CN204879790U - Lighting installation - Google Patents
Lighting installation Download PDFInfo
- Publication number
- CN204879790U CN204879790U CN201520682003.8U CN201520682003U CN204879790U CN 204879790 U CN204879790 U CN 204879790U CN 201520682003 U CN201520682003 U CN 201520682003U CN 204879790 U CN204879790 U CN 204879790U
- Authority
- CN
- China
- Prior art keywords
- heat sink
- light emitting
- substrate
- cover
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
本实用新型提供一种散热器的可制造性良好且能够提高散热性能的照明器具。照明器具(10)具备:框体(12)、发光模块(16)、散热器(18)。发光模块(16)具有基板(22)以及安装于基板(22)的多个发光元件(23)。散热器(18)通过挤压成型以挤压方向上的剖面相同的方式形成为一体。散热器(18)具有:用于安装发光模块(16)的主体部(29)、沿与挤压方向正交的方向排列且从主体部(29)突出的多个散热片部(30)、设置在主体部(29)的与挤压方向正交的方向上的侧部且安装于框体(12)的安装部(31)。
The utility model provides a lighting appliance with good manufacturability of a heat sink and improved heat dissipation performance. A lighting fixture (10) includes a housing (12), a light emitting module (16), and a radiator (18). The light emitting module (16) has a substrate (22) and a plurality of light emitting elements (23) mounted on the substrate (22). The heat sink (18) is integrally formed by extrusion molding in such a manner that the cross section in the extrusion direction is the same. The heat sink (18) has: a main body (29) for installing the light-emitting module (16), a plurality of fins (30) arranged in a direction perpendicular to the extruding direction and protruding from the main body (29), A mounting portion (31) provided on the side portion of the main body portion (29) in a direction perpendicular to the extrusion direction and mounted to the frame body (12).
Description
技术领域technical field
本实用新型的实施方式涉及一种使用散热器的照明器具。The embodiment of the utility model relates to a lighting fixture using a radiator.
背景技术Background technique
以往,例如用在高顶棚等的照明器具中,在使用基板上安装有多个发光元件的发光模块的情况下,为了对发光元件所产生的热量有效地进行散热,将发光模块安装于散热器上。In the past, for example, in lighting fixtures such as high ceilings, when using a light-emitting module with a plurality of light-emitting elements mounted on a substrate, the light-emitting module is mounted on a heat sink in order to effectively dissipate the heat generated by the light-emitting elements. superior.
并且,散热器具备用于安装发光模块的主体以及从该主体突出的多个散热片。In addition, the heat sink includes a main body for mounting the light emitting module and a plurality of cooling fins protruding from the main body.
在该种散热器中,主体和多个散热片分体形成,并且将各散热片分别压接于在主体上设置的多个槽中。制造这种结构的散热器需要耗费工时。In this type of heat sink, the main body and the plurality of cooling fins are formed separately, and the cooling fins are respectively crimped into the plurality of grooves provided on the main body. Man-hours are required to manufacture a heat sink of this structure.
并且,还有通过压铸成型而将主体部和散热片部形成为一体的散热器,但是,通过压铸成型形成的散热器的散热性能低于不是压铸成型的如同上述将主体和散热片组合而成的散热器的散热性能。In addition, there is also a heat sink in which the main body and fins are integrally formed by die-casting. However, the heat dissipation performance of the heat sink formed by die-casting is lower than that of a non-die-casting combination of the main body and fins. The cooling performance of the radiator.
专利文献1:日本特开2013-201080号公报Patent Document 1: Japanese Patent Laid-Open No. 2013-201080
发明内容Contents of the invention
本实用新型要解决的技术问题在于提供一种散热器的可制造性良好,并且能够提高散热性能的照明器具。The technical problem to be solved by the utility model is to provide a lighting fixture with good manufacturability of the radiator and improved heat dissipation performance.
实施方式的照明器具具备:框体、发光模块、散热器。发光模块具有基板以及安装于基板的多个发光元件。散热器通过挤压成型以挤压方向上的剖面相同的方式形成为一体。散热器具有:用于安装发光模块的主体部、沿与挤压方向正交的方向排列且从主体部突出的多个散热片部、设置在主体部的与挤压方向正交的方向上的侧部且安装于框体的安装部。A lighting fixture according to an embodiment includes a housing, a light emitting module, and a heat sink. The light emitting module has a substrate and a plurality of light emitting elements mounted on the substrate. The heat sink is integrally formed by extrusion molding in such a way that the section in the extrusion direction is the same. The heat sink has: a main body for mounting the light emitting module, a plurality of fins arranged in a direction perpendicular to the extrusion direction and protruding from the main body, The side part is installed on the mounting part of the frame.
根据本实用新型,能够期待散热器的可制造性良好,并且能够提高散热性能。According to the present invention, it can be expected that the manufacturability of the heat sink is good, and the heat radiation performance can be improved.
附图说明Description of drawings
图1是表示一种实施方式的照明器具的剖视图。FIG. 1 is a cross-sectional view showing a lighting fixture according to an embodiment.
图2是上述照明器具的立体图。Fig. 2 is a perspective view of the above lighting fixture.
图3是表示上述照明器具的分解状态的立体图。Fig. 3 is a perspective view showing an exploded state of the lighting fixture.
图4是表示上述照明器具的散热器、发光模块以及罩的立体图。Fig. 4 is a perspective view showing a heat sink, a light emitting module, and a cover of the lighting fixture.
图5是表示照明器具的罩的立体图。Fig. 5 is a perspective view showing a cover of the lighting fixture.
图中:10-照明器具;12-框体;16-发光模块;18-散热器;22-基板;23-发光元件;29-主体部;30-散热片部;31-安装部;P-挤压方向。In the figure: 10-lighting device; 12-frame body; 16-light-emitting module; 18-radiator; 22-substrate; 23-light-emitting element; 29-main body; Extrusion direction.
具体实施方式Detailed ways
以下,参照图1至图5对一种实施方式进行说明。Hereinafter, an embodiment will be described with reference to FIGS. 1 to 5 .
如图2所示,照明器具10例如设置于体育馆等建物内的高顶棚,用于照亮较广的照明空间。As shown in FIG. 2 , the lighting fixture 10 is, for example, installed on a high ceiling in a building such as a gymnasium, and is used to illuminate a wide lighting space.
照明器具10具备:照明单元11、安装有该照明单元11的框体12、向照明单元11供给电力的电源装置13。The lighting fixture 10 includes a lighting unit 11 , a housing 12 on which the lighting unit 11 is attached, and a power supply device 13 that supplies electric power to the lighting unit 11 .
如图1至图4所示,照明单元11具备:多个发光模块16、多个绝缘板17、散热器18、多个罩19。As shown in FIGS. 1 to 4 , the lighting unit 11 includes a plurality of light emitting modules 16 , a plurality of insulating plates 17 , a heat sink 18 , and a plurality of covers 19 .
如图1、图3以及图4所示,发光模块16具备:基板22、安装于该基板22的一个面上的多个发光元件23、连接器24。并且,在基板22的一个面上安装有多个与各发光元件23连接的片式电容器25。As shown in FIGS. 1 , 3 and 4 , the light emitting module 16 includes a substrate 22 , a plurality of light emitting elements 23 mounted on one surface of the substrate 22 , and a connector 24 . Furthermore, a plurality of chip capacitors 25 connected to the respective light emitting elements 23 are mounted on one surface of the substrate 22 .
基板22的一个面是部件的安装面22a,另一面是与散热器18接触的接触面22b。基板22例如以铝等金属为基体,并且在金属基体的一个面形成有绝缘层,并且在绝缘层上形成有配线图案,在配线图案上安装有发光元件23、连接器24、电容器25。基板22形成为大致正方形,并且在1个角部设置有配线槽26。在基板22的内侧部设置有多个孔部22c。在本实施方式中,设置有两个孔部22c,一个孔部22c配置于配线槽26的附近,另一个孔部22c配置于与配线槽26相反的一侧的基板22的角部附近。One surface of the substrate 22 is a component mounting surface 22 a , and the other surface is a contact surface 22 b that contacts the heat sink 18 . Substrate 22 is based on metal such as aluminum, for example, and an insulating layer is formed on one surface of the metal base, and a wiring pattern is formed on the insulating layer, and a light emitting element 23, a connector 24, and a capacitor 25 are mounted on the wiring pattern. . The substrate 22 is formed in a substantially square shape, and a wiring groove 26 is provided at one corner. A plurality of hole portions 22 c are provided on the inner side of the substrate 22 . In this embodiment, two holes 22c are provided, one hole 22c is arranged near the wiring groove 26, and the other hole 22c is arranged near the corner of the substrate 22 on the side opposite to the wiring groove 26. .
发光元件23例如使用SMD(SurfaceMountDevice,表面安装器件)型LED,并且分别隔着预定的间隔排列于基板22的一个面的整个区域。另外,在使用LED的情况下,也可以使用COB(ChipOnBoard,板上芯片)模块作为发光模块16。并且,还可以使用EL(ElectroLuminescence,电致发光)元件等作为发光元件23。The light emitting elements 23 use, for example, SMD (Surface Mount Device, Surface Mount Device) LEDs, and are arranged at predetermined intervals over the entire area of one surface of the substrate 22 . In addition, when using an LED, a COB (Chip On Board, chip on board) module may be used as the light emitting module 16 . In addition, an EL (ElectroLuminescence, electroluminescent) element or the like may be used as the light emitting element 23 .
连接器24与从电源装置13引出的带有连接器的供电线电连接。就连接器24而言,相对于该连接器24的供电线的连接方向A(参照图4)与配线槽26对置,并且配置成与基板22的一边平行。The connector 24 is electrically connected to a power supply line with a connector drawn out from the power supply device 13 . The connector 24 faces the wiring groove 26 with respect to the connection direction A (see FIG. 4 ) of the power supply line of the connector 24 and is arranged parallel to one side of the substrate 22 .
并且,多个发光模块16形成为相同结构。在本实施方式中,使用4个发光模块16,该4个发光模块16以基板22的配线槽26彼此对置的方式排列成矩形并且配置于散热器18上。Moreover, the plurality of light emitting modules 16 are formed in the same structure. In this embodiment, four light emitting modules 16 are used, and the four light emitting modules 16 are arranged in a rectangular shape so that the wiring grooves 26 of the substrate 22 face each other and are arranged on the heat sink 18 .
并且,绝缘板17具有绝缘性,并且具有黏着性以及导热性,形成为外形稍大于基板22的外形。在绝缘板17的与各基板22的孔部22c同轴的位置上形成有多个插通孔17a。并且,绝缘板17介于基板22和散热器18之间,使基板22和散热器18绝缘。In addition, the insulating plate 17 has insulating properties, adhesiveness, and thermal conductivity, and is formed in an outer shape slightly larger than that of the substrate 22 . A plurality of insertion holes 17 a are formed on the insulating plate 17 at positions coaxial with the hole portions 22 c of the respective substrates 22 . Furthermore, the insulating plate 17 is interposed between the substrate 22 and the heat sink 18 to insulate the substrate 22 and the heat sink 18 .
并且,如图1至图4所示,散热器18具备:主体部29、从该主体部29的上表面分别向上方突出的多个散热片部30、分别设置在主体部29的与一个方向正交的方向上的两侧的安装部31。And, as shown in FIGS. 1 to 4 , the heat sink 18 includes: a main body portion 29 , a plurality of fin portions 30 protruding upward from the upper surface of the main body portion 29 , and disposed on one side of the main body portion 29 and one direction respectively. The mounting portions 31 on both sides in the orthogonal direction.
散热器18例如使用铝等金属材料并通过挤压成型而形成为一体。因此,散热器18形成为其剖面形状沿一个方向即挤压方向P(参照图3以及图4)相同。The heat sink 18 is integrally formed by extrusion molding using a metal material such as aluminum, for example. Therefore, the heat sink 18 is formed such that its cross-sectional shape is the same along one direction, that is, the pressing direction P (see FIG. 3 and FIG. 4 ).
主体部29形成为大致正方形,且厚度厚于散热片部30的厚度。在主体部29的下表面形成有安装发光模块16的平坦状的安装面32。在安装面32的与4个角部相对应的4处分别设置有用于安装4个发光模块16的安装位置33。在各安装位置33的与各基板22的孔部22c同轴的位置分别贯穿形成有固定孔18a。在安装面32的中心且在4个安装位置33之间形成有用于穿过供电线的配线孔18b。The main body portion 29 is formed in a substantially square shape and has a thickness greater than that of the fin portion 30 . A flat mounting surface 32 on which the light emitting module 16 is mounted is formed on the lower surface of the main body portion 29 . Mounting positions 33 for mounting four light emitting modules 16 are respectively provided at four positions corresponding to the four corners of the mounting surface 32 . Fixing holes 18 a are respectively penetratingly formed at positions coaxial with the hole portions 22 c of the respective substrates 22 in the mounting positions 33 . In the center of the mounting surface 32 and between the four mounting positions 33, a wiring hole 18b for passing a power supply line is formed.
多个散热片30设置成彼此隔着预定间隔且沿挤压方向P彼此平行。散热片30的厚度形成为薄于主体部29的厚度。散热片30配置于各安装位置33的上方。在与挤压方向P正交的方向上相邻的安装位置33之间,未设置散热片30,而形成有与配线孔18b连通的空间部34。The plurality of cooling fins 30 are disposed at predetermined intervals from each other and parallel to each other in the pressing direction P. As shown in FIG. The heat sink 30 is formed to be thinner than the thickness of the main body portion 29 . The heat sink 30 is disposed above each installation position 33 . Between the mounting positions 33 adjacent in the direction perpendicular to the extrusion direction P, no heat sink 30 is provided, and a space portion 34 communicating with the wiring hole 18 b is formed.
安装部31从主体部29的与挤压方向P正交的方向上的两侧部向上方突出。在安装部31贯穿形成有多个固定孔18c,该多个固定孔18c将与安装面32平行的方向(水平方向)作为轴向。The mounting portion 31 protrudes upward from both side portions in the direction perpendicular to the pressing direction P of the main body portion 29 . A plurality of fixing holes 18c having an axial direction parallel to the mounting surface 32 (horizontal direction) are formed through the mounting portion 31 .
另外,如图1至图5所示,罩19例如由聚碳酸酯等具有透光性的树脂材料形成为一体。罩19具备:与发光模块16的前表面对置的罩部37、设置于该罩部37的周边部且覆盖发光模块16的周边部的侧壁部38。In addition, as shown in FIGS. 1 to 5 , the cover 19 is integrally formed of, for example, a translucent resin material such as polycarbonate. The cover 19 includes a cover portion 37 facing the front surface of the light emitting module 16 , and a side wall portion 38 provided on the peripheral portion of the cover portion 37 and covering the peripheral portion of the light emitting module 16 .
罩部37形成为与基板22相同的大致正方形的平板状,并且在1个角部形成有与基板22的配线槽26对置且向罩部37的外侧鼓出的配线罩部39。The cover portion 37 is formed in the same substantially square flat plate shape as the substrate 22 , and a wiring cover portion 39 facing the wiring groove 26 of the substrate 22 and protruding outward from the cover portion 37 is formed at one corner.
在罩部37上形成有多个固定部41,该多个固定部41用于通过多个螺钉40将罩19固定于散热器18。固定部41呈圆筒状,该固定部41从罩部37的内表面突出,在前端形成有与基板22抵接的抵接部42并且形成有嵌入基板22的孔部22c中的突出部43,在突出部43的中心形成有螺钉40插通的安装孔44。并且,通过突出部43和基板22的孔部22c的嵌合,罩19和基板22得以定位,并且通过使螺钉40从固定部41螺纹固定于散热器18的固定孔18a,将罩19以用固定部41(抵接部42)将基板22的内侧部按压于散热器18的状态固定于散热器18。A plurality of fixing portions 41 for fixing the cover 19 to the heat sink 18 with a plurality of screws 40 are formed on the cover portion 37 . The fixed portion 41 is cylindrical, protrudes from the inner surface of the cover portion 37 , and has a contact portion 42 at the front end that contacts the substrate 22 and a protruding portion 43 that fits into the hole 22 c of the substrate 22 . A mounting hole 44 through which the screw 40 is inserted is formed at the center of the protruding portion 43 . And, the cover 19 and the base plate 22 are positioned by the fitting of the protruding portion 43 and the hole portion 22c of the base plate 22, and the cover 19 is used by screwing the screw 40 from the fixing portion 41 to the fixing hole 18a of the radiator 18. The fixing portion 41 (contact portion 42 ) is fixed to the heat sink 18 in a state where the inner portion of the substrate 22 is pressed against the heat sink 18 .
遍及罩部37的周边部的全周而设置有侧壁部38。在侧壁部38的前端侧形成有使基板22外周部嵌合的嵌合部45、使绝缘板17的外周部嵌合的嵌合部46。在侧壁部38形成有按压部47,该按压部47在通过螺钉40将罩19紧固于散热器18的状态下将嵌合于嵌合部45的基板22的外周部按压于散热器18。侧壁部38在配线罩部39的部分向外侧鼓出,在该侧壁部38部分的内侧未形成有嵌合部45、46等,而是形成有配线空间48,并且在该侧壁部38部分上形成有与配线空间48连通的配线槽49。The side wall portion 38 is provided over the entire periphery of the peripheral portion of the cover portion 37 . A fitting portion 45 for fitting the outer peripheral portion of the substrate 22 and a fitting portion 46 for fitting the outer peripheral portion of the insulating plate 17 are formed on the front end side of the side wall portion 38 . A pressing portion 47 is formed on the side wall portion 38 for pressing the outer peripheral portion of the substrate 22 fitted into the fitting portion 45 against the heat sink 18 in a state where the cover 19 is fastened to the heat sink 18 with the screws 40 . . The side wall part 38 bulges outward at the part of the wiring cover part 39, and the fitting part 45, 46 etc. are not formed in the inside of this side wall part 38 part, but the wiring space 48 is formed, and on this side A wiring groove 49 communicating with the wiring space 48 is formed on the wall portion 38 .
并且,在罩部37上一体地形成有多个透镜部51,该多个透镜部51控制从各发光元件23入射的光的配光。透镜部51与各发光元件23对置且从罩部37的内表面突出成山状或者圆锥状,在透镜部51的顶部形成有与发光元件23对置的凹部52。凹部52的内表面成为入射来自发光元件23的光的入射面53,透镜部51的外侧表面成为将从入射面53入射的光向前方全反射的反射面54,罩部37的前表面成为射出面55。Furthermore, a plurality of lens units 51 for controlling light distribution of light incident from each light emitting element 23 are integrally formed on the cover unit 37 . The lens portion 51 faces each light emitting element 23 and protrudes from the inner surface of the cover portion 37 in a mountain or conical shape, and a concave portion 52 facing the light emitting element 23 is formed on the top of the lens portion 51 . The inner surface of the concave portion 52 becomes the incident surface 53 where the light from the light emitting element 23 enters, the outer surface of the lens portion 51 becomes the reflective surface 54 that totally reflects the light incident from the incident surface 53 forward, and the front surface of the cover portion 37 becomes the light emitting surface. Face 55.
接着,如图1至图3所示,框体12具备:用于固定照明单元11的底架58、覆盖照明单元11的前侧周边部的前面框59、将底架58支承于顶棚等的角铁60。Next, as shown in FIGS. 1 to 3 , the frame body 12 includes a base frame 58 for fixing the lighting unit 11, a front frame 59 covering the front peripheral portion of the lighting unit 11, and a frame for supporting the base frame 58 on a ceiling or the like. Angle iron 60.
底架58具备:上面部61、从该上面部61的两侧向下方弯曲的侧面部62。在上面部61的中央形成有使供电线插通的配线孔58a,在侧面部62的与散热器18的固定孔18c的位置相对应的位置形成有多个安装孔58b。The chassis 58 includes an upper surface 61 and side surfaces 62 bent downward from both sides of the upper surface 61 . A wiring hole 58 a through which a power supply line is inserted is formed at the center of the upper surface 61 , and a plurality of mounting holes 58 b are formed at positions corresponding to the fixing holes 18 c of the heat sink 18 on the side surface 62 .
前面框59形成为矩形框状,并且具备前面部63、设置于该前面部63的周边部的侧面部64。在侧面部64形成有多个安装孔59a,该多个安装孔59a供用于固定底架58以及前面框59和散热器18的螺钉65插通。并且,通过将螺钉65从前面框59的安装孔59a穿过底架58的安装孔58b并且螺纹固定于散热器18的固定孔18c,使散热器18、底架58、前面框59固定成一体,并且由前面框59覆盖发光模块16以及罩19的侧面,前面框59比罩19的前表面更向前方突出。The front frame 59 is formed in a rectangular frame shape, and includes a front portion 63 and a side portion 64 provided on a peripheral portion of the front portion 63 . A plurality of mounting holes 59 a through which screws 65 for fixing the bottom frame 58 , the front frame 59 , and the heat sink 18 are inserted are formed in the side portion 64 . And, by passing the screw 65 from the mounting hole 59a of the front frame 59 through the mounting hole 58b of the bottom frame 58 and screwing it into the fixing hole 18c of the radiator 18, the radiator 18, the bottom frame 58, and the front frame 59 are fixed integrally. , and the side surfaces of the light emitting module 16 and the cover 19 are covered by the front frame 59 , and the front frame 59 protrudes forward more than the front surface of the cover 19 .
角铁60被安装于顶棚等,并且为了调整照明单元11的光照射方向,底架58安装成可调整角度。The angle iron 60 is attached to a ceiling or the like, and the bottom frame 58 is attached so as to be adjustable in angle in order to adjust the light irradiation direction of the lighting unit 11 .
接着,电源装置13容纳于电源箱68内,并且设置于底架58的上表面。电源装置13通过电源线从外部输入交流电力,并且将该交流电力转换成预定的直流电力而供给到各发光模块16。将直流电力供给到各发光模块16时使用带有连接器的供电线,该供电线穿过底架58的配线孔58a以及散热器18的配线孔18b,与各发光模块16的连接器24电连接。Next, the power supply device 13 is accommodated in the power supply box 68 and is installed on the upper surface of the chassis 58 . The power supply unit 13 receives AC power from the outside through a power cord, converts the AC power into predetermined DC power, and supplies it to each light emitting module 16 . When DC power is supplied to each light-emitting module 16, a power supply line with a connector is used. 24 electrical connections.
并且,在组装照明器具10时,首先,将绝缘板17以及发光模块16依次配置于散热器18后,将从散热器18的配线孔18a引出的电源装置13的供电线连接于发光模块16的连接器24,然后,将罩19覆盖于发光模块16,并将螺钉40从罩19的固定部41螺纹固定于散热器18,从而组装照明单元11。另外,以任何顺序组装照明单元11均可,例如也可以将从散热器18的配线孔18a引出的电源装置13的供电线连接于发光模块16的连接器24,然后将发光模块16、绝缘板17和罩19组合在一起,并且将该组合件配置于散热器18后,将螺钉40从罩19的固定部41螺纹固定于散热器18。In addition, when assembling the lighting fixture 10, first, after disposing the insulating plate 17 and the light emitting module 16 on the heat sink 18 in order, connect the power supply line of the power supply device 13 drawn out from the wiring hole 18a of the heat sink 18 to the light emitting module 16. Then, the cover 19 is covered on the light emitting module 16, and the screw 40 is threaded and fixed to the heat sink 18 from the fixing portion 41 of the cover 19, thereby assembling the lighting unit 11. In addition, the lighting unit 11 can be assembled in any order. For example, the power supply line of the power supply device 13 drawn from the wiring hole 18a of the radiator 18 can also be connected to the connector 24 of the light emitting module 16, and then the light emitting module 16, insulated After the plate 17 and the cover 19 are assembled and the assembly is arranged on the heat sink 18 , screws 40 are screwed and fixed to the heat sink 18 from the fixing portion 41 of the cover 19 .
在已组装照明单元11的状态下,由于用螺钉40将罩19紧固于散热器18,因而通过罩19的固定部41将基板22的内侧部按压于散热器18,并且通过罩19的按压部47将基板22的外周部按压于散热器18,从而使基板22的接触面22b整体紧贴于散热器18。In the state where the lighting unit 11 has been assembled, since the cover 19 is fastened to the heat sink 18 with the screws 40, the inner side of the substrate 22 is pressed against the heat sink 18 by the fixing portion 41 of the cover 19, and the pressing force of the cover 19 The portion 47 presses the outer peripheral portion of the substrate 22 against the heat sink 18 so that the entire contact surface 22 b of the substrate 22 is in close contact with the heat sink 18 .
并且,罩19在其与散热器18之间覆盖包含前面以及侧面在内的整个发光模块16。Furthermore, the cover 19 covers the entire light-emitting module 16 including the front and side surfaces between it and the heat sink 18 .
并且,通过使罩19的设置于固定部41的突出部43嵌合于基板22的孔部22c,并且使基板22的外周部嵌合于罩19的嵌合部45,从而使罩19和基板22定位。因此,罩19的各透镜部51和各发光元件23得以定位。And, by fitting the protruding portion 43 provided on the fixing portion 41 of the cover 19 into the hole portion 22c of the substrate 22, and fitting the outer peripheral portion of the substrate 22 into the fitting portion 45 of the cover 19, the cover 19 and the substrate 22 positioning. Accordingly, each lens portion 51 and each light emitting element 23 of the cover 19 are positioned.
另外,从散热器18的配线孔18b引出的供电线穿过罩19的设置于配线罩部39的配线槽49而进入罩19内的配线空间48,从而连接于连接器24。由于罩19具有配线罩部39,因此供电线不会受到过度的负载即可连接于连接器24。In addition, the power supply wire drawn out from the wiring hole 18 b of the heat sink 18 enters the wiring space 48 inside the cover 19 through the wiring groove 49 provided in the wiring cover part 39 of the cover 19 , and is connected to the connector 24 . Since the cover 19 has the wiring cover portion 39, the power supply line can be connected to the connector 24 without receiving an excessive load.
并且,通过从电源装置13向发光元件23供给直流电力,发光元件23得以发光,光入射到透镜部51的入射面53,从射出面55即罩19的下表面向照明空间射出被透镜部51控制成预定配光的光。And, by supplying DC power to the light-emitting element 23 from the power supply device 13, the light-emitting element 23 is able to emit light, the light is incident on the incident surface 53 of the lens portion 51, and is emitted from the lower surface of the cover 19 from the emission surface 55 to the lighting space by the lens portion 51. Light controlled to a predetermined light distribution.
此时,由于透镜部51与罩19形成为一体,因此来自发光元件23的光仅透过透镜部51向照明空间射出,因此,与光分别透过分体的透镜和罩的情况相比,能够降低光的透射损失。At this time, since the lens part 51 and the cover 19 are integrally formed, the light from the light emitting element 23 is emitted to the lighting space only through the lens part 51. Therefore, compared with the case where the light passes through separate lenses and covers separately, it can Reduce light transmission loss.
并且,发光时发光元件23所产生的热量从基板22向散热器18传递,并从散热器18的散热片部30向空气中散热。Then, the heat generated by the light emitting element 23 when emitting light is transferred from the substrate 22 to the heat sink 18 , and is dissipated into the air from the fin portion 30 of the heat sink 18 .
此时,由于通过罩19的固定部41以及按压部47使基板22的接触面22b整体紧贴于散热器18,因而从基板22朝向散热器18的导热性良好,发光元件23的散热性能变高,因此,能够抑制发光元件23的温度过度上升,并且能够将发光元件23的发光效率保持为较高。At this time, since the entire contact surface 22b of the substrate 22 is in close contact with the heat sink 18 by the fixing portion 41 and the pressing portion 47 of the cover 19, the thermal conductivity from the substrate 22 to the heat sink 18 is good, and the heat dissipation performance of the light emitting element 23 is improved. Therefore, it is possible to suppress an excessive rise in the temperature of the light emitting element 23 and to keep the luminous efficiency of the light emitting element 23 high.
如此,根据照明器具10,由于能够降低光的透射损失,以及能够将发光元件23的发光效率保持为较高,因而能够提高光输出的效率。In this way, according to the lighting fixture 10 , since the transmission loss of light can be reduced and the light emitting efficiency of the light emitting element 23 can be kept high, the efficiency of light output can be improved.
并且,由于罩19具备罩部37和侧壁部38,因此能够覆盖发光模块16的周边部,由此,能够通过罩19覆盖整个发光模块16。Furthermore, since the cover 19 includes the cover portion 37 and the side wall portion 38 , it can cover the peripheral portion of the light emitting module 16 , whereby the entire light emitting module 16 can be covered by the cover 19 .
并且,由于相对于光模块16的连接器24的供电线的连接方向A与基板22的一边平行,因此在将发光模块16配置于散热器18时,能够使相对于连接器24的供电线的连接方向A朝向从散热器18引出供电线的配线孔18b,从而能够容易进行相对于连接器24的供电线的配线处理。Moreover, since the connection direction A of the power supply line with respect to the connector 24 of the optical module 16 is parallel to one side of the substrate 22, when the light emitting module 16 is arranged on the heat sink 18, the direction A of the power supply line with respect to the connector 24 can be adjusted. The connection direction A faces the wiring hole 18b through which the power supply line is drawn out from the heat sink 18, so that the wiring process of the power supply line to the connector 24 can be easily performed.
并且,由于前面框59覆盖罩19的周围且比罩19的前表面更向前方突出,因而在设置照明器具10时能够防止罩19物品触碰,从而能够保护罩19。Furthermore, since the front frame 59 covers the periphery of the cover 19 and protrudes forward from the front surface of the cover 19 , when the lighting fixture 10 is installed, the cover 19 can be prevented from being touched by objects and the cover 19 can be protected.
另外,由于散热器18通过挤压成型形成为一体,因此散热器18的可制造性良好,与通过压铸成型形成为一体的情况相比,能够提高散热器18的散热性能。In addition, since the heat sink 18 is integrally formed by extrusion molding, the manufacturability of the heat sink 18 is good, and the heat dissipation performance of the heat sink 18 can be improved compared with the case of integrally forming by die-casting.
并且,虽然可以在散热器18设置有用于安装于框体12的螺纹固定部分,但是若在主体部29的挤压方向P的侧部设置螺纹固定部分,则需要加厚主体部29的厚度,因而质量增加,导致材料费增加。与之相对,在本实施方式中,由于在主体部29的与挤压方向P正交的方向上的侧部设置安装部31,因而无需增加主体部29的厚度,从而能够实现轻量化,能够降低材料费。In addition, although the radiator 18 may be provided with a screw fixing portion for being mounted on the frame body 12, if the screw fixing portion is provided on the side of the extrusion direction P of the main body portion 29, the thickness of the main body portion 29 needs to be thickened. Consequently, the mass increases, leading to an increase in material cost. On the contrary, in this embodiment, since the mounting portion 31 is provided on the side portion of the main body portion 29 in the direction perpendicular to the pressing direction P, it is not necessary to increase the thickness of the main body portion 29, thereby reducing weight and enabling Reduce material costs.
并且,在散热器18中,由于在与挤压方向P正交的方向上的侧部具有安装于框体12的安装部31,因而框体12只需在与散热器18的挤压方向P正交的方向上的侧面上具有与散热器18的安装结构即可,能够使散热器18的挤压方向P上的侧面开放。因此,能够从散热片部30的挤压方向P上的侧面确保相对于散热片部30的空气流动,从而能够提高散热器18的散热性能。Moreover, in the heat sink 18, since the side portion in the direction perpendicular to the extruding direction P has the mounting portion 31 mounted on the frame body 12, the frame body 12 only needs to be aligned with the extruding direction P of the heat sink 18. It is only necessary to have a mounting structure for the heat sink 18 on the side surface in the orthogonal direction, and the side surface in the extrusion direction P of the heat sink 18 can be opened. Therefore, the air flow with respect to the fin part 30 can be ensured from the side surface in the extrusion direction P of the fin part 30, and the heat dissipation performance of the heat sink 18 can be improved.
以上,对本实用新型的若干实施方式进行了例示,但这些实施方式只是举例说明,并没有限定实用新型范围的意图。这些新的实施方式能够以其它各种方式实施,在不脱离本实用新型宗旨的范围内,可进行各种省略、置换、变更。这些实施方式或其变形均属于本实用新型的范围或宗旨内,并且也包含在技术方案中记载的实用新型及其等同的范围内。As mentioned above, although some embodiment of this invention was illustrated, these embodiment is only an illustration, and is not intended to limit the scope of the invention. These new embodiments can be implemented in other various forms, and various omissions, substitutions, and changes can be made without departing from the gist of the present invention. These embodiments and their modifications all belong to the scope or gist of the present invention, and are also included in the utility model described in the technical solution and its equivalent scope.
Claims (1)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-043145 | 2015-03-05 | ||
JP2015043145A JP6566189B2 (en) | 2015-03-05 | 2015-03-05 | lighting equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
CN204879790U true CN204879790U (en) | 2015-12-16 |
Family
ID=54824159
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201520682003.8U Expired - Fee Related CN204879790U (en) | 2015-03-05 | 2015-09-02 | Lighting installation |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6566189B2 (en) |
CN (1) | CN204879790U (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018055794A (en) * | 2016-09-26 | 2018-04-05 | 東芝ライテック株式会社 | Illuminating device |
JP6963721B2 (en) * | 2017-03-06 | 2021-11-10 | 東芝ライテック株式会社 | lighting equipment |
JP6907065B2 (en) * | 2017-08-09 | 2021-07-21 | 三菱電機株式会社 | lighting equipment |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110051410A1 (en) * | 2009-08-28 | 2011-03-03 | Chien Kuo Liang | In-wall led lamp can be adjustable in angles |
JP2012089285A (en) * | 2010-10-18 | 2012-05-10 | Toshiba Lighting & Technology Corp | Light emitting device, and lighting fixture |
JP6055607B2 (en) * | 2012-03-26 | 2016-12-27 | 東芝ライテック株式会社 | Lighting unit and lighting device |
JP5856691B2 (en) * | 2012-10-24 | 2016-02-10 | 学校法人玉川学園 | Lighting device and plant cultivation device |
JP5945246B2 (en) * | 2013-05-21 | 2016-07-05 | 三井化学株式会社 | Manufacturing method of high-reliability lighting fixture and high-reliability lighting fixture manufactured by the manufacturing method |
-
2015
- 2015-03-05 JP JP2015043145A patent/JP6566189B2/en active Active
- 2015-09-02 CN CN201520682003.8U patent/CN204879790U/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP6566189B2 (en) | 2019-08-28 |
JP2016162706A (en) | 2016-09-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7926982B2 (en) | LED illumination device and light engine thereof | |
US9518724B2 (en) | Light emitting device module array | |
US8430532B2 (en) | LED lamp having a heat-dispersing unit | |
JP2010272497A (en) | Electric apparatus | |
KR101032091B1 (en) | Light emitting diode lighting fixtures | |
CN103423613A (en) | Light emitting diode lamp | |
JP5197659B2 (en) | Lighting device | |
JP6380759B2 (en) | lighting equipment | |
CN204879790U (en) | Lighting installation | |
US20140168976A1 (en) | Lighting apparatus | |
TWI544175B (en) | Light emitting diode lamp with high efficiency heat dissipation structure | |
KR20170041126A (en) | Led lamp | |
TWI507634B (en) | Housing and lighting device having the same | |
US9228734B2 (en) | Light-emitting device | |
KR101257283B1 (en) | Radiator of led light | |
JP6197992B2 (en) | Lighting device | |
KR101343045B1 (en) | Heat-dissipating apparatus for LED module | |
US10871281B2 (en) | Lighting device with light guide | |
CN108302344B (en) | Light Emitting Diode Bulbs and Lamp Modules | |
CN205424543U (en) | Lamp device and lighting device | |
KR200454678Y1 (en) | LED lamp | |
KR101161834B1 (en) | Heat sink for led lighting apparatus | |
US20150124444A1 (en) | Led lamp having reflector with high heat dissipation rate | |
JP6811606B2 (en) | Embedded lighting fixtures | |
CN204611393U (en) | Lamp device and lighting device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151216 Termination date: 20170902 |
|
CF01 | Termination of patent right due to non-payment of annual fee |