore, the temperature of the refrigerating chamber 110 can be effectively reduced by entering the cold air and discharging the hot air until the temperature of the refrigerating chamber 110 reaches a predetermined temperature.

Please refer to FIG. 2 , the cooling surface 162 of the cooling chip 160 is connected to at least one fin 165 (or a fin group), and the contact area between the cooling surface 162 and the air is increased through the fins 165 to improve the cooling efficiency of the cooling chip 160 . Of course, the present invention is not limited to increasing the contact area between the cooling surface 162 and the air through the fins 165 , and can also use heat pipes or other heat conducting devices.

In addition, in an embodiment, the heating surface 164 of the cooling chip 160 can dissipate heat through a water cooling system 200 . Referring to FIG. 1 , the water cooling system 200 includes at least one water cooling head 210 , a water cooling device 220 , a first conduit 230 and at least one second conduit 240 . The heating surface 164 of the cooling chip 160 can be connected to the water-cooling head 210 , and the cooling liquid Q in the water-cooling head 210 can remove heat from the heating surface 164 to improve the cooling efficiency of the cooling chip 160 . Please refer to the water cooling head 210 shown in FIG. 2 , the water cooling head 210 has a water inlet 212 and at least one water outlet 214, the cooling liquid Q (such as water or other refrigerants) can enter the water cooling head 210 through the water inlet 212, and Heat exchange is performed in the water cooling head 210 (the cooling liquid Q exchanges heat with the heating surface 164 of the relatively high temperature cooling chip 160 to become a high temperature cooling liquid Q), and then the high temperature cooling liquid Q is discharged from the water cooling head 210 through the water outlet 214 outside.

In one embodiment, when the cooling liquid Q flows from the water inlet 212 of the water cooling head 210 to the heating surface 164, the direction in which the cooling liquid Q flows is almost perpendicular to the heating surface 164, so that the cooling liquid Q directly hits the heating surface 164 and Get the best heat exchange effect.

Referring to FIG. 1 , a water cooling device 220 (for example, a water refrigerator) has a water inlet 222 and a water outlet 224 , and the water cooling device 220 has a storage space for accommodating a coolant Q. The water outlet 224 of the water cooling device 220 is connected to the water inlet 212 of the water cooling head 210 via a first conduit 230 (see FIG. 2 ), and the water inlet 222 of the water cooling device 220 is connected to the outlet of the water cooling head 210 via at least one second conduit 240. Water port 214 (see Figure 2). Therefore, in this embodiment, the coolant Q can be driven by the water pump of the water cooling device 220, flow from the first conduit 230 for water inlet to the water cooling head 210, and then return to the water cooling device 220 through the second conduit 240 for water outlet, To facilitate recycling.

The heat dissipation capacity of the water cooling system 200 is higher than that of the air cooling system. Therefore, the water cooling system 200 can effectively improve the heat dissipation capacity of the heating surface 164 of the cooling chip 160, and enhance the cooling effect of the heating surface 164, especially for large refrigerators 110. Generally speaking, the cooling chip 160 combined with the air cooling system is only suitable for use in a small refrigerated space, so it cannot effectively reduce the temperature of the large refrigerated room 110. The heating surface of the cooling chip 160 must be increased through the above-mentioned cooling cavity 120 and the water cooling system 200. 164, the cooling efficiency of the cooling surface 162 of the cooling chip 160 can be further improved, so as to achieve the effect of freshness preservation and cold storage of refrigerated objects.

Please refer to FIG. 3 and FIG. 4 , which respectively illustrate a schematic diagram of a cooling cavity 120 according to an embodiment of the present invention. The refrigeration cavity 120 is, for example, a long hollow cavity with an air inlet hole 122 and an air outlet hole 124 at two ends thereof. In FIG. 3 , although the air supply unit 150 is not shown, the air supply unit 150 can be installed at the air inlet hole 122 in the cooling cavity 120 (corresponding to area A in the figure) or in the cooling cavity 120 The air outlet hole 124 (corresponding to the area B in the figure) or both. In addition, the air supply unit 150 can also be arranged in a pipeline outside the refrigeration cavity 120 (such as the first air guide pipe 130 or the second air guide pipe 140 ) or at the air inlet hole 112 or the air outlet of the refrigerator compartment 110 . The air hole 114 is not limited by the present invention. The air inlet hole 122 of the cooling cavity 120 is set on a first orifice plate 121, the air outlet hole 124 of the cooling cavity 120 is set on a second orifice plate 123, and the turbulence device 170 includes a set on the first orifice plate 121 At least two baffles 172 between the second orifice 123 allow the airflow F to pass between the at least two baffles 172 unevenly. The turbulence device 170 can adopt various structures or types, and the purpose is to increase the air resistance of the airflow F flowing through the cooling cavity 120 , so as to prolong the heat exchange time of the airflow F in the cooling cavity 120 .

In one embodiment, a cooling chip 160 and a water cooling head 210 connected to the cooling chip 160 are arranged between every two baffles 172 . Therefore, when there are five cooling chips 160 and five water cooling heads 210 , it is better to install six baffles 172 , and a turbulence space is formed between every two baffles 172 to increase the heat exchange time of the airflow. In addition, the baffles 172 are provided with a plurality of holes 174 through which the airflow F can pass. The holes 174 can be designed to be of the same size, different sizes or alternately arranged in order to decelerate the airflow F (increase the wind resistance) or form a turbulent flow in the cooling chamber 120 to increase the heat exchange time.

In addition, please refer to FIG. 4 , a drainage channel 125 is provided in the cooling cavity 120 , and the drainage channel 125 is connected obliquely downwards from the first orifice plate 121 to the second orifice plate 123 so that the condensed water can flow down along the drainage channel 125 To flow or concentrate somewhere. In addition, the drain channel 125 is provided with at least one drain hole 126 for draining condensed water. In one embodiment, when the hot air enters the cooling cavity 120 for heat exchange, after the heat of the hot air is absorbed by the fins 165, the temperature drops and becomes cold air, so that the saturated water vapor in the cold air condenses into water , the condensed water can flow down along the surface of the fins 165 to the drainage channel 125 with a difference in elevation, and then be discharged through the drainage hole 126 or be concentrated somewhere. Since the water vapor in the cold air is reduced due to condensation, the humidity of the cold air discharged from the cooling cavity 120 is relatively low, and excessive water vapor can also be prevented from entering the refrigerating chamber 110 .

The drainage holes 126 in this embodiment are not limited to be disposed under each baffle plate 172 , and may also be disposed at other positions of the drain channel 125 , but preferably at a lower position where condensed water is easy to gather.

Please refer to FIG. 5 and FIG. 6 , which are schematic diagrams illustrating the arrangement of the fins 165 and at least two baffles 172 in the cooling cavity 120 . In FIG. 5 , the direction in which the fins 165 are arranged is substantially parallel to the direction in which the baffles 172 are arranged. In order to allow the airflow F to have enough heat exchange time between the two baffles 172 to exchange heat with the fins 165, the baffles 172 There are a plurality of holes 174 through which the airflow F can pass, so that the parallel airflow F forms a plurality of turbulent eddies T between the two baffles 172, and part of the airflow F1 enters between the two adjacent fins 165, and also It can stay between two adjacent fins 165 for more time, allowing the fins 165 to absorb more heat energy.

In addition to decelerating the parallel-flowing airflow F (increasing wind resistance) to form multiple turbulent eddies T, the contact area between the fins 165 and the airflow F and the heat exchange time can also be increased through the design of the flow channel. Please refer to FIG. 7 , which shows a schematic diagram of the design of flow passages in the cooling cavity 120 . In the cooling cavity 120 , at least two baffles 173 are arranged in parallel and staggered, so that the airflow F passes between the at least two baffles 173 in an S shape. In one embodiment, when the airflow F passes between two adjacent baffles 173 in an S shape, part of the airflow F1 can further enter between two adjacent fins 165 (please refer to FIG. 6 ), and can Staying longer between two adjacent fins 165 allows the fins 165 to absorb more heat energy.

The refrigerating device disclosed in the above-mentioned embodiments of the utility model lowers the temperature of the refrigerating chamber through the refrigerating chamber connected to the refrigerating chamber to circulate cold air and discharge hot air, so as to maintain the freshness and storage time of the refrigerated items. In addition, waste heat can be quickly taken away through the heating surface of the cooling chip exposed outside the cooling cavity and the water cooling system, so as to effectively improve the heat dissipation capacity of the heating surface and improve the cooling efficiency of the cooling chip.

Claims (12)

1. a refrigerating plant, is characterized in that, this refrigerating plant comprises:

Refrigerating chamber, has into air holes and exhaust vent;

Refrigeration cavity, has into air holes and exhaust vent;

First guide duct, enters this exhaust vent of air holes and this refrigeration cavity in order to this linking this refrigerating chamber;

Second guide duct, enters air holes in order to this linking this exhaust vent of this refrigerating chamber and this refrigeration cavity;

Blowing unit, is connected with this first guide duct and this second guide duct, in order to produce air-flow;

Disturbing flow device, be arranged in this refrigeration cavity, this disturbing flow device increases the windage that this air-flow flows through this refrigeration cavity, to extend the heat exchanger time of this air-flow in this refrigeration cavity; And

At least one refrigerating chip, has chill surface and heats face, and this heats face, and to expose to this refrigerating chamber external, and this chill surface is placed in this refrigeration cavity.

2. refrigerating plant as claimed in claim 1, it is characterized in that, also comprise in this refrigeration cavity and arrange at least one fin, this fin is connected to this chill surface of this refrigerating chip.

3. refrigerating plant as claimed in claim 1, is characterized in that, this blowing unit be arranged in this refrigeration cavity this enter air holes place or this exhaust vent place.

4. refrigerating plant as claimed in claim 1, is characterized in that, this blowing unit be arranged in this refrigerating chamber this enter air holes place or this exhaust vent place.

5. refrigerating plant as claimed in claim 1, it is characterized in that, this blowing unit is arranged in this first guide duct or this second guide duct.

6. refrigerating plant as claimed in claim 1, is characterized in that, this of this refrigerating chip heats face and dispel the heat with water-cooling system, and this water-cooling system comprises:

At least one water-cooling head, has delivery port and water inlet, this water-cooling head be connected to this refrigerating chip this heat face;

Water cooling plant, has delivery port and water inlet, in order to accommodating cooling fluid;

First conduit, in order to this water inlet of this delivery port and this water-cooling head of linking this water cooling plant; And

At least one second conduit, in order to the delivery port of this water inlet and this water-cooling head of linking this water cooling plant.

7. refrigerating plant as claimed in claim 6, is characterized in that, this cooling fluid heats surface current from this water inlet of this water-cooling head toward this of this refrigerating chip and moves, and the direction of this coolant flow is with this, and to heat face vertical.

8. refrigerating plant as claimed in claim 1, it is characterized in that, this of this refrigeration cavity enters air holes and is arranged on the first orifice plate, this exhaust vent of this refrigeration cavity is arranged on the second orifice plate, this disturbing flow device comprises at least two baffle plates be arranged between this first orifice plate and this second orifice plate, and makes this air-flow non-smoothly by between this at least two baffle plate.

9. refrigerating plant as claimed in claim 8, it is characterized in that, this at least two baffle plate is provided with multiple holes that this air-flow can be allowed to pass through.

10. refrigerating plant as claimed in claim 8, is characterized in that, at least two baffle plates is parallel is staggered for this, makes this air-flow S-shaped by between this at least two baffle plate.

11. refrigerating plants as claimed in claim 8, is characterized in that, be provided with drainage in this refrigeration cavity, this drainage is tilted to down by this first orifice plate and is connected to this second orifice plate.

12. refrigerating plants as claimed in claim 11, it is characterized in that, this drainage is provided with at least one osculum, in order to discharge condensate water.