CN204810788U - Heat conducting structure for electronic component - Google Patents

Abstract

A thermal conductive structure for electronic components, which provides a structure, is easy to assemble, meets cost conditions, improves thermal conductivity, heat dissipation efficiency, and achieves uniform temperature. It includes an electronic component and a cover with an opening to cover the electronic component; the electronic component is selectively provided with a thermal conductive unit. A thermally conductive foil layer or heat pipe is disposed on the cover body, forming an arcuate portion along the opening position, and forming a connection or access opening toward the inside of the cover body to create an escape space to increase the available margin for component assembly. The heat dissipation efficiency of the thermal conductive foil layer is greater than or equal to the heat dissipation efficiency of copper; and the thermal conductive foil layer or the heat pipe is combined with a metal layer and is jointly arranged on the cover. Therefore, the thermal energy of the electronic component can be conducted to the cover and the thermally conductive foil layer, and is quickly output through the heat pipe and metal layer.

Description

Thermally Conductive Structures for Electronic Components

technical field

The utility model relates to a heat conduction/radiation structure design for electronic components; in particular, it refers to a heat conduction foil layer, a cover body, a heat pipe and a metal layer, which selectively cooperate with a heat conduction unit to assist the heat dissipation of an electronic component. Discharged utility model.

Background technique

It is a prior art to use a plurality of arranged heat sinks or fin structures to discharge the waste heat generated by electronic components or computer central processing units, so as to maintain their working efficiency or avoid crashes. The prior art has disclosed an integrally formed aluminum extruded and cut heat sink, or a means of manufacturing the heat dissipation panel and the heat dissipation fins separately, and then inserting, assembling or welding them into an integral structure. For example, Taiwan Patent No. 86116954 "Finn Assembly Method and Product of Heat Dissipating Device" provides a typical embodiment. As those who are familiar with the art know, the art is cumbersome in manufacture, workmanship, and difficulty.

The prior art also discloses a means of setting shaft holes on the cooling fins or fins, and combining shafts or tubes through the shaft holes to assemble and combine into a whole organization. For example, Chinese Taiwan No. 91209087 "Combined Structure of Heat Dissipating Fins" or Chinese Taiwan No. 94205324 "Improved Structure of Heat Dissipating Fins" provide typical embodiments.

The prior art has also disclosed a concept of means for assembling and combining a heat sink or a fin with grooves or slots on the sides or upper and lower ends, and multi-step protrusions or buckles correspondingly snapped together. For example, China Taiwan No. 91213373 "Heat Radiating Fin Fixing Structure Improvement", China Taiwan No. 86221373 "Combined Heat Dissipation Fin Structure", China Taiwan No. 93218949 "Heat Radiator Group Fastening Structure", or China Taiwan No. 91208823 " Combination structure of heat dissipation fins" patent case, etc., have also provided feasible embodiments.

Typically, these references show structural techniques related to the application of thermal dissipating structural arrangements to electronic assemblies. Existing heat sink or fin structures often tend to use complex structural combinations such as shafts or tubes, slots, multi-step protrusions, or snap-fit corresponding buckles. If the cooling structure is redesigned to make its structure different from that of the prior art, its usage form can be changed, and it is different from the old method. For example, make its structural design conform to a streamlined condition, or facilitate combination, and have the functions of dustproof protection, preventing electromagnetic interference and improving heat dissipation efficiency; especially, further cooperate with the arrangement of a metal foil layer that can produce rapid heat conduction The structure can establish a space application margin according to the configuration space of the electronic components, and increase the heat dissipation area and/or efficiency of the electronic components; these issues are not disclosed in the above reference materials.

Utility model content

The main purpose of the utility model is to provide a heat conduction structure for electronic components, which provides a structure, easy assembly, meets cost conditions, improves heat conduction, heat dissipation efficiency, and achieves temperature uniformity.

In order to achieve the above purpose, the utility model provides a heat conduction structure for electronic components, which includes: a cover body, the cover body has a rigid wall, defines the cover body to form an inner space, and covers an electronic component; the cover body has an inner wall, an outer wall and an opening formed between the inner wall and the outer wall;

One of the heat-conducting foil layer and the heat pipe is arranged on the cover body, and an arcuate part is provided in cooperation with the opening;

The heat conduction foil layer is made of a thin layer of metal material, with a first surface and a second surface; the heat conduction efficiency of the heat conduction foil layer is greater than or equal to the heat conduction efficiency of copper;

the thermally conductive foil layer engages the heat pipe; the heat pipe contains a heat exchange fluid; and

A metal layer is conformally connected to one of the heat pipe and the heat conduction foil layer; the metal layer includes a first surface, a second surface, and a metal layer arched portion matched with the above-mentioned arched portion.

The heat conduction structure for electronic components, wherein, the electronic components are provided with a heat conduction unit;

The heat conduction unit is made of a material capable of conducting heat to form a block structure, and has a first end and a second end; the first end of the heat conduction unit is arranged on the electronic component, and the second end of the heat conduction unit is connected to the inner wall of the cover and the first surface of the thermally conductive foil layer;

The heat conduction foil layer forms its arcuate portion along the second end of the heat conduction unit, the outer wall surface of the cover, and the position of the opening, allowing the arcuate portion of the heat conduction foil layer to enter the opening; the second surface of the heat conduction foil layer joins the first portion of the heat pipe. side;

Corresponding to the arcuate portion of the heat-conducting foil layer, the heat pipe is formed with an arcuate portion; and

The second side of the heat pipe combines with the first side of the metal layer.

The heat conduction structure for electronic components, wherein, the electronic components are provided with a heat conduction unit;

The heat conduction unit is made of a material capable of conducting heat to form a block structure, and has a first end and a second end; the first end of the heat conduction unit is arranged on the electronic component, and the second end of the heat conduction unit is connected to the inner wall surface of the cover and the first side of the heat pipe;

The heat pipe forms an electromagnetic seal along the second end of the heat conduction unit, the outer wall surface of the cover, and the position of the opening, and the arch of the heat pipe allows entry into the opening; the second side of the heat pipe is bonded to the first surface of the heat conduction foil layer;

The arcuate portion of the thermally conductive foil layer corresponds to the arcuate portion engaging the heat pipe; and

The second surface of the thermally conductive foil layer is combined with the first surface of the metal layer.

The heat conduction structure for electronic components, wherein the first surface of the heat conduction foil layer is arranged on the outer wall of the cover;

The heat-conducting foil layer forms its arcuate portion along the outer wall surface of the cover and the position of the opening, allowing the arcuate portion of the heat-conducting foil layer to enter the opening;

the second surface of the thermally conductive foil layer engages the first side of the heat pipe;

Corresponding to the arcuate portion of the heat-conducting foil layer, the heat pipe is formed with an arcuate portion; and

The second side of the heat pipe combines with the first side of the metal layer.

The heat conduction structure for electronic components, wherein, the first side of the heat pipe is arranged on the outer wall surface of the cover body, and forms an electromagnetic seal for the opening;

The heat pipe forms its arcuate portion along the outer wall of the cover and the position of the opening, allowing the arcuate portion of the heat pipe to enter the opening;

the second side of the heat pipe engages the first surface of the thermally conductive foil layer;

The arcuate portion of the thermally conductive foil layer corresponds to the arcuate portion engaging the heat pipe; and

The second surface of the thermally conductive foil layer is combined with the first surface of the metal layer.

The heat conduction structure for electronic components, wherein the area of the metal layer is larger than the area of the outer wall of the cover, and the metal layer defines a heat source area and a non-heat source area connected to the heat source area; and

The metal layer is provided with at least one column; the column is located between the non-heat source area of the metal layer and a circuit board, so that the column supports the non-heat source area of the metal layer.

The heat conduction structure for an electronic component, wherein the electronic component includes a heat source component that generates heat energy and a non-heat source component that does not generate heat energy; the non-heat source component is covered by a secondary cover;

The secondary cover has a rigid wall, which defines the secondary cover to form an inner space and covers the non-heat source element; the secondary cover has an inner wall surface and an outer wall surface; and

One of the thermally conductive foil layer and the heat pipe engages the cover rigid wall and the secondary cover rigid wall.

In the heat conduction structure for electronic components, the metal layer is arranged with a coating made of a heat radiation substance at least in a local area.

The utility model comprises an electronic component and a cover body with an opening to cover the electronic component; the electronic component is optionally provided with a heat conduction unit. A thermally conductive foil layer or heat pipe with a geometrical profile is arranged on the cover body, forming a bow-shaped portion that is concave toward the opening along the opening position, and connects or enters the opening to establish a dodging space in the area above the opening to increase the temperature of the group. with applicable margins. The heat dissipation efficiency of the heat conduction foil layer is greater than or equal to the heat dissipation efficiency of copper; and the heat conduction foil layer or heat pipe combined with a metal layer are jointly arranged on the cover. Therefore, the heat energy of the electronic component can be conducted to the cover body and the heat conduction foil layer, and the heat dissipation can be quickly output through the heat pipe and the metal layer.

According to the heat conduction structure for electronic components of the present invention, the metal layer forms a geometric profile structure; moreover, the area of the metal layer is larger than the area of the cover. And, the metal layer defines a heat source area above the cover and a connection heat source area to form a cantilever type area (or non-heat source area); the metal layer is provided with at least one column; the columnar level Between the non-heat source area of the metal layer and a circuit board, the pillar supports the non-heat source area of the metal layer.

According to the heat conduction structure for electronic components of the present invention, the electronic components include electronic components that generate waste heat (defined as heat source components) and electronic components that do not generate waste heat (defined as non-heat source components). The heat conduction unit and/or the heat conduction foil layer cooperate with the cover body and are arranged on the heat source element; a secondary cover body wraps the non-heat source element. And, arrange a heat pipe or heat conduction foil layer to pass through each cover body and sub-cover body; therefore, the heat energy of the heat source element can be conducted to the cover body and the sub cover body through the heat conduction unit and the heat conduction foil layer, and can be rapidly heated through the heat pipe and the metal layer Output; used to establish a cover (and/or sub-cover), heat conduction foil layer and heat pipe path according to the positions of heat source components and non-heat source components, so as to establish a function of increasing heat dissipation area or heat dissipation range.

Description of drawings

Fig. 1 is the structural combination schematic diagram of the embodiment of the utility model;

Fig. 2 is an exploded schematic diagram of the structure of Fig. 1; it shows the structural situation of the electronic components, the heat conduction unit, the cover body, the heat conduction foil layer forming an arcuate part arranged between the heat conduction unit and the heat pipe, the heat pipe and the metal layer;

Figure 3 is a schematic cross-sectional view of the structural combination of Figure 1; it depicts the combination of electronic components, heat conduction units, covers, heat conduction foil layers forming arcuate parts arranged between heat conduction units and heat pipes, heat pipes and metal layers;

Figure 4 is a schematic cross-sectional view of a structural combination of the present invention; it shows the combination of electronic components, heat conduction units, covers, heat pipes arranged between the cover and the heat conduction foil layer, and the heat conduction foil layer joined to the metal layer;

Fig. 5 is a three-dimensional exploded schematic diagram of the structure of Fig. 4;

Fig. 6 is a schematic cross-sectional view of another structural combination of the present invention; it depicts the combination of the electronic components, the cover, the heat-conducting foil layer forming an arcuate part arranged between the cover and the heat pipe, and the heat pipe and the metal layer;

Figure 7 is a schematic cross-sectional view of another structural combination of the present invention; it depicts the combination of electronic components, cover body, heat pipe forming arcuate part arranged between the cover body and the heat conduction foil layer, heat conduction foil layer bonded to the metal layer, etc. ;

Fig. 8 is a schematic diagram of the structural combination of a modified embodiment of the present invention; it depicts the arrangement of electronic components, heat conduction unit, cover, and heat conduction foil layer forming an arched portion between the cover and heat pipe, and between the metal layer and the circuit board Combination of parts such as pillars;

Fig. 9 is a schematic exploded view of the structure of Fig. 8;

Fig. 10 is a schematic cross-sectional view of the structural combination of Fig. 8;

Figure 11 is a schematic cross-sectional view of a structural combination of the present invention; it shows that the electronic components, the heat conduction unit, the cover, and the heat pipe form an arcuate part arranged between the cover and the heat conduction foil layer, and the columnar structure is arranged between the metal layer and the circuit board. Combination of parts, etc.;

Fig. 12 is a schematic cross-sectional view of another structural combination of the present invention; it depicts electronic components, a cover body, and a heat-conducting foil layer forming an arcuate portion arranged between the cover body and the heat pipe, and columns arranged between the metal layer and the circuit board, etc. combination of parts;

Fig. 13 is a schematic cross-sectional view of another structural combination of the present invention; it shows that the electronic components, the cover body, and the arcuate part of the heat pipe are arranged between the cover body and the heat-conducting foil layer, and columns are arranged between the metal layer and the circuit board, etc. combination of parts;

Fig. 14 is a schematic diagram of a structural combination of a feasible embodiment of the present invention; it shows that the heat source element, the heat conduction unit, the cover, and the heat conduction foil layer are arranged on the heat conduction unit and the cover, and the non-heat source element is provided with a secondary cover, a heat pipe and a metal layer The structural combination of the parts, as well as the arrangement path of the heat pipe connecting the heat conduction foil layer and the secondary cover;

Fig. 15 is an exploded schematic diagram of the structure of Fig. 14;

Fig. 16 is a schematic cross-sectional view of the structural combination of Fig. 14;

Figure 17 is a schematic cross-sectional view of a structural combination of the present invention; it depicts the heat source element, the heat conduction unit, the cover, the heat pipe connecting the heat conduction unit and the cover, the non-heat source element with the secondary cover, the heat conduction foil layer and the metal layer, etc. Structural combinations, and the arrangement of heat pipes connecting the cover and the sub-cover;

Fig. 18 is a schematic cross-sectional view of a structural combination of the present invention; it shows that the heat source element, the cover body, and the heat-conducting foil layer are arranged on the cover body to form an arcuate part, and the non-heat source element is provided with a sub-cover body, heat pipes and metal layers. Structural combination, and the arrangement path of the heat pipe connecting the heat conduction foil layer and the secondary cover;

Figure 19 is a schematic cross-sectional view of another structural combination of the present utility model; it depicts heat source elements, a cover body, heat pipes forming an arcuate part on the cover body, non-heat source elements are provided with a secondary cover body, heat conduction foil layer and metal layer, etc. The structural combination of the situation, and the arrangement path of the heat pipe connects the cover and the secondary cover.

Explanation of reference signs: 10-heat conduction unit; 11-first end; 12-second end; 20-electronic component; 20A-heat source element; 20B-non-heat source element; 30-cover; 30B-secondary cover; 31 , 36-rigid wall; 32, 37-inner space; 33, 38-inner wall; 34, 39-outer wall; 35-opening; 40-circuit board; 50-heat pipe; 51-first side; 52-second 53-side; 55-heat exchange fluid; 59, 63, 93-arch; 60-metal layer; 61-first side; 62-second side; 90-thermal foil layer; 91-first surface; 92 - second surface.

Detailed ways

Please refer to FIG. 1 , FIG. 2 and FIG. 3 , the heat conduction structure for electronic components of the present invention includes a heat conduction unit 10 disposed on an electronic component 20 . Basically, the electronic components 20 are disposed on a circuit board 40 . In the adopted embodiment, the heat conduction unit 10 is made of a block structure with a geometrical profile by selecting materials capable of conducting heat energy, and has a first end 11 and a second end 12; the first end 11 and the second end 12 The second ends 12 respectively form a planar structure, and the first ends 11 are stacked on the electronic component 20 to conduct waste heat (or thermal energy) generated by the electronic component 20 during operation.

FIG. 1 , FIG. 2 and FIG. 3 show that the heat conduction structure also includes a cover 30 covering the electronic component 20 and the heat conduction unit 10 . In detail, the cover 30 has a rigid wall 31, which defines the cover 30 to form a box (or plate-shaped body) structure with an internal space 32; the cover 30 (or rigid wall 31) has an inner wall surface 33 , the outer wall surface 34 and an opening 35 formed on the inner wall surface 33 and the outer wall surface 34 . And, the second end 12 of the heat conduction unit 10 is connected to the inner wall surface 33 of the cover and bonded with a heat conduction foil layer 90 .

Fig. 1, Fig. 2 and Fig. 3 depict that the heat conduction foil layer 90 is arranged on the heat conduction unit 10 and the cover body 30; and, allowing the arcuate portion 93 to connect or enter the opening 35 . Specifically, the thermally conductive foil layer 90 selects a metal material (for example, gold, silver, copper or the like) to make a thin layer structure with a geometric profile, and has better electrical conductivity, thermal conductivity and temperature uniformity than ordinary metals. effect, or make the heat conduction (or conduction) efficiency of the heat conduction foil layer 90 greater than or equal to the heat conduction efficiency of copper; and, the heat conduction foil layer 90 includes or defines a first surface 91 and a second surface 92 . The first surface 91 is disposed on the second end 12 of the heat conduction unit 10 and the outer wall surface 34 of the cover, and the second surface 92 is connected or bonded to a heat pipe 50 . Therefore, the heat conduction foil layer 90 can assist the heat conduction unit 10 to rapidly diffuse and conduct heat energy or waste heat generated by the electronic components 20 to the cover body 30 and the heat pipe 50 .

It can be understood that the structure of the cover 30 significantly increases the heat dissipation area of the electronic component 20; the cover 30 also provides grounding and dustproof protection for the electronic component 20, conducts magnetism, or prevents electromagnetic interference. Moreover, the structural design of the heat conduction unit 10 joining the cover body and the heat conduction foil layer 90 enables the heat conduction unit 10 to directly transfer the waste heat (or thermal energy) generated by the electronic component 20 to the heat pipe 50 for rapid output, which is obviously obtainable. reduce thermal resistance. And, the structural combination of the heat conduction unit 10 , the cover 30 and the heat conduction foil layer 90 significantly increases the heat dissipation area of the electronic component 20 .

Fig. 1, Fig. 2 and Fig. 3 also show that the heat pipe 50 comprising the heat exchange fluid 55 is combined on the heat conduction foil layer 90, and according to the structure of the arch portion 93 of the heat conduction foil layer 90, an arcuate portion 59 is formed, joined Thermally conductive foil layer 90 . The phantom line in FIG. 3 partially depicts that the heat pipe 50 can also form a straight pipe structure and join the heat conducting thin layer 90 . The heat pipe 50 is combined with the second surface 92 of the heat-conducting foil layer by welding or bonding. Therefore, the waste heat (or thermal energy) generated by the electronic components 20 can be conducted and diffused to the cover 30 through the heat conduction unit 10 and the heat conduction foil layer 90 , and then cooled, exchanged and output through the heat pipe 50 . That is to say, the heat pipe 50 can quickly guide heat energy away from the heat source area; or according to the figure, it can guide heat energy to a conforming metal layer 60 or other lower temperature areas to prevent heat concentration.

It must be noted that the structural combination of the cover opening 35, the heat-conducting foil layer arch 93 and the heat pipe arch 59 creates an additional avoidance space above the opening 35 to increase the applicability of parts assembly. The margin allows personnel to reserve a large configuration range and configuration space in the body according to the configuration type of electronic components.

In a feasible embodiment, the heat pipe 50 has a first side 51 , a second side 52 and at least one side 53 connecting the first side 51 and the second side 52 . The first side 51 of the heat pipe 50 is connected to the second surface 92 of the heat conducting thin layer; and, the second side 52 of the heat pipe 50 is provided with the metal layer 60 . The figure shows that the metal layer 60 is set as a film or sheet structure to form a larger contact area or heat dissipation area with the outside world; the metal layer 60 has a first surface 61 and a second surface 62; the first surface 61 can rely on the heat pipe 50 The curved line fits the second side 52 of the heat pipe 50 to form an arcuate portion 63, and cooperates with the rapid conduction of the heat pipe 50 to quickly discharge the above-mentioned heat energy or heat.

In a modified embodiment, part or all of the metal layer 60 may be coated with a heat radiation material to establish a radiation heat dissipation effect.

Please refer to FIG. 4 and FIG. 5 , which show a derivative embodiment. The first end 11 of the heat conduction unit is arranged on the electronic component 20, the second end 12 is connected to the inner wall surface 33 of the cover, and the arcuate portion 59 of the heat pipe 50 is connected to or enters the opening 35 to be engaged with the second end 12 of the heat conduction unit, and is connected to the outer body of the cover. The part on the wall surface 34 forms an electromagnetic seal to the opening 35; and, the heat-conducting thin layer 90 and/or the metal layer 60 with the arcuate portions 93, 63, corresponding to the arcuate portion 59 of the heat pipe, are sequentially arranged on the top of the heat pipe 50 The position is such that the first surface 91 of the heat conduction foil layer is connected to the second side 52 of the heat pipe; the second surface 92 is combined with the structure of the first surface 61 of the metal layer.

Referring to Figure 6, a modified embodiment is depicted. The cover 30 covers the electronic component 20 ; the heat conduction foil layer 90 is disposed between the cover 30 and the heat pipe 50 . That is, the first surface 91 of the thermally conductive foil layer is disposed on the outer wall surface 34 of the cover so that the arcuate portion 93 is connected to or enters the opening 35; the arcuate portion 93 of the thermally conductive foil layer and/or the arcuate portion 63 of the metal layer 60 corresponds to the arched portion of the heat pipe The portion 59 is such that the second surface 92 of the thermally conductive foil layer 90 is joined to the first side 51 of the heat pipe. And, the heat pipe 50 is disposed between the heat-conducting foil layer 90 and the metal layer 60 to form a structure in which the second side 52 of the heat pipe combines with the first surface 61 of the metal layer.

Figure 7 shows a possible embodiment. The cover 30 covers the electronic component 20 ; the heat pipe 50 is disposed between the cover 30 and the heat conducting foil layer 90 . That is, the first side 51 of the heat pipe is arranged on the outer wall surface 34 of the cover, so that the arcuate portion 59 faces the inner connection or the opening 35 of the cover body 30; 90 The first surface 91 engages the second side 52 of the heat pipe. And, the heat conduction foil layer 90 is disposed between the heat pipe 50 and the metal layer 60 , forming a structure in which the second surface 92 of the heat conduction foil layer is combined with the first surface 61 of the metal layer.

Please refer to FIG. 8 , FIG. 9 and FIG. 10 , which depict a specific embodiment. The electronic component 20 is disposed on the circuit board 40; the cover body 30 covers the electronic component 20 and the heat conduction unit 10, so that the first end 11 of the heat conduction unit is arranged on the electronic component 20, and the second end 12 is connected to the inner wall surface 33 of the cover, and joined The first surface 91 of the thermally conductive foil layer.

The figure depicts the position where the heat conduction foil layer 90 is arranged on the heat conduction unit 10 and the cover body 30 to electromagnetically close the opening 35 and make the arcuate portion 93 of the heat conduction foil layer 90 face the internal connection or access opening of the cover body 30 35, let the first surface 91 join the second end 12 of the heat conduction unit 10 and the outer wall surface 34 of the cover, and the arcuate portion 93 of the heat conduction foil layer corresponds to the arcuate portion 59 of the heat pipe, so that the second surface 92 of the heat conduction foil layer is connected or joined to the second end of the heat pipe 51 on one side. Therefore, the heat conduction foil layer 90 can assist the heat conduction unit 10 to rapidly diffuse and conduct heat energy or waste heat generated by the electronic components 20 to the cover body 30 and the heat pipe 50 . The phantom line in FIG. 9 depicts the structure of the heat pipe 50 forming a straight pipe structure and joining the heat conducting thin layer 90 .

The figure also shows the structure in which the second side 52 of the heat pipe joins the first surface 61 of the metal layer; and the area of the metal layer 60 is larger than the area of the cover 30 (outer wall 34 ). In the adopted embodiment, the metal layer 60 is a plate-shaped object with a rectangular outline, defining a heat source area 63 superimposed on the heat pipe 50 and a connecting heat source area 63 to form a cantilever-type area (or non-heat source area). District 64). And, the metal layer 60 is provided with at least one pillar 70; the pillar 70 is located between the non-heat source region 64 of the metal layer 60 and the circuit board 40, so that the pillar 70 supports the non-heat source region of the metal layer 60 64. After the metal layer 60 and the heat pipe 50 are combined, no sagging will occur.

In a feasible embodiment, a coating (not shown) is disposed on a part or all of the metal layer 60; The role of heat dissipation.

Assuming that the coating is arranged in the non-heat source region 64 of the metal layer 60; when the electronic component 20 works, waste heat (or thermal energy) is conducted to the cover body 30, the heat-conducting foil layer 90, the heat pipe 50 and the metal layer 60 through the heat conduction unit 10 After the heat source area 63, the heat energy will be conducted from the heat source area 63 to the non-heat source area 64, and the coated heat radiation material will dissipate heat in a radiation manner, and cooperate with the heat pipe 50 for rapid conduction, cooling exchange, and then the effect of output can obviously be obtained. A more ideal thermal efficiency than the older method. In particular, the area of the metal layer 60 is significantly larger than the area of the cover 30 (the outer wall surface 34 ), so that the heat conduction structure has a better heat dissipation effect than the prior art.

Please refer to Figure 11, which shows a derivative embodiment. The first end 11 of the heat conduction unit is arranged on the electronic component 20, the second end 12 is connected to the inner wall surface 33 of the cover, and the arcuate portion 59 of the heat pipe 50 is connected to or enters the opening 35 to be engaged with the second end 12 of the heat conduction unit, and is connected to the outer body of the cover. The part on the wall surface 34 forms an electromagnetic seal to the opening 35; and, the heat-conducting thin layer 90 and or the metal layer 60 with the arcuate portions 93, 63, corresponding to the arcuate portion 59 of the heat pipe, are sequentially arranged at the position above the heat pipe 50 , make the first surface 91 of the heat conduction foil layer join the second side 52 of the heat pipe; the second surface 92 combines the structure of the first surface 61 of the metal layer. And, the pillars 70 support the structure of the metal layer 60 (or the non-heat source region 64 ).

Referring to Figure 12, a modified embodiment is depicted. The cover 30 covers the electronic component 20 ; the heat conduction foil layer 90 is disposed between the cover 30 and the heat pipe 50 . That is, the first surface 91 of the thermally conductive foil layer is disposed on the outer wall surface 34 of the cover so that the arcuate portion 93 is connected to or enters the opening 35; the arcuate portion 93 of the thermally conductive foil layer and/or the arcuate portion 63 of the metal layer 60 corresponds to the arched portion of the heat pipe The portion 59 is such that the second surface 92 of the thermally conductive foil layer 90 is joined to the first side 51 of the heat pipe. Moreover, the heat pipe 50 is disposed between the heat conduction foil layer 90 and the metal layer 60 , forming a structure in which the second side 52 of the heat pipe combines with the first surface 61 of the metal layer. And, the pillars 70 support the structure of the metal layer 60 (or the non-heat source region 64 ).

Please refer to Fig. 13, which shows another derivative embodiment. The cover 30 covers the electronic component 20 ; the heat pipe 50 is disposed between the cover 30 and the heat conducting foil layer 90 . That is, the first side 51 of the heat pipe is arranged on the outer wall surface 34 of the cover, so that the arcuate portion 59 faces the inner connection or the opening 35 of the cover body 30; 90 The first surface 91 engages the second side 52 of the heat pipe. Moreover, the heat conduction foil layer 90 is disposed between the heat pipe 50 and the metal layer 60 , forming a structure in which the second surface 92 of the heat conduction foil layer is combined with the first surface 61 of the metal layer. And, the pillars 70 support the structure of the metal layer 60 (or the non-heat source region 64 ).

14, FIG. 15 and FIG. 16, it is assumed that the electronic components 20 configured on the circuit board 40 include electronic components that generate waste heat (defined as heat source components 20A) and electronic components that do not generate waste heat (defined as non-heat source components 20B). ). The cover 30 covers the heat source element 20A and the heat conduction unit 10; the arcuate part 93 of the heat conduction foil layer is connected to or enters the opening 35, so that the first surface 91 is arranged on the second end 12 of the heat conduction unit and the outer wall surface 34 of the cover, and is electromagnetically closed The opening 35 ; makes the arcuate portion 59 of the heat pipe correspond to the arcuate portion 93 of the thermally conductive foil layer, and allows the second surface 92 of the thermally conductive foil layer to join the first edge 51 of the heat pipe. A secondary cover 30B is provided to cover the non-heat source element 20B. And, the heat pipe 50 is arranged to pass through or connect each cover body 30 (or heat conduction foil layer 90) and the secondary cover body 30B; therefore, the heat energy of the heat source element 20A can be conducted to the cover body 30 through the heat conduction unit 10 and the heat conduction foil layer 90 and secondary cover 30B, and output quickly through heat pipe 50 and metal layer 60; to establish a position according to heat source element 20A, non-heat source element 20B, arrange cover 30 (and/or secondary cover 30B), heat conduction foil layer 90 and the path of the heat pipe 50 are used to establish a function of increasing the heat dissipation area or the heat dissipation range.

The imaginary line in FIG. 16 partially depicts the structure in which the heat pipe 50 forms a straight pipe structure and joins the heat-conducting thin layer 90 .

In the adopted embodiment, the auxiliary cover body 35 also has a rigid wall 36, which limits the auxiliary cover body 30B to form a box (or plate-shaped body) structure with an internal space 37; the auxiliary cover body 30B has an inner wall surface 38 and an outer wall surface 39 ; In the adopted embodiment, the inner wall surface 38 and the outer wall surface 39 of the auxiliary cover body 30B also form a plane structure.

The figure shows that the heat pipe 50 is disposed between the heat-conducting foil layer 90 (and/or the secondary cover 30B) and the metal layer 60 . Therefore, the first side 51 of the heat pipe is connected to the first surface 91 of the heat-conducting foil layer (or the side 53 can be connected to the rigid wall 31 of the cover body) and the outer wall surface 39 of the auxiliary cover; and the second side 52 of the heat pipe is connected to the first surface 61 of the metal layer the structural type.

It can be understood that the structure of the secondary cover 30B assists in increasing the heat dissipation area of the heat source element 20A; and the secondary cover 30B also provides grounding and dustproof protection for the non-heat source element 20B, conducts magnetism or prevents electromagnetic interference And so on.

It should be noted that the heat conduction foil layer 90, the cover body 30 (and/or the secondary cover body 30B) and the heat pipe 50 are arranged according to the positions of the heat source element 20A and/or the non-heat source element 20B, so that the heat source element 20A generates The waste heat or thermal energy can be conducted to the cover 30 and the sub-cover 30B through the heat conduction unit 10 and the heat conduction foil layer 90, and output in conjunction with the heat pipe 50 path and the metal layer 60 to increase the heat dissipation area and temperature uniformity effect of the heat conduction system. That is to say, the waste heat (or thermal energy) produced by the heat source element 20A is not only discharged through the heat conduction unit 10 connected to it, the heat conduction foil layer 90 and the cover 30, the secondary cover 30B, and the heat pipe 50; The metal layer 60. Therefore, the heat dissipation area of the heat conduction structure is significantly increased; moreover, in conjunction with the diffusion and heat conduction effect of the heat conduction foil layer 90 , a more ideal temperature equalization effect than that of the prior art can be obtained.

Referring to Figure 17, a derivative embodiment is shown. The first end 11 of the heat conduction unit is arranged on the heat source element 20A, the second end 12 is connected to the inner wall surface 33 of the cover, and the arcuate portion 59 of the heat pipe 50 is connected to or enters the opening 35, and is joined to the second end 12 of the heat conduction unit and the outer wall surface 34 of the cover. And on the outer wall surface 39 of the auxiliary cover; and, the heat-conducting thin layer 90 and or the metal layer 60 with arcuate portions 93, 63 correspond to the heat pipe arcuate portion 59, and are arranged at a position above the heat pipe 50, so that the first surface 91 of the heat-conducting foil layer The second side 52 of the heat pipe is joined; the second surface 92 is combined with the structure of the first surface 61 of the metal layer.

Please refer to FIG. 18 , the cover 30 covers the heat source element 20A; the heat conduction foil layer 90 is disposed between the cover 30 and the heat pipe 50 . That is, the first surface 91 of the heat-conducting foil layer is arranged on the outer wall surface 34 of the cover, so that the arcuate portion 93 is connected to or enters the opening 35 toward the inner part of the cover body 30; The second surface 92 of the foil layer 90 is joined to the first side 51 of the heat pipe, and the first side 51 of the heat pipe is also connected to the rigid wall 36 or the outer wall surface 39 of the secondary cover. Moreover, the heat pipe 50 is disposed between the heat conduction foil layer 90 and the metal layer 60 , forming a structure in which the second side 52 of the heat pipe combines with the first surface 61 of the metal layer.

Please refer to Fig. 19, which shows another derivative embodiment. The cover 30 covers the heat source element 20A; the heat pipe 50 is disposed between the cover 30 and the heat conducting foil layer 90 . That is, the first side 51 of the heat pipe is arranged on the outer wall surface 34 of the cover, and electromagnetically closes the opening 35, and makes the arcuate portion 59 face the inner connection of the cover body 30 or enter the opening 35; the arcuate portion 93 of the heat-conducting foil layer corresponds to the arch of the heat pipe Shaped portion 59 , so that the first surface 91 of the heat conduction foil layer 90 is joined to the second side 52 of the heat pipe, and the first side 51 of the heat pipe is also connected to the rigid wall 36 or the outer wall surface 39 of the secondary cover. Moreover, the heat conduction foil layer 90 is disposed between the heat pipe 50 and the metal layer 60 , forming a structure in which the second surface 92 of the heat conduction foil layer is combined with the first surface 61 of the metal layer.

Typically, this heat-conducting structure used for electronic components has the following considerations and advantages compared to the old method, provided that it is protected against dust, prevents electromagnetic interference, and complies with manufacturing costs:

1. The heat conduction structure and related component structures, operation and use conditions, etc. have been redesigned and considered, which is different from the existing technology; and its use pattern has been changed, which is different from the old method. For example, make the electronic component 20 cooperate with the heat conduction unit 10, the heat conduction foil layer 90, the cover body 30, or the heat conduction unit 10 includes the first end 11 and the second end 12, and the heat conduction foil layer 90 includes the first surface 91 and the second surface 92, cooperate with the inner wall surface 33 and the outer wall surface 34 of the cover body 30, or combine the heat pipe 50 and the metal layer 60; or cooperate with the heat conduction foil layer 90 to form the arcuate part 93 structure, so that the heat pipe 50 is correspondingly provided with the arcuate part 59 and other parts The structural design obviously removes the more complex structural combination types such as shafts or tubes, slots, multi-step protrusions or buckles corresponding to the conventional heat dissipation structure, and provides a streamlined structure than the existing technology. And the structural design that is convenient to combine.

2. The metal foil layer 90 is arranged to connect the structure of the heat conduction unit 10, the cover body 30, the heat pipe 50 or the metal layer 60, which can produce a rapid diffusion and heat conduction effect, which relatively improves the heat dissipation efficiency of the electronic component 20, and also obtains a comparative advantage. The more ideal temperature equalization effect of the existing technology. Moreover, the structural design of the cover 30 (and/or sub-cover 30B), the heat pipe 50 path, and the metal layer 60 is arranged according to the positions of the heat source element 20A and the non-heat source element 20B, so that the heat dissipation area of the heat conduction structure is significantly increased. , and the formation of a larger contact pattern also improves its heat dissipation or waste heat discharge effect.

3. In particular, the structural combination of the lid opening 35, the heat-conducting foil layer arcuate portion 93, the metal layer arcuate portion 63 and the heat pipe arcuate portion 59 establishes a condition with excellent heat dissipation effect, It also has extra dodging space to increase the applicability of parts assembly, so that personnel can have a larger configuration range and configuration space according to the configuration of electronic components.

Therefore, the utility model provides an effective heat conduction structure for electronic components. Its spatial configuration is different from that of the prior art, and has incomparable advantages in the old method. It shows considerable progress and is fully practical. Requirements for a utility model patent.

However, the above descriptions are only feasible embodiments of the utility model, and are not used to limit the implementation scope of the utility model, that is, all equal changes and modifications made according to the patent scope of the utility model are all within the patent scope of the utility model covered.

Claims (10)

1. A heat conduction structure for electronic components, characterized in that it comprises: a cover body, the cover body has a rigid wall, defines the cover body to form an inner space, and covers an electronic component; the cover body has an inner wall surface, an outer wall and an opening formed between the inner wall and the outer wall; One of the heat-conducting foil layer and the heat pipe is arranged on the cover body, and an arcuate part is provided in cooperation with the opening; The heat conduction foil layer is made of a thin layer of metal material, with a first surface and a second surface; the heat conduction efficiency of the heat conduction foil layer is greater than or equal to the heat conduction efficiency of copper; the thermally conductive foil layer engages the heat pipe; the heat pipe contains a heat exchange fluid; and A metal layer is conformally connected to one of the heat pipe and the heat conduction foil layer; the metal layer includes a first surface, a second surface, and a metal layer arched portion matched with the above-mentioned arched portion. 2. The heat conduction structure for electronic components as claimed in claim 1, characterized in that, the electronic components are provided with a heat conduction unit; The heat conduction unit is made of a material capable of conducting heat to form a block structure, and has a first end and a second end; the first end of the heat conduction unit is arranged on the electronic component, and the second end of the heat conduction unit is connected to the inner wall of the cover and the first surface of the thermally conductive foil layer; The heat conduction foil layer forms its arcuate portion along the second end of the heat conduction unit, the outer wall surface of the cover, and the position of the opening, allowing the arcuate portion of the heat conduction foil layer to enter the opening; the second surface of the heat conduction foil layer joins the first portion of the heat pipe. side; Corresponding to the arcuate portion of the heat-conducting foil layer, the heat pipe is formed with an arcuate portion; and The second side of the heat pipe combines with the first side of the metal layer. 3. The heat conduction structure for electronic components as claimed in claim 1, characterized in that, the electronic components are provided with a heat conduction unit; The heat conduction unit is made of a material capable of conducting heat to form a block structure, and has a first end and a second end; the first end of the heat conduction unit is arranged on the electronic component, and the second end of the heat conduction unit is connected to the inner wall surface of the cover and the first side of the heat pipe; The heat pipe forms an electromagnetic seal along the second end of the heat conduction unit, the outer wall surface of the cover, and the position of the opening, and the arch of the heat pipe allows entry into the opening; the second side of the heat pipe is bonded to the first surface of the heat conduction foil layer; The arcuate portion of the thermally conductive foil layer corresponds to the arcuate portion engaging the heat pipe; and The second surface of the thermally conductive foil layer is combined with the first surface of the metal layer. 4. The heat conduction structure for electronic components according to claim 1, wherein the first surface of the heat conduction foil layer is arranged on the outer wall of the cover; The heat-conducting foil layer forms its arcuate portion along the outer wall surface of the cover and the position of the opening, allowing the arcuate portion of the heat-conducting foil layer to enter the opening; the second surface of the thermally conductive foil layer engages the first side of the heat pipe; Corresponding to the arcuate portion of the heat-conducting foil layer, the heat pipe is formed with an arcuate portion; and The second side of the heat pipe combines with the first side of the metal layer. 5. The heat conduction structure for electronic components according to claim 1, wherein the first side of the heat pipe is arranged on the outer wall of the cover, and forms an electromagnetic seal for the opening; The heat pipe forms its arcuate portion along the outer wall of the cover and the position of the opening, allowing the arcuate portion of the heat pipe to enter the opening; the second side of the heat pipe engages the first surface of the thermally conductive foil layer; The arcuate portion of the thermally conductive foil layer corresponds to the arcuate portion engaging the heat pipe; and The second surface of the thermally conductive foil layer is combined with the first surface of the metal layer. 6. The heat conducting structure for electronic components as claimed in any one of claims 1 to 5, wherein the area of the metal layer is greater than the area of the outer wall of the cover, and the metal layer defines a heat source area and a connection the non-heat source area of the heat source area; and The metal layer is provided with at least one column; the column is located between the non-heat source area of the metal layer and a circuit board, so that the column supports the non-heat source area of the metal layer. 7. The heat conducting structure for an electronic component according to any one of claims 1 to 5, wherein the electronic component comprises a heat source element that generates heat energy and a non-heat source element that does not generate heat energy; the non-heat source element covered by a cover; The secondary cover has a rigid wall, which defines the secondary cover to form an inner space and covers the non-heat source element; the secondary cover has an inner wall surface and an outer wall surface; and One of the thermally conductive foil layer and the heat pipe engages the lid rigid wall and the secondary lid rigid wall. 8. The heat conduction structure for electronic components according to any one of claims 1 to 5, characterized in that, at least a partial area of the metal layer is provided with a coating made of a heat radiating substance. 9. The heat conduction structure for electronic components according to claim 6, characterized in that, at least a partial area of the metal layer is provided with a coating made of a heat radiating substance. 10. The heat conduction structure for electronic components according to claim 7, characterized in that, at least a partial area of the metal layer is provided with a coating made of a heat radiating substance.