CN204482037U - A kind of microphone board structure of circuit - Google Patents
A kind of microphone board structure of circuit Download PDFInfo
- Publication number
- CN204482037U CN204482037U CN201520045794.3U CN201520045794U CN204482037U CN 204482037 U CN204482037 U CN 204482037U CN 201520045794 U CN201520045794 U CN 201520045794U CN 204482037 U CN204482037 U CN 204482037U
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- China
- Prior art keywords
- microphone
- inner casing
- installing hole
- conductive layer
- shell
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- 238000009413 insulation Methods 0.000 claims abstract description 31
- 239000000428 dust Substances 0.000 claims abstract description 14
- 238000005538 encapsulation Methods 0.000 claims abstract description 13
- 230000005540 biological transmission Effects 0.000 claims description 21
- 238000010276 construction Methods 0.000 claims description 3
- 230000003247 decreasing effect Effects 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model relates to a kind of microphone board structure of circuit, and microphone comprises circuit board, inner casing, diaphragm, back pole plate, shell and sound-absorbing dust layer; Described circuit board is arranged at the uncovered side of described inner casing; Described circuit board includes insulation board, and is arranged at the soft encapsulation of described insulation board inner surface.By the technical scheme of the application, original position is improved in the triode of circuit board inner surface and capacitance structure the soft encapsulating structure only using triode, this improvement, had both added the interior space of microphone, reduced the interference of electromagnetism again because decreasing the use of electric capacity.
Description
Technical field
The utility model belongs to microphone field, is specifically related to a kind of board structure of circuit for microphone.
Background technology
In the electronic device, many aspects are had to need microphone, utilize the MEMS microphone that MEMS (micro electromechanical systems) technology manufactures, its general principle forms encapsulation by substrate and cover, microphone chip and circuit element are set at the upper surface of substrate, and on cover, are provided with the acoustic aperture transmitting sound.Or microphone chip and circuit element are set at the upper surface of substrate, the substrate that the lower surface of microphone chip is just right offers acoustic aperture; Or be laterally arranged side by side microphone chip and circuit element at the upper surface of substrate, the substrate outside the position leaving microphone chip offers acoustic aperture.
Now utilize the microphone that MEMS principle manufactures, its structure comprises circuit board, diaphragm, shell, and shell is provided with the sound transmission aperture relative with circuit board; Also be provided with inner casing in the enclosure, the position relative with sound transmission aperture at inner casing and shell is provided with diaphragm, circuit board inner surface is provided with electric capacity and triode, is also provided with wire in the inner surface edge of circuit board, be connected for same microphone chip and other circuit.Along with the reduction of microphone volume, electric capacity and the triode of circuit board inner surface also replace with patch electronics, but microphone inner space is still in reduction, so just causes the distortion phenomenon of microphone.Meanwhile, the wire due to circuit board inner surface also can cause the change in magnetic field, and produces certain interference to the sound wave of microphone.
Utility model content
The purpose of this utility model is by proposing improvement opportunity scheme to existing circuit board, can be overcome the distortion phenomenon caused because microphone inner space is not enough, and reduce the effect because of electromagnetic interference influence microphone by the technical program.
The utility model is achieved through the following technical solutions:
A kind of microphone board structure of circuit, microphone comprises circuit board, inner casing, diaphragm, back pole plate, shell and sound-absorbing dust layer;
Described inner casing and shell are one end the uncovered columnar structured of base, and is provided with sound transmission aperture on the bottom surface of described inner casing and the bottom surface of shell;
Described back pole plate is arranged between the inner bottom surface of described shell and the outer bottom of described inner casing;
Described diaphragm arrangement is between the outer bottom and described back pole plate of described inner casing;
Described sound-absorbing dust layer is arranged at the outer bottom of described shell;
Described circuit board is arranged at the uncovered side of described inner casing;
Described circuit board includes insulation board, and is arranged at the soft encapsulation of inner surface of described insulation board; Described insulation board is provided with two installing holes, is respectively the first installing hole and the second installing hole; Edge along the outer surface of described insulation board is provided with circle first conductive layer; Described first installing hole is provided with the second conductive layer in outer surface one end of described insulation board, and described second installing hole is provided with the 3rd conductive layer in one end of described insulation board outer surface;
There are two electrodes in described soft encapsulation, are respectively the first electrode and the second electrode; Described first electrode inserts described first installing hole and is connected with described second conductive layer; Described second electrode inserts described second installing hole and is connected with described 3rd conductive layer; Described 3rd conductive layer is connected with described first conductive layer.
Described first installing hole and described second installing hole are arranged relative to the Central Symmetry of described insulation board.
Described microphone also includes plastic hoop, and described plastic hoop is arranged between the sidewall of described inner casing and the sidewall of described shell.
Also gasket construction is provided with between the outer bottom of described diaphragm and described inner casing.
The beneficial effects of the utility model are:
By the technical scheme of the application, original position is improved in the triode of circuit board inner surface and capacitance structure the soft encapsulating structure only using triode, this improvement, had both added the interior space of microphone, reduced the interference of electromagnetism again because decreasing the use of electric capacity.
On the other hand, by the improvement of the conductive layer to circuit board, both facilitate the connection of circuit board and microphone chip, decreased the use of wire, avoided the contact of conductive layer and sound wave simultaneously, and reduced interference, improve the tonequality of microphone.
Accompanying drawing explanation
Fig. 1 is the utility model microphone construction exploded view;
Fig. 2 is the utility model circuit board outer surface schematic diagram;
Fig. 3 is the utility model circuit board inner surface schematic diagram.
Description of reference numerals
1 circuit board, 2 inner casings, 3 plastic hoops, 4 pads, 5 diaphragms, 6 shells, 7 sound-absorbing dust layers, 21 first sound transmission aperture, 61 second sound transmission aperture, 101 insulation boards, 102 first conductive layers, 103 second conductive layers, 104 the 3rd conductive layers, 105 first installing holes, 106 second installing holes, 107 soft encapsulation, 108 third electrodes.
Embodiment
Describe the technical solution of the utility model in detail by the following examples, following embodiment is only exemplary, only can be used for explaining and the technical solution of the utility model being described, and can not be interpreted as being the restriction to technical solutions of the utility model.
In this application; the shell of microphone and inner casing configuration are prior art; shell and inner casing are the columnar structured of one end open; and on the bottom surface of shell and inner casing, be provided with sound transmission aperture; extraneous sound wave enters microphone inner space by sound transmission aperture, and, because the structure of shell and inner casing; by circuit board or sensor setting in inner casing, play a protective role.
Embodiment 1
As shown in Figure 1 to Figure 3, the application provides a kind of microphone board structure of circuit, and microphone comprises circuit board 1, inner casing 2, diaphragm 5, back pole plate (not shown), shell 6 and sound-absorbing dust layer 7;
Described inner casing 2 and shell 6 are one end the uncovered columnar structured of bottom surface, and on the bottom surface of described inner casing 2, be provided with the first sound transmission aperture 21, the bottom surface of shell 6 is provided with the second sound transmission aperture 61; Described sound-absorbing dust layer 7 is without anti-cloth, is pasted on the outer bottom of described shell 6; Sound-absorbing and dust-proof function can be played, can prevent dust from entering in microphone by the first sound transmission aperture 21 and the second sound transmission aperture 61, particularly prevent dust to be attached on diaphragm 5, affect transaudient effect.
Between the outer bottom that described diaphragm 5 is arranged at described inner casing 2 and described back pole plate; Make diaphragm vibration by the extraneous sound wave of the second sound transmission aperture 61, realize the transmission of sound.
Described circuit board 1 is arranged at the uncovered side of described inner casing 2; Described circuit board 1 includes insulation board 101, and is arranged at the soft encapsulation 107 of inner surface of described insulation board 101; The surface that insulation board 101 is relative with the first sound transmission aperture 21 is inner surface, and the surface relative with inner surface is outer surface.
Described insulation board 101 is provided with two installing holes, is respectively the first installing hole 105 and the second installing hole 106, first installing hole 105 and the second installing hole 106 and arranges relative to the Central Symmetry of described insulation board 101; Edge along the outer surface of described insulation board 101 is provided with circle first conductive layer 102, and this first conductive layer 102 is electrically connected with microphone chip; Described first installing hole 105 is provided with the second conductive layer 103 in one end of the outer surface of described insulation board, and described second installing hole 106 is provided with the 3rd conductive layer 104 in one end of the outer surface of described insulation board; One end of first installing hole 105 is closed by the second conductive layer 103, the 3rd conductive layer 104 just the second installing hole 106 one end close.
Be provided with triode in described soft encapsulation 107, wherein the first electrode and the second electrode are arranged in soft encapsulation 107 to be respectively the first electrode, the second electrode and third electrode 108; First electrode is connected with described second conductive layer 103 by the first installing hole 105, and the second electrode is connected with described 3rd conductive layer 104 by the second installing hole 106; The third electrode 108 of triode is connected with other circuit.Described 3rd conductive layer 104 is connected with described first conductive layer 102, and the second conductive layer 103 is connected with microphone chip.
Embodiment 2
A microphone board structure of circuit as shown in Figure 1 to Figure 3, microphone comprises circuit board 1, inner casing 2, diaphragm 5, back pole plate, pad 4, shell 6 and sound-absorbing dust layer 7;
Described inner casing 2 and shell 6 are one end the uncovered columnar structured of bottom surface, and on the bottom surface of described inner casing 2, be provided with the first sound transmission aperture 21, the bottom surface of shell 6 is provided with the second sound transmission aperture 61; Described sound-absorbing dust layer 7 is without anti-cloth, is pasted on the outer bottom of described shell 6; Sound-absorbing and dust-proof function can be played, can prevent dust from entering in microphone by the first sound transmission aperture 21 and the second sound transmission aperture 61, particularly prevent dust to be attached on diaphragm 5, affect transaudient effect.
Between the inner bottom surface that back pole plate is arranged at described shell 6 and described pad 4; Described pad 4 is arranged between described back pole plate and described diaphragm 5, for increasing the Oscillation Amplitude of diaphragm 5.
Between the outer bottom that described diaphragm 5 is arranged at described inner casing 2 and described back pole plate; By the extraneous sound wave of the second sound transmission aperture 61, diaphragm 5 is vibrated, realize the transmission of sound.
Described microphone also includes plastic hoop 4, and described plastic hoop 4 is arranged between described inner casing 2 and the sidewall of described shell 6, can play the effect of support.
Described circuit board 1 is arranged at the uncovered side of described inner casing 2; Include insulation board 101 and soft encapsulation 107.
Described insulation board 101 is provided with two installing holes, is respectively the first installing hole 105 and the second installing hole 106, first installing hole 105 and the second installing hole 106 and arranges relative to the Central Symmetry of described insulation board 101; Edge along the outer surface of described insulation board 101 is provided with circle first conductive layer 102, and this first conductive layer 102 is electrically connected with microphone chip; Described first installing hole 105 is provided with the second conductive layer 103 in one end of the outer surface of described insulation board, and described second installing hole 106 is provided with the 3rd conductive layer 104 in one end of the outer surface of described insulation board; One end of first installing hole 105 is closed by the second conductive layer 103, the 3rd conductive layer 104 just the second installing hole 106 one end close.
Be provided with triode in described soft encapsulation 107, wherein the first electrode and the second electrode are arranged in soft encapsulation 107 to be respectively arranged with the first electrode, the second electrode and third electrode 108; First electrode is connected with described second conductive layer 103 by the first installing hole 105, and the second electrode is connected with described 3rd conductive layer 104 by the second installing hole 106; 3rd electrode 108 of triode is connected with other circuit.Described 3rd conductive layer 104 is connected with described first conductive layer 102, and the second conductive layer 103 is connected with microphone chip.
Although illustrate and described embodiment of the present utility model, for the ordinary skill in the art, be appreciated that and can carry out multiple change, amendment, replacement and modification to these embodiments when not departing from principle of the present utility model and spirit, scope of the present utility model is by claims and equivalency thereof.
Claims (4)
1. a microphone board structure of circuit, microphone comprises circuit board, inner casing, diaphragm, back pole plate, shell and sound-absorbing dust layer;
Described inner casing and shell are one end the uncovered columnar structured of base, and is provided with sound transmission aperture on the bottom surface of described inner casing and the bottom surface of shell;
Described back pole plate is arranged between the inner bottom surface of described shell and the outer bottom of described inner casing;
Described diaphragm arrangement is between the outer bottom and described back pole plate of described inner casing;
Described sound-absorbing dust layer is arranged at the outer bottom of described shell;
Described circuit board is arranged at the uncovered side of described inner casing; It is characterized in that:
Described circuit board includes insulation board, and is arranged at the soft encapsulation of inner surface of described insulation board; Described insulation board is provided with two installing holes, is respectively the first installing hole and the second installing hole; Edge along the outer surface of described insulation board is provided with circle first conductive layer; Described first installing hole is provided with the second conductive layer in one end of the outer surface of described insulation board, and described second installing hole is provided with the 3rd conductive layer in one end of the outer surface of described insulation board;
There are two electrodes in described soft encapsulation, are respectively the first electrode and the second electrode; Described first electrode inserts described first installing hole and is connected with described second conductive layer; Described second electrode inserts described second installing hole and is connected with described 3rd conductive layer; Described 3rd conductive layer is connected with described first conductive layer.
2. microphone board structure of circuit according to claim 1, is characterized in that: described first installing hole and described second installing hole are arranged relative to the Central Symmetry of described insulation board.
3. microphone board structure of circuit according to claim 1, it is characterized in that: described microphone also includes plastic hoop, described plastic hoop is arranged between the sidewall of described inner casing and the sidewall of described shell.
4. microphone board structure of circuit according to claim 1, is characterized in that: be also provided with gasket construction between the outer bottom of described diaphragm and described inner casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520045794.3U CN204482037U (en) | 2015-01-22 | 2015-01-22 | A kind of microphone board structure of circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520045794.3U CN204482037U (en) | 2015-01-22 | 2015-01-22 | A kind of microphone board structure of circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204482037U true CN204482037U (en) | 2015-07-15 |
Family
ID=53637806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520045794.3U Expired - Fee Related CN204482037U (en) | 2015-01-22 | 2015-01-22 | A kind of microphone board structure of circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204482037U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108307251A (en) * | 2018-01-30 | 2018-07-20 | 重庆市长寿区臻波通讯设备有限公司 | Communication apparatus sound arrester |
-
2015
- 2015-01-22 CN CN201520045794.3U patent/CN204482037U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108307251A (en) * | 2018-01-30 | 2018-07-20 | 重庆市长寿区臻波通讯设备有限公司 | Communication apparatus sound arrester |
| CN108307251B (en) * | 2018-01-30 | 2020-09-22 | 重庆市长寿区臻波通讯设备有限公司 | Sound-absorbing device for communication equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150715 Termination date: 20160122 |
|
| EXPY | Termination of patent right or utility model |