CN204431837U - Composite gas Obstruct membrane - Google Patents
Composite gas Obstruct membrane Download PDFInfo
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- 239000002131 composite material Substances 0.000 title claims abstract description 25
- 239000012528 membrane Substances 0.000 title claims abstract 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 67
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 66
- 230000004888 barrier function Effects 0.000 claims abstract description 32
- 239000010410 layer Substances 0.000 claims abstract description 31
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 229920006254 polymer film Polymers 0.000 claims abstract description 8
- 210000002469 basement membrane Anatomy 0.000 claims abstract 6
- 210000004379 membrane Anatomy 0.000 claims abstract 4
- 239000007789 gas Substances 0.000 abstract description 28
- 238000007789 sealing Methods 0.000 abstract description 9
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- 230000001070 adhesive effect Effects 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
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- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000004549 pulsed laser deposition Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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- 239000004715 ethylene vinyl alcohol Substances 0.000 description 1
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- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
技术领域technical field
本实用新型涉及一种复合气体阻隔膜。The utility model relates to a composite gas barrier film.
背景技术Background technique
高分子膜由于在表面形成氧化硅、氧化铝、氧化镁等而作为一种气体阻隔膜,可有效地阻挡氧气、水蒸气等,因此广泛地应用于防止食品、工业用品和医药品等的变质的包装。另外,由于可有效地阻挡也能够气等,还可用于密封太阳能电池、液晶显示元件、有机EL元件等电子器件。但是氧化物粒子之间存在晶界缺陷,随着时间的增加,有些气体或液体会泄露,起不到严格密封的作用,因为高分子材料中存在很多孔洞,分子会从孔洞中穿过。金属密封膜的采用会改善密封效果,但密封效果仍不理想。人们选择在基膜上设置铝箔,可获得稳定的氧、水蒸气阻隔性,但是对于气体分子量较小的氢气、氦气的阻隔性较差。近年来人们开发的具有由聚偏二氯乙烯(PVDC)或乙烯-乙烯醇共聚物(EVOH)形成的阻隔膜,也可有效地阻挡氧气,但前者含有氯,对环境有污染,后者的阻隔性随环境影响较大。普通高分子膜的导热性能很差,一般工业上的高分子导热材料都是用导热作用的氮化硼、三氧化二铝粉作填料复合而成,制作过程复杂,导热率相对较低。Polymer film is used as a gas barrier film due to the formation of silicon oxide, aluminum oxide, magnesium oxide, etc. on the surface, which can effectively block oxygen, water vapor, etc., so it is widely used to prevent deterioration of food, industrial supplies, and pharmaceuticals package of. In addition, because it can effectively block gas, etc., it can also be used to seal electronic devices such as solar cells, liquid crystal display elements, and organic EL elements. However, there are grain boundary defects between the oxide particles. As time goes by, some gases or liquids will leak, which cannot be strictly sealed, because there are many holes in the polymer material, and molecules will pass through the holes. The adoption of the metal sealing film will improve the sealing effect, but the sealing effect is still unsatisfactory. People choose to set aluminum foil on the base film, which can obtain stable oxygen and water vapor barrier properties, but the barrier properties to hydrogen and helium with small gas molecular weights are poor. In recent years, people have developed a barrier film formed of polyvinylidene chloride (PVDC) or ethylene-vinyl alcohol copolymer (EVOH), which can also effectively block oxygen, but the former contains chlorine and pollutes the environment, while the latter The barrier property is greatly affected by the environment. The thermal conductivity of ordinary polymer films is very poor. Generally, industrial polymer thermal conductive materials are compounded with boron nitride and aluminum oxide powder as fillers for thermal conductivity. The production process is complicated and the thermal conductivity is relatively low.
实用新型内容Utility model content
本实用新型的目的是提供一种密封性好,制备简单的复合气体阻隔膜。The purpose of the utility model is to provide a composite gas barrier film with good sealing performance and simple preparation.
实现本实用新型第一个目的的技术方案是一种复合气体阻隔膜,依次为基膜、气体阻隔功能层、黏接层和保护膜;所述基膜为聚合物膜,例如PET膜或PE膜,厚度为10μm~250μm;所述黏接层为有粘性的固态胶,如:OCA光学胶或双面胶,厚度为2μm~250μm;所述保护膜为聚合物膜,例如PET膜或PE膜,厚度为10μm~250μm;所述气体阻隔功能层为一层或者两层或者多层石墨烯膜或石墨烯与纳米级金属膜的叠加。The technical solution to achieve the first purpose of the utility model is a composite gas barrier film, which is a base film, a gas barrier functional layer, an adhesive layer and a protective film in sequence; the base film is a polymer film, such as a PET film or a PE film. film, with a thickness of 10 μm to 250 μm; the adhesive layer is a sticky solid adhesive, such as: OCA optical adhesive or double-sided tape, with a thickness of 2 μm to 250 μm; the protective film is a polymer film, such as PET film or PE The film has a thickness of 10 μm to 250 μm; the gas barrier functional layer is one layer or two layers or multi-layer graphene film or the superposition of graphene and nanoscale metal film.
采用了上述技术方案,本实用新型具有以下的有益效果:(1)本实用新型所提供的石墨烯复合结构可用于气体、液体和固体的密封保护,这种石墨烯复合结构的气体、液体和固体泄露率相对于高分子密封膜和金属密封膜可大大降低;还可用于高分子膜导热方面,石墨烯具有优异的热导性,所以实用新型提供的这种石墨烯复合结构与不含石墨烯的高分子膜相比,导热性会大大提高。By adopting the above technical scheme, the utility model has the following beneficial effects: (1) the graphene composite structure provided by the utility model can be used for the sealing protection of gas, liquid and solid, the gas, liquid and solid of this graphene composite structure Compared with the polymer sealing film and metal sealing film, the solid leakage rate can be greatly reduced; it can also be used in the heat conduction of the polymer film. Graphene has excellent thermal conductivity, so the graphene composite structure provided by the utility model is compatible with the Compared with the polymer film of vinyl, the thermal conductivity will be greatly improved.
(2)本实用新型提供了多种复合气体阻隔膜的结构方案,包括采用石墨烯膜制备而得的以及石墨烯粉末制备而得,包含金属膜和不含金属膜的,均充分利用了石墨烯的优良密封性能和超高热导性,品质优良,选择余地大。(2) The utility model provides a variety of structural solutions for composite gas barrier films, including those prepared from graphene films and graphene powders, those containing metal films and those without metal films, all of which fully utilize graphite Excellent sealing performance and ultra-high thermal conductivity of vinyl, good quality and wide choice.
附图说明Description of drawings
为了使本实用新型的内容更容易被清楚地理解,下面根据具体实施例并结合附图,对本实用新型作进一步详细的说明,其中In order to make the content of the utility model easier to understand clearly, the utility model will be further described in detail below according to specific embodiments and in conjunction with the accompanying drawings, wherein
图1为本实用新型的一种结构示意图。Fig. 1 is a kind of structural representation of the utility model.
图2为本实用新型的第二种结构示意图。Fig. 2 is a second structure schematic diagram of the present invention.
附图中标号为:The labels in the accompanying drawings are:
基膜1、气体阻隔功能层2、石墨烯膜21、金属膜22、黏接层3、保护膜4。A base film 1 , a gas barrier functional layer 2 , a graphene film 21 , a metal film 22 , an adhesive layer 3 , and a protective film 4 .
具体实施方式Detailed ways
(实施例1)(Example 1)
本实施例的一种复合气体阻隔膜的制备方法,包括以下步骤:A method for preparing a composite gas barrier film of this embodiment comprises the following steps:
步骤一:准备基膜1、含石墨烯膜21的生长基体、含黏接层3的保护膜4;基膜1为PET膜或PE膜,厚度为10μm~250μm;所述保护膜4为PET膜或PE膜,厚度为10μm~250μm;黏接层3的种类为OCA光学胶或双面胶,黏接层3的原材料为有机硅橡胶、丙烯酸型树脂及不饱和聚酯、聚氨酯、环氧树脂等的一种或几种的组合,黏接层3的厚度2μm~250μm;获得含石墨烯膜21的生长基体的方法为:将经过化学抛光、电化学抛光、机械抛光中的一种表面处理过的铜箔放入密闭的化学气象沉积炉内;将沉积炉内的空气抽干净,充入10-200sccm氢气和100-1000sccm氩气,使沉积炉内的压力保持在常压;加热沉积炉到900-1050℃,在这个温度下保持5-40min;通入1-20sccm的碳氢化合物,保持5-30min;关闭碳氢化合物和氢气,只通氩气,同时停止加热,使沉积炉随炉冷却至室温;取出石墨烯膜21的生长基体;本实施例中石墨烯的层数为3~8层。Step 1: Prepare a base film 1, a growth substrate containing a graphene film 21, and a protective film 4 containing an adhesive layer 3; the base film 1 is a PET film or a PE film with a thickness of 10 μm to 250 μm; the protective film 4 is PET film or PE film with a thickness of 10 μm to 250 μm; the type of adhesive layer 3 is OCA optical adhesive or double-sided adhesive tape, and the raw materials of adhesive layer 3 are silicone rubber, acrylic resin and unsaturated polyester, polyurethane, epoxy One or more combinations of resins, etc., the thickness of the adhesive layer 3 is 2 μm to 250 μm; the method for obtaining the growth substrate containing the graphene film 21 is: chemical polishing, electrochemical polishing, or mechanical polishing. Put the treated copper foil into a closed chemical vapor deposition furnace; pump out the air in the deposition furnace, fill it with 10-200sccm hydrogen and 100-1000sccm argon to keep the pressure in the deposition furnace at normal pressure; heat the deposition Furnace to 900-1050°C, keep at this temperature for 5-40min; pass 1-20sccm hydrocarbon, keep for 5-30min; close hydrocarbon and hydrogen, only pass argon, stop heating at the same time, make the deposition furnace Cool down to room temperature with the furnace; take out the growth substrate of the graphene film 21; the number of layers of graphene in this embodiment is 3-8 layers.
步骤二:将含石墨烯膜2的生长基体与含黏接层3的保护膜4采用贴覆的方法复合;然后采用化学剥离或电化学剥离方法中的一种去除生长基体;得到石墨烯膜21+黏接层3+保护膜4的复合结构;Step 2: Composite the growth substrate containing the graphene film 2 and the protective film 4 containing the adhesive layer 3 by pasting; then remove the growth substrate by one of the chemical stripping or electrochemical stripping methods; obtain the graphene film Composite structure of 21+adhesive layer 3+protective film 4;
步骤三:将步骤二得到的复合结构与基膜1采用贴覆的方法复合。Step 3: Composite the composite structure obtained in Step 2 and the base film 1 by pasting.
由本实施例的方法获得的复合气体阻隔膜的结构如图1所示。The structure of the composite gas barrier film obtained by the method of this embodiment is shown in FIG. 1 .
(实施例2)(Example 2)
本实施例的方法与实施例1的区别在于气体阻隔功能层2还包含一层采用真空蒸镀或溅射镀膜或脉冲激光沉积方法覆盖的纳米级金属膜21。该结构示意图如图2所示。The difference between the method of this embodiment and that of Embodiment 1 is that the gas barrier functional layer 2 further includes a layer of nanoscale metal film 21 covered by vacuum evaporation or sputtering coating or pulsed laser deposition. The schematic diagram of the structure is shown in Fig. 2 .
(实施例3)(Example 3)
本实施例为另一种方案,石墨烯膜采用石墨烯粉末得到。具体步骤为:This embodiment is another scheme, and the graphene film is obtained by using graphene powder. The specific steps are:
步骤一:准备基膜1和保护膜4;基膜1为PET膜或PE膜,厚度为10μm~250μm。Step 1: Prepare the base film 1 and the protective film 4; the base film 1 is a PET film or a PE film with a thickness of 10 μm to 250 μm.
步骤二:在基膜1上形成石墨烯膜2;将石墨烯粉末和碳黑按一定比例混合后,溶于去离子水或者有机溶液中,选择加入或不加粘合剂;浸渍法、刮涂法、喷涂法、滚涂法、旋涂法、辊涂法、浇涂法、喷墨法、印刷法、流延成膜法、棒涂法、凹版印刷法方法中的一种将石墨烯粉末溶液涂覆在基膜1上,在空气或烘箱中干燥,形成一层石墨烯膜2Step 2: Form a graphene film 2 on the base film 1; mix the graphene powder and carbon black in a certain proportion, dissolve in deionized water or an organic solution, and choose to add or not add an adhesive; dipping method, scraping Coating method, spray coating method, roll coating method, spin coating method, roll coating method, pour coating method, inkjet method, printing method, cast film forming method, rod coating method, gravure printing method in a method of graphene The powder solution is coated on the base film 1 and dried in air or oven to form a layer of graphene film 2
步骤三:在石墨烯膜2上滚压贴覆含有黏结层3的保护膜4。Step 3: rolling and pasting the protective film 4 containing the adhesive layer 3 on the graphene film 2 .
该结构如图1所示。The structure is shown in Figure 1.
气体阻隔功能层2还可以包含一层采用真空蒸镀或溅射镀膜或脉冲激光沉积方法覆盖的纳米级金属膜21,得到图2所示的复合气体阻隔膜结构。The gas barrier functional layer 2 may also include a layer of nanoscale metal film 21 covered by vacuum evaporation or sputtering coating or pulsed laser deposition to obtain the composite gas barrier film structure shown in FIG. 2 .
(实施例4)(Example 4)
本实施例的结构与实施例1相同,得到的复合气体阻隔膜如图1所示;石墨烯膜采用低压化学气相沉积法获得的石墨烯膜为基础转移得到多层石墨烯膜。具体来说可以采用下述四种方法:The structure of this example is the same as that of Example 1, and the obtained composite gas barrier film is shown in Figure 1; the graphene film is transferred based on the graphene film obtained by the low-pressure chemical vapor deposition method to obtain a multilayer graphene film. Specifically, the following four methods can be used:
第一种:2.1采用化学气相沉积法在低压下获得含有石墨烯膜21的生长基体;The first method: 2.1 Obtain the growth substrate containing the graphene film 21 under low pressure by chemical vapor deposition;
2.2将长有石墨烯膜21的生长基体贴覆在热释放胶带上;2.2 Paste the growth substrate with the graphene film 21 on the thermal release tape;
2.3去除生长基体;2.3 Remove the growth substrate;
2.4将含有石墨烯膜21的热释放胶带贴覆到基膜1上;2.4 Paste the thermal release tape containing the graphene film 21 on the base film 1;
2.5在90-125℃的温度下将热释放胶带释放,完成第一层石墨烯膜21从热释放胶带到基膜1的转移;2.5 Release the thermal release tape at a temperature of 90-125°C to complete the transfer of the first layer of graphene film 21 from the thermal release tape to the base film 1;
2.6将生长有石墨烯膜21的生长基体贴覆在热释放胶带上;2.6 Pasting the growth substrate with the graphene film 21 on the thermal release tape;
2.7去除生长基体;2.7 Remove the growth substrate;
2.8将含有石墨烯膜21的热释放胶带贴覆到步骤2.5的石墨烯膜21上;2.8 Paste the thermal release tape containing the graphene film 21 on the graphene film 21 in step 2.5;
2.9在90-125℃的温度下将热释放胶带释放,完成第二层石墨烯膜层21从热释放胶带到第一层石墨烯膜21的转移;2.9 Release the thermal release tape at a temperature of 90-125°C to complete the transfer of the second graphene film layer 21 from the thermal release tape to the first graphene film 21;
2.10重复2.6-2.9步,完成第n层石墨烯层从生长基体到第n-1层石墨烯层的转移n为自然数,n≥1;得到气体阻隔功能层2和基膜1的复合结构;2.10 Repeat steps 2.6-2.9 to complete the transfer of the nth graphene layer from the growth substrate to the n-1th graphene layer n is a natural number, n≥1; obtain the composite structure of the gas barrier functional layer 2 and the base film 1;
步骤三中,将含有黏接层3的保护膜4贴合到气体阻隔功能层2上。In step three, the protective film 4 containing the adhesive layer 3 is pasted on the gas barrier functional layer 2 .
第二种:2.1采用化学气相沉积法在低压下获得含有石墨烯膜21的生长基体;The second method: 2.1 Obtain the growth substrate containing the graphene film 21 under low pressure by chemical vapor deposition;
2.2将长有石墨烯膜21的生长基体贴覆在热释放胶带上;2.2 Paste the growth substrate with the graphene film 21 on the thermal release tape;
2.3去除生长基体;2.3 Remove the growth substrate;
2.4将长有石墨烯膜层21的生长基体贴覆在已经转有一层石墨烯膜21的热释放胶带上,去除生长基体;2.4 Paste the growth substrate with the graphene film layer 21 on the thermal release tape that has been transferred with a layer of graphene film 21, and remove the growth substrate;
2.5重复步骤2.4,完成n层(n为自然数,n≥1)石墨烯到热释放胶带的转移;2.5 Repeat step 2.4 to complete the transfer of n-layer (n is a natural number, n≥1) graphene to the thermal release tape;
2.6将转有n层石墨烯膜的热释放胶带贴覆到基膜1上;2.6 Paste the thermal release tape with n-layer graphene film on the base film 1;
2.7在90-125℃的温度下将热释放胶带释放,完成n层石墨烯到基膜1上的转移;得到气体阻隔功能层2和基膜1的复合结构;2.7 Release the heat release tape at a temperature of 90-125°C to complete the transfer of n-layer graphene to the base film 1; obtain the composite structure of the gas barrier functional layer 2 and the base film 1;
步骤三中,将含有黏接层3的保护膜4贴覆到气体阻隔功能层2上。In step three, the protective film 4 containing the adhesive layer 3 is pasted on the gas barrier functional layer 2 .
第三种:2.1采用化学气相沉积法在低压下获得含有石墨烯膜21的生长基体;The third method: 2.1 Obtain the growth substrate containing the graphene film 21 under low pressure by chemical vapor deposition;
2.2在基膜1上涂一层粘结剂;2.2 Apply a layer of adhesive on the base film 1;
2.3将长有石墨烯膜21的生长基体贴覆在基膜1上;2.3 Paste the growth substrate with the graphene film 21 on the base film 1;
2.4去除生长基体;2.4 Remove the growth substrate;
2.5将长有石墨烯膜21的生长基体贴覆在热释放胶带上,去除生长基体;2.5 Paste the growth substrate with the graphene film 21 on the thermal release tape, and remove the growth substrate;
2.6将含有石墨烯膜的热释放胶带贴覆到含石墨烯的基膜1上;2.6 Paste the thermal release tape containing the graphene film on the graphene-containing base film 1;
2.7在90-125℃的温度下将热释放胶带释放,完成第二层石墨烯膜层从热释放胶带到第一层石墨烯膜的转移;2.7 Release the thermal release tape at a temperature of 90-125°C to complete the transfer of the second layer of graphene film from the thermal release tape to the first layer of graphene film;
2.8重复步骤2.5-2.7,完成第n层石墨烯层从生长基体到第n-1层石墨烯层的转移(n为自然数,n≥1);得到气体阻隔功能层2和基膜1的复合结构;2.8 Repeat steps 2.5-2.7 to complete the transfer of the nth graphene layer from the growth substrate to the n-1th layer of graphene layer (n is a natural number, n≥1); obtain the composite of the gas barrier function layer 2 and the base film 1 structure;
步骤三中,将含有黏接层3的保护膜4贴覆到气体阻隔功能层2上。In step three, the protective film 4 containing the adhesive layer 3 is pasted on the gas barrier functional layer 2 .
第四种:2.1采用化学气相沉积法在低压下获得含有石墨烯膜21的生长基体;The fourth type: 2.1 Obtain the growth substrate containing the graphene film 21 under low pressure by chemical vapor deposition;
2.2将长有石墨烯膜21的生长基体贴覆含有黏接层3的保护膜4上;2.2 Paste the growth substrate with the graphene film 21 on the protective film 4 containing the adhesive layer 3;
2.3去除生长基体;2.3 Remove the growth substrate;
2.4将长有石墨烯膜21的生长基体贴覆在已经转有一层石墨烯膜21且含有黏接层3的保护膜4上,去除生长基体;2.4 Paste the growth substrate with the graphene film 21 on the protective film 4 that has been transferred with a layer of graphene film 21 and contains the adhesive layer 3, and remove the growth substrate;
2.5重复步骤2.4,完成n(n为自然数,n≥1)层石墨烯到含有黏接层3的保护膜4的转移;得到气体阻隔功能层2和含有黏接层3的保护膜4的复合结构;2.5 Repeat step 2.4 to complete the transfer of n (n is a natural number, n≥1) layers of graphene to the protective film 4 containing the adhesive layer 3; obtain the composite of the gas barrier function layer 2 and the protective film 4 containing the adhesive layer 3 structure;
步骤三中,将气体阻隔功能层2贴覆到基膜1上。In step three, the gas barrier functional layer 2 is pasted on the base film 1 .
以上所述的具体实施例,对本实用新型的目的、技术方案和有益效果进行了进一步详细说明,所应理解的是,以上所述仅为本实用新型的具体实施例而已,并不用于限制本实用新型,凡在本实用新型的精神和原则之内,所做的任何修改、等同替换、改进等,均应包含在本实用新型的保护范围之内。The specific embodiments described above have further described the purpose, technical solutions and beneficial effects of the present utility model in detail. It should be understood that the above descriptions are only specific embodiments of the present utility model and are not intended to limit the present invention. For the utility model, any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the utility model shall be included in the protection scope of the utility model.
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CN104553115A (en) * | 2014-12-26 | 2015-04-29 | 常州二维碳素科技有限公司 | Composite gas barrier film and preparation method thereof |
CN105620713A (en) * | 2016-01-26 | 2016-06-01 | 无锡格菲电子薄膜科技有限公司 | Skin provided with surface helium gas blocking layer and preparation method of skin |
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CN104553115A (en) * | 2014-12-26 | 2015-04-29 | 常州二维碳素科技有限公司 | Composite gas barrier film and preparation method thereof |
CN105620713A (en) * | 2016-01-26 | 2016-06-01 | 无锡格菲电子薄膜科技有限公司 | Skin provided with surface helium gas blocking layer and preparation method of skin |
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