CN205185302U - Synchronous welding set of semiconductor laser - Google Patents
Synchronous welding set of semiconductor laser Download PDFInfo
- Publication number
- CN205185302U CN205185302U CN201520753976.6U CN201520753976U CN205185302U CN 205185302 U CN205185302 U CN 205185302U CN 201520753976 U CN201520753976 U CN 201520753976U CN 205185302 U CN205185302 U CN 205185302U
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- die clamper
- semiconductor laser
- clamping device
- welding
- lower mould
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- 238000003466 welding Methods 0.000 title claims abstract description 51
- 239000004065 semiconductor Substances 0.000 title claims abstract description 45
- 230000001360 synchronised effect Effects 0.000 title claims abstract description 37
- 239000013307 optical fiber Substances 0.000 claims description 7
- 241000931526 Acer campestre Species 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 239000000835 fiber Substances 0.000 abstract description 4
- 239000000843 powder Substances 0.000 abstract description 2
- 230000003760 hair shine Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 238000010257 thawing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
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- Laser Beam Processing (AREA)
- Mechanical Coupling Of Light Guides (AREA)
Abstract
The utility model discloses a synchronous welding set of semiconductor laser, include: go up the die clamper, lower die clamper, down the die clamper can with go up die clamper accordant connection, wherein, it is used for the fixed positioner who treats welding set to descend the die clamper to have, go up the die clamper and have a plurality of optic fibre outputs, it is a plurality of the laser warp that the optic fibre output was exported simultaneously the reflection of going up the inner chamber of die clamper is just right the welding of treating welding set is regional. Use the utility model relates to a synchronous welding set of semiconductor laser, the laser of the synchronous output of a plurality of optic fibre outputs, the intracavity shines in the welding regionally through the reflection in the gilding of last die clamper, simultaneously, through continuously exerting pressure of last die clamper and die clamper down, makes effectively and welds the region and melt to firm combination. Adoption laser locking welding, welding speed is fast, the regional weld width invariant of welding, one shot forming improves welded quality and firm ability in addition effectively, need not any additional scaling powder.
Description
Technical field
The utility model relates to a kind of technical field of process equipment, particularly relates to a kind of semiconductor laser synchronous welder.
Background technology
Welding be a kind of with the mode jointing metal of heating, high temperature or high pressure or other thermoplastics as the manufacturing process of plastics and technology.Existing welding method adopts hot plate welding, ultrasonic bonding and laser weld, but the speed of welding of hot plate welding and ultrasonic bonding, fastness and weld attractive in appearance far away from laser weld.And laser weld is asynchronous welding, only have beam of laser to weld along welding region, this method can not realize disposable welding, as welded for car light, can produce stress at different directions in welding process, can not ensure the uniformity of welding, speed of welding is also comparatively low.
Utility model content
For the problems referred to above that existing laser weld exists, now provide one to be intended to realize synchronous welding, have welding fast, stable and firmly semiconductor laser synchronous welder, foreign matter is there is in welding process for solving in ultrasonic welding technique, welding bar stitches unsightly, the problem of high in cost of production.
Concrete technical scheme is as follows:
A kind of semiconductor laser synchronous welder, comprising: upper die clamper; Lower mould clamping device, described lower mould clamping device can mate with described upper die clamper and be connected; Wherein, described lower mould clamping device has the positioner for fixing device to be welded; Described upper die clamper has some fiber-optic outputs, and some described fiber-optic outputs are just to the welding region of described device to be welded.
Above-mentioned a kind of semiconductor laser synchronous welder, wherein, some described fiber-optic outputs are installed on the edge of described upper die clamper.
Above-mentioned a kind of semiconductor laser synchronous welder, wherein, described upper die clamper encloses the described inner chamber of indent along its edge one, and some described fiber-optic outputs are installed in described inner chamber.
Above-mentioned a kind of semiconductor laser synchronous welder, wherein, the interior sidewall surface of described inner chamber is reflecting surface.
Above-mentioned a kind of semiconductor laser synchronous welder, wherein, described reflecting surface is gold-plated.
Above-mentioned a kind of semiconductor laser synchronous welder, wherein, fiber-optic output described in each connects an optical fiber, Fiber connection semiconductor laser transmitter described in each.
Above-mentioned a kind of semiconductor laser synchronous welder, wherein, described positioner comprises some locating pieces, and some described locating pieces are installed on the edge of described lower mould clamping device respectively.
Above-mentioned a kind of semiconductor laser synchronous welder, wherein, the optical maser wavelength of described semiconductor laser transmitter is 980nm.
Above-mentioned a kind of semiconductor laser synchronous welder, wherein, the cross-sectional width of the described inner chamber that fiber-optic output described in each is corresponding is 3mm.
Above-mentioned a kind of semiconductor laser synchronous welder, wherein, also comprises: support; Described upper die clamper is fixedly installed in the upper end of described support; Described lower mould clamping device is installed on the lower end of described support, and described lower mould clamping device is just to described upper die clamper; Lowering or hoisting gear, described lowering or hoisting gear is connected with described lower mould clamping device, drives described lower mould clamping device near connecting described upper die clamper.
The good effect that technique scheme compared with prior art has is:
(1) laser of some fiber-optic output synchronism output, in the gold-plated inner chamber of upper die clamper through reflected illumination in welding region, meanwhile, by the continu to press of upper die clamper and lower mould clamping device, effectively make welding region melt, and firmly combine.
(2) adopt laser synchronization welding, speed of welding is fast, and the weld width of welding region is constant, one-shot forming, and effectively improves the quality of welding and firm ability, without the need to any additional scaling powder.
(3) adopt fiber-optic output transfer laser to realize laser synchronization welding, compared to traditional welding, there is minimum mechanical stress, minimum thermal stress, stable welding process and weld flexibility greatly, and equipment is without the need to large usage space.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of a kind of semiconductor laser synchronous welder of the present utility model;
Fig. 2 is the schematic diagram of the positioner of lower mould clamping device in a kind of semiconductor laser synchronous welder of the present utility model;
Fig. 3 is the schematic diagram of laser weld in a kind of semiconductor laser synchronous welder of the present utility model;
Fig. 4 is the sectional view of laser weld in Fig. 3.
In accompanying drawing: 1, upper die clamper; 11, inner chamber; 2, lower mould clamping device; 3, fiber-optic output; 4, optical fiber; 5, locating piece; 6, car light main casing; 7, car light upper cover; 8, support; 81, patrix jig plate; 82, lower mould clamping device plate; 83, base plate; 9, lowering or hoisting gear; 10, support bar.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail, but not as restriction of the present utility model.
Fig. 1 is a kind of schematic diagram of semiconductor laser synchronous welder, shown in Figure 1.Show a kind of semiconductor laser synchronous welder of preferred embodiment, it includes die clamper 1 and lower mould clamping device 2, lower mould clamping device 2 can mate with upper die clamper 1 and be connected, namely lower mould clamping device 2 can pass through mobile near connecting upper die clamper 1, or upper die clamper 1 can pass through mobile near connecting lower mould clamping device 2.Certainly, also include support, support, for fixedly mounting upper die clamper 1 and lower mould clamping device 2, can have specific descriptions to support below.
In addition, lower mould clamping device 2 is provided with positioner, with this, device to be welded is fixedly mounted in lower mould clamping device 2 by positioner.
In addition, upper die clamper 1 is provided with some fiber-optic outputs 3, some fiber-optic outputs 3 are connected with generating laser (not shown), and some fiber-optic outputs 3 are just to the welding region of the device to be welded in lower mould clamping device 2, the laser that generating laser is exported by some fiber-optic outputs 3 simultaneously in the welding region of device to be welded, thus ensures that the welding region of device to be welded firmly welds through the reflected illumination of the inner chamber of upper die clamper 1.
Above-described upper die clamper and lower mould clamping device are only the utility model preferred embodiment, not thereby limit embodiment of the present utility model and protection domain.
Fig. 3 is the schematic diagram of laser weld in a kind of semiconductor laser synchronous welder of the present utility model, and Fig. 4 is the sectional view of laser weld in Fig. 3, refers to shown in Fig. 1, Fig. 3 and Fig. 4.The welding region being fixedly installed in the device to be welded in lower mould clamping device 2 is adjacent edges, then in a kind of preferred embodiment, show the edge that some fiber-optic outputs 3 are installed on die clamper 1, make some fiber-optic outputs 3 just treat the welding region of welder with this.
Certainly, the installation site of above-described fiber-optic output 3 is only the utility model preferred embodiment, not thereby limits embodiment of the present utility model and protection domain.
Or as in preferred embodiment, upper die clamper 1 encloses along the edge one of upper die clamper 1 inner chamber 11 caved inward, and some fiber-optic outputs 3 are installed in inner chamber 11 mutually equably, as shown in Figure 3 and Figure 4.
Further, as in preferred embodiment, can reflex on the device to be welded of lower mould clamping device 2 to make the laser exported by fiber-optic output 3, the interior sidewall surface of the inner chamber 11 of upper die clamper 1 is reflecting surface, with this, laser is formed by the uniform hot spot of continuous print compressed by the reflective surface of inner chamber 11, and the width of hot spot is consistent with the width of the welding region of device to be welded.
Concrete, in a kind of preferred embodiment, the interior sidewall surface of inner chamber 11 adopts gold-plated process, can have efficient reflectivity with this to laser.
Further, as in preferred embodiment, each fiber-optic output 3 connects an optical fiber 4, and each optical fiber 4 connects semiconductor laser transmitter (not shown), by semiconductor laser transmitter by optical fiber 4 transfer laser, and by fiber-optic output 3 Output of laser.
Fig. 2 is the schematic diagram of the positioner of lower mould clamping device in a kind of semiconductor laser synchronous welder, refers to shown in Fig. 1 and Fig. 2.In a preferred embodiment, positioner comprises some locating pieces 5, and some locating pieces 5 are installed on the edge of lower mould clamping device 2 respectively.
Concrete, as in preferred embodiment, this semiconductor laser synchronous welder is used for the welding of car light.Car light main casing 6 is positioned in lower mould clamping device 2, and then car light upper cover 7 is positioned on car light main casing 6, and make both laminatings by some locating pieces 5, ensure the fixing of car light main casing 6 and car light upper cover 7.
In addition, the shape of upper die clamper 1 and lower mould clamping device 3 designs and produces according to the profile of car light.
Refer to shown in Fig. 3 and Fig. 4, further, as in preferred embodiment, the optical maser wavelength of semiconductor laser transmitter is 980nm.Certainly, the optical maser wavelength of semiconductor laser transmitter is only the utility model preferred embodiment, not thereby limits embodiment of the present utility model and protection domain.According to the welding demand of reality, the thawing speed that when power output also by adjusting laser realizes welding, car light welding is brilliant.
Further, as in preferred embodiment, the cross-sectional width of the inner chamber 11 of each fiber-optic output 3 correspondence is 3mm, and the width of hot spot laser finally being exported with this is also 3mm, consistent with the width of the welding region of device to be welded.
Shown in Figure 1.In addition, in a kind of preferred embodiment, also show semiconductor laser synchronous welder and include support 8, upper die clamper 1 is fixedly installed in the upper end of support 8, and lower mould clamping device 2 is installed on the lower end of support 8, and lower mould clamping device 2 is just to upper die clamper 1.Meanwhile, also comprise lowering or hoisting gear 9, lowering or hoisting gear 9 is connected with lower mould clamping device 2, drives lower mould clamping device 2 near connecting upper die clamper 1 with this by lowering or hoisting gear 9.
Concrete, as in preferred embodiment, support 8 comprises patrix jig plate 81, lower mould clamping device plate 82 and base plate 83, upper die clamper 1 is installed on the lower surface of patrix jig plate 81, lower mould clamping device 2 is installed on the upper surface of lower mould clamping device plate 82, and the lower surface of patrix jig plate 81 is run through lower mould clamping device plate 82 by some support bars 10 and is fixedly connected with the upper surface of base plate 83, simultaneously, lowering or hoisting gear 9 runs through base plate 83 and is connected with the lower surface of lower mould clamping device plate 82, lower mould clamping device plate 82 is driven along support bar 10 near patrix jig plate 81 with this lowering or hoisting gear 9, make lower mould clamping device 2 near connecting upper die clamper 1.
Further, as in preferred embodiment, lowering or hoisting gear 9 is jacking cylinder.
Next, the working method of a kind of preferred embodiment of lower semiconductor laser synchronization welder is described, for car light main casing 6 and car light upper cover 7:
Please continue see shown in Fig. 1 to Fig. 4.
Step one: car light main casing 6 is positioned in lower mould clamping device 2, it is made to fit in lower mould clamping device 2, and then transparent or translucent car light upper cover 7 is positioned on car light main casing 6, and make both laminatings by some locating pieces 5, ensure the fixing of car light main casing 6 and car light upper cover 7.
Step 2: lowering or hoisting gear 9 jacking lower mould clamping device plate 82 makes it along support bar 10 near patrix jig plate 81, lower mould clamping device 2, near connecting upper die clamper 1, makes some fiber-optic outputs 3 of die clamper 1 just to welding region, and makes it overlap completely.
Step 3: the laser that semiconductor laser transmitter sends conducts in the inner chamber 11 of upper die clamper 1 by some fiber-optic outputs 3, laser is formed by the uniform hot spot of continuous print compressed by the gold-plated reflective surface of inner chamber 11, through transparent or translucent car light upper cover 7, arrive the welding region of car light main casing 6, make its surface melting.Meanwhile, in the irradiation process that laser continues, upper die clamper 1 and lower mould clamping device 2 are by lowering or hoisting gear 9 continu to press, and make the thawing that car light upper cover 7 also occurs to a certain degree, two parts firmly combine the most at last.
Further, lower mould clamping device 2 can suppress to occur bubble in welding process to the pressure that upper die clamper 1 produces by lowering or hoisting gear 9 effectively, thus reach weld strength with weld that bar stitches attractive in appearance.
The foregoing is only the utility model preferred embodiment; not thereby embodiment of the present utility model and protection domain is limited; to those skilled in the art; should recognize and all should be included in the scheme that equivalent replacement done by all utilization the utility model descriptions and diagramatic content and apparent change obtain in protection domain of the present utility model.
Claims (10)
1. a semiconductor laser synchronous welder, comprising:
Upper die clamper (1);
Lower mould clamping device (2), described lower mould clamping device (2) can mate with described upper die clamper (1) and be connected; It is characterized in that,
Described lower mould clamping device (2) has the positioner for fixing device to be welded;
Described upper die clamper (1) has some fiber-optic outputs (3), and some described fiber-optic outputs (3) are just to the welding region of described device to be welded.
2. semiconductor laser synchronous welder according to claim 1, is characterized in that,
Some described fiber-optic outputs (3) are installed on the edge of described upper die clamper (1).
3. semiconductor laser synchronous welder according to claim 1, is characterized in that,
Described upper die clamper (1) encloses the inner chamber (11) of indent along its edge one, and some described fiber-optic outputs (3) are installed in described inner chamber (11).
4. semiconductor laser synchronous welder according to claim 3, is characterized in that,
The interior sidewall surface of described inner chamber (11) is reflecting surface.
5. semiconductor laser synchronous welder according to claim 4, is characterized in that,
Described reflecting surface is gold-plated.
6. semiconductor laser synchronous welder according to claim 1, is characterized in that,
Fiber-optic output described in each (3) connects an optical fiber (4), and optical fiber described in each (4) connects semiconductor laser transmitter.
7. semiconductor laser synchronous welder according to claim 1, is characterized in that,
Described positioner comprises some locating pieces (5), and some described locating pieces (5) are installed on the edge of described lower mould clamping device (2) respectively.
8. semiconductor laser synchronous welder according to claim 6, is characterized in that,
The optical maser wavelength of described semiconductor laser transmitter is 980nm.
9. semiconductor laser synchronous welder according to claim 3, is characterized in that,
The cross-sectional width of the described inner chamber (11) that fiber-optic output described in each (3) is corresponding is 3mm.
10. semiconductor laser synchronous welder according to claim 1, is characterized in that, also comprise:
Support (8);
Described upper die clamper (1) is fixedly installed in the upper end of described support (8);
Described lower mould clamping device (2) is installed on the lower end of described support (8), and described lower mould clamping device (2) is just to described upper die clamper (1);
Lowering or hoisting gear (9), described lowering or hoisting gear (9) is connected with described lower mould clamping device (2), drives described lower mould clamping device (2) near connecting described upper die clamper (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520753976.6U CN205185302U (en) | 2015-09-25 | 2015-09-25 | Synchronous welding set of semiconductor laser |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520753976.6U CN205185302U (en) | 2015-09-25 | 2015-09-25 | Synchronous welding set of semiconductor laser |
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| Publication Number | Publication Date |
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| CN205185302U true CN205185302U (en) | 2016-04-27 |
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| CN201520753976.6U Active CN205185302U (en) | 2015-09-25 | 2015-09-25 | Synchronous welding set of semiconductor laser |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105109035A (en) * | 2015-09-25 | 2015-12-02 | 上海信耀电子有限公司 | Semiconductor laser synchronous welding set and operating mode thereof |
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- 2015-09-25 CN CN201520753976.6U patent/CN205185302U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105109035A (en) * | 2015-09-25 | 2015-12-02 | 上海信耀电子有限公司 | Semiconductor laser synchronous welding set and operating mode thereof |
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| GR01 | Patent grant |