CN204345371U - Light-emitting device - Google Patents

Abstract

The utility model provides a kind of light-emitting device that inhibit common-mode noise.The light-emitting device of embodiment comprises: the installation base plate being provided with lighting source; Be installed on the heat sink of described installation base plate; Power circuit; Hold described power circuit, and be electrically connected with described heat sink and hot linked electric conductivity framework; Have multiple metal level, described multiple metal level is electrically connected to each other, and opposed with at least one of described heat sink and described framework, and the electric conductor be electrically connected with the described lead-out terminal of the low potential side of described power circuit; Have be arranged at described electric conductor multiple metal levels between multiple second metal levels, described multiple second metal level is electrically connected to each other, and with at least one second opposed electric conductor of described heat sink and described framework; Be arranged at the insulating barrier between the metal level of described electric conductor and the second metal level of described second electric conductor.

Description

light emitting device

technical field

The new embodiment of the utility model relates to a light emitting device.

Background technique

There is a light emitting device that emits light from an illumination light source in response to supply of electric power. The light emitting device includes a power supply circuit that converts power supplied from the outside into power corresponding to an illumination light source. The power supply circuit is a so-called switching power supply, which includes switching elements, and converts electric power according to the on and off of the switching elements. In such a light emitting device, it is desired to suppress common mode noise.

Patent Document 1: Japanese Patent Laid-Open No. 2012-79498

Contents of the invention

The purpose of the utility model is to provide a light-emitting device that suppresses common noise.

The light-emitting device according to the embodiment includes: a mounting substrate on which an illumination light source is mounted; a heat dissipation plate mounted on the mounting substrate; a pair of input terminals and a pair of output terminals electrically connected to the illumination light source, and a power supply circuit that converts the input power input to the input terminal into DC output power corresponding to the illumination light source, and outputs the output power from the pair of output terminals; accommodates the power supply circuit, and is connected with the heat dissipation plate A conductive frame that is electrically and thermally connected; has a plurality of metal layers, and the multiple metal layers are electrically connected to each other, and are opposed to at least one of the heat sink and the frame, and are connected to the power supply A first electrical conductor electrically connected to the output terminal on the low potential side of the circuit; a plurality of second metal layers disposed between the plurality of metal layers of the first electrical conductor, the plurality of second metal layers Electrically connected to each other, and at least one second electrical conductor opposite to the heat dissipation plate and the frame; disposed between the metal layer of the first electrical conductor and the second metal layer of the second electrical conductor insulating layer between.

A light emitting device according to an embodiment includes: a heat dissipation plate mounted on a substrate on which a light source is mounted; a power supply circuit for converting input power into output power corresponding to the light source; accommodating the power supply circuit; a board-connected frame; having a plurality of metal layers electrically connected to each other and a first electrical conductor electrically connected to the output terminal on the low potential side of the power circuit, and connecting the frame The stray capacitance between the power circuit and the power circuit is set to be larger than the stray capacitance between the frame and the ground.

The utility model provides a light-emitting device which suppresses common state noise.

Description of drawings

FIG. 1 is a cross-sectional view schematically showing a light emitting device according to a first embodiment.

FIG. 2 is a block diagram schematically showing a part of the light emitting device according to the first embodiment.

Fig. 3 is a block diagram schematically showing a part of the light emitting device according to the second embodiment.

4(a) and 4(b) are block diagrams schematically showing a part of the light emitting device according to the third embodiment.

In the figure: 4-power supply, 10, 100, 200-light-emitting device, 11-installation substrate, 12-heat dissipation plate, 13-power supply circuit, 14-frame body, 15-conductor, 15a-metal layer, 16-illumination light source , 18-lamp holder, 20-resin shell, 22-cover, 24-bank, 26-sealing resin, 28-circuit board, 30-dielectric, 32-wiring, 33a, 33b, 34a, 34b-connection 40a, 40b-input terminal, 42a, 42b-output terminal, 44-filtering part, 46-AC-DC converter, 48-DC-DC converter, 50-inductor, 51-capacitor, 52-rectifier circuit , 53-filter capacitor, 60-switching element, 61-diode, 62-inductor, 63-capacitor, 70-insulating layer, 71-second conductor, 71a-second metal layer.

Detailed ways

Embodiments will be described in detail below with reference to the drawings. In addition, in this-application specification and each drawing, the same code|symbol is attached|subjected to the same element as what was already described by drawing, and detailed description is abbreviate|omitted suitably.

(first embodiment)

FIG. 1 is a cross-sectional view schematically showing a light emitting device according to a first embodiment.

As shown in FIG. 1 , the light emitting device 10 includes a mounting substrate 11 , a heat sink 12 , a power supply circuit 13 , a housing 14 , and a conductor 15 . An illumination light source 16 is mounted on the mounting board 11 . The illumination light source 16 is, for example, an LED (Light Emitting Diode, light emitting diode). The light emitting device 10 further includes, for example, a base 18 , a resin case 20 , and a cover 22 . The light emitting device 10 radiates light from an illumination light source 16 by electric power supplied from the outside via a base 18 . That is, in this example, the light emitting device 10 is a so-called LED light bulb.

For example, a plurality of illumination light sources 16 are mounted on the mounting board 11 . The mounting substrate 11 has a mounting surface provided with a wiring pattern. The illumination light sources 16 are arranged side by side on the mounting surface of the mounting substrate 11 . The illumination light sources 16 are connected in series via wiring patterns, for example. The wiring of each illumination light source 16 is not limited to series connection, but may be parallel connection or a combination of series connection and parallel connection. In addition, the illumination light source 16 is not limited to LEDs, for example, it may be other light-emitting elements such as organic EL (Electro-Luminescence, electroluminescence) or OLED (Organic light-emitting diode, organic light-emitting diode).

A bank 24 and a sealing resin 26 are provided on the mounting substrate 11 . The embankment 24 is disposed on the installation surface and surrounds each illumination light source 16 in a ring shape. For the bank portion 24, for example, silicone resin is used. The sealing resin 26 is filled in the area surrounded by the bank portion 24 to cover each illumination light source 16 . For the sealing resin 26, for example, silicone resin is used. Furthermore, the sealing resin 26 contains phosphor, for example. Each illumination light source 16 emits blue light, for example. The phosphor absorbs blue light and emits yellow light, for example. Thus, the light emitting device 10 emits white light, for example.

In this example, a so-called COB (Chip On Board, Chip On Board) type light emitting unit composed of each illumination light source 16 , bank 24 , and sealing resin 26 is provided on the mounting substrate 11 . However, the present invention is not limited thereto. For example, an illumination light source 16 that emits white light may be provided on the mounting substrate 11 . Furthermore, the color of the light emitted by the light emitting device 10 is not limited to white, and may be any color.

The heat sink 12 is mounted on the mounting substrate 11 . The radiator plate 12 is attached to the surface of the mounting substrate 11 opposite to the mounting surface. The heat sink 12 is, for example, in contact with the surface of the mounting substrate 11 opposite to the mounting surface. Thus, the heat sink 12 is thermally connected to the mounting substrate 11 . The heat sink 12 has electrical and thermal conductivity. The heat sink 12 is made of, for example, a metal material. The heat sink 12 is made of a metal material with high thermal conductivity such as aluminum or iron, for example. The heat dissipation plate 12 is used, for example, to improve heat dissipation of heat emitted from each illumination light source 16 .

Here, in the specification of the present application, "thermal connection" includes not only the case of direct connection but also the case of contact via other heat conductive members such as heat sinks and thermal paste.

The light emitting device 10 further includes a circuit substrate 28 . The power supply circuit 13 is mounted on the circuit board 28 . The power supply circuit 13 is constituted by a plurality of electronic components mounted on the circuit board 28 . The power supply circuit 13 is electrically connected to each illumination light source 16 and the lamp cap 18 . The power supply circuit 13 converts the input power input from the base 18 into DC output power corresponding to each illumination light source 16 . Thereafter, the power supply circuit 13 supplies output power to each illumination light source 16 . Thereby, the power supply circuit 13 turns on each illumination light source 16 .

Here, in the specification of the present application, "electrically connected" includes not only the case of direct connection but also the case of connection via another conductive member.

The frame body 14 accommodates the power supply circuit 13 . In other words, the housing 14 accommodates the circuit board 28 . The frame body 14 is, for example, cylindrical. The frame body 14 accommodates a circuit board 28 in an internal space. In this example, the frame body 14 is a truncated cone-shaped cylinder whose diameter increases from one end toward the other end. The frame body 14 has electrical and thermal conductivity. The frame body 14 is made of, for example, a metal material. The frame body 14 is made of a metal material with high thermal conductivity such as aluminum or iron, for example.

The radiator plate 12 is mounted on one end of the frame body 14 on the larger diameter side. The radiator plate 12 has a first surface 12 a facing the mounting substrate 11 , and a second surface 12 b opposite to the first surface 12 a. The radiator plate 12 is attached to the frame body 14 so as to close one end of the frame body 14 with the second surface 12b. The frame body 14 is, for example, in contact with the second surface 12 b of the heat sink 12 . Thus, the frame body 14 is electrically and thermally connected to the radiator plate 12 . Therefore, the potential of the frame body 14 is substantially the same as the potential of the radiator plate 12 .

On the outer surface of the frame body 14, for example, a plurality of cooling fins protruding radially from the central axis are provided. In this way, the housing 14 supports, for example, the mounting board 11, the circuit board 28, and the like. Furthermore, the frame body 14 improves the heat radiation performance of the heat emitted from each illumination light source 16 together with the heat dissipation plate 12 .

The resin case 20 is provided between the frame body 14 and the circuit board 28 . The resin case 20 is accommodated in the frame body 14 . Also, the resin case 20 accommodates a circuit board 28 . The circuit board 28 is held in the resin case 20 by, for example, a holding member or the like. The frame body 14 accommodates a circuit board 28 via a resin case 20 . The resin case 20 has insulating properties. The resin case 20 uses an insulating resin material such as polybutylene terephthalate (PBT), for example.

The resin case 20 is, for example, a truncated cone-shaped cylinder whose diameter increases from one end toward the other end. The outer diameter of the resin case 20 is, for example, substantially the same as the inner diameter of the frame body 14 . Thus, the resin case 20 is fitted into the frame body 14, for example. Furthermore, the axial length of the resin case 20 is longer than the axial length of the housing 14 . Thus, a part of the resin case 20 protrudes from the end of the frame body 14 on the smaller diameter side.

The base 18 is attached to one end of the resin case 20 protruding from the frame body 14 . The base 18 is, for example, a base that can be connected to a socket for a general lighting bulb such as an E17 type. The base 18 includes, for example, a case part 18a, an insulating part 18b provided at an end part of the case part 18a, and an eyelet part 18c provided at an apex part of the insulating part 18b. The insulating portion 18b electrically insulates the shell portion 18a and the eyelet portion 18c. The case portion 18 a and the eyelet portion 18 c are electrically connected to the power supply circuit 13 . Accordingly, the input electric power input through the base 18 is supplied to the power supply circuit 13 .

The cover 22 is attached to one end of the frame body 14 on the larger-diameter side, and covers each illumination light source 16 . The cover 22 has translucency. The cover 22 may also have light diffusing properties, for example. In other words, the cover 22 is a lamp cover. For the cover 22, for example, glass or resin material is used.

Conductor 15 is provided to face frame body 14 . The conductor 15 is provided in the frame body 14 and faces the frame body 14 inside the frame body 14 . Furthermore, the conductor 15 faces the frame body 14 in a state separated from the frame body 14 . That is, the conductor 15 is not in direct contact with the frame body 14 . Therefore, the electric potential of the conductor 15 is different from the electric potential of the frame body 14 and the electric potential of the radiator plate 12 . Accordingly, the conductor 15 and the frame body 14 form a pseudo capacitor.

The conductor 15 is, for example, in the shape of a thin plate. Metal material such as aluminum or copper is used for the conductor 15 , for example. In other words, the conductor 15 is a thin metal body.

The light emitting device 10 further includes, for example, a dielectric body 30 and wiring 32 . The dielectric body 30 is provided between the frame body 14 and the conductor 15 . Conductor 15 is separated from frame body 14 by dielectric body 30 . For example, an air layer may be provided between the frame body 14 and the conductor 15 . The thickness of the dielectric body 30 is the distance between the conductor 15 and the frame body 14 . The conductor 15 and the dielectric 30 are provided between the frame body 14 and the resin case 20 . That is, the conductor 15 and the dielectric body 30 are held in a state sandwiched between the frame body 14 and the resin case 20 .

One end of the wiring 32 is electrically connected to the mounting substrate 11 via a pair of connectors 33a and 33b. The other end of the wiring 32 is electrically connected to the circuit board 28 via a pair of connectors 34a, 34b. Thus, the wiring 32 electrically connects the mounting board 11 and the circuit board 28 . In other words, the wiring 32 electrically connects the mounting substrate 11 and the power supply circuit 13 . The wiring 32 passes through the inner space of the resin case 20 (the inner space of the housing 14 ). Therefore, the heat dissipation plate 12 is provided with the through-hole 12d. The wiring 32 is inserted through the through hole 12d.

Conductor 15 is provided between wiring 32 and frame body 14 . In other words, the conductor 15 is provided along the wiring 32 . In this example, conductor 15 is provided only in a portion between wiring 32 and frame body 14 . Conductor 15 may be, for example, annular along the inner surface of frame body 14 . It is only necessary that at least a part of the conductor 15 is provided between the wiring 32 and the frame body 14 .

FIG. 2 is a block diagram schematically showing a part of the light emitting device according to the first embodiment.

As shown in FIG. 2, the power supply circuit 13 has a pair of input terminals 40a, 40b, and a pair of output terminals 42a, 42b. Wiring patterns 11 a and 11 b are provided on the mounting surface of the mounting substrate 11 . The wiring pattern 11a is electrically connected to the positive electrode of the illumination light source 16 which is a light emitting element. The wiring pattern 11b is electrically connected to the negative electrode of the illumination light source 16 which is a light emitting element. For the wiring patterns 11a and 11b, for example, a highly conductive metal material such as copper is used.

The input terminal 40 a is electrically connected to the eyelet portion 18 c of the base 18 , for example. The input terminal 40b is electrically connected to the case portion 18a of the base 18, for example. Thereby, each input terminal 40a, 40b is electrically connected to the AC power supply 4 via the base 18, a socket, etc.,. AC input power supplied from the AC power supply 4 is input to each input terminal 40a, 40b. The AC power supply 4 is, for example, an AC commercial power supply with an effective value of 100V.

Each output terminal 42 a, 42 b is electrically connected to the illumination light source 16 . More specifically, the output terminal 42a is connected to the positive electrode of the illumination light source 16 via the wiring 32, the wiring pattern 11a, and the like, for example. The output terminal 42b is connected to the negative electrode of the illumination light source 16 via the wiring 32, the wiring pattern 11b, and the like, for example. That is, the output terminal 42a is a high potential output terminal, and the output terminal 42b is a low potential output terminal.

The power supply circuit 13 includes, for example, a filter unit 44 , an AC-DC converter 46 , and a DC-DC converter 48 . The filter part 44 is electrically connected to each input terminal 40a, 40b. The filter unit 44 includes, for example, an inductor 50 and a capacitor 51 . The inductor 50 is connected in series with the input terminal 40a. The capacitor 51 is connected in parallel to each input terminal 40a, 40b. The filter part 44 suppresses the noise of the input electric power input from each input terminal 40a, 40b. The filter unit 44 suppresses, for example, normal noise of input power.

The AC-DC converter 46 is connected to the filter unit 44 . The AC-DC converter 46 includes: a rectification circuit 52 and a filter capacitor 53 . The rectification circuit 52 rectifies AC input power and converts it into rectified power. The rectified power is, for example, pulsating current power. The rectification circuit 52 is, for example, a full-wave rectifier that full-wave rectifies input power. The rectification circuit 52 may be, for example, a half-wave rectifier or the like. The smoothing capacitor 53 smoothes the rectified voltage output from the rectification circuit 52, and converts the rectified voltage into DC power.

The DC-DC converter 48 includes, for example, a switching element 60 , a diode 61 , an inductor 62 , and a capacitor 63 . That is, in this example, the DC-DC converter 48 is a step-down chopper circuit. The DC-DC converter 48 converts the DC power output from the AC-DC converter 46 into DC output power having different absolute values by turning on and off the switching element 60 . In this example, DC power is down-converted to output power.

The DC-DC converter 48 is electrically connected to each output terminal 42a, 42b. The DC-DC converter 48 outputs the converted output power to each output terminal 42a, 42b. As a result, the output power is supplied to the illumination light source 16 and the illumination light source 16 is turned on.

The structure of the DC-DC converter 48 is not limited to the above-mentioned structure, and other structures are also possible. The DC-DC converter 48 may be any circuit that includes the switching element 60 and generates DC output power by turning the switching element 60 on and off. For example, when the input power is DC power, only the DC-DC converter 48 may be provided in the power supply circuit 13 . The power supply circuit 13 may be a switching power supply including the switching element 60 .

Furthermore, as shown in FIG. 2 , the conductor 15 is electrically connected to the output terminal 42 b on the low potential side. Therefore, the potential of the conductor 15 is substantially the same as the reference potential of the power supply circuit 13 . Thereby, the stray capacitance Cs1 between the housing 14 and the power circuit 13 can be made larger than the stray capacitance Cs2 between the housing 14 and the ground. For example, the stray capacitance Cs1 can be made about 10 times the stray capacitance Cs2. In other words, the stray capacitance Cs1 is a stray capacitance between the housing 14 and the circuit board 28 . In other words, the stray capacitance Cs1 is a stray capacitance between the housing 14 and the conductor 15 .

The stray capacitances Cs1 and Cs2 can be measured using, for example, an artificial power supply network (LISN: Line Impedance Stabilization Network) and a spectrum analyzer.

In the light emitting device 10, the power supply circuit 13 becomes a noise source. For example, as shown by the arrow N1 in the drawing, through the stray capacitance between the power circuit 13 and the frame body 14, the stray capacitance between the frame body 14 and the ground, the ground, the ground and the input wiring of the power circuit 13 The current flowing due to the stray capacitance between them becomes common mode noise.

In the light emitting device 10 according to this embodiment, the conductor 15 is provided so that the stray capacitance Cs1 between the housing 14 and the power circuit 13 is larger than the stray capacitance Cs2 between the housing 14 and the ground. This makes it difficult for high-frequency noise of the power supply circuit 13 to leak from the housing 14 to the ground. For example, as indicated by the arrow N2 in the drawing, through the stray capacitance Cs1 between the power circuit 13 and the frame 14, the frame 14, the heat sink 12, the stray capacitance between the heat sink 12 and the wiring patterns 11a, 11b The capacitor Cs3 , the wiring patterns 11 a , 11 b , the route of the wiring 32 , and the like can circulate a noise current in the light emitting device 10 . Accordingly, in the light emitting device 10, common mode noise can be suppressed.

In addition, in the light emitting device 10, for example, common mode noise can be suppressed without using a common mode choke coil or the like. Accordingly, in the light emitting device 10 , for example, an increase in size of the device can be suppressed.

Furthermore, as described above, the conductor 15 is provided between the wiring 32 and the frame body 14 . In this way, the conductor 15 is disposed between the noise source and the portion closest to the housing 14 . Thereby, for example, it is possible to more reliably suppress the flow of noise current from the housing 14 to the ground. For example, common mode noise can be more reliably suppressed.

(second embodiment)

Fig. 3 is a block diagram schematically showing a part of the light emitting device according to the second embodiment.

As shown in FIG. 3 , in the light emitting device 100 , the conductor 15 is provided to face the second surface 12 b of the heat sink 12 . In addition, in the light emitting device 100 , except for the arrangement of the conductors 15 , other configurations are substantially the same as those of the light emitting device 10 of the first embodiment described above. Hereinafter, parts having substantially the same functions and structures as those of the light emitting device 10 are assigned the same reference numerals, and detailed description thereof will be omitted.

Conductor 15 faces second surface 12 b in a state separated from heat sink 12 . That is, conductor 15 does not directly contact radiator plate 12 . Therefore, the electric potential of the conductor 15 is different from the electric potential of the frame body 14 and the electric potential of the radiator plate 12 .

In the light emitting device 100 , the dielectric body 30 is provided between the heat dissipation plate 12 and the conductor 15 . Conductor 15 is separated from heat sink 12 by dielectric 30 . In this example, for example, the conductor 15 is attached to the second surface 12 b via the dielectric 30 . The thickness of the dielectric body 30 is substantially the same as that of the above-mentioned first embodiment. The area of the surface of the conductor 15 facing the heat sink 12 and the thickness of the conductor 15 are substantially the same as those of the first embodiment described above.

In this example, the conductor 15 is also electrically connected to the output terminal 42b on the low potential side. The potential of the conductor 15 is substantially the same as the reference potential of the power supply circuit 13 . Thereby, the stray capacitance between the radiator plate 12 and the power supply circuit 13 can be made larger than the stray capacitance Cs2 between the housing 14 and the ground. As described above, the radiator plate 12 is electrically connected to the frame body 14 . Therefore, also in this example, the stray capacitance Cs1 between the housing 14 and the power supply circuit 13 can be made larger than the stray capacitance Cs2 between the housing 14 and the ground.

Also in the light emitting device 100 , similarly to the first embodiment described above, it is possible to prevent the high-frequency noise of the power supply circuit 13 from leaking from the housing 14 to the ground. In this example, for example, through the conductor 15, the stray capacitance between the conductor 15 and the heat sink 12, the heat sink 12, the stray capacitance Cs3 between the heat sink 12 and the wiring patterns 11a, 11b, the wiring The patterns 11 a , 11 b , the route of the wiring 32 , and the like can circulate a noise current in the light emitting device 10 . Accordingly, common mode noise can also be suppressed in the light emitting device 100 .

In this way, the conductor 15 can face the heat dissipation plate 12 . Conductor 15 may face both heat sink 12 and frame body 14 . That is, the conductor 15 has only to face at least one of the radiator plate 12 and the frame body 14 .

(third embodiment)

Fig. 4(a) is a block diagram schematically showing a part of the light emitting device according to the third embodiment. In addition, FIG. 4( b ) is an enlarged view showing a part of FIG. 4( a ).

As shown in FIG. 4(a) and FIG. 4(b), the light emitting device 200 includes: a conductor 15 having a plurality of metal layers 15a, and a second metal layer 71a ( second conductor 71) and the insulating layer 70 disposed between the metal layer 15a and the second metal layer 71a. In addition, in the light-emitting device 200, except for the arrangement of the conductor 15, the metal layer 15a, the second conductor 71, the second metal layer 71a, and the insulating layer 70, other structures are the same as those of the light-emitting devices of the first and second embodiments described above. The devices 10, 100 are substantially identical. Parts having substantially the same functions and structures as those of the light emitting devices 10 and 100 are assigned the same reference numerals, and detailed description thereof will be omitted.

Furthermore, as shown in FIGS. 4( a ) and ( b ), the conductor 15 has a plurality of metal layers 15 a, and the plurality of metal layers 15 a are electrically connected to each other and are electrically connected to the output terminal 42 b on the low potential side. Therefore, the potential of the conductor 15 and the plurality of metal layers 15 a is substantially the same as the reference potential of the power supply circuit 13 . The second metal layer 71 a is provided between the metal layers 15 a of the conductor 15 . The plurality of second metal layers 71 a are electrically connected to each other, and form the second conductor 71 . An insulating layer 70 is provided between the metal layer 15 a of the conductor 15 and the second metal layer 71 a of the second conductor 71 . Moreover, the conductor 15, the metal layer 15a, the 2nd conductor 71, the 2nd metal layer 71a, and the insulating layer 70 are covered with the insulator which is not shown in figure. The metal layer 15a and the second metal layer 71a may be metal thin films, or may be formed in a multi-layer substrate.

Through the conductor 15, the metal layer 15a, the second conductor 71, the second metal layer 71a, and the insulating layer 70, the stray capacitance Cs1 between the frame body 14 and the power circuit 13 can be greater than that between the frame body 14 and the ground. Stray capacitance Cs2. For example, the stray capacitance Cs1 can be made about 10 times the stray capacitance Cs2. In other words, the stray capacitance Cs1 is a stray capacitance between the housing 14 and the circuit board 28 . In other words, the stray capacitance Cs1 is the stray capacitance between the conductor 15 , the metal layer 15 a , the second conductor 71 , the second metal layer 71 a and the insulating layer 70 , and the frame 14 .

In the light emitting device 10, the power supply circuit 13 becomes a noise source. For example, as shown by the arrow N1 in the drawing, through the stray capacitance between the power circuit 13 and the frame body 14, the stray capacitance between the frame body 14 and the ground, the ground, the ground and the input wiring of the power circuit 13 The current flowing due to the stray capacitance between them becomes common mode noise.

In the light-emitting device 200 according to this embodiment, the conductor 15, the metal layer 15a, the second conductor 71, the second metal layer 71a, and the insulating layer 70 are provided, and the miscellaneous space between the housing 14 and the power circuit 13 The stray capacitance Cs1 is larger than the stray capacitance Cs2 between the frame body 14 and the ground. This makes it difficult for high-frequency noise of the power supply circuit 13 to leak from the housing 14 to the ground. For example, as shown by the arrow N2 in the drawing, through the stray capacitance Cs1 between the power supply circuit 13 and the frame body 14, the frame body 14, the heat sink plate 12, the stray capacitance between the heat sink plate 12 and the wiring patterns 11a, 11b The capacitor Cs3 , the wiring patterns 11 a , 11 b , the route of the wiring 32 , and the like can circulate a noise current in the light emitting device 10 . Accordingly, common mode noise can be suppressed in the light emitting device 10 .

Furthermore, in the light emitting device 200, for example, common mode noise can be suppressed without using a common mode choke coil or the like. Accordingly, in the light emitting device 200 , for example, an increase in size of the device can be suppressed.

Furthermore, as described above, the conductor 15 , the metal layer 15 a , the second conductor 71 , the second metal layer 71 a , and the insulating layer 70 are provided between the wiring 32 and the frame body 14 . In this way, the conductor 15 , the metal layer 15 a , the second conductor 71 , the second metal layer 71 a , and the insulating layer 70 are arranged between the noise source and the portion closest to the housing 14 . Thereby, for example, the flow of noise current from the housing 14 to the ground is more reliably suppressed. For example, common mode noise can be more reliably suppressed.

In each of the above-described embodiments, the bulb-type light emitting device having the base 18 and receiving power supply from the outside through the base 18 has been shown. The light emitting device is not limited to a light bulb type, and may be, for example, a light emitting module (for example, an LED module) that receives power supply from the outside through wiring. That is, the connection part for electrically connecting the light-emitting device to an external power source may be a base or a wire.

As mentioned above, although some embodiment of this invention was demonstrated, these embodiment is an illustration and does not intend to limit the scope of the invention. These new embodiments can be implemented in other various forms, and various omissions, substitutions, and changes can be made without departing from the gist of the present invention. These embodiments and their modifications all belong to the scope or gist of the present invention, and are also included in the utility model described in the technical solution and its equivalent scope.

Claims (5)

1. a light-emitting device, is characterized in that, possesses:

The installation base plate of lighting source is installed;

Be installed on the heat sink of described installation base plate;

Pair of output there is pair of input terminals, being electrically connected with described lighting source, and convert the input electric power inputted from described pair of input terminals to the DC output power corresponding with described lighting source, and export the power circuit of described output power from described pair of output;

Hold described power circuit, and be electrically connected with described heat sink and hot linked electric conductivity framework;

Have multiple metal level, described multiple metal level is electrically connected to each other, and opposed with at least one of described heat sink and described framework, and the first electric conductor be electrically connected with the described lead-out terminal of the low potential side of described power circuit;

Have be arranged at described first electric conductor multiple metal levels between multiple second metal levels, described multiple second metal level is electrically connected to each other, and with at least one second opposed electric conductor of described heat sink and described framework;

Be arranged at the insulating barrier between the metal level of described first electric conductor and the second metal level of described second electric conductor.

2. light-emitting device according to claim 1, is characterized in that,

Described light-emitting device also possesses the distribution making described installation base plate and the electrical connection of described power circuit,

Described first electric conductor is at least arranged between described distribution and described framework.

3. light-emitting device according to claim 1, is characterized in that,

Described heat sink have the first surface opposed with described installation base plate, with second of described first surface opposite side,

Described first electric conductor at least with described second opposed.

4. light-emitting device according to any one of claim 1 to 3, is characterized in that,

Stray capacitance between described framework and described power circuit is greater than the stray capacitance between described framework and the earth.

5. a light-emitting device, is characterized in that, possesses:

Be installed on the heat sink be provided with on the substrate of light source;

For input electric power being converted to the power circuit of the output power corresponding with described light source;

Hold described power circuit, and the framework be connected with described heat sink;

Have multiple metal level, described multiple metal level is electrically connected to each other, and the first electric conductor be electrically connected with the described lead-out terminal of the low potential side of described power circuit,

Further, the stray capacitance between framework and power circuit is set greater than the stray capacitance between framework and the earth.