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CN205026425U - LED bulb lamp - Google Patents

LED bulb lamp Download PDF

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Publication number
CN205026425U
CN205026425U CN201520814641.0U CN201520814641U CN205026425U CN 205026425 U CN205026425 U CN 205026425U CN 201520814641 U CN201520814641 U CN 201520814641U CN 205026425 U CN205026425 U CN 205026425U
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opening
bulb lamp
led bulb
led
heat sink
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江逊旌
杨翔云
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Polytronics Technology Corp
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Polytronics Technology Corp
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Abstract

一种LED球泡灯包含灯罩、电源连接座、LED发光模块、散热座以及电源转换模块。散热座的上方连接该灯罩下缘,且上方中央设有LED载台,用以承载LED发光模块,下方则连接该电源连接座。散热座具有一环状侧壁,该环状侧壁内部形成可容纳电源转换模块的内部空间。该环状侧壁中包含多个穿孔,各该穿孔的第一开口连通至灯罩所形成的内部空间,而第二开口连通至LED球泡灯的外部。本实用新型利用散热座中具对流功能的穿孔,可将灯罩内部空间的热逸散至LED球泡灯外部。也可搭配高分子导热片固定LED发光模块,增加热传导。本实用新型利用热对流及热传导的双重作用,提升LED发光模块的发光效率及延长其使用寿命。

An LED bulb lamp includes a lampshade, a power connection base, an LED light-emitting module, a heat sink and a power conversion module. The top of the heat dissipation base is connected to the lower edge of the lampshade, and an LED carrier is provided in the center of the top to carry the LED light-emitting module, and the bottom is connected to the power connection base. The heat dissipation base has an annular side wall, and an internal space that can accommodate the power conversion module is formed inside the annular side wall. The annular side wall includes a plurality of perforations, the first opening of each perforation is connected to the internal space formed by the lampshade, and the second opening is connected to the outside of the LED bulb. This utility model utilizes the perforations with convection function in the heat sink to dissipate the heat in the inner space of the lampshade to the outside of the LED bulb. It can also be used with polymer thermal conductive sheets to fix the LED light-emitting module to increase heat conduction. The utility model utilizes the dual functions of heat convection and heat conduction to improve the luminous efficiency of the LED light-emitting module and extend its service life.

Description

LED球泡灯LED Bulb

技术领域technical field

本实用新型涉及一种灯泡结构,特别涉及一种发光二极管(LED)球泡灯。The utility model relates to a bulb structure, in particular to a light emitting diode (LED) bulb lamp.

背景技术Background technique

一般常用的LED灯泡主要将多个LED芯片设在铝材质的电路板上,再将该电路板结合在一通常为铝材质的导热板上。之后将该导热板组装在铝材质的一散热座的一端,该导热板相反于该散热座的一侧结合一灯罩,借此将该电路板及所述多个LED芯片罩设其中。散热座的另一端结合有一电源连接座,可供其安装在一灯泡电源座上,而且于散热座中设有一电源驱动电路模块供与该电源连接座及该电路板电性连接。如此,LED芯片发光时所产生高热便可经由铝材质的电路板传导至铝材质的导热板,再通过铝材质的导热板传导至铝材质的散热座。通常散热座侧壁可设置多个散热鳍片,其间的散热槽可将热量散布到周围的空气中以达到降温效果。Commonly used LED light bulbs are mainly provided with a plurality of LED chips on an aluminum circuit board, and then the circuit board is combined on a heat conducting plate usually made of aluminum. Afterwards, the heat conduction plate is assembled on one end of a heat dissipation base made of aluminum, and the side of the heat conduction plate opposite to the heat dissipation base is combined with a lampshade, so that the circuit board and the plurality of LED chips are covered therein. The other end of the cooling base is combined with a power connection base, which can be installed on a light bulb power base, and a power drive circuit module is provided in the cooling base for electrical connection with the power connection base and the circuit board. In this way, the high heat generated when the LED chip emits light can be conducted to the heat conducting plate made of aluminum through the circuit board made of aluminum, and then conducted to the heat sink made of aluminum through the heat conducting plate made of aluminum. Usually, a plurality of heat dissipation fins can be arranged on the side wall of the heat dissipation seat, and the heat dissipation grooves therebetween can dissipate heat into the surrounding air to achieve a cooling effect.

然而,该常用的LED灯泡在实际制作及使用时会产生以下的诸多缺点:1.由于LED芯片发光时所产生的热量需经过电路板、导热板及散热座才会散发至外部空气的中,而电路板、导热板及散热座形成热阻而使得该LED芯片的热量的传导效率降低,进而影响其散热效果。而且,该散热座内部的热气不易排出,大幅降低整体散热效果。2.电路板与该导热板及该导热板与该散热座的间的贴合状态如果有非常多的空隙或贴合介面不佳,也会使其导热效果大幅降低。However, the commonly used LED light bulbs have the following disadvantages in actual production and use: 1. The heat generated by the LED chip needs to pass through the circuit board, the heat conducting plate and the heat sink before it can be dissipated into the outside air. The thermal resistance formed by the circuit board, the heat conduction plate and the heat sink lowers the heat conduction efficiency of the LED chip, thereby affecting its heat dissipation effect. Moreover, the hot air inside the heat sink is difficult to discharge, which greatly reduces the overall heat dissipation effect. 2. If there are too many gaps or poor bonding interface between the circuit board and the heat conduction plate and between the heat conduction plate and the heat sink, the heat conduction effect will be greatly reduced.

鉴于高功率LED为照明应用的发展趋势,高功率的LED将进一步提升导热的规格要求,不良的设计或组装,都将影响到LED灯泡的发光效率甚至影响其使用寿命。因此如何提高导热效率,实为近期开发不可避免的重点方向。In view of the development trend of high-power LEDs for lighting applications, high-power LEDs will further increase the specification requirements for heat conduction, and poor design or assembly will affect the luminous efficiency of LED bulbs and even affect their service life. Therefore, how to improve the heat conduction efficiency is an inevitable key direction for recent development.

实用新型内容Utility model content

为了提升LED球泡灯的散热效率,特别是针对高功率LED照明应用,本实用新型提供具有对流散热机制散热座(heatsink)的LED球泡灯,可有效逸散LED芯片所产生的热量,提升发光效率及使用寿命。In order to improve the heat dissipation efficiency of LED bulb lamps, especially for high-power LED lighting applications, the utility model provides an LED bulb lamp with a convection cooling mechanism heatsink, which can effectively dissipate the heat generated by the LED chip and improve Luminous efficiency and service life.

根据本实用新型的一实施例的LED球泡灯,其包含灯罩、电源连接座、LED发光模块、散热座以及电源转换模块。散热座的上方连接该灯罩下缘,且上方中央设有LED载台,用以承载LED发光模块,下方则连接该电源连接座。散热座具有一环状侧壁,该环状侧壁内部形成可容纳电源转换模块的内部空间。该环状侧壁中包含多个穿孔,各该穿孔的第一开口连通至灯罩所形成的内部空间,而第二开口连通至LED球泡灯的外部,从而产生对流散热效果。The LED bulb lamp according to an embodiment of the present invention includes a lampshade, a power connection seat, an LED light emitting module, a heat sink and a power conversion module. The top of the cooling seat is connected to the lower edge of the lampshade, and the center of the top is provided with an LED carrier for carrying the LED light emitting module, and the bottom is connected to the power connection seat. The heat sink has an annular side wall, and the inner space of the annular side wall can accommodate the power conversion module. The ring-shaped side wall contains a plurality of perforations, the first opening of each perforation communicates with the inner space formed by the lampshade, and the second opening communicates with the outside of the LED bulb lamp, thereby generating a convective heat dissipation effect.

一实施例中,散热座上方另设有外凸缘,外凸缘和LED载台间设有环状凹槽,该第一开口设置于该环状凹槽内。In one embodiment, an outer flange is further provided above the heat sink, and an annular groove is provided between the outer flange and the LED carrier, and the first opening is disposed in the annular groove.

一实施例中,灯罩下缘嵌入该散热座外凸缘的内壁,且该灯罩下缘设置于该第一开口外侧。In one embodiment, the lower edge of the lampshade is embedded in the inner wall of the outer flange of the heat sink, and the lower edge of the lampshade is disposed outside the first opening.

一实施例中,多个穿孔环绕该LED载台设置。In one embodiment, a plurality of through holes are arranged around the LED carrier.

一实施例中,第二开口位于该散热座的底部,可达到较佳的对流效率。In one embodiment, the second opening is located at the bottom of the heat sink to achieve better convection efficiency.

一实施例中,第二开口位于该散热座的下半部侧面,可达到较佳的对流效率。In one embodiment, the second opening is located at the side of the lower half of the heat sink to achieve better convection efficiency.

一实施例中,该穿孔的深宽比大于10。In one embodiment, the through hole has an aspect ratio greater than 10.

一实施例中,该穿孔的孔径自第一开口至第二开口维持不变。In one embodiment, the diameter of the through hole remains unchanged from the first opening to the second opening.

一实施例中,该穿孔包含二个不同孔径,接近该第一开口的孔径大于接近第二开口的孔径。In one embodiment, the through hole includes two different diameters, and the diameter of the hole near the first opening is larger than the diameter of the hole near the second opening.

一实施例中,散热座一体成形。In one embodiment, the heat sink is integrally formed.

一实施例中,散热座中的穿孔可以机械钻孔方式制成。In one embodiment, the through holes in the heat sink can be made by mechanical drilling.

一实施例中,该穿孔的孔径为0.2至3mm。In one embodiment, the through hole has a diameter of 0.2 to 3 mm.

一实施例中,LED发光模块可利用高分子导热片固定于散热座上,其具有粘合性,故不需螺丝即可进行固定,借此可进一步结合热传导机制,提升散热效果。In one embodiment, the LED light-emitting module can be fixed on the heat sink by using a polymer heat conduction sheet, which has adhesiveness, so it can be fixed without screws, thereby further combining the heat conduction mechanism to improve the heat dissipation effect.

一实施例中,高分子导热片的导热率大于等于2W/m·K。In one embodiment, the thermal conductivity of the polymer thermal conductive sheet is greater than or equal to 2W/m·K.

一实施例中,该穿孔中可设置吸水透气材料,如硅胶,从而防止水气进入。In one embodiment, a water-absorbing and breathable material, such as silica gel, can be arranged in the perforation, so as to prevent water vapor from entering.

本实用新型利用于散热座中设计具对流功能的穿孔,可将灯罩内部空间的热逸散至LED球泡灯外部。另外,也可搭配高分子导热片固定LED发光模块,增加热传导。因此,本实用新型可利用热对流及热传导的双重作用,达到最佳的散热效果,从而提升LED发光模块的发光效率及延长其使用寿命。The utility model utilizes the perforation with convection function designed in the cooling seat, which can dissipate the heat in the inner space of the lampshade to the outside of the LED bulb lamp. In addition, the LED light-emitting module can also be fixed with a polymer heat-conducting sheet to increase heat conduction. Therefore, the utility model can utilize the dual effects of heat convection and heat conduction to achieve the best heat dissipation effect, thereby improving the luminous efficiency of the LED light emitting module and prolonging its service life.

附图说明Description of drawings

图1为本实用新型第一实施例的LED球泡灯的立体分解示意图。FIG. 1 is a three-dimensional exploded schematic view of the LED bulb lamp of the first embodiment of the present invention.

图2为本实用新型第一实施例的LED球泡灯的剖面结构示意图。FIG. 2 is a schematic cross-sectional structure diagram of the LED bulb lamp according to the first embodiment of the present invention.

图3为本实用新型第一实施例的LED球泡灯的散热座结构示意图。Fig. 3 is a schematic structural diagram of the heat sink of the LED bulb lamp according to the first embodiment of the present invention.

图4为本实用新型第二实施例的LED球泡灯的剖面结构示意图。Fig. 4 is a schematic cross-sectional structure diagram of the LED bulb lamp according to the second embodiment of the present invention.

图5为本实用新型第三实施例的LED球泡灯的剖面结构示意图。FIG. 5 is a schematic cross-sectional structure diagram of an LED bulb lamp according to a third embodiment of the present invention.

图6A至6C为本实用新型不同散热座的结构示意图。6A to 6C are structural schematic diagrams of different heat sinks of the present invention.

其中,附图标记说明如下:Wherein, the reference signs are explained as follows:

10、20、30LED球泡灯10, 20, 30 LED bulbs

11灯罩11 shade

12、61、62、63散热座12, 61, 62, 63 heat sink

13电源连接座13 power connector

14LED发光模块14LED lighting module

15电源转换模块15 power conversion module

16高分子导热片16 Polymer heat conducting sheet

65环状凹槽65 ring groove

111下缘111 lower edge

121外凸缘121 outer flange

122LED载台122LED carrier

123开口123 openings

124、134、144、611、621、631穿孔124, 134, 144, 611, 621, 631 perforations

125、135、145、612、622、632第一开口125, 135, 145, 612, 622, 632 first opening

126、136、146、613、623、633第二开口126, 136, 146, 613, 623, 633 second opening

127环状凹槽127 ring groove

128环状侧壁128 ring side wall

151导线151 wire

具体实施方式detailed description

为让本实用新型的上述和其他技术内容、特征和优点能更明显易懂,下文特举出相关实施例,并配合附图,作详细说明如下。In order to make the above and other technical contents, features and advantages of the present invention more comprehensible, relevant embodiments are specifically cited below, together with the accompanying drawings, for detailed description as follows.

图1和图2绘示本实用新型第一实施例的LED球泡灯示意图,其中图1为立体分解图,图2则为剖面的结构示意图。LED球泡灯10主要包含灯罩11、LED发光模块14、散热座12、电源转换模块15以及电源连接座13。灯罩11的下缘111连接散热座12,形成一容置LED发光模块14的内部空间。散热座12的下方连接电源连接座13,以提供LED发光模块14的电源。散热座12上方中央设有LED载台122,用以承载LED发光模块14。散热座12朝下有一开口,且其中包含中空室,以容置该电源转换模块15。散热座12的LED载台122设置有开口123,允许电源转换模块15的导线151穿过,以连接至LED发光模块14。电源转换模块15连接至电源连接座13,形成导电路径。1 and 2 are schematic diagrams of the LED bulb lamp according to the first embodiment of the present invention, wherein FIG. 1 is a three-dimensional exploded view, and FIG. 2 is a cross-sectional structural schematic diagram. The LED bulb lamp 10 mainly includes a lampshade 11 , an LED lighting module 14 , a heat sink 12 , a power conversion module 15 and a power connection seat 13 . The lower edge 111 of the lampshade 11 is connected to the heat sink 12 to form an inner space for accommodating the LED lighting module 14 . The power connection socket 13 is connected to the bottom of the heat sink 12 to provide power for the LED lighting module 14 . An LED carrier 122 is disposed at the center above the heat sink 12 for carrying the LED light emitting module 14 . The heat sink 12 has an opening facing downwards, and includes a hollow chamber therein for accommodating the power conversion module 15 . The LED carrier 122 of the heat sink 12 is provided with an opening 123 for allowing the wire 151 of the power conversion module 15 to pass through to be connected to the LED lighting module 14 . The power conversion module 15 is connected to the power connection socket 13 to form a conductive path.

图3为第一实施例的散热座12的外观立体示意图。散热座12大致上为一圆柱形结构,且上半部的直径可略大于下半部。LED载台122表面可承载包含LED芯片的LED发光模块14。散热座12具有环状侧壁128,该环状侧壁128内部形成可容纳电源转换模块15的内部空间,该环状侧壁128的中包含多个垂直向的穿孔124。各该穿孔124的第一开口125连通至灯罩11和散热座12所形成的内部空间,而第二开口126连通至LED球泡灯10的外部。通过此种结构设计,形成自灯罩11内部连通至外界的对流通道,且LED球泡灯10使用时为倒置,按热空气往上的原理,LED芯片发光所产生的热量或热空气可快速对流或逸散至外部,可有效增进散热效果。FIG. 3 is a schematic perspective view of the appearance of the heat sink 12 of the first embodiment. The heat sink 12 is substantially a cylindrical structure, and the diameter of the upper half may be slightly larger than that of the lower half. The surface of the LED carrier 122 can carry the LED lighting module 14 including LED chips. The heat sink 12 has a ring-shaped side wall 128 , which forms an inner space for accommodating the power conversion module 15 . The ring-shaped side wall 128 includes a plurality of vertical through holes 124 . The first opening 125 of each through hole 124 communicates with the inner space formed by the lampshade 11 and the heat sink 12 , while the second opening 126 communicates with the outside of the LED bulb lamp 10 . Through this structural design, a convection channel from the inside of the lampshade 11 to the outside is formed, and the LED bulb lamp 10 is used upside down. According to the principle of hot air upward, the heat or hot air generated by the LED chip light can be quickly Convection or dissipation to the outside can effectively improve the heat dissipation effect.

特别的,本实施例中散热座12上方设有外凸缘121,外凸缘121和LED载台122间形成环状凹槽127。穿孔124的第一开口125设置于该环状凹槽127内,或者可视为设置于该环状凹槽127表面。多个穿孔124环绕该LED载台122设置,其可为等角度或非等角度设置,视需求而定。灯罩11的下缘111嵌入该散热座12的外凸缘121的内壁,该灯罩11的下缘111环绕设置于第一开口125外侧,从而穿孔124可以连通至灯罩11和散热座12所形成的内部空间提供对流管道。散热座12可为一体成形,其中穿孔124可以机械钻孔方式制成,而直线形穿孔易于机械钻孔加工。In particular, in this embodiment, an outer flange 121 is disposed above the heat sink 12 , and an annular groove 127 is formed between the outer flange 121 and the LED carrier 122 . The first opening 125 of the through hole 124 is disposed in the annular groove 127 , or can be regarded as disposed on the surface of the annular groove 127 . A plurality of through holes 124 are arranged around the LED carrier 122 , which can be arranged at equal angles or non-equal angles, depending on requirements. The lower edge 111 of the lampshade 11 is embedded in the inner wall of the outer flange 121 of the heat sink 12, and the lower edge 111 of the lampshade 11 is arranged around the outer side of the first opening 125, so that the perforation 124 can communicate with the opening formed by the lampshade 11 and the heat sink 12. The interior space provides convection ducts. The heat sink 12 can be integrally formed, wherein the through hole 124 can be made by mechanical drilling, and the linear through hole can be easily processed by mechanical drilling.

一实施例中,该LED发光模块14可利用其下设置的高分子导热片16固定于LED载台122表面。如此设计不需要如传统使用螺丝等机械件进行固定,组装简单,且可进一步增加导热效果。高分子导热片16的导热率较佳地大于2W/m·K,也可为大于4W/m·K或8W/m·K。In one embodiment, the LED light-emitting module 14 can be fixed on the surface of the LED carrier 122 by the polymer heat-conducting sheet 16 disposed thereunder. Such a design does not require mechanical parts such as screws to be fixed in the traditional way, the assembly is simple, and the heat conduction effect can be further increased. The thermal conductivity of the polymer thermal conductive sheet 16 is preferably greater than 2W/m·K, and may also be greater than 4W/m·K or 8W/m·K.

再次参阅图2,本实施例中穿孔124的第二开口126位于散热座12的底部。即,穿孔124自第一开口125至第二开口126为垂直贯穿设计,其中较佳地穿孔124的深宽比大于10。穿孔124的孔径大小自第一开口125至第二开口126维持不变,穿孔124的孔径须配合散热座12的尺寸,并无特别限制,但较佳为0.2至3mm,例如0.5mm、1mm、2mm。穿孔124可为圆形、椭圆形、方形或多边形(如三角形)。一实施例中,穿孔124中可视需求填入吸水透气材料,例如但不限于硅胶或氧化铝等多孔或颗粒材料,从而防止水气进入,但仍保持对流效果。Referring to FIG. 2 again, the second opening 126 of the through hole 124 is located at the bottom of the heat sink 12 in this embodiment. That is, the through hole 124 is vertically penetrating from the first opening 125 to the second opening 126 , wherein the aspect ratio of the through hole 124 is preferably greater than 10. The aperture size of the through hole 124 remains unchanged from the first opening 125 to the second opening 126. The aperture size of the through hole 124 must match the size of the heat sink 12. There is no special limitation, but it is preferably 0.2 to 3mm, such as 0.5mm, 1mm, 2mm. The perforation 124 can be circular, elliptical, square or polygonal (eg triangular). In one embodiment, the perforations 124 can be filled with water-absorbing and breathable materials, such as but not limited to porous or granular materials such as silica gel or alumina, so as to prevent water vapor from entering, but still maintain the convection effect.

为了达到较佳的对流效果,也可设计不同的穿孔结构,如图4所示的第二实施例的LED球泡灯20,与第一实施例的差异仅在于散热座12中的穿孔134设计。穿孔134包含二个不同孔径,接近该第一开口135的孔径大于接近第二开口136的孔径,如此连通至灯罩11和散热座12所形成内部空间的第一开口135较大,允许较多的热空气流通,可增进对流效果。In order to achieve a better convection effect, different perforated structures can also be designed. The LED bulb lamp 20 of the second embodiment as shown in FIG. . The perforation 134 includes two different apertures, the aperture close to the first opening 135 is larger than the aperture close to the second opening 136, so the first opening 135 connected to the internal space formed by the lampshade 11 and the heat sink 12 is larger, allowing more Hot air circulates for enhanced convection.

图5绘示本实用新型第三实施例的LED球泡灯30示意图,与第一实施例的差异仅在于散热座12中的穿孔144设计。其中该第二开口146位于散热座12的环状侧壁128,且位于该散热座12下半部。具体的,穿孔144的自第一开口145垂直向下延伸,并于过了散热座12高度约二分之一后转向延伸并穿出散热座12的环状侧壁128,形成位于散热座12侧面的第二开口146。FIG. 5 is a schematic diagram of an LED bulb lamp 30 according to a third embodiment of the present invention. The difference from the first embodiment is only the design of the through hole 144 in the heat sink 12 . The second opening 146 is located on the annular sidewall 128 of the heat sink 12 and is located at the lower half of the heat sink 12 . Specifically, the through hole 144 extends vertically downward from the first opening 145, and turns to extend after about half of the height of the heat sink 12 and passes through the annular side wall 128 of the heat sink 12 to form a The second opening 146 on the side.

按照对流原理,对流的热通量和温差成正比,因此本实用新型较佳地将第二开口126、136或146设置于散热座12的下半部,使得第一开口125、135或145和第二开口126、136或146(外部环境)间有较大的温差或温度梯度(通常距离LED芯片愈远,温度愈低),因此可提升对流效果。因此,当第二开口126、136或146位于散热座的下半部,或位于散热座12高度的下方三分之一处,会有较佳的散热效果。According to the principle of convection, the heat flux of convection is directly proportional to the temperature difference, so the utility model preferably arranges the second opening 126, 136 or 146 on the lower half of the heat sink 12, so that the first opening 125, 135 or 145 and There is a larger temperature difference or temperature gradient between the second openings 126 , 136 or 146 (external environment) (generally, the farther away from the LED chip, the lower the temperature), so the convection effect can be improved. Therefore, when the second opening 126 , 136 or 146 is located at the lower half of the heat sink, or at the lower third of the height of the heat sink 12 , a better heat dissipation effect will be obtained.

参照图6A至6C,其为针对不同散热座结构设计,针对8W/800流明球泡灯的LED发光模块(电路板)及散热座外壳进行温度量测,其结果如下表1所示。图6A中散热座61的穿孔611的第一开口612位于环状凹槽65内,第二开口613位于散热座61的上半部。穿孔611为倾斜的直线穿孔。图6B中散热座62的穿孔621的第一开口622位于环状凹槽65内,第二开口623位于散热座62的下半部或约下方三分之一处。穿孔621为倾斜的直线穿孔。图6C中散热座63的穿孔631的第一开口632位于环状凹槽65内,第二开口633位于散热座63的底部。穿孔631为垂直的直线穿孔。本实用新型中穿孔除了直线形外,也可制作为如图5的具有弯角的非直线形穿孔。Referring to Figures 6A to 6C, which are designed for different heat sink structures, the temperature measurement of the LED light-emitting module (circuit board) and the heat sink shell of the 8W/800 lumen bulb lamp is carried out, and the results are shown in Table 1 below. In FIG. 6A , the first opening 612 of the through hole 611 of the heat sink 61 is located in the annular groove 65 , and the second opening 613 is located in the upper half of the heat sink 61 . The perforation 611 is an oblique linear perforation. In FIG. 6B , the first opening 622 of the through hole 621 of the heat sink 62 is located in the annular groove 65 , and the second opening 623 is located at the lower half or about the lower third of the heat sink 62 . The perforation 621 is an oblique linear perforation. In FIG. 6C , the first opening 632 of the through hole 631 of the heat sink 63 is located in the annular groove 65 , and the second opening 633 is located at the bottom of the heat sink 63 . The perforation 631 is a vertical linear perforation. In the utility model, the perforation can also be made as a non-linear perforation with curved angles as shown in FIG. 5 in addition to the straight line.

表1Table 1

按表1的测试结果,第二开口位于散热座的下半部或位于散热座高度的下方三分之一处时,不论是LED发光模块或灯壳皆有较低的温度,显示当散热座的第二开口(下方开口)位置较低或穿孔较长时,可有效提供散热和降温的功效。According to the test results in Table 1, when the second opening is located at the lower half of the heat sink or at the lower third of the height of the heat sink, both the LED light-emitting module and the lamp housing have a lower temperature, which shows that when the heat sink When the position of the second opening (lower opening) is lower or the perforation is longer, it can effectively provide heat dissipation and cooling effects.

以上实施例所示的提供对流散热的穿孔仅为例示,并非对本实用新型的限制,举凡其他非垂直的倾斜直线或非直线穿孔设计,如图5的具有弯角的非直线形穿孔,或其他各种变形也为本实用新型的保护范围所涵盖。The perforations that provide convection and heat dissipation shown in the above embodiments are only examples and are not limitations of the present invention. For example, other non-perpendicular inclined straight or non-linear perforation designs, such as non-linear perforations with curved corners as shown in Figure 5, or other Various modifications are also covered by the protection scope of the present utility model.

本实用新型特殊散热座的对流穿孔设计,可将LED芯片产生的热迅速对流逸散,甚至有机会取代传统散热鳍片设计,以简化结构,进而提升加工性。再者,本实用新型可使用高导热率的高分子导热片固定LED发光模块,无须螺丝固定,除简化结构外,也可进一步利用热传导增加散热效率。本实用新型的LED球泡灯因具有非常好的散热效果,可间接提升LED芯片的发光效率,并延长其使用寿命。The convection perforation design of the special heat sink of the utility model can quickly dissipate the heat generated by the LED chip by convection, and even have the opportunity to replace the traditional heat dissipation fin design to simplify the structure and improve the processability. Furthermore, the utility model can use high thermal conductivity polymer heat conduction sheets to fix the LED light-emitting module without screws. In addition to simplifying the structure, it can also further use heat conduction to increase heat dissipation efficiency. Because the LED bulb lamp of the utility model has a very good heat dissipation effect, it can indirectly improve the luminous efficiency of the LED chip and prolong its service life.

本实用新型的技术内容及技术特点已公开如上,然而本领域技术人员仍可基于本实用新型的公开及教导而作种种不背离本实用新型精神的替换及修饰。因此,本实用新型的保护范围应不限于实施例所公开的,而应包括各种不背离本实用新型的替换及修饰,并为以下的权利要求书所涵盖。The technical content and technical features of the present utility model have been disclosed above, but those skilled in the art can still make various replacements and modifications without departing from the spirit of the present utility model based on the disclosure and teaching of the present utility model. Therefore, the protection scope of the utility model should not be limited to the disclosed embodiments, but should include various replacements and modifications that do not deviate from the utility model, and are covered by the following claims.

Claims (14)

1.一LED球泡灯,其特征在于,包括:1. An LED bulb lamp, characterized in that it comprises: 一灯罩;a lampshade; 一电源连接座;a power connection socket; 一LED发光模块;One LED lighting module; 一散热座,其上方连接该灯罩下缘,上方中央设有LED载台,用以承载该LED发光模块,下方连接该电源连接座;A heat sink, the top of which is connected to the lower edge of the lampshade, the center of the top is provided with an LED carrier for carrying the LED light-emitting module, and the bottom is connected to the power connection seat; 一电源转换模块;A power conversion module; 其中该散热座具有一环状侧壁,该环状侧壁内部形成可容纳电源转换模块的内部空间,该环状侧壁中包含多个穿孔,各该穿孔的第一开口连通至灯罩所形成的内部空间,而第二开口连通至LED球泡灯的外部。Wherein the heat sink has a ring-shaped side wall, the inner space of which can accommodate the power conversion module is formed inside the ring-shaped side wall, the ring-shaped side wall contains a plurality of perforations, and the first opening of each perforation communicates with the first opening formed by the lampshade. The inner space, and the second opening communicates with the outside of the LED bulb lamp. 2.根据权利要求1所述的LED球泡灯,其特征在于,所述散热座上方设有外凸缘,该外凸缘和LED载台间形成环状凹槽,所述第一开口设置于该环状凹槽内。2. The LED bulb lamp according to claim 1, wherein an outer flange is provided above the heat sink, and an annular groove is formed between the outer flange and the LED carrier, and the first opening is set in the annular groove. 3.根据权利要求2所述的LED球泡灯,其特征在于,所述灯罩的下缘嵌入所述散热座外凸缘的内壁,且该灯罩的下缘设置于所述第一开口外侧。3 . The LED bulb lamp according to claim 2 , wherein the lower edge of the lampshade is embedded in the inner wall of the outer flange of the heat sink, and the lower edge of the lampshade is disposed outside the first opening. 4 . 4.根据权利要求1所述的LED球泡灯,其特征在于,所述多个穿孔环绕所述LED载台设置。4. The LED bulb lamp according to claim 1, wherein the plurality of perforations are arranged around the LED carrier. 5.根据权利要求1所述的LED球泡灯,其特征在于,所述第二开口位于所述散热座的底部。5. The LED bulb lamp according to claim 1, wherein the second opening is located at the bottom of the heat sink. 6.根据权利要求1所述的LED球泡灯,其特征在于,所述第二开口位于所述散热座的侧面,且位于该散热座下半部。6 . The LED bulb lamp according to claim 1 , wherein the second opening is located at the side of the heat sink and is located at the lower half of the heat sink. 7 . 7.根据权利要求1所述的LED球泡灯,其特征在于,所述穿孔的深宽比大于10。7. The LED bulb lamp according to claim 1, characterized in that, the aspect ratio of the perforated holes is greater than 10. 8.根据权利要求1所述的LED球泡灯,其特征在于,所述穿孔的孔径自第一开口至第二开口维持不变。8 . The LED bulb lamp according to claim 1 , wherein the diameter of the perforation remains unchanged from the first opening to the second opening. 9.根据权利要求1所述的LED球泡灯,其特征在于,所述穿孔包含二个不同孔径,接近该第一开口的孔径大于接近第二开口的孔径。9 . The LED bulb lamp according to claim 1 , wherein the through hole comprises two different apertures, and the aperture close to the first opening is larger than the aperture close to the second opening. 10.根据权利要求1所述的LED球泡灯,其特征在于,所述散热座一体成形。10. The LED bulb lamp according to claim 1, characterized in that the heat dissipation seat is integrally formed. 11.根据权利要求1所述的LED球泡灯,其特征在于,所述穿孔的孔径为0.2至3mm。11. The LED bulb lamp according to claim 1, characterized in that, the diameter of the perforation is 0.2 to 3mm. 12.根据权利要求1所述的LED球泡灯,其特征在于,还包含高分子导热片,用于将LED发光模块固定于所述散热座。12. The LED bulb lamp according to claim 1, further comprising a thermally conductive polymer sheet for fixing the LED light emitting module to the heat sink. 13.根据权利要求12所述的LED球泡灯,其特征在于,所述高分子导热片的导热率大于等于2W/m·K。13. The LED bulb lamp according to claim 12, characterized in that, the thermal conductivity of the polymer heat conducting sheet is greater than or equal to 2W/m·K. 14.根据权利要求1所述的LED球泡灯,其特征在于,所述穿孔中填入吸水透气材料,从而防止水气进入。14. The LED bulb lamp according to claim 1, characterized in that, the perforation is filled with water-absorbing and breathable material, so as to prevent water vapor from entering.
CN201520814641.0U 2015-01-19 2015-10-20 LED bulb lamp Expired - Fee Related CN205026425U (en)

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