CN204424227U - A kind of wafer surface metal-stripping system - Google Patents

Abstract

A wafer surface metal stripping system, used to strip the metal on the wafer surface, the system consists of a working area and an upper and lower sheet area, characterized in that: the working area is composed of a contact stripping device, a high pressure removal device, a manipulator, the contact type The peeling device is composed of a film inlet roll, a pressing weight, a stage, a guide rail, and a film exit roll; the high-pressure removal device is composed of a high-pressure fluid pipeline, an air blowing pipeline, a rotary stage, a wafer fixing device, and a recovery device . The upper and lower slide areas include at least one slide frame. The system provided by the utility model can realize fully automatic operation, improve the metal stripping efficiency, and reduce manpower consumption.

Description

A wafer surface metal stripping system

technical field

The utility model relates to a chip surface metal peeling system, in particular to a system for automatically peeling off the Metal metal layer and photoresist of an LED chip in layers.

Background technique

The metal metal layer and photoresist stripping of existing semiconductor LED wafers are mostly carried out by manual operation: specifically, white film is used to peel off the metal metal layer, and this stripping method cannot completely strip and recover precious metals , there will be losses in the subsequent recovery and refining of precious metals; in addition, the photoresist stripping operation is carried out after the Metal metal layer is stripped, and the glue on the surface of the wafer is removed by soaking in SF-M15 photoresist solution, and then rinsed with pure water; this part of the Metal metal Layers are difficult to recover, resulting in loss of precious metals.

Contents of the invention

The problem to be solved by the utility model is to provide a wafer surface metal stripping system capable of automatic operation and high recovery rate of precious metals, so as to realize the purpose of convenient and efficient operation of metal layer and photoresist stripping for users.

In order to solve the above technical problems, the utility model provides a system capable of automatic loading and unloading and layered peeling, which initially peels off the metal layer on the wafer surface, and further peels off the metal layer and photoresist. It is characterized in that: the system is composed of an upper and lower film area, a working area and a manipulator; the upper and lower film area is provided with a film loading frame carrying a slide tray, and the slide tray has at least one first wafer slot; the work area includes a contact stripping device, high-pressure removal device; the contact stripping device, by contacting the wafer surface, provides a viscous suction force greater than the adhesion between the metal and the wafer, and initially realizes the peeling of the metal from the wafer surface; the flushing removal device, through the high-pressure fluid The surface of the wafer is impacted to further realize metal peeling and photoresist peeling; the upper and lower wafer areas and the working area are passed through the manipulator to realize wafer transfer and continuous operation.

Preferably, the viscous suction is provided by the white film, and the metal is peeled off by utilizing the viscosity of the white film.

Preferably, the contact stripping device includes a film inlet roll, a pressing weight, a carrier, a guide rail, and a film outlet roll. The film inlet roll provides white film, the film output roll recycles old film, and precious metals are recovered through the old film.

Preferably, the high-pressure fluid of the flushing removal device is preferably SF-M15 degumming solution whose main component is a mixed solution of NMP, MEA and DMSO.

Preferably, the flushing removal device is programmed to control the angle of the stage relative to the sprinkler head, the rotation speed, and the impact velocity of the high-pressure fluid, so that the metal stripping efficiency can be improved by adjusting the program.

Preferably, the filter screen has fine and dense pores, so as to ensure the passage of the used solution while leaving metal debris, improve the metal recovery rate, and reduce production costs.

Preferably, the working surface of the manipulator has suction cups equal to the number of wafers in a single loading tray, and the wafers are grasped by the suction cups to realize wafer transfer.

The beneficial effects of the utility model include but not limited to:

The chip surface metal stripping system of the utility model solves the problems in the background technology, and the multi-layer metal stripping of the utility model improves the efficiency of the metal stripping, and only needs to place the wafer in the slide frame to automatically Complete metal stripping, save manpower, and improve the recovery rate of metal and solution due to the recovery device, and reduce production costs.

Description of drawings

FIG. 1 is a schematic diagram of the system in situ of an embodiment of the present invention.

Fig. 2 is a schematic diagram of the upper and lower areas of the embodiment of the utility model.

Fig. 3 is a schematic diagram of the position of the slide frame of the embodiment of the present invention.

FIG. 4 is a schematic diagram of a contact peeling device according to an embodiment of the present invention.

Fig. 5 is a schematic diagram of a flushing removal device according to an embodiment of the present invention.

Fig. 6 is a schematic diagram of a manipulator according to an embodiment of the present invention.

FIG. 7 is a wafer with a metal layer according to an embodiment of the present invention.

FIG. 8 is a wafer after peeling off the metal layer according to the embodiment of the present invention.

FIG. 9 is a wafer after the metal layer and the photoresist are peeled off according to the embodiment of the present invention.

Drawings: 1: Wafer surface metal peeling system; 2: Upper and lower film areas; 21: Carrier frame; 22: Carrier tray; 23: First wafer slot; 31: Positioning column; 32: Positioning hole; 4: Contact type Stripping device; 41: Film inlet roll; 42: Down weight block; 43: Guide rail; 44: Carrier; 45: Film output roll; 46: Second wafer tank; 47: White film; 5: Washing removal device; 51 : High-pressure fluid pipeline; 52: Rotary carrier; 53: Recovery device; 54: Filter screen; 55: Rotary hinge; 56: Rotary shaft; 6: Manipulator; 61: Mechanical arm; 62: Suction cup; 63: Main shaft; 71 : metal layer; 72: photoresist; 73: P electrode; 74: N electrode; 75: substrate.

Detailed ways

Now in conjunction with accompanying drawing and preferred embodiment the utility model is described in further detail. These drawings are all simplified schematic diagrams, which only illustrate the basic mechanism of the utility model in a schematic way, so they only show the configurations related to the utility model. Apparently, the described embodiments are only some embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, those skilled in the art can obtain all other Embodiments all belong to the protection scope of the utility model. It should be noted that the words "up" and "down" indicating orientation in the text are only used to describe this embodiment in detail, and do not limit the content of the present utility model.

Example

As shown in FIG. 1 , this embodiment provides a wafer surface metal stripping system 1 , which includes an upper and lower wafer area 2 , a contact stripping device 4 , a rinse removal device 5 , and a manipulator 6 .

As shown in Figure 2, the upper and lower film area 2 includes a slide frame 21, two slide trays 22 can be fully loaded on the slide frame 21, each slide tray 22 has the same structure, and the slide tray 22 and the slide frame 21 are composed of As shown in Figure 3, the positioning column 31 in a triangular orientation fits with the positioning hole 32 for positioning, and the upper surface of the carrier tray 22 includes three first wafer grooves 23, and each first wafer groove 23 carries a wafer as shown in Figure 7. Wafer comprising substrate 75 .

As shown in Figure 4, the film inlet roll 41, the lower pressure weight 42, the guide rail 43, the stage 44, and the film roll 45 are installed on the contact stripping device 4; A pipeline 51 , a rotary carrier 52 , a recovery device 53 , a filter 54 , a rotary hinge 55 , and a rotary shaft 56 .

The suction cup 62 connected by the mechanical arm 61 of FIG. 6 rotates with the main shaft 63 and moves up and down to realize taking and unloading the film.

1) During operation, after the operator puts the wafer on the loading tray 22, the suction cup 62 of the manipulator 6 uses vacuum to pick up the wafers, and transports three wafers on the loading tray 22 from the upper and lower wafer areas 2 to the contact stripping at a time. The second wafer groove 46 on the stage 44 in the device 4, the surface of the second wafer groove 46 includes pores, the pores are connected with a vacuum pump, and the vacuum suction setting of the second wafer groove 46 is opened to fix the wafer.

2) The stage 44 is driven by the cylinder through the guide rail 43, and moves from the original position in Fig. 1 to the bottom of the white film provided by the pressing weight 42 and the film feeding roll 41, and the pressing weight 42 is driven vertically by the cylinder. The downward movement brings the white film into contact with the metal layer 71 on the wafer surface, the pressing weight 42 rises, the stage 44 returns to its original position, and the white film and part of the metal are peeled off.

3) The robot arm 6 transports the wafer on the stage 44 to the rotary stage 52 of the rinse removal device 5 . The flushing removal device 5 passes through the high-pressure fluid pipeline 51, and the program controls the movement of the rotary hinge 55 and the rotary shaft 56 under the rotary platform 52, so that the angle and relative position between the rotary platform 52 and the high-pressure fluid are continuously changed during the working process, and the steps are carried out in sequence. Three rounds of rinsing, the first round of pure water pipeline impacts the wafer from multiple angles, and the metal layer 71 is peeled off by using the impact force of pure water, and the effect after stripping is shown in Figure 8; Lu 51 uses SF-M15 photoresist stripper to strip photoresist 72 and residual metal. The main component of SF-M15 is a mixture of NMP, MEA, and DMSO; The wafer is dried by blowing nitrogen through the nitrogen pipeline, and the P electrode 73 and the N electrode 74 of the wafer are exposed after processing. The stripped metal is brought into the recovery device 53 by the high-pressure fluid, and filtered by the filter screen 54 to realize the separation of the metal and the waste liquid.

4) Through the manipulator 6, transport the peeled wafer as shown in FIG. 8 back to the loading tray 22 in the upper and lower area 2 . Then the manipulator 6 takes the wafer to be processed from the upper and lower wafer areas 2 and transports it to the stage 44 of the contact stripping device 4 . So far, the wafer surface metal stripping system 1 realizes circular and efficient removal of wafer surface metal. The operator ensures circular operation by replacing the wafers on the loading tray 22, and regularly replaces the film roll 45 and the filter screen 54 to realize metal recovery.

Claims (10)

1. a wafer surface metal-stripping system, comprise upper and lower section, service area and manipulator, it is characterized in that: described service area comprises contact stripping off device, rinses removal device, get sheet, bottom sheet by manipulator, the wafer of upper and lower section delivered to successively contact stripping off device and rinse operation on removal device.

2. wafer surface metal-stripping system according to claim 1, is characterized in that: described upper and lower section is provided with the slide glass frame of carrying slide glass dish, and slide glass dish is at least provided with first wafer slots, for placing wafer.

3. wafer surface metal-stripping system according to claim 1, is characterized in that: described contact stripping off device comprises into film volume, lower saddle weight, microscope carrier, guide rail, membrane volume, by contact wafer surface, provides viscosity suction to wafer surface.

4. wafer surface metal-stripping system according to claim 3, it is characterized in that: described microscope carrier comprises second wafer slots the same number of with the first wafer slots on slide glass dish, second wafer slots surface is provided with pore, and pore is connected with vacuum pump, carries out absorption fix wafer; Wafer is being delivered to below tunica albuginea by guide rail by microscope carrier, provides pressure by lower saddle weight to tunica albuginea and wafer, thus carries out contact stripping metal.

5. wafer surface metal-stripping system according to claim 1, is characterized in that: described flushing removal device, uses high-pressure fluid to impact wafer surface.

6. wafer surface metal-stripping system according to claim 1, is characterized in that: described flushing removal device comprises high-pressure liquid line, rotates microscope carrier and retracting device.

7. wafer surface metal-stripping system according to claim 6, is characterized in that: described high-pressure liquid line comprises pure water pipeline, removing photoresistance liquid pipeline and nitrogen pipeline.

8. wafer surface metal-stripping system according to claim 6, is characterized in that: the height of described rotation microscope carrier is controlled by the liftable rotating shaft be positioned at below it; Described rotation microscope carrier is controlled by the rotary gemel be positioned at below described rotation microscope carrier relative to the angle of high-pressure fluid line way outlet.

9. wafer surface metal-stripping system according to claim 6, is characterized in that: described retracting device comprises screen pack and devil liquor recovery pipe.

10. wafer surface metal-stripping system according to claim 1, is characterized in that: described robot work face is provided with sucker, captures wafer by sucker.