CN204643248U - Base board delivery device - Google Patents

Abstract

The utility model provides a substrate conveying device, which suppresses the bending of the substrate and stably conveys the substrate. It has: a conveyor belt (331), which conveys the substrate (K); a conveyor belt drive unit (333), which conveys the conveyor belt; side; the substrate holder (335), which is arranged on the upper side of the conveyor belt; the lifting part (350), which raises the conveyor belt support body or lowers the substrate holder to clamp the substrate; and the support roller (336), which It is arranged inside the concave portion (334b) on the upper surface of the conveyor belt support body. When the substrate is transported, the lifting part lowers the conveyor belt support body or raises the substrate holder so that the support roller is opposite to the upper surface of the conveyor belt support body. protruding.

Description

Substrate transport device

technical field

The utility model relates to a substrate conveying device for conveying substrates.

Background technique

The substrate transfer device that transfers the substrate performs operations such as supplying the substrate to a working area where a predetermined operation is performed on the substrate, holding the substrate in the working area, and discharging the processed substrate. Therefore, the following two systems are known as the substrate conveying device, that is, one is to support and convey the substrate by a plurality of rollers arranged along the substrate conveying path, and the other is to use a conveyor belt supported from below by a conveyor belt guide rail. The conveyor belt conveys the substrate (for example, refer to Patent Documents 1 and 2).

In contrast, the substrate transfer apparatus is required to increase the size of substrates that can be transferred, and to transfer even small substrates in an integrated state using a jig substrate that simultaneously sets a plurality of substrates in order to improve productivity.

Patent Document 1: Japanese Patent Laid-Open No. 2001-024305

Patent Document 2: Japanese Patent Laid-Open No. 2005-162380

However, in the case of the substrate conveyance device of Patent Document 1, since the individual rollers may vary in height due to assembly accuracy, if the weight of the substrate increases due to the enlargement of the substrate, the substrate may warp and flatness may not be maintained. In this case, it may not be possible to properly perform work requiring high positional accuracy, such as mounting minute electronic components.

In addition, in the case of the substrate transfer device of Patent Document 2, if the substrate is enlarged and the weight increases, the sliding friction between the conveyor belt and the conveyor guide rail that supports the conveyor belt from below becomes large, and becomes the driving source for conveyor belt transportation. The load on the electric motor increases, which may lead to failure of delivery or motor imbalance.

Utility model content

The purpose of this utility model is to provide a substrate conveying device, which can hold the substrate without bending the substrate, and can transport it stably.

The utility model relates to a substrate conveying device, which conveys a substrate along a substrate conveying path, and has a working area for performing predetermined operations on the substrate in the middle of the substrate conveying path, and the substrate conveying device is characterized in that it has: a conveying belt , which is arranged along the substrate conveying path, and carries the substrate on which it is conveyed; a conveyor belt drive unit, which conveys the conveyor belt along the conveying direction; and a conveyor belt support body, which is arranged in the working area The lower side of the substrate loading part of the conveyor belt, the upper surface of the conveyor belt support body is flat; the substrate holder, which is provided on the upper side of the conveyor belt in the work area; the lifting part, which raises the conveyor belt support or lowers the substrate holder when the substrate is clamped by the conveyor belt support and the substrate holder through the conveyor belt; and a support roller which Supported together with the substrate holder while maintaining a constant distance from the substrate holder, the support roller is disposed inside a recess formed on the upper surface of the belt supporter, and conveys the substrate , the lifting unit lowers the conveyor belt support or raises the substrate holder so that the support roller protrudes from the upper surface of the conveyor belt support.

The utility model can make the support roller protrude from the concave part of the conveyor belt support body by using the lifting part to move the conveyor belt support body downward or the substrate holder upward, and make contact with the conveyor belt from below. The substrate transfer is performed in a state where the slippage between the lower surface of the belt and the upper surface of the belt support is reduced.

In addition, by moving the conveyor belt support upward or the substrate holder downward by the elevating part, the support roller enters the concave portion of the conveyor belt support, and the upper surface of the conveyor belt support comes into contact with the conveyor belt from below. , the substrate is clamped by the conveyor belt support and the substrate holder via the conveyor belt.

As a result, the conveyor support with a flat upper surface sandwiches the substrate together with the substrate holder, so the contact area is increased, and the substrate can be held while maintaining the flatness of the substrate.

With the above configuration, it is possible to reduce the load due to sliding when the substrate is transported, and it is possible to hold the substrate while maintaining the flatness of the substrate.

In addition, in the above-mentioned invention, a plurality of concave portions of the support roller and the belt support body may be provided along the substrate conveyance direction.

In the above utility model, since there are a plurality of support rollers along the conveying direction of the substrate, the conveyer belt can be supported by a plurality of support rollers, and the slippage between the conveyer belt and the conveyer belt support can be further reduced.

In addition, in the above-mentioned invention, the above-mentioned supporting roller and the above-mentioned substrate holder may be supported by the conveyance frame, and the above-mentioned elevating unit may raise the above-mentioned conveyer belt support when clamping the above-mentioned substrate, and the conveyer The above-mentioned conveyor belt support body is lowered during the above-mentioned substrate.

In addition, in the above-mentioned utility model, it is also possible to have a conveyor pulley that supports both ends of the conveyor belt and is rotatably supported on the conveyor belt support body, where the conveyor belt support body is movable. At the lower limit of the area, the conveyor belt is supported by the conveyor pulley and the support roller, and the conveyor belt is conveyed in the conveying direction.

By supporting the conveyor belt by the conveyor pulley and the support roller, it is possible to prevent the conveyor belt from coming into contact with the conveyor belt support or to reduce slippage.

The effect of utility model

As described above, according to the substrate conveyance device of the present invention, the substrate can be held without bending the substrate, and can be stably conveyed.

Description of drawings

FIG. 1 is a plan view of an electronic component mounting device according to the present embodiment.

Fig. 2 is a perspective view of a board transfer device mounted on the electronic component mounting device.

Fig. 3 is a plan view of the substrate transfer device.

Fig. 4 is a cross-sectional view taken along line W-W in Fig. 5 .

Fig. 5 is a side view of the substrate transfer device, showing a substrate transfer state.

Fig. 6 is a side view of the substrate transfer device, showing a substrate holding state.

7 is a block diagram showing a control system of the electronic component mounting device.

Explanation of labels

10 Electronic component mounting device

20 feeder container

21 Electronic component feeder

30 substrate conveying device

32 Move into the buffer zone

33 central buffer area (work area)

34 Move out of the buffer zone

40 carrying head

41 suction nozzle

50 gantry

90 Controls

311a side wall

320, 330, 340 conveying mechanism

321, 331, 341 conveyor belt

323, 333, 343 Conveying motor (conveyor belt driving part)

334 conveyor guide rail (conveyor belt support body)

334b Recess

335 Board guide (board holder)

336 support roller

350 lifting department

352 lift motor

K Substrate

Detailed ways

[Overall structure of the embodiment of the utility model]

Embodiments of the present invention will be described based on FIGS. 1 to 7 . In this embodiment, a substrate transfer device incorporated in an electronic component mounting device is exemplified.

FIG. 1 is a plan view of an electronic component mounting device 10 . As shown in the figure, this electronic component mounting apparatus 10 mainly includes: a feeder container 20 serving as an electronic component supply unit, which holds a plurality of electronic component feeders 21 for supplying electronic components to be mounted; , which transports the substrate K along a fixed conveying direction inside the device; the mounting head 40, which receives electronic components from the electronic component supplier 21, and installs them on the substrate K; the XY gantry 50 as the moving unit of the mounting head, whose The mounting head 40 is driven and transported to any position within the specified range; the component camera 11 photographs the electronic components held on the mounting head 40 from below; the substrate camera 12 is mounted on the mounting head 40, and A board mark (not shown) on the board K is photographed; a control device 90 controls each structure of the electronic component mounting apparatus 10; and a main frame 13 supports the entire structure.

In addition, in the following description, the direction in which the substrate K is transported by the substrate transport device 30 inside the electronic component mounting apparatus 10 is defined as the X-axis direction, and the vertical vertical direction is defined as the Z-axis direction. The direction perpendicular to the direction is the Y-axis direction, and when the electronic component mounting device 10 is correctly used, the device is installed so that the X-axis direction and the Y-axis direction become horizontal.

In addition, this electronic component mounting apparatus 10 has a central buffer area 33 at an intermediate position of the transport path for transporting the substrate K by the substrate transport device 30. In the work area, two feeder containers 20 and 20 are provided on both sides of the central buffer area 33 with the substrate transfer device 30 interposed therebetween. In addition, two mounting heads 40 and two XY gantry frames 50 are also mounted corresponding to the feeder containers 20 .

[Electronic component mounting device: Feeder container]

In each feeder container 20 , a plurality of electronic component feeders 21 are placed side by side along the X-axis direction.

In each electronic component feeder 21 , a component supply tape formed by arranging electronic components in a row and packaging them is supplied from a reel (not shown) to the rear end thereof, and the supplied component supply tape is conveyed to a place where the electronic components are placed. The component transfer position on the upper side of the front end portion (the end portion on the conveyance path side) of the feeder 21 . Then, at the component transfer position, the electronic components in the component supply tape are sucked by the suction nozzles 41 mounted on the mounting head 40 .

[Electronic component mounting device: mounting head]

As shown in the figure, each mounting head 40 is provided with: a plurality of suction nozzles 41 (for example, 6 pieces), which hold electronic components by air suction at their front ends; a Z-axis motor 42 (refer to FIG. It moves the suction nozzle 41 up and down in the Z-axis direction; and a θ-axis motor 43 (see FIG. 7 ) as a rotational drive source rotates the electronic component held by the suction nozzle 41 around the Z-axis direction.

Each suction nozzle 41 is connected to a negative pressure generator, and the electronic component is sucked and held by suctioning the lower end of the suction nozzle 41 .

In addition, Z-axis motors 42 and θ-axis motors 43 are mounted on the mounting head 40 in the same number as the suction nozzles 41 .

In addition, the number of suction nozzles 41 mounted on the mounting head 40 is not limited to six, and may be increased or decreased.

[Electronic component mounting device: each camera]

Both the component camera 11 and the substrate camera 12 are CCD cameras or CMOS cameras.

The component cameras 11 are fixedly attached to predetermined positions of the main frame 13 (for example, between the feeder container 20 and the substrate transport path) corresponding to the mounting heads 40 . Each component camera 11 directs its line of sight vertically upward from the main frame 13 , and photographs the electronic component picked up by its suction nozzle 41 from below when the mounting head 40 passes through the field of view. Based on the image data captured by the component camera 11 , the displacement of the suction nozzle 41 and the center position of the electronic component is obtained, and after correction based on the displacement is performed, the electronic component is mounted. In addition, the substrate camera 12 is mounted on the mounting head 40 with its line of sight directed downward, images a substrate mark on the substrate K, obtains the position of the mark, and positions the mounting head 40 based thereon.

[Electronic component installation device: X-Y gantry]

Each XY gantry 50 has: an X-axis guide rail 51, which supports the loading head 40, and can move the loading head 40 along the X-axis direction; a Y-axis guide rail 52, which supports the loading head 40 via the X-axis guide rail 51, and can move the loading head 40 The mounting head 40 moves in the Y-axis direction; the X-axis motor 53 (refer to FIG. 7 ) as a drive source moves the mounting head 40 in the X-axis direction; and the Y-axis motor 54 (refer to FIG. 7 ) as a drive source The mounting head 40 is moved in the Y-axis direction via the X-axis guide rail 51 .

In addition, the mounting head 40 can be conveyed to the entire central buffer area 33 by driving the motors 53 and 54 .

In addition, the two XY gantry frames 50 , 50 conveying the two loading heads 40 share the two Y-axis guide rails 52 , 52 .

In addition, encoders for detecting respective rotation amounts are attached to the respective motors 53 and 54 , and the rotation angles are input to the control device 90 . Accordingly, the control device 90 controls the motors 53 and 54 to position the suction nozzles 41 and the substrate camera 12 of the mounting head 40 .

[Electronic component mounting device: Substrate conveying device]

2 is a perspective view of the substrate transfer device 30 , FIG. 3 is a plan view, FIG. 4 is a cross-sectional view viewed from the substrate transfer direction, and FIGS. 5 and 6 are side views.

As shown in each figure, the substrate transfer device 30 has a transfer frame 311 extending substantially over the entire length of the substrate transfer path along the X-axis direction. The portion becomes the substrate export port 313 .

In addition, the substrate conveying path is from the substrate import port 312 toward the substrate export port 313, and sequentially forms an import buffer area 32 as an upstream substrate standby area, a central buffer area 33 as a work area, and an unload buffer area as a downstream substrate standby area. 34.

The central buffer area 33 is an area where the substrate K is held and electronic component mounting work is performed.

The loading buffer area 32 is an area where the board K loaded in from the board loading port 312 is kept on standby until the board K having completed the board mounting operation is discharged from the central buffer area 33 .

The unloading buffer area 34 is used until another board manufacturing device for performing the next operation is connected to the board export port 313 of the electronic component mounting device 10 until a signal for permission to carry in the board is received from the board manufacturing device. The area where substrate K stands by. Therefore, when the downstream side of the substrate export 313 is not connected to the subsequent substrate manufacturing apparatus, the substrate K passes through the export buffer area 34 and is discharged from the substrate export 313 .

In order to realize the transfer of the substrate K by conveying between the aforementioned areas 32 to 34 , transport mechanisms 320 to 340 are provided in the respective areas 32 to 34 on the transport path.

In addition, on the conveying path, be provided with: carry in sensor 314, it is arranged on the upstream end portion of carrying in buffer zone 32; Wait for sensor 315, it is arranged on the downstream end portion of carrying in buffer zone 32; The downstream end portion of the buffer area 33 is slightly upstream compared to the downstream end; the center carry-out sensor 317 is arranged at the downstream end portion of the central buffer area 33; the carry-out sensor 318 is arranged at the downstream end portion of the carry-out buffer area 34; The actuator 319 stops the substrate K at the substrate holding position in the central buffer region 33 .

Each of the sensors 314 to 318 is an optical sensor composed of a light source and a light receiving element, and can detect the arrival or passage of the front or rear end of the board K.

The carry-in sensor 314 is used to detect the carry-in of the substrate K into the carry-in buffer area 32 . The control device 90 operates the transport mechanism 320 based on the detection by the carry-in sensor 314 , and carries the substrate K into the carry-in buffer area 32 .

The waiting sensor 315 is used to make the board K carried in stand by in the carrying-in buffer area 32 . When the control device 90 detects the front part of the next substrate K by the waiting sensor 315 when there is a substrate K carried in earlier in the central buffer area 33, the conveyance of the next substrate K is stopped to prevent it from entering the center. Buffer area 33.

The stop sensor 316 is used to position the substrate K at an appropriate substrate holding position in the central buffer area 33 . When the control apparatus 90 detects the front part of the board|substrate K by the stop sensor 316, it will stop conveyance, and will switch to holding operation|movement of the board|substrate K.

At this time, the stopper 319 is simultaneously controlled to forcibly stop the substrate K at an appropriate substrate holding position. In addition, the stopper 319 can be switched between the permissive state which allows the board|substrate K to pass and the blocking state which prevents it by the control of the control apparatus 90. FIG.

The central carry-out sensor 317 is used to detect discharge of the substrate K from the central buffer area 33 . The control device 90 recognizes that the next substrate K can be carried into the central buffer area 33 when the passage of the rear end portion of the substrate K is detected by the central carry-out sensor 317 .

The carry-out sensor 318 is used to detect discharge of the substrate K from the carry-out buffer area 34 . The control device 90 recognizes that the next substrate K can be discharged from the central buffer area 33 when the passage of the rear end portion of the substrate K is detected by the carry-out sensor 318 .

Next, the conveyance mechanisms 320 to 340 in the respective buffer areas 32 to 34 of the conveyance path will be described.

Each conveying mechanism 320, 330, 340 has: a pair of conveyor belts 321, 331, 341, they are at the both ends of the Y-axis direction of each buffer area 32, 33, 34, and each buffer area 32, 33, 34 The entire length of the X-axis direction is tensioned; the conveyor pulleys 322, 332, 342 are tensioned to support these conveyor belts 321, 331, 341; and the conveyor motors 323, 333, 343 ( Referring to FIG. 7 ), the conveyor belts 321 , 331 , and 341 are conveyed in the substrate conveying direction via the conveyor pulleys 322 , 332 , and 342 .

In addition, a conveyor belt 321 and a conveyor pulley 322 are arranged in the loading buffer area 32 , and a conveyor motor 323 drives the conveyor belt 321 . The central buffer area 33 and the carry-out buffer area 34 are also configured in the same manner.

In addition, the conveyor belts 321, 331, 341 are arranged horizontally and substantially at the same height so that their ends face each other, and the substrate K placed on the upper surface of the conveyor belt can move smoothly from the previous conveyor belt to the next conveyor belt.

As shown in FIGS. 4-6 , the conveying mechanism 330 of the central buffer area 33 has a pair of conveying guide rails 334 , and the upper surfaces of the pair of conveying guide rails 334 serve as flat conveyer belt supports. The pair of transport rails 334 are respectively provided on the lower side of the annular upper portion (substrate placement portion) of the pair of transport belts 331 .

In addition, the conveyance mechanism 330 has: a pair of substrate guides 335 as substrate holders, which are respectively provided on the upper side of the pair of conveyance belts 331; and each substrate guide part 335 clamps the substrate K via the conveyance belt 331; and a support roller 336, which is fixedly supported on the conveyance frame together with each substrate guide part 335 in a state of maintaining a fixed distance with respect to each substrate guide part 335 311 on.

The conveying frame 311 has a pair of side walls 311a, 311a standing up from both ends in the Y-axis direction of the conveying frame 311, and a conveying belt 331, a plurality of conveying pulleys 332, and conveying rails are respectively provided on the sidewalls 311a, 311a. 334 . The substrate guiding part 335 . In addition, each structure of the transport mechanism 330 provided on one side wall 311a and the other side wall 311a has a symmetrical arrangement and structure across the substrate transport path. Therefore, only the structure of the transport mechanism 330 on one side wall 311a Be explained.

The conveyor belt 331 is tensioned by a plurality of conveyor pulleys 332 a , 332 b , 332 c , and 332 d in a substantially rectangular ring shape extending substantially over the entire length of the central buffer region 33 in the X-axis direction. The plurality of conveyor pulleys 332 a , 332 b , 332 c , and 332 d are rotatably supported by plate-shaped support portions 334 c , 334 d provided at both end portions of the conveyor rail 334 . The plate-shaped support portions 334c and 334d are close to and opposite to the side wall 311a.

In addition, the conveyance belt 331 places and conveys the board|substrate K on the upper surface. Therefore, the conveyor belt 331 is given a conveying operation by the conveying motor 333 so that the loop-shaped upper portion moves in the conveying direction (rightward in FIGS. 4 to 6 ).

The substrate guide 335 is a flat plate supported at the upper end of the side wall 311 a of the conveying frame 311 in a horizontal state, and its lower surface is nearly opposed to the upper surface of the upper portion of the conveying belt 331 . The width of the substrate guide portion 335 in the Y-axis direction is approximately equal to the width of the conveyer belt 331, and the lower surface of the substrate guide portion 335 and the upper surface of the upper portion (substrate placement portion) of the conveyer belt 331 form a ratio of conveyance. The gap is slightly larger than the thickness of the substrate K so that the conveyed substrate K does not come into sliding contact with the substrate guide 335 (see FIG. 5 ).

The transport rail 334 has a long cuboid as a main body portion 334e, and has the above-mentioned support portions 334c and 334d at both ends thereof. Moreover, the main-body part 334e of the conveyance rail 334 is provided in the state along the X-axis direction inside the endless conveyance belt 331 in the tensioned state. The upper surface of the main body portion 334e of the conveyance rail 334 is formed flat, and the upper surface portion is arranged to be close to the lower surface of the endless upper portion (substrate placement portion) of the conveyance belt 331 .

The conveying rail 334 is vertically supported on the side wall 311 a of the conveying frame 311 , and is raised and lowered between the lower limit position and the upper limit position of its movable range by the lifter 350 .

The upper surface of the main body portion 334e of the transport rail 334 is slightly lower than the upper ends of the transport pulleys 332a and 332b on both sides supported by both ends of the substrate mounting portion of the transport belt 331 . Therefore, when the transport rail 334 is located at the lower limit of its movable range (the state of FIG. 5 ), the upper surface of the transport rail 334 is slightly separated from the lower surface of the substrate mounting portion of the transport belt 331 .

In addition, when the conveyance rail 334 is located at the upper limit of its movable range (the state of FIG. 6 ), the upper surface of the conveyance belt 331 abuts against the lower surface of the substrate guide 335, and the conveyance belt 331 is pressed downward, and the conveyance rail 334 The upper surface is in contact with the lower surface of the substrate mounting portion of the conveyor belt 331 , and finally the conveyor belt 331 is sandwiched by the conveyor rail 334 and the substrate guide portion 335 . Thereby, the substrate K placed on the conveyor belt 331 can be clamped by the conveyance rail 334 and the substrate guide part 335 via the conveyor belt 331 , and the substrate K can be held.

In addition, rod-shaped input parts 334a, 334a extending downward are fixedly installed at the lower parts of both ends in the X-axis direction of the transport rail 334. The lifting unit 350 raises and lowers the transport rail 334 via the input units 334a, 334a.

In addition, on the upper surface of the transport rail 334, two concave portions 334b, 334b are formed along the substrate transport direction. Each recess 334b is formed through the conveyance rail 334 along the Y-axis direction, and accommodates support rollers 336 , 336 supported on the side wall 311a of the conveyance frame 311 inside.

The support rollers 336, 336 are supported on the side wall 311a so as to be rotatable around the Y axis. And, when the conveyance rail 334 is located at the lower limit of the movable range, the upper ends of the support rollers 336, 336 are at a height equal to the conveyance pulleys 332a on both sides supported at both ends of the substrate mounting portion of the conveyance belt 331. , 332b are mounted on the side wall 311a so that the upper ends thereof are equal.

In addition, since the supporting rollers 336 and 336 and the substrate guide portion 335 are fixedly supported on the side wall 311a, the distance between them is always kept constant.

Therefore, when the conveyance rail 334 is located at the lower limit of the movable range (the state of FIG. 5 ), the upper end portions of the support rollers 336, 336 are slightly higher than the upper surface of the main body portion 334e of the conveyance rail 334, and the recesses 334b , 334b protrude and come into contact with the lower surface of the substrate placement portion of the conveyor belt 331 .

In addition, when the conveyance rail 334 is located at the upper limit of the movable range (the state of FIG. 6 ), the upper end portion of each support roller 336, 336 becomes lower than the upper surface of the main body portion 334e of the conveyance rail 334, and each support roller 336, 336 enters into each recessed part 334b, 334b, and does not contact the lower surface of the conveyor belt 331.

The lifting part 350 has: a supporting table 351, which is supported on the conveying frame 311, and can be lifted relative to the conveying frame 311 between the two side walls 311a, 311a in the central buffer area 33; and a ball screw mechanism (not shown), which converts the rotational torque of the elevating motor 352 into a linear motion in the vertical direction and transmits it to the supporting table 351.

The support table 351 is disposed below the transport rails 334 , 334 , and spherical protrusions 351 a abutting the rod-shaped input portions 334 a , 334 a of the transport rails 334 are provided at four corners of the support table 351 . And, if the support table 351 rises, each projection 351a pushes up each conveying guide rail 334, 334 to the upper limit of the movable area via the input portion 334a.

Furthermore, an encoder 353 is provided together with the lift motor 352, and based on the amount of rotation obtained from the encoder 353, the raised support table 351 can be stopped at an appropriate stop position.

In addition, a plurality of back support rods (not shown) can be attached to the upper surface of the support table 351 so that the back of the substrate K held by the transport rail 334 and the substrate guide 335 does not bend due to its own weight. The back support bar is erected on the upper surface of the support table 351 in the raised state, and the upper end of the back support bar is set so that there is almost no gap or gap with respect to the back surface of the substrate K in a state where no bending occurs. The height of the degree that a gap is produced slightly. Thereby, when the substrate K bends due to its own weight, it can be supported by the back support rod-shaped body, and the bending can be suppressed. In addition, the back support rod-shaped body can be attached and detached at any position on the upper surface of the support table 351 .

[Control system of electronic component mounting device]

Next, the control system of the electronic component mounting apparatus 10 will be described based on the block diagram of FIG. 7 .

The X-axis motor 53 and the Y-axis motor 54 of the above-mentioned XY gantry 50 , and the Z-axis motor 42 and theta-axis motor 43 mounted on the mounting head 40 are respectively connected to the control device 90 via a drive circuit not shown in the figure. .

In addition, the imaging operation of the component camera 11 and the substrate camera 12 is controlled by the control device 90 . In addition, image data captured by the component camera 11 and the substrate camera 12 are output to an image processing device (not shown), and the processing results are output to the control device 90 .

In addition, although the said motors 42, 43, 53, 54 and each camera 11, 12 are mounted in multiple numbers on the electronic component mounting apparatus 10, only one is shown in FIG. 7, and others are abbreviate|omitted.

Furthermore, the first conveyance motor 323 and the second conveyance motor as conveyance motors respectively performing substrate conveyance in the respective regions 32 , 33 , and 34 of the above-mentioned substrate conveyance device 30 are connected to the control device 90 via a drive circuit not shown. The motor 333 , the third conveyance motor 343 , and the lift motor 352 . In addition, the carry-in sensor 314, the waiting sensor 315, the stop sensor 316, the center carry-out sensor 317, and the carry-out sensor 318 installed at each position of the conveying path of the substrate conveying device 30 are connected to the control device 90 through an interface not shown, and the substrate The detection signal is input to the control device 90 . Furthermore, the stopper 319 provided in the central buffer region 33 is connected to the control device 90 via a drive circuit not shown.

The control device 90 mainly includes an EEPROM 94 that stores a list of electronic components to be mounted and mounting plan data in which the order of mounting electronic components, the mounting position of each electronic component on the substrate K, and the display of each electronic component are determined. The receiving position, etc. from which electronic component feeder 21 is received; the ROM 92, which stores a mounting operation control program and a substrate transfer control program; a CPU 91, which executes various programs; and a RAM 93, which executes various programs becomes the data storage area during execution.

The operation of the electronic component mounting apparatus 10 executed by the CPU 91 using the above-described board transport program and mounting operation control program will be described.

First, when the carry-in sensor 314 detects the front portion of the substrate K, the CPU 91 starts driving the conveyance motor 323, and carries the substrate K from the carry-in port 312 to the carry-in buffer area 32.

Then, if the front portion of the substrate K is detected by the waiting sensor 315, if there is a substrate K carried in earlier in the central buffer area 33, the conveyance of the substrate K carried in the buffer area 32 is stopped, and if there is no substrate K carried in earlier, In the case of the substrate K, the drive of the conveyance motor 333 is also started, and the substrate K is conveyed from the carry-in buffer area 32 to the central buffer area 33 .

Accordingly, the substrate K moves from the pair of conveyor belts 321 to the pair of conveyor belts 331 , and is conveyed downstream while being placed on the upper surface of the conveyor belts 331 .

At this time, as shown in FIG. 5 , since the pair of conveying rails 334 are located at the lower limit of the movable range, the main body 334 e is separated from the conveying belt 331 , and the supporting rollers 336 support the conveying belt 331 from below. Therefore, even when the substrate K is large and heavy, the conveyor belt 331 can smoothly convey the substrate K. In addition, illustration of the substrate K is omitted in FIG. 5 .

Then, when the front portion of the substrate K is detected by the stop sensor 316 , the stopper 319 is set to the substrate stop state, and the transport motor 333 is stopped when the substrate K reaches the stopper 319 . And, as shown in FIG. 6, the lifting motor 352 is driven to raise the support table 351. Thereby, each conveyance rail 334 is pushed up to the upper limit of the movable range. As a result, each support roller 336 enters into the concave portion 334b, and the board guide portion 335 comes into contact with the upper surface of the conveyor belt 331 . Then, the upper surface of the main body portion 334e of the transport rail 334 abuts against the lower surface of the transport belt 331, whereby the substrate K is held between the transport rail 334 and the substrate guide portion 335 via the transport belt 331, and becomes fixed. At this time, since the lower side of the substrate K is pressed and held by the upper surface of the main body portion 334e of the flat conveying rail 334 via the conveying belt 331, load is dispersed by surface contact and warpage is suppressed.

In the above-mentioned holding state of the board K, the mounting operation of the electronic component is performed. That is, by controlling the X-axis and Y-axis motors 53, 54 based on the mounting plan data by the CPU 91 executing the mounting operation control program, the suction nozzle of the mounting head 40 is positioned at a predetermined receiving position of the electronic component feeder 21. 41 , the Z-axis motor 42 is controlled, and the electronic component is sucked by the suction nozzle 41 . Then, the mounting head 40 is passed above the component camera 11 to take an image of the bottom, and the electronic component is transported to the board mounting position specified in the mounting plan data. Then, the position of the electronic component is corrected by the X-axis and Y-axis motors 53, 54, and the orientation is corrected by the θ-axis motor 43. At the same time, the electronic component is lowered by the Z-axis motor 42 to execute the mounting operation.

In addition, when specified in the mounting plan data, the mounting operation on the substrate K is performed after the plurality of suction nozzles 41 of the mounting head 40 perform the suction operation of the electronic component simultaneously or sequentially.

Then, when the mounting operation of the electronic component is completed, the elevating motor 352 is driven to lower the support table 351 . Thereby, each conveyance rail 334 descends to the lower limit of a movable range, and returns to the state where each support roller 336 protrudes from the recessed part 334b, and supports the conveyance belt 331 from below.

Then, when the board restraint state of the stopper 319 is released and it is confirmed that the board K carried in earlier has been discharged from the unloading buffer area 34 , the transport motor 333 is driven to transport the board K from the central buffer area 33 to the unloading buffer area 34 .

Then, if the passage of the rear end portion of the substrate K is detected by the central unloading sensor 317, the CPU 91 stops the driving of the conveyance motor 333, and recognizes that the next substrate K can be conveyed into the central buffer area 33.

And, when the substrate K conveyed to the unloading buffer area 34 can be unloaded out of the facility, it is unloaded directly through the unloading buffer area 34.

Then, if the passing of the rear end portion of the substrate K is detected by the carry-out sensor 318, the CPU 91 stops the drive of the conveyance motor 343, and recognizes that the next substrate K can be conveyed into the carry-out buffer area 34.

[the effect of the embodiment of the utility model]

In the electronic component mounting apparatus 10 described above, the substrate conveyance device 30 conveys the substrate K along the substrate conveyance path, and has a central buffer area 33 as a work area for performing predetermined operations on the substrate K in the middle of the substrate conveyance path, and the The substrate conveying device 30 is characterized in that it includes: a conveying belt 331 provided along the substrate conveying path, on which the substrate K is placed and conveyed; a conveying motor 333 serving as a conveying belt drive unit that conveys the conveying belt 331 in the conveying direction; The conveying guide rail 334 of the conveyer belt support body is provided on the lower side of the substrate mounting portion of the conveyer belt 331 in the central buffer area 33, and the upper surface of the conveying guide rail 334 is flat; the substrate guide portion serving as the substrate holding body 335, which is disposed on the upper side of the conveyor belt 331 in the central buffer area 33; the lifting part 350, which raises the conveyor rail 334 to clamp the substrate K via the conveyor belt 331 by the conveyor rail 334 and the substrate guide part 335; And the support roller 336 is supported on the side wall 311 a together with the substrate holder 335 while maintaining a fixed distance with respect to the substrate guide 335 , and is disposed inside the concave portion 334 b formed on the upper surface of the transport rail 334 . The elevating unit 350 raises and lowers the conveyance rail 334 within a range in which the support roller 336 can move in and out with respect to the upper surface of the conveyance rail 334 (the range from the upper limit to the lower limit of the movable range).

In addition, the substrate conveyance device 30 supports the support rollers 336 and the substrate holder 335 on the conveyance frame 311 , and the elevating unit 350 elevates the conveyor belt support 334 . On this basis, it is configured to have conveyor pulleys 332a, 332b, which support the both ends of the conveyor belt 331, and are rotatably supported on the conveyor belt support body 334, and the conveyor belt support body 334 is positioned movable At the lower limit of the region, the conveyor belt 331 is supported by the conveyor pulleys 332a, 332b and the support roller 336, and the conveyor belt 331 is conveyed in the conveying direction.

Utilize above-mentioned structure, when conveying guide rail 334 is positioned at the lower limit of movable range, this conveying guide rail 334 is far away from conveying belt 331, is supported conveying belt 331 from below by support roller 336, therefore, avoids the sliding of conveying belt 331 and conveying guide rail 334, Delivered smoothly. Therefore, even in the case of transporting a large substrate or a bonded substrate in which a plurality of substrates are bonded with a jig, the load on the transport motor 333 can be reduced, and a stable transport operation can be performed.

In addition, when the conveyance rail 334 is located at the upper limit of the movable range, the entire upper surface of the conveyance rail 334 clamps the lower surface of the substrate K via the conveyer belt 331, so that the pressing load generated by the clamping portion is distributed and the substrate K is reduced. The generation of the bending and the positional error caused by the bending are suppressed. Therefore, the electronic component can be positioned with high precision and the mounting operation can be performed at the same time, and the stable mounting operation with few errors can be performed.

In addition, since the two supporting rollers 336 and the concave portion 334b of the conveying rail 334 are provided along the substrate conveying direction, compared with the case where there is only one supporting roller 336, the conveying belt 331 is less likely to come into contact with the conveying rail 334, and the risk of slippage can be further reduced. occur.

In addition, more support rollers 336 and recesses 334b of the transport rail 334 may be provided.

[other]

In addition, in the above-mentioned substrate conveyance apparatus 30, the conveyance rail 334 is raised and lowered, but for example, the conveyance rail 334 may be fixedly attached to the side wall 311a of the conveyance frame 311, and may be attached to a movable member capable of moving up and down relative to the sidewall 311a. The substrate guide part 335 and the support roller 336 are integrally raised and lowered by the lift part 350 .

That is, when the substrate K is conveyed, the substrate guide 335 and the support roller 336 are lifted up, and the conveyance belt 331 is pushed up by the support roller 336 so that no slippage occurs with the conveyance rail 334 .

In addition, in the case of holding the substrate K, the substrate guide 335 and the support roller 336 are lowered, the support roller 336 enters the concave portion 334b of the transport rail 334, and the substrate guide 335 and the upper surface of the transport rail 334 are lowered to pass through The conveyor belt 331 clamps the substrate K.

With the above configuration, the same effect as that obtained in the case of raising and lowering the conveyance rail 334 can be obtained.

In addition, in the above-mentioned embodiment, the case where the substrate transfer device 30 is mounted on the electronic component mounting device 10 as a substrate manufacturing device is exemplified, but the substrate transfer device 30 may be mounted on other substrate manufacturing devices. . For example, other substrate manufacturing devices include devices that print solder paste onto a substrate, devices that perform solder reflow, and the like.

Claims (4)

1. a base board delivery device, it is along substrate transport path conveying substrate, and, there is in the midway of described substrate transport path the operating area of substrate being carried out to regulation operation,

The feature of this base board delivery device is to have:

Load-transfer device, it is arranged along described substrate transport path, loads described substrate and carries;

Load-transfer device drive division, described load-transfer device is carried along throughput direction by it;

Load-transfer device supporter, it is in described operating area, is arranged on the downside of the substrate-placing part of described load-transfer device, and the upper surface of this load-transfer device supporter is smooth;

Substrate holder, it is arranged on the upside of described load-transfer device in described operating area;

Lifting unit, it is when utilizing described load-transfer device supporter and described substrate holder clamps described substrate via described load-transfer device, makes described load-transfer device supporter rise or described substrate holder is declined; And

Backing roll, it is under the state maintaining the distance of fixing relative to described substrate holder, and supported together with this substrate holder, this backing roll is configured in inside the recess of the upper surface being formed at described load-transfer device supporter,

When carrying described substrate, described lifting unit makes described load-transfer device supporter decline or make described substrate holder increase, and protrudes relative to the upper surface of described load-transfer device supporter to make described backing roll.

2. base board delivery device according to claim 1, is characterized in that,

The recess of multiple described backing roll and described load-transfer device supporter is set along described substrate throughput direction.

3. base board delivery device according to claim 1, is characterized in that,

Described backing roll and described substrate holder are supported in transportation frame, and,

Described lifting unit, makes described load-transfer device supporter rise when clamping described substrate, when carrying described substrate, described load-transfer device supporter is declined.

4. base board delivery device according to claim 3, is characterized in that,

Have belt pulley for feeding foil, it supports the both ends of described load-transfer device, and, be rotatably supported on described load-transfer device supporter,

Be positioned at the lower of movable area at described load-transfer device supporter to prescribe a time limit, described belt pulley for feeding foil and described backing roll support described load-transfer device, are carried by described load-transfer device along throughput direction.