CN204560027U - There is the printed circuit board imbedding inductance - Google Patents
There is the printed circuit board imbedding inductance Download PDFInfo
- Publication number
- CN204560027U CN204560027U CN201520262439.1U CN201520262439U CN204560027U CN 204560027 U CN204560027 U CN 204560027U CN 201520262439 U CN201520262439 U CN 201520262439U CN 204560027 U CN204560027 U CN 204560027U
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- China
- Prior art keywords
- circuit board
- split ring
- inductance
- printed circuit
- metal pattern
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- Expired - Fee Related
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- 239000010410 layer Substances 0.000 claims abstract description 40
- 239000002184 metal Substances 0.000 claims abstract description 23
- 239000011229 interlayer Substances 0.000 claims abstract description 18
- 230000004888 barrier function Effects 0.000 claims abstract description 5
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 238000001465 metallisation Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
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- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The utility model discloses and a kind of there is the printed circuit board imbedding inductance; Belong to board structure of circuit technical field; Its technical essential comprises the body by some layer insulatings and the pressing of some layers of metal pattern layer intersecting, wherein said body is provided with through hole along the direction in vertical panel face, in through hole, be embedded with magnetic core, the metal pattern layer of magnetic core periphery is provided with split ring; Insulating barrier between adjacent two layers metal pattern layer is provided with metallized interlayer conductive hole along the direction in vertical panel face, and adjacent two split rings and metallized interlayer conductive hole are connected to form split ring coil, and the sense of current of each layer split ring is identical; Split ring coil coordinates with magnetic core to be formed, and vertical direction imbeds inductance individuality; Split ring coil two ends are connected with metal pattern layer respectively; The utility model aims to provide a kind of compact conformation, can reduce circuit board size, the miniaturization of realizing circuit plate there is the printed circuit board imbedding inductance; For circuit board making.
Description
Technical field
The utility model relates to a kind of board structure of circuit, more particularly, particularly relates to and a kind ofly has the printed circuit board imbedding inductance.
Background technology
Along with electronic product is towards compact direction development, product power source block density is more and more higher, and build is also more and more less.In element pasted on surface, the surface area that inductance element accounts for printed circuit board is comparatively large, especially power panel, and shared by it, printed circuit board surface area is more than 40%, and most inductance element needs manual attachment, and serious have impact on packaging efficiency.If inductance can be embedded to the inside of printed circuit board, not only can save the ability that plate space of planes strengthens wiring cloth member, realize high density, compact, and can avoid mounting inductance element by hand, realize automatic assembling, significantly promote packaging efficiency, and device solder joint number reduces and greatly can improve product reliability.
Utility model content
The purpose of this utility model is to provide a kind of compact conformation, can reduce circuit board size, the miniaturization of realizing circuit plate there is the printed circuit board imbedding inductance.
The technical solution of the utility model is achieved in that a kind ofly have the printed circuit board imbedding inductance, comprise the body by some layer insulatings and the pressing of some layers of metal pattern layer intersecting, wherein said body is provided with through hole along the direction in vertical panel face, in through hole, be embedded with magnetic core, the metal pattern layer of magnetic core periphery is provided with split ring; Insulating barrier between adjacent two layers metal pattern layer is provided with metallized interlayer conductive hole along the direction in vertical panel face, and adjacent two split rings and metallized interlayer conductive hole are connected to form split ring coil, and the sense of current of each layer split ring is identical; Split ring coil coordinates with magnetic core to be formed, and vertical direction imbeds inductance individuality; Split ring coil two ends are connected with metal pattern layer respectively.
Above-mentioned having is imbedded in the printed circuit board of inductance, and each inductance is connected to form cascaded structure or parallel-connection structure individual by outermost metal pattern layer.
Above-mentioned having is imbedded in the printed circuit board of inductance, and split ring is connected for directly to connect with the interlayer conductive hole after metallization; The A/F of split ring is not less than the radius in the hole after institute's connection metal.
Above-mentioned having is imbedded in the printed circuit board of inductance, and split ring is connected for be connected by electric conductor line with the interlayer conductive hole after metallization.
A kind of printed circuit board, its inside has the circuit board unit that the printed circuit board described in the claims is made, and this circuit board unit is connected with external graphics by metallized conductive hole.
After the utility model adopts said method and corresponding construction, compared with prior art, there is following advantage:
According to the utility model, following beneficial effect can be realized:
(1) imbed inductance in circuit board vertical direction, reduce attachment expense, and plate face size under same design condition, can be reduced, save the ability that plate space of planes strengthens wiring cloth member, realize product high density, compact;
(2) avoid mounting inductance element by hand, realize automatic assembling, significantly promote packaging efficiency;
(3) device solder joint number reduces and greatly can improve product reliability;
(4) manufacture craft is simple, the manufacture method of the similar general printed circuit board of manufacture method.
Accompanying drawing explanation
Below in conjunction with the embodiment in accompanying drawing, the utility model is described in further detail, but do not form any restriction of the present utility model.
Fig. 1 is one of structural representation of the utility model embodiment 1;
Fig. 2 is the structural representation two of the utility model embodiment 2;
Fig. 3 is the structural representation of the utility model split ring coil.
In figure: insulating barrier 1, metal pattern layer 2, body 3, magnetic core 4, split ring 5, interlayer conductive hole 6, circuit board unit 7.
Embodiment
Embodiment 1
Consult shown in Fig. 1, of the present utility model a kind ofly have the printed circuit board imbedding inductance, comprise the body 3 by some layer insulatings 1 and the pressing of some layers of metal pattern layer 2 intersecting, the number of plies of body 3 is at least three layers, the concrete number of plies is depending on concrete, and in the present embodiment, the number of plies of body is four layers.Direction along vertical panel face on described body 3 is provided with through hole, is embedded with magnetic core 4 in through hole, and the metal pattern layer 5 of magnetic core 4 periphery is provided with split ring 5; Insulating barrier between adjacent two layers metal pattern layer is provided with metallized interlayer conductive hole along the direction in vertical panel face, adjacent two split rings 5 are connected to form split ring coil with metallized interlayer conductive hole 6, the sense of current of each layer split ring 5 is identical, and split ring coil coordinates with magnetic core 4 to be formed, and vertical direction imbeds inductance individuality.Its structure is as shown in Figure 3: two split rings 5 at two ends, and split ring 5 one end connects middle split ring 5 by interlayer conductive hole 6, and the other end, as a pole of whole flush type inductance, is connected with other figures of circuit board.One end of middle split ring 5 is connected with upper strata split ring 5 by the interlayer conductive hole 6 on upper strata, and the other end is connected with lower floor split ring 5 by the interlayer conductive hole 6 that is positioned at lower floor, and namely an interlayer conductive hole 6 connects two-layer two split rings 5 up and down.For four laminates, wherein imbed magnetic core containing one, four split ring ab, ef, ij and mn (letter represents the two ends of split ring), four split rings are connected by three holes, hole is cd, gh and kl (letter represents the two ends in hole) respectively, four split ring compositions imbed the coil of inductance, the two ends of coil extend out and connect A and B bright spot, if pass into electric current at A place, the circulating direction of electric current is: A → a → b → c → d → e → f → g → h → i → j → k → l → m → n → B; If pass into electric current at B place, the circulating direction of electric current is: B → n → m → l → k → j → i → h → g → f → e → d → c → b → a → A.
Each inductance is connected to form cascaded structure or parallel-connection structure individual by outermost metal pattern layer 2, depends on actual need and determines, and can certainly have series and parallel connections structure simultaneously; Split ring coil two ends are connected with metal pattern layer 2 respectively.
Further, the interlayer conductive hole 6 after split ring 5 and metallization is connected with two kinds of modes, and one be direct connection, adopts this connected mode, and the A/F of split ring 5 is not less than the radius in the hole after institute's connection metal.Another kind is connected by electric conductor line.This connected mode, it is very little that opening just can do, and its size is subject to the impact of graphic making gap ability.
In board structure of circuit, all can imbed inductance individuality between layers arbitrarily.
Embodiment 2
A kind of printed circuit board of the present utility model, its inside has the circuit board unit 7 that above-mentioned printed circuit board is made, and this circuit board unit 7 is connected with external graphics by metallized conductive hole.Consult shown in Fig. 2, for four laminates, imbed the inside that circuit board unit 7 is embedded into printed circuit board, two end points and the side a and b of imbedding inductance are connected on the conductor of printed circuit board by plated-through hole, thus realize the electrical connection with printed circuit board.A circuit board unit 7 can be imbedded, also can imbed multiple circuit board unit 7.
Above illustrated embodiment is better embodiment of the present utility model, only be used for conveniently the utility model being described, not any pro forma restriction is done to the utility model, have in any art and usually know the knowledgeable, if do not depart from the utility model carry in the scope of technical characteristic, utilize the utility model disclose the Equivalent embodiments changing or modify in the done local of technology contents, and do not depart from technical characteristic content of the present utility model, all still belong in the scope of the utility model technical characteristic.
Claims (5)
1. one kind has the printed circuit board imbedding inductance, comprise the body (3) by some layer insulatings (1) and the intersecting pressing of some layers of metal pattern layer (2), it is characterized in that, direction along vertical panel face on described body (3) is provided with through hole, in through hole, be embedded with magnetic core (4), the metal pattern layer (2) that magnetic core (4) is peripheral is provided with split ring (5); Insulating barrier (1) between adjacent two layers metal pattern layer (2) is provided with metallized interlayer conductive hole (6) along the direction in vertical panel face, adjacent two split rings (5) and metallized interlayer conductive hole (6) are connected to form split ring coil, and the sense of current of each layer split ring (5) is identical; Split ring coil coordinates with magnetic core (4) to be formed, and vertical direction imbeds inductance individuality; Split ring coil two ends are connected with metal pattern layer (2) respectively.
2. according to claim 1 have the printed circuit board imbedding inductance, it is characterized in that, each inductance is connected to form cascaded structure or parallel-connection structure individual by outermost metal pattern layer (2).
3. according to claim 1 have the printed circuit board imbedding inductance, it is characterized in that, split ring (5) is connected for directly to connect with the interlayer conductive hole (7) after metallization; The A/F of split ring (5) is not less than the radius in the hole after institute's connection metal.
4. according to claim 1 have the printed circuit board imbedding inductance, it is characterized in that, split ring (5) is connected for be connected by electric conductor line with the interlayer conductive hole (6) after metallization.
5. a printed circuit board, is characterized in that, its inside has the circuit board unit (7) that the arbitrary described printed circuit board of Claims 1-4 is made, and this circuit board unit (7) is connected with external graphics by metallized conductive hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520262439.1U CN204560027U (en) | 2015-04-27 | 2015-04-27 | There is the printed circuit board imbedding inductance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520262439.1U CN204560027U (en) | 2015-04-27 | 2015-04-27 | There is the printed circuit board imbedding inductance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204560027U true CN204560027U (en) | 2015-08-12 |
Family
ID=53835088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520262439.1U Expired - Fee Related CN204560027U (en) | 2015-04-27 | 2015-04-27 | There is the printed circuit board imbedding inductance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204560027U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104780719A (en) * | 2015-04-27 | 2015-07-15 | 博敏电子股份有限公司 | Method for embedding inductors in printed-circuit board and printed-circuit board adopted by method |
| CN108281285A (en) * | 2017-01-06 | 2018-07-13 | 照敏企业股份有限公司 | High voltage-resistant passive element |
| CN112203416A (en) * | 2019-07-07 | 2021-01-08 | 深南电路股份有限公司 | Circuit board and method of making the same |
-
2015
- 2015-04-27 CN CN201520262439.1U patent/CN204560027U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104780719A (en) * | 2015-04-27 | 2015-07-15 | 博敏电子股份有限公司 | Method for embedding inductors in printed-circuit board and printed-circuit board adopted by method |
| CN108281285A (en) * | 2017-01-06 | 2018-07-13 | 照敏企业股份有限公司 | High voltage-resistant passive element |
| CN108281285B (en) * | 2017-01-06 | 2020-03-17 | 照敏企业股份有限公司 | High voltage-resistant passive element |
| CN112203416A (en) * | 2019-07-07 | 2021-01-08 | 深南电路股份有限公司 | Circuit board and method of making the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150812 |