CN204565437U - A kind of semiconductor refrigeration member bonding machine - Google Patents
A kind of semiconductor refrigeration member bonding machine Download PDFInfo
- Publication number
- CN204565437U CN204565437U CN201520274902.4U CN201520274902U CN204565437U CN 204565437 U CN204565437 U CN 204565437U CN 201520274902 U CN201520274902 U CN 201520274902U CN 204565437 U CN204565437 U CN 204565437U
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- cylinder
- plumb joint
- frame
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- dish
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Abstract
The utility model relates to the equipment of cooling component production technical field, title is a kind of semiconductor refrigeration member bonding machine, comprise frame, frame has the plumb joint of the first cylinder interlock, conveyer is had below plumb joint, frame after plumb joint is provided with the second cylinder, below the second described cylinder, has cooling conduction seat; In frame, first cylinder and the second cylinder both sides are respectively provided with a slideway, these two slideways are separately installed with the 3rd cylinder, 3rd cylinder is through control device connecting fluid cylinder pressure, also have power set to connect the 3rd cylinder, the 3rd cylinder moves can run between the both sides of plumb joint and the both sides of cooling conduction seat along slideway under the effect of power set; It also comprises one and keeps out dish, has and can make cooling component at short notice reducing temperature and having a firm process under keeping certain pressure, to improve the advantage of welding quality, also have the effect reducing energy waste, ensure production efficiency.
Description
Technical field
The utility model relates to the equipment of cooling component production technical field, particularly relates to cooling component bonding machine.
Background technology
Cooling component is made up of porcelain plate and the multiple crystal grain be welded on porcelain plate, and cooling component is middle is crystal grain, both sides are porcelain plates, and the quality that crystal grain welds on porcelain plate is directly connected to the quality of cooling component.
Be cooling component bonding machine by crystal particle welding on porcelain plate, such bonding machine has frame, and frame has the plumb joint that cylinder links, and described plumb joint has heater, below plumb joint, has conveyer; The process of welding is such: be placed in by crystal grain after on porcelain plate and be placed on conveyer, conveyer is transported to below plumb joint, and plumb joint runs downwards, and plumb joint at high temperature presses down porcelain plate and crystal grain, can complete the welding to cooling component.
Use such bonding machine, after cooling component welds, if plumb joint departs from cooling component at a higher temperature, make cooling component be in freely stress-free state, will welding quality be affected; If Deng plumb joint reduce certain temperature after move apart cooling component again, then because plumb joint has larger thermal capacity, there is the shortcoming of difficulty, the production efficiency that wastes energy, affects of again heating up.
Make the good cooling component of welding at short notice reducing temperature and having a firm process under keeping certain pressure, be the effective measures improving cooling component welding quality, meanwhile, reduce energy waste, ensure the pursuit of production efficiency Ye Shi producer.
Summary of the invention
The purpose of this utility model is exactly for above-mentioned shortcoming, a kind of cooling component that can make is provided to reduce temperature and under keeping certain pressure, having a firm process at short notice, to improve the semiconductor refrigeration member bonding machine of welding quality, reach the effect reducing energy waste, ensure production efficiency simultaneously.
The technical solution of the utility model is achieved in that a kind of semiconductor refrigeration member bonding machine, comprise frame, frame has the plumb joint of the first cylinder interlock, first cylinder is through control device connecting fluid cylinder pressure, described plumb joint there is heater, below plumb joint, there is conveyer, below conveyer, have supporting plate;
It is characterized in that:
Frame after plumb joint is provided with the second cylinder, the second cylinder is through control device connecting fluid cylinder pressure, and have cooling conduction seat below the second described cylinder, seat inside is transmitted in cooling circulation pipe, and circulation pipe connects cooling fluid;
In frame, first cylinder and the second cylinder both sides are respectively provided with a slideway, these two slideways are separately installed with the 3rd cylinder, 3rd cylinder is through control device connecting fluid cylinder pressure, also have power set to connect the 3rd cylinder, the 3rd cylinder moves can run between the both sides of plumb joint and the both sides of cooling conduction seat along slideway under the effect of power set;
It also comprises one and keeps out dish, it is described that to keep out dish be the lamellar body that a high-strength steel is made, keep out above dish and there are cooperation plumb joint, two structures that the 3rd cylinder presses down, keep out dish centre below and have the structure coordinated above cooling component welding afterwards, keeping out dish both sides is below the structures tilted.
Described plumb joint side is provided with the first magnet, and described keeping out on dish is provided with the second magnet, and the first magnet and the second magnet coordinate and can be adsorbed on keeping out dish below the first cylinder.
The beneficial effects of the utility model are: such bonding machine has can be made reducing temperature and having a firm process under keeping certain pressure in the cooling component short time, to improve the advantage of welding quality, reach the effect reducing energy waste, ensure production efficiency simultaneously.
Described plumb joint side is provided with the first magnet, and described keeping out on dish is provided with the second magnet, and the first magnet and the second magnet coordinate and can be adsorbed on keeping out dish below the first cylinder, has installation and keeps out and coil advantage more easily.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the head-down position relation schematic diagram of keeping out dish, plumb joint, the 3rd cylinder after welding.
Fig. 3 is that the 3rd cylinder runs to the second cylinder process from plumb joint, keeps out the head-down position relation schematic diagram of dish and the 3rd cylinder.
Fig. 4 keeps out dish when the second cylinder side, keeps out dish, the second cylinder, the 3rd cylinder head-down position relation schematic diagram.
Wherein: 1, frame 2, first cylinder 3, plumb joint 4, heater 5, conveyer 6, supporting plate 7, second cylinder 8, cooling are conducted seat 9, circulation pipe 10, slideway 11, the 3rd cylinder 12, kept out dish 13, first magnet 14, second magnet 15, power set 16, product.
Detailed description of the invention
Below in conjunction with accompanying drawing, the utility model is described in further detail.
As shown in Figure 1, a kind of semiconductor refrigeration member bonding machine, comprise frame 1, frame 1 has the plumb joint 3 that the first cylinder 2 links, first cylinder 2 is through control device connecting fluid cylinder pressure, described plumb joint there is heater 4, below plumb joint, have conveyer 5, below conveyer, have supporting plate 6;
It is characterized in that:
Frame after plumb joint is provided with the second cylinder 7, second cylinder 7 through control device connecting fluid cylinder pressure, have cooling conduction seat 8 below the second described cylinder, seat inside is transmitted in cooling circulation pipe 9, and circulation pipe connects cooling fluid;
In frame, first cylinder and the second cylinder both sides are respectively provided with a slideway 10, these two slideways are separately installed with the 3rd cylinder 11,3rd cylinder is through control device connecting fluid cylinder pressure, also have power set 15 to connect the 3rd cylinder, the 3rd cylinder moves can run between the both sides of plumb joint and the both sides of cooling conduction seat along slideway under the effect of power set;
It also comprises one and keeps out dish 12, it is described that to keep out dish be the lamellar body that a high-strength steel is made, keep out above dish and there are cooperation plumb joint, two structures that the 3rd cylinder presses down, keep out dish centre below and have the structure coordinated above cooling component welding afterwards, keeping out dish both sides is below the structures tilted;
Plumb joint can weld cooling component, and described conveyer can be conveyer belt, and described dish of keeping out has certain pressure bearing capacity.
When this device uses, 3rd cylinder runs to the both sides of plumb joint, following dish of keeping out is placed on above the product that will weld, weld, then the 3rd cylinder runs, and press against following keeping out and coils both sides, continue to exert pressure to cooling component, at this moment keep out dish, plumb joint, the 3rd cylinder head-down position relation as shown in Figure 2, in figure 16 represent products.
First cylinder upwards runs, depart from welding, at this moment when the 3rd cylinder continues to exert pressure, run to the second cylinder both sides under power set effect downwards, Fig. 3 is that the 3rd cylinder runs to the second cylinder process from plumb joint, keeps out the head-down position relation schematic diagram of dish and the 3rd cylinder.
Second cylinder presses down, can cool product, at this moment cooling work also has the downward pressure of the 3rd cylinder to act on to keep out dish, whole process is just carried out under stress, can realize the purpose of this utility model, Fig. 4 keeps out dish when the second cylinder side, keeps out dish, the second cylinder, the 3rd cylinder head-down position relation schematic diagram, can be implemented in when exerting pressure and cool, there is effect of the present utility model.
Described plumb joint side is provided with the first magnet 13, and described keeping out dish is provided with the second magnet 14, first magnet and the second magnet coordinates and can be adsorbed on keeping out dish below the first cylinder.
Before welding, can will keep out dish and be placed on below plumb joint like this, have quick for installation, contraposition easily, use advantage more easily.
The foregoing is only specific embodiment of the utility model, but architectural feature of the present utility model is not limited to this, any those skilled in the art is in field of the present utility model, and the change done or modification are all encompassed in the scope of the claims of the present invention.
Claims (2)
1. a semiconductor refrigeration member bonding machine, comprises frame, and frame has the plumb joint of the first cylinder interlock, first cylinder is through control device connecting fluid cylinder pressure, described plumb joint there is heater, below plumb joint, has conveyer, below conveyer, have supporting plate;
It is characterized in that:
Frame after plumb joint is provided with the second cylinder, the second cylinder is through control device connecting fluid cylinder pressure, and have cooling conduction seat below the second described cylinder, seat inside is transmitted in cooling circulation pipe, and circulation pipe connects cooling fluid;
In frame, first cylinder and the second cylinder both sides are respectively provided with a slideway, these two slideways are separately installed with the 3rd cylinder, 3rd cylinder is through control device connecting fluid cylinder pressure, also have power set to connect the 3rd cylinder, the 3rd cylinder moves can run between the both sides of plumb joint and the both sides of cooling conduction seat along slideway under the effect of power set;
It also comprises one and keeps out dish, it is described that to keep out dish be the lamellar body that a high-strength steel is made, keep out above dish and there are cooperation plumb joint, two structures that the 3rd cylinder presses down, keep out dish centre below and have the structure coordinated above cooling component welding afterwards, keeping out dish both sides is below the structures tilted.
2. semiconductor refrigeration member bonding machine according to claim 1, it is characterized in that: described plumb joint side is provided with the first magnet, described keeping out on dish is provided with the second magnet, and the first magnet and the second magnet coordinate and can be adsorbed on keeping out dish below the first cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520274902.4U CN204565437U (en) | 2015-05-04 | 2015-05-04 | A kind of semiconductor refrigeration member bonding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520274902.4U CN204565437U (en) | 2015-05-04 | 2015-05-04 | A kind of semiconductor refrigeration member bonding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204565437U true CN204565437U (en) | 2015-08-19 |
Family
ID=53858128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520274902.4U Withdrawn - After Issue CN204565437U (en) | 2015-05-04 | 2015-05-04 | A kind of semiconductor refrigeration member bonding machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204565437U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104801872A (en) * | 2015-05-04 | 2015-07-29 | 河南鸿昌电子有限公司 | Semiconductor refrigeration piece welding machine |
-
2015
- 2015-05-04 CN CN201520274902.4U patent/CN204565437U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104801872A (en) * | 2015-05-04 | 2015-07-29 | 河南鸿昌电子有限公司 | Semiconductor refrigeration piece welding machine |
| CN104801872B (en) * | 2015-05-04 | 2017-04-05 | 河南鸿昌电子有限公司 | A kind of semiconductor refrigeration member bonding machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20150819 Effective date of abandoning: 20170405 |
|
| AV01 | Patent right actively abandoned |