CN204760382U - LED lamp packaging support - Google Patents

Abstract

The utility model provides a LED lamp packaging bracket, which comprises a plurality of substrate belts arranged in parallel; each substrate strip comprises a first lead, a second lead and a thermal lead, wherein the first lead, the second lead and the thermal lead are arranged in parallel, a light emitting area and a heat dissipation area are arranged in the substrate strip at intervals in the longitudinal direction, the first leads are symmetrically arranged in the light emitting area in an inverted L shape, and the thermal lead of the heat dissipation area is provided with an arc shape protruding downwards; the LED lamp comprises a light emitting area, a first lead, a second lead and a heat conducting wire, wherein the light emitting area is provided with an LED lamp holder, the upper part of the LED lamp holder is provided with an LED lamp cup, and the first lead, the second lead and the heat conducting wire penetrate through the LED lamp holder and are positioned at the bottom of the lamp cup. The LED lamp holders of the utility model are not connected by insulated wires, but are directly connected; the heat conducting wires are added, and the downward convex arcs of the heat conducting wires in the heat dissipation area of the heat conducting wires can be connected to the heat dissipation sheet in a welding mode and the like, so that the heat dissipation performance of each substrate strip of the packaging support is better.

Description

An LED lamp packaging bracket

technical field

The utility model relates to a mounting bracket for an LED lamp, in particular to a packaging bracket for an LED lamp.

Background technique

LED (Light Emitting Diode), light emitting diode, is a solid-state semiconductor device that can directly convert electricity into light. The heart of LED is the wafer of a semiconductor, and one end of wafer is attached on a bracket, and one end is negative pole, and the other end connects the positive pole of power supply, and whole wafer is encapsulated by epoxy resin. Semiconductor wafer is made up of two parts, and a part is P-type semiconductor, and hole occupies an leading position in it, and the other end is N-type semiconductor, and here mainly is electron. But time these two kinds of semiconductors couple together, between them, just form a "P-N junction". When electric current acts on this chip by wire time, electron will be pushed to P district, and in P district, electron is with hole recombination, then will send energy with the form of photon, the principle of LED luminescence that Here it is. And the wavelength of light i.e. the color of light, be determined by the material forming P-N junction.

The practicality and commercialization of high-performance LEDs have brought about a new revolution in lighting technology. The pixel light composed of multiple ultra-high-brightness red, blue, and green LEDs can not only emit various colors of light with continuously adjustable wavelengths, but also emit white light with a brightness of tens to one hundred candlepower as a lighting source. For incandescent lamps and LED solid-state lighting lamps with the same luminance, the power consumption of the latter only accounts for 10%-20% of the former.

Most of the white LEDs currently produced are made by coating blue LEDs with a yellowish phosphor coating, which is usually made by grinding cerium-doped yttrium aluminum garnet crystals into powder and mixing them in made from a dense adhesive. When the LED chip emits blue light, part of the blue light will be efficiently converted into a broad-spectrum mainly yellow light by the crystal, because the yellow light will stimulate the red and green light receptors in the naked eye, and then mix the blue light of the LED itself , making it look like white light.

Existing LED lamps are generally installed directly on the mounting board, and the mounting board is generally a sheet structure, including three layers: a heat dissipation layer for heat dissipation, an insulating layer for insulation under the heat dissipation layer, and an insulating layer under the insulating layer. The circuit layer for wiring, in which the heat dissipation layer is generally aluminum foil or aluminum alloy sheet; the circuit layer is generally made of copper foil for circuit layout. The LED lamp is installed on the heat dissipation layer and welded with the circuit layer. The heat dissipation performance of this type of LED mounting board largely depends on the thermal conductivity index of the insulating layer, and the thermal conductivity index of the insulating layer is often not high, resulting in poor heat dissipation performance of the entire LED lamp mounting board strip.

The most ideal situation is that the entire LED lamp mounting board has only one layer, that is, the heat dissipation layer, and the LED strip is directly welded to the LED lamp mounting board, so as to better dissipate heat. Due to the cancellation of the insulating layer and the wiring layer, the power supply of the LED light strip can only be connected by wires. However, if the wires are distributed on the mounting board, because the LED lights will generate a lot of heat during the light-emitting process, the insulation layer on the surface of the wires will be heated and melted, resulting in an open circuit or even an accident.

Utility model content

In order to overcome the deficiencies of the prior art, the utility model proposes an LED lamp packaging bracket comprising:

a plurality of substrate strips arranged in parallel;

Each substrate strip includes a first wire, a second wire and a thermal wire, wherein the first wire, the second wire and the thermal wire are arranged in parallel, and the substrate strip is provided with a light-emitting area and a heat dissipation area at intervals in the longitudinal direction, and in the light-emitting area The first wire is symmetrically arranged in an inverted "L" shape, and the heat wire in the heat dissipation area has a downwardly protruding arc;

The light-emitting area is provided with an LED lamp holder, and an LED lamp cup is arranged on the upper part of the LED lamp holder. The first wire, the second wire and the heat conduction wire pass through the LED lamp holder and are located at the bottom of the lamp cup.

Further, the bottom of the lamp cup is circular, and gradually expands upward in an arc shape, the uppermost opening of the lamp cup is circular, and the edge of the opening has an upward protrusion.

Further, the part of the thermal wire in the light emitting area has a through hole.

Further, the protruding arc of the part of the thermal wire in the heat dissipation area is a protruding trapezoid.

Further, in the part of the thermal wire in the heat dissipation area, the convex arc shape includes a concave slope and a concave bottom plate.

Further, the material of the package bracket of the LED lamp is copper or aluminum.

The LED lamp packaging bracket described in the utility model has a plurality of substrate strips, and the substrate strips are used to install LED lamps. The LED lamps are no longer connected by insulated wires, but directly connected; the thermal wires are added. The downward convex arc of the heat dissipation area can be connected to the heat sink by welding or other means, so that the heat dissipation performance of the substrate strip is better; the lamp cup on the LED lamp holder can be directly injected with a mixture of phosphor powder and mold top glue to form an LED lens , the substrate strip together with the LED lamp holder and the LED lens form the LED light string.

Description of drawings

In order to illustrate the embodiments of the present utility model more clearly, the accompanying drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only an embodiment of the present utility model. For Those of ordinary skill in the art can also obtain other drawings based on these drawings without any creative effort.

Fig. 1 is a structural schematic diagram of a specific embodiment of the LED lamp packaging bracket of the present invention;

Fig. 2 is a structural schematic diagram of the metal bracket of the utility model LED lamp packaging bracket;

Fig. 3 is a partial enlarged view of the hardware bracket of a specific embodiment of the LED lamp package bracket of the present invention;

Fig. 4 is an enlarged view of the LED lamp holder in Fig. 1;

In the figure: 1-first wire; 2-second wire; 3-heat conduction wire; 4-luminous area; 5-heat dissipation area; 6-recessed slope; 7-recessed bottom plate; light Cup.

Detailed ways

The utility model will be further described below in conjunction with specific embodiments. Wherein, the accompanying drawings are for illustrative purposes only, and represent only schematic diagrams, rather than actual drawings, and should not be construed as limitations on this patent; in order to better illustrate the embodiments of the present utility model, some parts of the accompanying drawings will be omitted , enlargement or reduction, and do not represent the size of the actual product; for those skilled in the art, it is understandable that some known structures and their descriptions in the drawings may be omitted.

Please refer to Fig. 1, 2 and Fig. 4, an LED lamp packaging bracket of the present invention includes a plurality of substrate strips arranged in parallel; each substrate strip includes a first wire 1, a second wire 2 and a thermal wire 3, wherein the The first conductive wire 1, the second conductive wire 2 and the thermal conductive wire 3 are arranged in parallel, and the substrate strip is provided with a light-emitting area 4 and a heat-dissipating area 5 at intervals in the longitudinal direction, and the first conductive wire 1 in the light-emitting area 4 is symmetrically arranged in an inverted "L" shape , the thermal wire 3 in the heat dissipation area 5 has a downwardly protruding arc; the LED lamp holder 8 is provided in the light-emitting area 4, and the LED lamp cup 9 is provided on the upper part of the LED lamp holder 8. The first wire 1, the second The two wires 2 and the heat conducting wire 3 pass through the LED lamp holder 8 and are located at the bottom of the lamp cup 9 .

The lamp cup 9 is used to inject the mixture of fluorescent powder and mold top glue to form an LED lens.

According to different actual needs, the package bracket of the utility model can be processed into a plurality of substrate strips each time, and the length of the substrate strips can be adjusted as required.

The utility model is formed by injection molding on the basis of the hardware support, and the structure of the hardware support is as shown in Figure 2.

In one embodiment of the present invention, the thermal wire 3 has a through hole in the light emitting area 4 . The light-emitting area 4 will be provided with LED lamp beads, and the through holes of the thermal wire 3 can make the heat transfer to the heat-dissipating area better.

In another embodiment of the present utility model, the protruding arc of the part of the thermal wire 3 in the heat dissipation area 5 is a protruding trapezoid. The trapezoid is used for welding or bonding to other heat conductors or heat conducting sheets, so that its heat dissipation performance is stronger. Preferably, it can be directly welded to a metal mounting strip.

Please refer to FIG. 3 , in a specific embodiment of the present invention, where the heat wire 3 of the hardware bracket is in the heat dissipation area 5 , the protruding arc includes a concave slope and a concave bottom plate. The concave slope allows the protruding part to extend obliquely downward, and the concave bottom plate is used for welding or bonding to other heat conductors or heat conducting sheets, so that its heat dissipation performance is stronger. Preferably, it can be directly welded to metal Attach the mounting plate.

In the utility model, the material of the package bracket of the LED lamp is copper or aluminum. Copper or aluminum conduct heat well and are inexpensive.

In a preferred embodiment of the present invention, the part of the LED base of the first wire 1 in the light-emitting area is disconnected, and the disconnected part is separated during injection molding. In the LED lamp string made by using the substrate strip of the utility model, the parallel connection or series connection of the LED lamps on the entire lamp string can be realized by connecting or disconnecting the first wires under some lamp beads. Adjusting the size of the bottom and the opening of the lamp cup 9 and the shape of the edge of the opening can make the LED lens formed by the mixture of injected phosphor powder and mold top glue become hemispherical under the action of surface tension.

The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present utility model shall be included in the Within the protection scope of the present utility model.

Claims (6)

1. a LED package support, is characterized in that, comprising:

The many substrate bands be arranged in parallel;

Every bar substrate band comprises the first wire, the second wire and thermal wire, wherein said first wire, the second wire and thermal wire be arranged in parallel, substrate band longitudinal direction compartment of terrain is provided with luminous zone and radiating area, in luminous zone, the first wire is symmetrically arranged inverted "L" shaped, and the thermal wire of radiating area has the arc protruded downwards;

Described luminous zone is provided with LED seat, and LED seat top is provided with LED lamp cup, and described first wire, the second wire and thermal conductive wire through described LED seat, and are positioned at the bottom of described Lamp cup.

2. LED package support according to claim 1, is characterized in that, be circular, and upwards arc-shaped expands gradually bottom described Lamp cup, and its top opening is circular, and edge of opening has projection upwards.

3. LED package support according to claim 1, is characterized in that, described thermal wire has through hole in the part of luminous zone.

4. LED package support according to claim 1, is characterized in that, described thermal wire is in the part of radiating area, and its arc protruded is the trapezoidal of protrusion.

5. LED package support according to claim 1, is characterized in that, described thermal wire is in the part of radiating area, and it protrudes arc and comprises recessed slope and recessed base plate.

6. LED package support according to claim 1, is characterized in that, described its material of LED package support is copper or aluminium.