CN204696158U - A kind of LED integrated light-emitting module - Google Patents
A kind of LED integrated light-emitting module Download PDFInfo
- Publication number
- CN204696158U CN204696158U CN201520388503.0U CN201520388503U CN204696158U CN 204696158 U CN204696158 U CN 204696158U CN 201520388503 U CN201520388503 U CN 201520388503U CN 204696158 U CN204696158 U CN 204696158U
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- Prior art keywords
- printed substrate
- led
- emitting module
- integrated light
- nation
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- 238000005538 encapsulation Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
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- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 2
- 239000004917 carbon fiber Substances 0.000 claims description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 2
- 238000010992 reflux Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 6
- 238000003466 welding Methods 0.000 abstract description 6
- 230000002950 deficient Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 description 7
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- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000012536 packaging technology Methods 0.000 description 2
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- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of LED integrated light-emitting module, comprise the first printed substrate, the upper surface of the first printed substrate is provided with nation and determines pad, and nation determines pad and determines wire by nation and be connected with the first printed substrate, and nation determines pad and is provided with LED wafer; The upper surface of the first printed substrate is provided with the panel be located in LED wafer, and panel is provided with the through hole matched with LED wafer, is provided with the LED glue for packaged LED wafer in through hole.There is module distortion in the utility model, the evenness of module is good, and surperficial order look good, adds the productibility of product under effectively can avoiding the impact in process of production because of high temperature reflux welding, reduce fraction defective and the cost of product.
Description
Technical field
The utility model relates to illuminating module, particularly relates to a kind of LED integrated light-emitting module.
Background technology
So-called LED display, is a kind of flat-panel monitor, is made up of LED illuminating module little one by one.Existing Small Distance LED illuminating module actualizing technology is divided into two kinds, and a kind of is traditional surface mount technology, namely single packaged SMD lamp pearl successively array be mounted on enclose tin cream PCB (printed circuit board) on.Welded the combination realizing lamp pearl and PCB again by high temperature reflux, the change of being lighted each lamp pearl by conducting wire realizes its effect shown.Particularly in Small Distance module, to the density of lamp pearl array and the requirement of single volume higher.The principal elements such as its shortcoming is that the manufacturing process of single SMD lamp pearl is complicated, and difficulty is large, and cost is high, and the large and scrap cost of whole plate maintenance difficulty is high.
Another kind is exactly adopt so-called COB encapsulation technology (COB, chip On board, chip on board), namely redgreenblue bare chip conduction or non-conductive adhesive are directly sticked on PCB, then carry out the bonding of metal guide line on the pad of PCB, realize its conduction and connect.Its chips adopts exposed packaging technology, define for the fixed thin pad of both positive and negative polarity copper of LED wafer nation after copper thin-pass on PCB crosses the etch process of circuit, the thin pad of copper can make the pad that it binds metal guide line after the surface treatment such as gold-plated or silver-plated.Fixed by surface encapsulation glue again after having bound, light each luminescent wafer to realize the effect of its display finally by conducting wire.It is more that this COB encapsulation technology is applied to field of LED display technical problem at present, particularly in the application of Small Distance LED display.Its shortcoming one: because the encapsulated wafer assembly of LED module and electronic devices and components are all on same PCB, electronic devices and components need to weld through SMT high temperature reflux, its PCB is by then having distortion in varying degrees after high temperature, PCB after distortion not only can increase the difficulty of packaging technology, but also cause serious bad in assembling module that can be follow-up again, when being namely arranged on drain pan by the fixed copper post of module surrounding, the PCB of this module evening up by force is made owing to locking the dynamics of screw, therefore the wafer weld layer of part LED module can be caused, the factor such as rosin joint or bad connection between metal guide line and PCB pad.That therefore causes is bad higher; Its shortcoming two: because existing PCB bottom has all been covered with some electronic devices and components (resistance, electric capacity, various IC and connector), make nation determine bonding machine and directly heat the temperature heat skewness on PCB, cause obvious metal guide wire bonding effect different, thus also result in higher fraction defective; Its shortcoming three: in the process of encapsulation, should be dehumidified, dry the glue of fixed wafer, the glue of drying encapsulation all needs the temperature baking carrying out about 80 to 180 degrees Celsius, and the repeatedly baking in this production technology link can cause the surperficial order look generation color degradation in various degree of face shield.Cause the aberration occurred between module in various degree.The surface color consistency of whole product is poor, and technique controlling difficulty is large, cannot meet the requirement of product quality aspect.
Utility model content
Technical problem to be solved in the utility model is: provide a kind of LED integrated light-emitting module, module distortion is there is under effectively can avoiding the impact in process of production because of high temperature reflux welding, the evenness of module is good, surface order look good, add the productibility of product, reduce fraction defective and the cost of product.
For solving the problems of the technologies described above, the utility model proposes a kind of LED integrated light-emitting module, comprise the first printed substrate, the upper surface of described first printed substrate is provided with nation and determines pad, described nation determines pad and determines wire by nation and be connected with the first printed substrate, and described nation determines pad and is provided with LED wafer;
The upper surface of described first printed substrate is provided with the panel be located in LED wafer, and described panel is provided with the through hole matched with LED wafer, is provided with the LED glue for packaged LED wafer in described through hole.
Further, described panel is bonded on the upper surface of the first printed substrate by adhesive.
Further, described adhesive is black glue or heatproof adhesive glue.
Further, the lower surface of described first printed substrate is provided with electronics unit device assembly, and the lower surface of described first printed substrate is provided with the drain pan for being located on electronics unit device assembly.
Further, described electronics unit device assembly comprises the second printed substrate be arranged on the first printed substrate lower surface, and the second printed substrate is provided with electronic devices and components.
Further, described panel is carbon fiber board.
Further, described nation determines wire is gold thread or alloy wire or copper cash.
Further, described nation determines pad and is provided with Gold plated Layer or silver coating.
Further, the base material of described first printed substrate is FR4 or BT material.
Further, described LED glue is AB glue or encapsulation glue.
Technique scheme at least has following beneficial effect: the utility model adopts and is provided with nation at the upper surface of the first printed substrate and determines pad, and nation determines pad and determines wire by nation and be connected with the first printed substrate, and described nation determines pad and is provided with LED wafer; Be provided with the panel be located in LED wafer at the upper surface of the first printed substrate, panel is provided with the through hole matched with LED wafer, in through hole, be provided with the LED glue for packaged LED wafer, thus form LED lamp panel.Electronics unit device assembly is provided with various PCB and various electronic devices and components, form electronics unit device assembly, then assembly welding is in LED lamp panel after high temperature reflux welding.Thus avoid LED lamp panel to deform when high temperature reflux welds, the evenness of module is good, and surperficial order look good, adds the productibility of product, reduces fraction defective and the cost of product.
Accompanying drawing explanation
Fig. 1 is the structural blast figure of the utility model LED integrated light-emitting module.
Fig. 2 is the enlarged drawing at A place in Fig. 1.
Embodiment
It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combine mutually.Below in conjunction with accompanying drawing, the utility model is described further.
As shown in Figure 1 and Figure 2, the utility model LED integrated light-emitting module comprises the first printed substrate 1, be provided with nation at the upper surface of the first printed substrate 1 and determine pad 2, nation is determined pad 2 and determine wire 3 by nation and be connected with the first printed substrate 1, nation determines pad 2 and is provided with LED wafer 4; Particularly, nation determines wire 3 is one in gold thread or alloy wire or copper cash; Nation determines pad 2 and is provided with Gold plated Layer or silver coating, increases nation and determines Joint Properties; The base material of the first printed substrate 1 is the one of FR4 or BT material.
The upper surface of the first printed substrate 1 is provided with the panel 5 be located in LED wafer 4, and panel 5 is provided with the through hole 51 matched with LED wafer 4, is provided with the LED glue 6 for packaged LED wafer 4 in through hole 51.Preferably, panel 5 is bonded on the upper surface of the first printed substrate 1 by adhesive 8, and particularly, adhesive 8 is the one in black glue or Special temperature resistant adhesive glue, and LED glue 6 is AB glue or special changeable colour encapsulation glue.
The lower surface of the first printed substrate 1 is provided with electronics unit device assembly 7, particularly, electronics unit device assembly 7 comprises the second printed substrate 71 be arranged on the first printed substrate 1 lower surface, second printed substrate 71 is provided with electronic devices and components 72, particularly, the base material of the second printed substrate 71 is pcb board or FPCB plate.
The lower surface of the first printed substrate 1 is also provided with the drain pan 9 for being located on electronics unit device assembly 7; drain pan 9 is metalwork; to the first printed substrate 1; namely fixation is played to LED lamp panel; the adjustment be convenient between module is fixed; LED lamp panel stress deformation is played a protective role, the effect of antinoise signal interference shielding is played to electronics unit device assembly 7 simultaneously.
To sum up, the utility model adopts and is provided with nation at the upper surface of the first printed substrate and determines pad, and nation determines pad and determines wire by nation and be connected with the first printed substrate, and described nation determines pad and is provided with LED wafer; Be provided with the panel be located in LED wafer at the upper surface of the first printed substrate, panel is provided with the through hole matched with LED wafer, in through hole, be provided with the LED glue for packaged LED wafer, thus form LED lamp panel.Electronics unit device assembly is provided with various PCB and various electronic devices and components, form electronics unit device assembly, then assembly welding is in LED lamp panel after high temperature reflux welding.Thus avoid LED lamp panel to deform when high temperature reflux welds, the evenness of module is good, and surperficial order look good, adds the productibility of product, reduces fraction defective and the cost of product.
The above is embodiment of the present utility model; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the utility model principle; can also make some amendments, these amendments are also considered as protection range of the present utility model.
Claims (10)
1. a LED integrated light-emitting module, it is characterized in that, comprise the first printed substrate, the upper surface of described first printed substrate is provided with nation and determines pad, described nation determines pad and determines wire by nation and be connected with the first printed substrate, and described nation determines pad and is provided with LED wafer;
The upper surface of described first printed substrate is provided with the panel be located in LED wafer, and described panel is provided with the through hole matched with LED wafer, is provided with the LED glue for packaged LED wafer in described through hole.
2. LED integrated light-emitting module as claimed in claim 1, it is characterized in that, described panel is bonded on the upper surface of the first printed substrate by adhesive.
3. LED integrated light-emitting module as claimed in claim 2, it is characterized in that, described adhesive is black glue or heatproof adhesive glue.
4. LED integrated light-emitting module as claimed in claim 1, is characterized in that, the lower surface of described first printed substrate is provided with electronics unit device assembly, and the lower surface of described first printed substrate is provided with the drain pan for being located on electronics unit device assembly.
5. LED integrated light-emitting module as claimed in claim 4, is characterized in that, described electronics unit device assembly comprises the second printed substrate be arranged on the first printed substrate lower surface, and the second printed substrate is provided with electronic devices and components.
6. LED integrated light-emitting module as claimed in claim 1, it is characterized in that, described panel is carbon fiber board.
7. LED integrated light-emitting module as claimed in claim 1, is characterized in that, it is gold thread or alloy wire or copper cash that described nation determines wire.
8. LED integrated light-emitting module as claimed in claim 1, it is characterized in that, described nation determines pad and is provided with Gold plated Layer or silver coating.
9. LED integrated light-emitting module as claimed in claim 1, it is characterized in that, the base material of described first printed substrate is FR4 or BT material.
10. LED integrated light-emitting module as claimed in claim 1, is characterized in that, described LED glue is AB glue or encapsulation glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520388503.0U CN204696158U (en) | 2015-06-08 | 2015-06-08 | A kind of LED integrated light-emitting module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520388503.0U CN204696158U (en) | 2015-06-08 | 2015-06-08 | A kind of LED integrated light-emitting module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204696158U true CN204696158U (en) | 2015-10-07 |
Family
ID=54236416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520388503.0U Expired - Fee Related CN204696158U (en) | 2015-06-08 | 2015-06-08 | A kind of LED integrated light-emitting module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204696158U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104882531A (en) * | 2015-06-08 | 2015-09-02 | 杨子龙 | LED integrated light-emitting module group |
-
2015
- 2015-06-08 CN CN201520388503.0U patent/CN204696158U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104882531A (en) * | 2015-06-08 | 2015-09-02 | 杨子龙 | LED integrated light-emitting module group |
| WO2016197496A1 (en) * | 2015-06-08 | 2016-12-15 | 唐刚 | Led integrated light-emitting module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151007 Termination date: 20170608 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |