CN204769666U - Silicon chip washing unit - Google Patents
Silicon chip washing unit Download PDFInfo
- Publication number
- CN204769666U CN204769666U CN201520481106.8U CN201520481106U CN204769666U CN 204769666 U CN204769666 U CN 204769666U CN 201520481106 U CN201520481106 U CN 201520481106U CN 204769666 U CN204769666 U CN 204769666U
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- CN
- China
- Prior art keywords
- cleaning
- line
- lautertuns
- rinse bath
- filter
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title abstract description 17
- 229910052710 silicon Inorganic materials 0.000 title abstract description 17
- 239000010703 silicon Substances 0.000 title abstract description 17
- 238000005406 washing Methods 0.000 title abstract 5
- 238000004140 cleaning Methods 0.000 claims abstract description 90
- 239000007921 spray Substances 0.000 claims abstract description 20
- 230000007246 mechanism Effects 0.000 claims abstract description 13
- 239000003599 detergent Substances 0.000 claims description 35
- 239000012530 fluid Substances 0.000 claims description 16
- 230000002000 scavenging effect Effects 0.000 claims description 15
- 238000000034 method Methods 0.000 description 9
- 239000007788 liquid Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 239000003513 alkali Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 238000006701 autoxidation reaction Methods 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model discloses a silicon chip washing unit, wherein, include: belt cleaning device, belt cleaning device includes washing tank, spray set and conveying mechanism, spray set sets up on the washing tank, conveying mechanism sets up in spray set, filter equipment, filter equipment includes filter -tank and filter screen, the filter -tank sets up on the washing tank, the filter screen sets up in the filter -tank. The utility model discloses speed height, high, the convenient operation of degree of automation are washd to the reasonable compactness of structural configuration, and the cleaning performance is good.
Description
Technical field
The utility model relates to silicon chip production equipment field, is specifically related to a kind of Wafer Cleaning unit.
Background technology
The particle, organic matter, metal adsorption molecule, natural oxidizing layer etc. of silicon chip surface can have a strong impact on device performance, clean the half that the not good component failure caused has exceeded total losses in solar cell manufacture.Wafer Cleaning refers to before the operations such as oxidation, photoetching, extension, diffusion and lead-in wire evaporation, adopts the method for physics or chemistry to remove pollutant and the autoxidation thing of silicon chip surface, to obtain the process meeting the silicon chip surface that cleannes require.In technique for processing silicon chip, there is the step of nearly 20% for cleaning.It is impossible for manufacturing that the contamination of silicon chip surface all removes by a kind of equipment.In Wafer Cleaning process, the contamination on every sheet is reduced to 100,000 grades relatively easily from 1,000,000 grades, but will is very difficult staiing all removals or ensureing that in whole technique contamination no longer increases.Therefore Wafer Cleaning technology becomes a large focus of silicon wafer processing and photovoltaic cell technical study, the control of the various pollutant of silicon chip surface is defined to the particular/special requirement of nano-particle removal, not damaged is proposed to cleaning equipment of new generation and cleaning technique and suppresses the new technology requirement of corrosion, so the nanoparticle cleaning technique researching and developing novel, suitable silicon chip surface is imperative.
Chinese patent CN201310308659.9 discloses a kind of wiper mechanism of silicon chip, and this Wafer Cleaning mechanism comprises the first acid tank, alkali groove, the first rinse bath, the first flusher, draining valve, the second rinse bath, the second flusher and pump installation.First rinse bath is between the first acid tank and alkali groove.First flusher is located in the first rinse bath.First rinse bath is suitable for accept the first cleaning fluid after utilizing the first flusher to clean.Draining valve is communicated with the first rinse bath.First cleaning fluid is discharged through draining valve.Second rinse bath is between the first rinse bath and alkali groove.Second flusher is located in the second rinse bath.Second rinse bath is suitable for accept the second cleaning fluid after utilizing the second flusher to clean.Pump installation is suitable for so that the second cleaning fluid is recycled to the first rinse bath for the first flusher.But this device complex operation, can not realize automation, scavenging period length consuming time, is difficult to meet the requirement of more large-scale industrial production.
Therefore the silicon chip cleaning device that a kind of cleaning rate is high, automaticity is high, easy to operate is badly in need of.
Utility model content
The utility model, for the problems referred to above, provides that a kind of cleaning rate is high, automaticity is high, easy to operate, the Wafer Cleaning unit that cleaning performance is good.
The technical scheme in the invention for solving the above technical problem is:
A kind of Wafer Cleaning unit, wherein, comprising: cleaning device, described cleaning device comprises rinse bath, spray equipment and conveying mechanism, and described spray equipment is arranged on rinse bath, and described conveying mechanism is arranged in spray equipment; Filter, described filter comprises lautertuns and screen pack, and described lautertuns is arranged on rinse bath, and described screen pack is arranged in lautertuns.
Further, described spray equipment comprises scavenging pump, cleaning main line and several shower nozzles, and described scavenging pump is arranged on rinse bath, and described cleaning main line is connected on scavenging pump, and described shower nozzle is arranged on one end of cleaning main line.
Further, described spray equipment also comprises lower detergent line and upper detergent line, described lower detergent line and upper detergent line are all arranged on one end of cleaning main line, and several shower nozzles are arranged on the top of lower detergent line, and several shower nozzles are arranged on the top of detergent line.
Further, described conveying mechanism comprises conveyer belt, and described conveyer belt is between lower detergent line and upper detergent line.
Further, described cleaning device also comprises heater, cleaning discharge pipe line and cleaning draining valve, described heater is arranged in rinse bath, and described cleaning discharge pipe line is arranged on the bottom of rinse bath, and described cleaning draining valve is arranged on cleaning discharge pipe line.
Further, described filter also comprises cleaning fluid feeder and overflow launder, and described cleaning fluid feeder is positioned at the bottom of lower detergent line, and one end extends in lautertuns, described overflow launder is arranged in lautertuns, and is positioned at the bottom of cleaning fluid feeder one end.
Further, described filter also comprises overblow blowdown pipeline, and described overblow blowdown pipeline is arranged on the top of lautertuns, and is connected with overflow launder.
Further, described filter also comprises return line and return valve, and described return line is arranged on side, lautertuns bottom, and extends in rinse bath, and described return valve is arranged on return line.
The utility model has the advantages that topology layout is rationally compact, cleaning rate be high, automaticity is high, easy to operate, cleaning performance is good.
Except object described above, feature and advantage, the utility model also has other object, feature and advantage.Below with reference to figure, the utility model is described in further detail.
Accompanying drawing explanation
Forming the part of this description, showing preferred embodiment of the present utility model for understanding accompanying drawing of the present utility model further, and be used for principle of the present utility model is described together with description.In the accompanying drawings:
Fig. 1 is front view of the present utility model; And
Fig. 2 is left view of the present utility model.
Wherein, be labeled as in figure:
1 is cleaning device, 11 is rinse bath, 12 is scavenging pump, 13 is cleaning main line, 14 is lower detergent line, 15 is upper detergent line, 16 is shower nozzle, 17 is heater, 18 is cleaning discharge pipe line, 19 is cleaning draining valve, 2 is filter, 21 is lautertuns, 22 is cleaning fluid feeder, 23 is overflow launder, 24 is screen pack, 25 is return line, 26 is return valve, 27 is lautertuns blowoff line, 28 is lautertuns blowoff valve, 29 is overblow blowdown pipeline, 3 is conveyer belt.
Detailed description of the invention
Below in conjunction with accompanying drawing, embodiment of the present utility model is described in detail, but the multitude of different ways that the utility model can be defined by the claims and cover is implemented.
Referring to figs. 1 to Fig. 2, a kind of Wafer Cleaning unit as depicted in figs. 1 and 2, wherein, this cleaning unit comprises cleaning device 1 and filter 2, cleaning device 1 comprises rinse bath 11, spray equipment and conveying mechanism, spray equipment is arranged on rinse bath 11, conveying mechanism is arranged in spray equipment, spray equipment comprises scavenging pump 12, cleaning main line 13 and several shower nozzles 16, scavenging pump 12 is arranged on rinse bath 11, specifically, scavenging pump 12 is fixed on the outside of rinse bath 11, one end of scavenging pump 12 is stretched in rinse bath 11, cleaning main line 13 is connected on scavenging pump 12, and extend along on the lateral of rinse bath 11, cleaning main line 13 horizontal-extending when rinse bath 11 top, one end of cleaning main line 13 is provided with lower detergent line 14 and upper detergent line 15, lower detergent line 14 and upper detergent line 15 are equipped with several shower nozzles 16, the shower nozzle 16 being arranged on lower detergent line 14 is positioned at the top of lower detergent line 14, the shower nozzle 16 being arranged on detergent line 15 is positioned at the top of detergent line 15.
Conveying mechanism comprises conveyer belt 3, conveyer belt 3 is between lower detergent line 14 and upper detergent line 15, shower nozzle 16 in lower detergent line 14 is positioned at the bottom of conveyer belt 3, shower nozzle 16 in upper detergent line 15 is positioned at the top of conveyer belt 3, during work, shower nozzle 16 is to the silicon chip spraying cleaning liquid on conveyer belt 3, and conveyer belt 3 is netted, is convenient to bottom spray.
Filter 2 comprises lautertuns 21 and screen pack 24, lautertuns 21 is arranged on rinse bath 11, and screen pack 24 is arranged in lautertuns 21, and lautertuns 21 is divided into front groove and pit, screen pack 24 is 85 ° with the angle bottom lautertuns 21, and front groove is 1/3rd of lautertuns 21.
Cleaning device 1 also comprises heater 17, cleaning discharge pipe line 18 and cleaning draining valve 19, heater 17 is arranged in rinse bath 11, and be positioned at the bottom of rinse bath 11, cleaning discharge pipe line 18 is arranged on the bottom of rinse bath 11, and away from scavenging pump 12, cleaning draining valve 19 is arranged on cleaning discharge pipe line 18.
Filter 2 also comprises cleaning fluid feeder 22, overblow blowdown pipeline 29 and overflow launder 23, cleaning fluid feeder 22 is positioned at the bottom of lower detergent line 14, and one end extends in lautertuns 21, overflow launder 23 is arranged in lautertuns 21, and be positioned at the bottom of cleaning fluid feeder 22 one end, and be positioned at side, lautertuns 21 top, overblow blowdown pipeline 29 is arranged on the top of lautertuns 21, and be connected with overflow launder 23, overblow blowdown pipeline 29 flows to crossing with cleaning fluid feeder 22 liquid stream, when liquid in lautertuns 21 is full, liquid will be discharged from overflow launder 23 through overblow blowdown pipeline 29.
Filter 2 also comprises return line 25, return valve 26, lautertuns blowoff line 27 and lautertuns blowoff valve 28, return line 25 is arranged on side, lautertuns 21 bottom, and extend in rinse bath 11, return valve 26 is arranged on return line 25, lautertuns blowoff line 27 is arranged on the front trench bottom of lautertuns 21, lautertuns blowoff line 27 passes rinse bath 11 inside and extends to outside rinse bath 11, lautertuns blowoff valve 28 is arranged on lautertuns blowoff line 27, and is positioned at outside rinse bath 11.
Silicon chip is carried through conveyer belt 3, time under process between detergent line 14 and upper detergent line 15, scavenging pump 12 provides high pressure liquid spray, hydrojet sprays to silicon chip four faces through shower nozzle 16, clean silicon chip, the soiling solution after cleaning flows into lautertuns 21 through cleaning fluid feeder 22 and processes, and this cellular construction is compact, processing speed is fast, and cleaning performance is good.
These are only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection domain of the present utility model.
Claims (8)
1. a Wafer Cleaning unit, is characterized in that, comprising:
Cleaning device (1), described cleaning device (1) comprises rinse bath (11), spray equipment and conveying mechanism, and described spray equipment is arranged on rinse bath (11), and described conveying mechanism is arranged in spray equipment;
Filter (2), described filter (2) comprises lautertuns (21) and screen pack (24), described lautertuns (21) is arranged on rinse bath (11), and described screen pack (24) is arranged in lautertuns (21).
2. Wafer Cleaning unit according to claim 1, it is characterized in that, described spray equipment comprises scavenging pump (12), cleaning main line (13) and several shower nozzles (16), described scavenging pump (12) is arranged on rinse bath (11), described cleaning main line (13) is connected on scavenging pump (12), and described shower nozzle (16) is arranged on one end of cleaning main line (13).
3. Wafer Cleaning unit according to claim 2, it is characterized in that, described spray equipment also comprises lower detergent line (14) and upper detergent line (15), described lower detergent line (14) and upper detergent line (15) are all arranged on one end of cleaning main line (13), several shower nozzles (16) are arranged on the top of lower detergent line (14), and several shower nozzles (16) are arranged on the top of detergent line (15).
4. Wafer Cleaning unit according to claim 3, it is characterized in that, described conveying mechanism comprises conveyer belt (3), and described conveyer belt (3) is positioned between lower detergent line (14) and upper detergent line (15).
5. Wafer Cleaning unit according to claim 1, it is characterized in that, described cleaning device (1) also comprises heater (17), cleaning discharge pipe line (18) and cleaning draining valve (19), described heater (17) is arranged in rinse bath (11), described cleaning discharge pipe line (18) is arranged on the bottom of rinse bath (11), and described cleaning draining valve (19) is arranged in cleaning discharge pipe line (18).
6. Wafer Cleaning unit according to claim 4, it is characterized in that, described filter (2) also comprises cleaning fluid feeder (22) and overflow launder (23), described cleaning fluid feeder (22) is positioned at the bottom of lower detergent line (14), and one end extends in lautertuns (21), described overflow launder (23) is arranged in lautertuns (21), and is positioned at the bottom of cleaning fluid feeder (22) one end.
7. Wafer Cleaning unit according to claim 4, it is characterized in that, described filter (2) also comprises overblow blowdown pipeline (29), described overblow blowdown pipeline (29) is arranged on the top of lautertuns (21), and is connected with overflow launder (23).
8. Wafer Cleaning unit according to claim 4, it is characterized in that, described filter (2) also comprises return line (25) and return valve (26), described return line (25) is arranged on lautertuns (21) side, bottom, and extending in rinse bath (11), described return valve (26) is arranged on return line (25).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520481106.8U CN204769666U (en) | 2015-07-02 | 2015-07-02 | Silicon chip washing unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520481106.8U CN204769666U (en) | 2015-07-02 | 2015-07-02 | Silicon chip washing unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204769666U true CN204769666U (en) | 2015-11-18 |
Family
ID=54509794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520481106.8U Expired - Fee Related CN204769666U (en) | 2015-07-02 | 2015-07-02 | Silicon chip washing unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204769666U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109967737A (en) * | 2018-12-26 | 2019-07-05 | 西安铂力特增材技术股份有限公司 | A kind of automatic cleaning apparatus for 3D printing equipment optical element protection eyeglass |
-
2015
- 2015-07-02 CN CN201520481106.8U patent/CN204769666U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109967737A (en) * | 2018-12-26 | 2019-07-05 | 西安铂力特增材技术股份有限公司 | A kind of automatic cleaning apparatus for 3D printing equipment optical element protection eyeglass |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151118 Termination date: 20160702 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |