[go: up one dir, main page]

CN205179362U - Single directional MEMS microphone - Google Patents

Single directional MEMS microphone Download PDF

Info

Publication number
CN205179362U
CN205179362U CN201521015071.5U CN201521015071U CN205179362U CN 205179362 U CN205179362 U CN 205179362U CN 201521015071 U CN201521015071 U CN 201521015071U CN 205179362 U CN205179362 U CN 205179362U
Authority
CN
China
Prior art keywords
sound
mems microphone
housing
sound channel
acoustic aperture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201521015071.5U
Other languages
Chinese (zh)
Inventor
安春璐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goertek Microelectronics Inc
Original Assignee
Goertek Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goertek Inc filed Critical Goertek Inc
Priority to CN201521015071.5U priority Critical patent/CN205179362U/en
Application granted granted Critical
Publication of CN205179362U publication Critical patent/CN205179362U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

本实用新型涉及一种单指向MEMS麦克风。该单指向MEMS麦克风包括:PCB板,所述PCB板上设置有第一声孔和第二声孔;壳体,所述壳体设置在所述PCB板上,所述壳体与PCB板形成容纳腔,所述第一声孔将所述容纳腔与外界连通,所述第二声孔位于所述容纳腔外,所述壳体上设置有第三声孔;声道,所述声道设置在所述容纳腔之外,所述声道将所述第二声孔与第三声孔连通;设置在所述容纳腔中的MEMS芯片和AISC芯片。本实用新型的一个目的是提供一种具有单指向性的MEMS麦克风。

The utility model relates to a unidirectional MEMS microphone. The unidirectional MEMS microphone comprises: a PCB board, on which a first sound hole and a second sound hole are arranged on the PCB; a housing, on which the housing is arranged on the PCB, and the housing is formed with the PCB board accommodating chamber, the first sound hole communicates the accommodating chamber with the outside world, the second sound hole is located outside the accommodating chamber, and a third sound hole is provided on the housing; sound channel, the sound channel It is arranged outside the accommodating chamber, and the sound channel connects the second sound hole with the third sound hole; the MEMS chip and the AISC chip arranged in the accommodating chamber. One purpose of the utility model is to provide a MEMS microphone with unidirectionality.

Description

单指向MEMS麦克风Unidirectional MEMS Microphone

技术领域technical field

本实用新型属于声电换能技术领域,具体地,本实用新型涉及一种单指向MEMS麦克风。The utility model belongs to the technical field of acoustic-electric energy conversion, in particular, the utility model relates to a unidirectional MEMS microphone.

背景技术Background technique

消费类电子产品已成为现代生活不可缺少的设备,人们对消费类电子产品的使用越来越频繁。其中,麦克风用以将声音转换成电信号,是手机等电子产品的重要器件。现阶段,在一些电子产品中主要采用MEMS(微型机电系统)麦克风作为声电换能器件。Consumer electronics have become an indispensable device in modern life, and people use consumer electronics more and more frequently. Among them, the microphone is used to convert sound into electrical signals, and is an important component of electronic products such as mobile phones. At this stage, MEMS (micro electromechanical system) microphones are mainly used as acoustic-electric transducers in some electronic products.

MEMS麦克风通常包括MEMS芯片和ASIC芯片,声波从外壳或PCB板上的声孔传入MEMS芯片中,MEMS芯片的振膜在声波的作用下产生振动,从而将声音转换呈电信号。ASIC芯片起到放大信号的作用,将MEMS芯片生成的电信号进行放大,便于实现传输。A MEMS microphone usually includes a MEMS chip and an ASIC chip. Sound waves are transmitted into the MEMS chip from the sound hole on the housing or the PCB board. The diaphragm of the MEMS chip vibrates under the action of the sound waves, thereby converting the sound into an electrical signal. The ASIC chip plays the role of amplifying the signal, amplifying the electrical signal generated by the MEMS chip to facilitate transmission.

由于手机等电子产品被使用的频率越来越高,周围的环境越来越复杂,相应的体现出了传统MEMS麦克风的性能缺陷。例如,当用户在嘈杂的环境中使用手机通话时,MEMS麦克风会接收到所有声音,并转换成电信号。这就造成通话的对方会听到大量噪音,无法准确辨识用户的言语。As electronic products such as mobile phones are used more and more frequently, and the surrounding environment is becoming more and more complex, correspondingly, the performance defects of traditional MEMS microphones are reflected. For example, when a user is talking on a mobile phone in a noisy environment, the MEMS microphone will pick up all the sound and convert it into an electrical signal. As a result, the other party on the call will hear a lot of noise and cannot accurately identify the user's speech.

所以,有必要对MEMS麦克风进行改进,使其能够滤除噪音或不接收其它方向的声音,从而改善用户的使用体验。Therefore, it is necessary to improve the MEMS microphone so that it can filter out noise or not receive sounds from other directions, thereby improving user experience.

实用新型内容Utility model content

本实用新型的一个目的是提供一种具有单指向性的MEMS麦克风。An object of the present utility model is to provide a MEMS microphone with unidirectionality.

根据本实用新型的一个方面,提供了一种单指向MEMS麦克风,包括:According to one aspect of the present utility model, a kind of unidirectional MEMS microphone is provided, comprising:

PCB板,所述PCB板上设置有第一声孔和第二声孔;A PCB board, the PCB board is provided with a first sound hole and a second sound hole;

壳体,所述壳体设置在所述PCB板上,所述壳体与PCB板形成容纳腔,所述第一声孔将所述容纳腔与外界连通,所述第二声孔位于所述容纳腔外,所述壳体上设置有第三声孔;A casing, the casing is arranged on the PCB board, the casing and the PCB board form an accommodating chamber, the first sound hole communicates the accommodating chamber with the outside world, and the second sound hole is located on the Outside the accommodation cavity, a third acoustic hole is arranged on the housing;

声道,所述声道设置在所述容纳腔之外,所述声道将所述第二声孔与第三声孔连通;a sound channel, the sound channel is arranged outside the accommodating cavity, and the sound channel connects the second sound hole with the third sound hole;

设置在所述容纳腔中的MEMS芯片AISC芯片。A MEMS chip AISC chip arranged in the cavity.

可选地,所述单指向MEMS麦克风包括壳套,所述壳套罩在所述第二声孔和第三声孔上,所述壳套与所述壳体的外表面以及PCB板组合包围形成所述声道。Optionally, the unidirectional MEMS microphone includes a shell, the shell is covered on the second sound hole and the third sound hole, and the shell is combined with the outer surface of the housing and the PCB board to surround Form the vocal tract.

可选地,所述单指向MEMS麦克风包括壳套,所述声道形成在所述壳套中,所述声道的两端分别与所述第二声孔和第三声孔对接。Optionally, the unidirectional MEMS microphone includes a casing, the sound channel is formed in the casing, and two ends of the sound channel are connected to the second sound hole and the third sound hole respectively.

可选地,所述声道与所述壳体为一体结构,所述壳体设置在所述PCB板上时,所述声道与所述第二声孔对接。Optionally, the sound channel is integrated with the housing, and when the housing is arranged on the PCB, the sound channel is connected to the second sound hole.

优选地,所述第二声孔上设置有第二阻尼结构。可选地,所述第一声孔外侧可以设置有防尘网。Preferably, the second sound hole is provided with a second damping structure. Optionally, a dustproof net may be provided outside the first sound hole.

特别地,所述第一声孔外侧设置有第一阻尼结构,所述第一阻尼结构的透气量大于所述第二阻尼结构的透气量。In particular, a first damping structure is provided outside the first sound hole, and the air permeability of the first damping structure is greater than that of the second damping structure.

可选地,所述第三声孔设置在所述壳体的顶部或侧壁上,所述声道从所述壳体的顶面或侧壁延伸到所述PCB板上。Optionally, the third sound hole is disposed on the top or side wall of the casing, and the sound channel extends from the top surface or the side wall of the casing to the PCB.

优选地,所述声道呈“L”型。Preferably, the sound channel is "L" shaped.

优选地,所述壳套为胶套。Preferably, the casing is a rubber casing.

本实用新型的一个技术效果在于,所述单指向MEMS麦克风可以减小从第二声孔传入的声音的声压,加大了声音经第一、第二声孔到达MEMS芯片振膜的声程差,从而使MEMS麦克风具有单指向性。A technical effect of the utility model is that the unidirectional MEMS microphone can reduce the sound pressure of the incoming sound from the second sound hole, and increase the sound pressure of the sound reaching the diaphragm of the MEMS chip through the first and second sound holes. The distance difference makes the MEMS microphone unidirectional.

通过以下参照附图对本实用新型的示例性实施例的详细描述,本实用新型的其它特征及其优点将会变得清楚。Other features and advantages of the present invention will become clear through the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings.

附图说明Description of drawings

构成说明书的一部分的附图描述了本实用新型的实施例,并且连同说明书一起用于解释本实用新型的原理。The accompanying drawings, which constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.

图1是本实用新型具体实施例提供的单指向MEMS麦克风的侧面剖面图。Fig. 1 is a side sectional view of a unidirectional MEMS microphone provided by a specific embodiment of the present invention.

具体实施方式detailed description

现在将参照附图来详细描述本实用新型的各种示例性实施例。应注意到:除非另外具体说明,否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本实用新型的范围。Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

以下对至少一个示例性实施例的描述实际上仅仅是说明性的,决不作为对本实用新型及其应用或使用的任何限制。The following description of at least one exemplary embodiment is merely illustrative in nature, and in no way serves as any limitation of the invention and its application or use.

对于相关领域普通技术人员已知的技术和设备可能不作详细讨论,但在适当情况下,所述技术和设备应当被视为说明书的一部分。Techniques and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques and devices should be considered part of the description.

在这里示出和讨论的所有例子中,任何具体值应被解释为仅仅是示例性的,而不是作为限制。因此,示例性实施例的其它例子可以具有不同的值。In all examples shown and discussed herein, any specific values should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have different values.

应注意到:相似的标号和字母在下面的附图中表示类似项,因此,一旦某一项在一个附图中被定义,则在随后的附图中不需要对其进行进一步讨论。It should be noted that like numerals and letters denote like items in the following figures, therefore, once an item is defined in one figure, it does not require further discussion in subsequent figures.

本实用新型提供了一种单指向MEMS麦克风,其中包括PCB板、壳体、声道以及MEMS芯片和ASIC芯片。如图1所示,所述PCB板1为MEMS麦克风的基板,其上设置有第一声孔11和第二声孔12。所述壳体2设置在所述PCB板1上,壳体2与PCB板1形成基本封闭的容纳腔3。所述第一声孔11将所述容纳腔3与外界连通,所以所述第二声孔12位于所述容纳腔3之外。特别地,所述壳体2上还设置有第三声孔21,所述声道4是位于所述容纳腔3之外的通道结构,所述声道4将所述第三声孔21与所述第二声孔12连通。所述容纳腔3经过所述第三声孔21和声道4,从所述第二声孔12与外界连通。所述MEMS芯片5设置在所述容纳腔3中,通常的,所述MEMS芯片5设置在所述PCB板1上正对所述第一声孔11的位置。如图1所示,所述单指向MEMS麦克风中还包括ASIC芯片6,所述ASIC芯片6设置在所述PCB板1上,主要用于对MEMS芯片生成的电信号进行放大。这样,本实用新型提供的单指向MEMS麦克风中具有两个声孔,所述第一声孔11正对所述MEMS芯片5,第一声孔11为主声孔,所述容纳腔3经过所述声道4从所述第二声孔12与外界连通,第二声孔12作为次声孔。The utility model provides a unidirectional MEMS microphone, which comprises a PCB board, a casing, a sound channel, a MEMS chip and an ASIC chip. As shown in FIG. 1 , the PCB board 1 is a substrate of a MEMS microphone, on which a first sound hole 11 and a second sound hole 12 are arranged. The housing 2 is disposed on the PCB 1 , and the housing 2 and the PCB 1 form a substantially closed receiving cavity 3 . The first sound hole 11 communicates the accommodating cavity 3 with the outside world, so the second sound hole 12 is located outside the accommodating cavity 3 . In particular, the housing 2 is also provided with a third sound hole 21, and the sound channel 4 is a channel structure located outside the accommodating cavity 3, and the sound channel 4 connects the third sound hole 21 with the The second sound hole 12 is connected. The accommodating cavity 3 passes through the third sound hole 21 and the sound channel 4 , and communicates with the outside from the second sound hole 12 . The MEMS chip 5 is arranged in the accommodating cavity 3 , and generally, the MEMS chip 5 is arranged on the PCB board 1 opposite to the first acoustic hole 11 . As shown in FIG. 1 , the unidirectional MEMS microphone further includes an ASIC chip 6 . The ASIC chip 6 is arranged on the PCB 1 and is mainly used to amplify the electrical signal generated by the MEMS chip. In this way, there are two sound holes in the unidirectional MEMS microphone provided by the utility model, the first sound hole 11 is facing the MEMS chip 5, the first sound hole 11 is the main sound hole, and the accommodating cavity 3 passes through the The sound channel 4 communicates with the outside world through the second sound hole 12, and the second sound hole 12 is used as an infrasound hole.

本实用新型的MEMS麦克风在工作时,部分外界的声音从作为主声孔的第一声孔11传到所述MEMS芯片5的一侧,从一侧对MEMS芯片5的振膜产生作用。其它声音从作为次声孔的第二声孔12进入所述声道4,并经过声道4和第三声孔21传到所述容纳腔3中,进而从MEMS芯片5的另一侧对MEMS芯片5的振膜产生作用。也就是说,外界的声音通过主声孔、次声孔分别作用于MEMS芯片5中振膜的两侧。所述声道4可以减小从次声孔传入容纳腔3的声音的声压,在物理结构上加大了声音经主、次声孔到达MEMS芯片5振膜的声程差。MEMS芯片在声道4的作用下对从主声孔和次声孔传入的声音的响应灵敏度产生差异,从而实现了MEMS麦克风的单指向性。When the MEMS microphone of the utility model is working, part of the external sound is transmitted from the first sound hole 11 as the main sound hole to one side of the MEMS chip 5, and acts on the diaphragm of the MEMS chip 5 from one side. Other sounds enter the sound channel 4 from the second sound hole 12 as a subsound hole, and pass through the sound channel 4 and the third sound hole 21 into the accommodating cavity 3, and then from the other side of the MEMS chip 5 to the sound channel 4. The diaphragm of the MEMS chip 5 works. That is to say, external sound acts on both sides of the diaphragm in the MEMS chip 5 through the main sound hole and the subsound hole respectively. The sound channel 4 can reduce the sound pressure of the sound transmitted from the infrasound hole to the accommodation cavity 3, and increase the sound path difference between the sound passing through the main and infrasound holes to the diaphragm of the MEMS chip 5 in terms of physical structure. Under the action of channel 4, the MEMS chip has a difference in response sensitivity to the sound incoming from the main sound hole and the subsound hole, thereby realizing the unidirectionality of the MEMS microphone.

优选地,如图1所示,所述第二声孔12上可以设置有第二阻尼结构121,第二阻尼结构121能够降低第二声孔12的通气量,从而有效降低从第二声孔12(次声孔)传入容纳腔3的声音的声压。所述第二阻尼结构121与所述声道4共同作用可以进一步增大传到MEMS芯片5两侧的声音的声程差。当声音从不同声孔传入MEMS芯片5时,MEMS芯片5的振膜的灵敏度会产生明显的差异。如果将主声孔和次声孔引向不同的声源方向,就会使MEMS麦克风对不同方向的声音产生明显的单指向性,对来自主声孔方向的声音具有良好的响应灵敏度,而对于来自次声孔方向的声音具有较低的响应灵敏度。本领域技术人员可以根据实际的性能要求调整所述第二阻尼结构的透气量,以达到理想的单指向性效果。Preferably, as shown in FIG. 1, a second damping structure 121 may be provided on the second sound hole 12, and the second damping structure 121 can reduce the ventilation volume of the second sound hole 12, thereby effectively reducing the 12 (infrasound hole) The sound pressure of the sound introduced into the accommodation cavity 3 . The second damping structure 121 cooperates with the sound channel 4 to further increase the sound path difference of the sound transmitted to both sides of the MEMS chip 5 . When sound is transmitted into the MEMS chip 5 from different sound holes, the sensitivity of the diaphragm of the MEMS chip 5 will produce obvious differences. If the main sound hole and the sub-sound hole are directed to different sound source directions, the MEMS microphone will have obvious unidirectionality to the sound in different directions, and have good response sensitivity to the sound from the main sound hole direction, while for Sound from the direction of the subsonic hole has a lower response sensitivity. Those skilled in the art can adjust the air permeability of the second damping structure according to actual performance requirements, so as to achieve the ideal unidirectional effect.

本实用新型并不对所述声道的形成方式进行限制,本领域技术人员可以根据成型工艺、性能要求等因素选择形成所述声道的方法。在本实用新型的一种实施方式中,如图1所示,所述单指向MEMS麦克风可以包括壳套7,所述壳套7罩在所述第二声孔12和第三声孔21上,壳套7与所述壳体2的外表面以及PCB板1组合包围形成所述声道4。所述壳套7中应具有部分凹陷空间用以形成所述声道4。当所述第三声孔21位于所述壳体2的顶部时,如图1所示,所述壳套7可以罩在所述壳体2上。在这种实施例中,所述声道的成型工艺相对简单,便于装配。在本实用新型的另一种实施方式中,所述单指向MEMS麦克风也包括壳套7,所述壳套7中可以直接形成有作为声道4的通道结构,当所述壳套7设置在所述PCB板1和壳体2上时,通道结构的两端分别与所述第二声孔12和第三声孔21对接。在该实施例中,由于所述声道完全形成在所述壳套中,所以成型工艺相对复杂,但是声道的形状、尺寸不受所述壳体外形的限制,本领域技术人员可以将声道设计成更优的结构。优选地,所述壳套7可以是胶套,胶套结构易于成型,能够形成理想的声道结构。或者,所述壳套7也可以是塑料壳或金属壳,本实用新型不对此进行限制。在本实用新型的第三种实施方式中,所述声道4还可以直接形成在所述壳体2上,也即所述声道4与所述壳体2为一体结构。例如,在所述容纳腔3外,所述壳体2还包括与所述第三声孔21连通的通道结构,该通道结构作为声道4,当所述壳体2设置在所述PCB板1上时,通道结构与PCB板1上的第二声孔12对接。在这种实施例中,单指向MEMS麦克风的零件较少,装配容易,但是成型工艺相对复杂。The present invention does not limit the way of forming the sound channel, and those skilled in the art can choose the method of forming the sound channel according to factors such as molding process and performance requirements. In one embodiment of the present utility model, as shown in FIG. 1 , the unidirectional MEMS microphone may include a shell 7, and the shell 7 covers the second sound hole 12 and the third sound hole 21 , the shell 7 is combined with the outer surface of the housing 2 and the PCB 1 to form the sound channel 4 . The casing 7 should have a partially recessed space for forming the sound channel 4 . When the third sound hole 21 is located at the top of the housing 2 , as shown in FIG. 1 , the casing 7 can cover the housing 2 . In this embodiment, the molding process of the sound channel is relatively simple, which facilitates assembly. In another embodiment of the present utility model, the unidirectional MEMS microphone also includes a shell 7, and the channel structure as the sound channel 4 can be directly formed in the shell 7, when the shell 7 is arranged on When the PCB board 1 and the housing 2 are on, the two ends of the channel structure are connected to the second sound hole 12 and the third sound hole 21 respectively. In this embodiment, since the sound channel is completely formed in the shell, the molding process is relatively complicated, but the shape and size of the sound channel are not limited by the shape of the shell, and those skilled in the art can make the sound channel The road is designed into a better structure. Preferably, the shell 7 may be a rubber sleeve, and the structure of the rubber sleeve is easy to form and can form an ideal sound channel structure. Alternatively, the shell 7 may also be a plastic shell or a metal shell, which is not limited by the present invention. In the third embodiment of the present utility model, the sound channel 4 can also be directly formed on the housing 2 , that is, the sound channel 4 and the housing 2 are integrally structured. For example, outside the accommodating cavity 3, the housing 2 also includes a channel structure communicating with the third sound hole 21, and the channel structure serves as the sound channel 4. When the housing 2 is arranged on the PCB board 1, the channel structure is docked with the second sound hole 12 on the PCB 1. In this embodiment, the unidirectional MEMS microphone has fewer parts and is easy to assemble, but the molding process is relatively complicated.

另一方面,本实用新型并对所述第三声孔设置在所述壳体上的位置进行限制,本领域技术人员可以根据对单指向MEMS麦克风的性能要求对所述第三声孔21的位置进行设计。例如,在一种实施方式中,如图1所示,所述第三声孔21可以设置在所述壳体2的顶部上,这样,所述声道4应从所述壳体2的顶面一直延伸到所述PCB板1的表面。当所述单指向MEMS麦克风包括壳套7时,所述壳套7可以罩在所述壳体2的顶部,或将整个壳体2罩住。在该实施例中,所述声道4的长度普遍较长且至少具有弯折部分。在另一种实施方式中,所述第三声孔21可以设置在所述壳体2的侧壁上,所述声道4则从所述壳体2的侧壁延伸到所述PCB板1的表面上。当所述单指向MEMS麦克风包括壳套7时,所述壳套7可以只覆盖在所述壳体2的侧壁上。在该实施例中,所述声道的长度普遍较短。On the other hand, the present invention does not limit the position of the third sound hole on the housing, and those skilled in the art can adjust the position of the third sound hole 21 according to the performance requirements of the unidirectional MEMS microphone. location design. For example, in one embodiment, as shown in FIG. 1 , the third sound hole 21 can be arranged on the top of the housing 2, so that the sound channel 4 should pass from the top surface of the housing 2 extending all the way to the surface of the PCB board 1 . When the unidirectional MEMS microphone includes a shell 7 , the shell 7 can cover the top of the housing 2 , or cover the entire housing 2 . In this embodiment, the sound channel 4 is generally long and has at least a bent portion. In another embodiment, the third sound hole 21 can be arranged on the side wall of the housing 2, and the sound channel 4 extends from the side wall of the housing 2 to the PCB board 1 on the surface. When the unidirectional MEMS microphone includes a shell 7 , the shell 7 may only cover the side wall of the housing 2 . In this embodiment, the length of the vocal tract is generally short.

进一步地,在本实用新型的实施例中,所述声道4的结构形状也可以根据单指向MEMS麦克风的性能要求进行调整。例如,在如图1所示的实施方式中,所述声道4从所述壳体2的顶部延伸到所述PCB板1的表面,整体呈“L”型结构。在其它实施方式中,本领域技术人员可以通过调整所述声道的形状实现对声道长短的调整,并且,所述声道的宽窄、直径也对麦克风的指向性性能具有直接的影响,本领域技术人员也可以根据实际情况设计。Further, in the embodiment of the present utility model, the structural shape of the sound channel 4 can also be adjusted according to the performance requirements of the unidirectional MEMS microphone. For example, in the embodiment shown in FIG. 1 , the sound channel 4 extends from the top of the housing 2 to the surface of the PCB 1 , and is in an "L" shape as a whole. In other embodiments, those skilled in the art can adjust the length of the sound channel by adjusting the shape of the sound channel, and the width and diameter of the sound channel also have a direct impact on the directivity performance of the microphone. Those skilled in the art can also design according to actual conditions.

另外,由于所述容纳腔3直接通过所述第一声孔11与外界连接,所以外部的灰尘有可能从所述第一声孔11进入所述容纳腔3和MEMS芯片5。灰尘、颗粒等异物的进入会对MEMS芯片5的性能造成严重影响,所以,在所述第一声孔11外侧可以设置有防尘网111,以免灰尘从所述第一声孔11进入。或者,在一些特殊的性能要求或使用环境限制的情况下,所述第一声孔11外侧可以设置有第一阻尼结构,所述第一阻尼结构用于降低从第一声孔11进入容纳腔3和MEMS芯片5的声音的声压。特别地,所述第一阻尼结构的透气量通常应大于所述第二阻尼结构的透气量,使MEMS芯片对从第一声孔传入的声音具有更灵敏的响应。In addition, since the accommodation cavity 3 is directly connected to the outside through the first acoustic hole 11 , external dust may enter the accommodation cavity 3 and the MEMS chip 5 through the first acoustic hole 11 . The entry of foreign matter such as dust and particles will seriously affect the performance of the MEMS chip 5 , so a dust-proof net 111 can be provided outside the first sound hole 11 to prevent dust from entering through the first sound hole 11 . Alternatively, in the case of some special performance requirements or restrictions in the use environment, a first damping structure may be provided outside the first sound hole 11, and the first damping structure is used to reduce the 3 and the sound pressure of the sound of the MEMS chip 5 . In particular, the air flow rate of the first damping structure should generally be greater than the air flow rate of the second damping structure, so that the MEMS chip has a more sensitive response to the sound introduced from the first sound hole.

虽然已经通过示例对本实用新型的一些特定实施例进行了详细说明,但是本领域的技术人员应该理解,以上示例仅是为了进行说明,而不是为了限制本实用新型的范围。本领域的技术人员应该理解,可在不脱离本实用新型的范围和精神的情况下,对以上实施例进行修改。本实用新型的范围由所附权利要求来限定。Although some specific embodiments of the present utility model have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration, rather than limiting the scope of the present utility model. It should be understood by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the present invention. The scope of the invention is defined by the appended claims.

Claims (10)

1. list points to a MEMS microphone, it is characterized in that, comprising:
Pcb board (1), described pcb board (1) is provided with the first acoustic aperture (11) and the second acoustic aperture (12);
Housing (2), described housing (2) is arranged on described pcb board (1), described housing (2) and pcb board (1) form container cavity (3), described container cavity (3) is in communication with the outside by described first acoustic aperture (11), described second acoustic aperture (12) is positioned at described container cavity (3) outward, described housing (2) is provided with the 3rd acoustic aperture (21);
Sound channel (4), described sound channel (4) is arranged on outside described container cavity (3), and described second acoustic aperture (12) is communicated with the 3rd acoustic aperture (21) by described sound channel (4);
Be arranged on the MEMS chip (5) in described container cavity (3) and AISC chip (6).
2. list according to claim 1 points to MEMS microphone, it is characterized in that, described single MEMS microphone of pointing to comprises valve jacket (7), described valve jacket (7) covers in described second acoustic aperture (12) and the 3rd acoustic aperture (21), and the outer surface of described valve jacket (7) and described housing (2) and pcb board (1) combine to surround and form described sound channel (4).
3. list according to claim 1 points to MEMS microphone, it is characterized in that, described single MEMS microphone of pointing to comprises valve jacket (7), described sound channel (4) is formed in described valve jacket (7), and the two ends of described sound channel (4) are docked with described second acoustic aperture (12) and the 3rd acoustic aperture (21) respectively.
4. list according to claim 1 points to MEMS microphone, it is characterized in that, described sound channel (4) and described housing (2) are structure as a whole, when described housing (2) is arranged on described pcb board (1), described sound channel (4) is docked with described second acoustic aperture (12).
5. list according to claim 1 points to MEMS microphone, it is characterized in that, described second acoustic aperture (12) is provided with the second damping structure (121).
6. point to MEMS microphone according to one of any described list of claim 1-5, it is characterized in that, described first acoustic aperture (11) arranged outside has Air Filter (111).
7. list according to claim 5 points to MEMS microphone, it is characterized in that, described first acoustic aperture (11) arranged outside has the first damping structure, and the Air permenbility of described first damping structure is greater than the Air permenbility of described second damping structure (121).
8. list according to claim 1 points to MEMS microphone, it is characterized in that, on the top that described 3rd acoustic aperture (21) is arranged on described housing (2) or sidewall, described sound channel (4) extends to described pcb board (1) from the end face of described housing (2) or sidewall.
9. list according to claim 1 points to MEMS microphone, it is characterized in that, described sound channel (4) is in " L " type.
10. the list according to Claims 2 or 3 points to MEMS microphone, and it is characterized in that, described valve jacket (7) is gum cover.
CN201521015071.5U 2015-12-08 2015-12-08 Single directional MEMS microphone Active CN205179362U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201521015071.5U CN205179362U (en) 2015-12-08 2015-12-08 Single directional MEMS microphone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201521015071.5U CN205179362U (en) 2015-12-08 2015-12-08 Single directional MEMS microphone

Publications (1)

Publication Number Publication Date
CN205179362U true CN205179362U (en) 2016-04-20

Family

ID=55743287

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201521015071.5U Active CN205179362U (en) 2015-12-08 2015-12-08 Single directional MEMS microphone

Country Status (1)

Country Link
CN (1) CN205179362U (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108513241A (en) * 2018-06-29 2018-09-07 歌尔股份有限公司 Vibrating sensor and audio frequency apparatus
CN109511066A (en) * 2017-09-15 2019-03-22 意法半导体股份有限公司 For manufacturing the method for thin filter membrane and including the Acoustic energy converting device of filter membrane
CN109600692A (en) * 2017-09-30 2019-04-09 山东共达电声股份有限公司 A kind of noise-eliminating earphone
CN110475193A (en) * 2019-09-05 2019-11-19 朝阳聚声泰(信丰)科技有限公司 It is a kind of to be singly directed toward MEMS microphone and its production method
JP2021512537A (en) * 2018-01-24 2021-05-13 シュアー アクイジッション ホールディングス インコーポレイテッドShure Acquisition Holdings,Inc. Directional MEMS microphone with correction circuit
CN112887884A (en) * 2021-03-24 2021-06-01 苏州敏芯微电子技术股份有限公司 Vibration sensor packaging structure
WO2021135112A1 (en) * 2019-12-31 2021-07-08 潍坊歌尔微电子有限公司 Mems device
CN113949978A (en) * 2020-07-17 2022-01-18 通用微(深圳)科技有限公司 Sound collection device, sound processing device and method, device and storage medium
CN112887884B (en) * 2021-03-24 2025-04-15 苏州敏芯微电子技术股份有限公司 Vibration sensor packaging structure

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109511066A (en) * 2017-09-15 2019-03-22 意法半导体股份有限公司 For manufacturing the method for thin filter membrane and including the Acoustic energy converting device of filter membrane
CN109511066B (en) * 2017-09-15 2021-11-05 意法半导体股份有限公司 Method for manufacturing a thin filter membrane and acoustic transducer device comprising a filter membrane
US11317219B2 (en) 2017-09-15 2022-04-26 Stmicroelectronics S.R.L. Method for manufacturing a thin filtering membrane and an acoustic transducer device including the filtering membrane
CN109600692A (en) * 2017-09-30 2019-04-09 山东共达电声股份有限公司 A kind of noise-eliminating earphone
JP7200256B2 (en) 2018-01-24 2023-01-06 シュアー アクイジッション ホールディングス インコーポレイテッド Directional MEMS microphone with correction circuit
JP2021512537A (en) * 2018-01-24 2021-05-13 シュアー アクイジッション ホールディングス インコーポレイテッドShure Acquisition Holdings,Inc. Directional MEMS microphone with correction circuit
WO2020000594A1 (en) * 2018-06-29 2020-01-02 歌尔股份有限公司 Vibration sensor and audio device
CN108513241B (en) * 2018-06-29 2024-04-19 潍坊歌尔微电子有限公司 Vibration sensor and audio device
CN108513241A (en) * 2018-06-29 2018-09-07 歌尔股份有限公司 Vibrating sensor and audio frequency apparatus
CN110475193A (en) * 2019-09-05 2019-11-19 朝阳聚声泰(信丰)科技有限公司 It is a kind of to be singly directed toward MEMS microphone and its production method
WO2021135112A1 (en) * 2019-12-31 2021-07-08 潍坊歌尔微电子有限公司 Mems device
CN113949978A (en) * 2020-07-17 2022-01-18 通用微(深圳)科技有限公司 Sound collection device, sound processing device and method, device and storage medium
CN112887884A (en) * 2021-03-24 2021-06-01 苏州敏芯微电子技术股份有限公司 Vibration sensor packaging structure
CN112887884B (en) * 2021-03-24 2025-04-15 苏州敏芯微电子技术股份有限公司 Vibration sensor packaging structure

Similar Documents

Publication Publication Date Title
CN205179362U (en) Single directional MEMS microphone
US8983096B2 (en) Bone-conduction pickup transducer for microphonic applications
CN109413554B (en) Directional MEMS microphone
CN111866633B (en) Gradient MEMS microphone with assemblies of different heights
US8457342B2 (en) Differential microphone
CN205378215U (en) Directional MEMS microphone
US8649545B2 (en) Microphone unit
WO2017041514A1 (en) Loudspeaker module and terminal device
CN204968106U (en) Directional MEMS microphone
JP2014155144A (en) Audio input unit and noise suppression method
CN204968105U (en) Directional MEMS microphone
JP2014160948A (en) Earphone microphone
CN103401966A (en) Earphone interface compatible with microphone function
CN107820147A (en) The control method of microphone apparatus and microphone apparatus
KR20110030418A (en) Microphone unit, near-field interactive voice input device, information processing system, and method of manufacturing microphone unit
KR20200040958A (en) Directional MEMS microphone and MEMS microphone module comprising it
CN202799144U (en) Micro-electromechanical systems (MEMS) microphone
CN110958509A (en) Sound generating device module and electronic product
CN207995325U (en) Ear canal earphone microphone with micro-electromechanical microphone
CN203368544U (en) Headset interface compatible with microphone function
CN207124756U (en) Side is spoken sound-producing device module
CN102131140A (en) Micro-electro-mechanical systems (MEMS) microphone
WO2021098014A1 (en) Active noise reduction acoustic unit and sound-generating body
CN204291391U (en) A kind of directive property MEMS microphone
CN204291393U (en) A kind of directive property MEMS microphone

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268

Patentee after: Goertek Inc.

Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268

Patentee before: Goertek Inc.

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20200617

Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province

Patentee after: Goer Microelectronics Co.,Ltd.

Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268

Patentee before: GOERTEK Inc.

CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: F / F, phase II, Qingdao International Innovation Park, 1 Keyuan Weiyi Road, Laoshan District, Qingdao City, Shandong Province, 266104

Patentee after: Geer Microelectronics Co.,Ltd.

Country or region after: China

Address before: Room 103, 396 Songling Road, Laoshan District, Qingdao City, Shandong Province 266104

Patentee before: Goer Microelectronics Co.,Ltd.

Country or region before: China