CN204303859U - Light source module and there is the LED display of this light source module - Google Patents

Abstract

The utility model provides a light source module and an LED display device with the light source module. The light source module includes: a substrate (10); a light-emitting chip (20), which is arranged on the surface of the substrate (10); a scattering layer (30), coated on the outside of the light-emitting chip (20); the light-emitting layer (40), covered on the surface of the substrate (10), and the light-emitting layer (40) is arranged on at least the circumferential outer side of the scattering layer (30). The technical scheme of the utility model effectively solves the problem of uneven distribution of light emitted by the blue LED on the quantum dot package assembly in the prior art.

Description

Light source module and LED display device having the light source module

technical field

The utility model relates to the technical field of LED display, in particular to a light source module and an LED display device with the light source module.

Background technique

At present, due to the characteristics of energy concentration and narrow half-wave width of light emitted by quantum dot materials, they are suitable for use as backlight sources for display screens. Generally speaking, the quantum dot material display is to fix the quantum dot packaging component between the light-emitting surface of the blue LED and the side of the diffusion plate. In this way, the blue light emitted by the blue LED excites the quantum dots of various wavelengths in the quantum dot packaging component, and after mixing, it emits white light, and then the white light is evenly distributed and projected onto the display screen through the diffusion plate.

In the display screen, in order to pursue appearance factors such as thin thickness and narrow edges of the display screen, the distance between the blue LED and the quantum dot package components is often very close. In this way, the light emitted by the blue LED will be unevenly distributed on the quantum dot package component, which will easily cause excessive local light intensity and high temperature. Since quantum dot materials are very sensitive to temperature and light intensity, long-term exposure to strong light or working in a high-temperature environment will seriously affect their stability. In turn, the overall efficiency of the quantum dot packaging component is reduced, which ultimately affects the display effect. In order to reduce the local light intensity of the body surface of the quantum dot packaging component for some quantum dot material display screens, the distance between the quantum dot packaging component and the blue LED is increased. However, this increases the overall volume of the display screen, and at the same time, the display effect is not ideal.

Utility model content

The utility model aims to provide a light source module and an LED display device with the light source module, so as to solve the problem of uneven distribution of light emitted by blue LEDs on quantum dot packaging components in the prior art.

In order to achieve the above object, according to one aspect of the present invention, a light source module is provided, including: a substrate; a light-emitting chip disposed on the surface of the substrate; a scattering layer coated on the outside of the light-emitting chip; a light-emitting layer covered on the On the surface of the substrate, a light emitting layer is provided on at least the circumferential outer side of the scattering layer.

Further, the light source module further includes a frame, the frame is arranged at the peripheral edge of the substrate, and the light-emitting layer is filled in the frame.

Further, the scattering layer is hemispherical.

Further, the scattering layer is in the shape of a cuboid.

Further, the light emitting chip is an LED blue light chip.

Further, the material of the light-emitting layer is quantum dot material.

Further, the light-emitting chip is welded on the substrate through metal wires.

Further, the substrate is a metal substrate.

Further, the material of the frame is PC or PMMA.

According to another aspect of the present utility model, an LED display device is provided, including a display screen and a light source module connected to the display screen, the light source module being the above-mentioned light source module.

Applying the technical solution of the utility model, the light-emitting chip is arranged on the surface of the substrate, the scattering layer is coated on the outside of the light-emitting chip, the light-emitting layer is covered on the surface of the substrate, the light-emitting layer is covered on the scattering layer, or the light-emitting layer is arranged around Circumferentially outside of the scattering layer. The scattering layer can scatter the light emitted by the light-emitting chip to the surroundings. After scattering, the surface of the scattering layer will have light, and the light distribution on the surface of the scattering layer will be uniform. Then the light after passing through the scattering layer excites the light-emitting layer to emit white light, so that the light distribution on the light-emitting layer is relatively uniform, effectively avoiding the situation that the local light intensity of the light-emitting layer is too large and the temperature is too high, thereby improving the brightness of the light-emitting layer. stability.

Description of drawings

The accompanying drawings constituting a part of this application are used to provide a further understanding of the utility model, and the schematic embodiments of the utility model and their descriptions are used to explain the utility model and do not constitute improper limitations to the utility model. In the attached picture:

Fig. 1 shows a schematic cross-sectional structural view of Embodiment 1 of a light source module according to the present invention;

Fig. 2 shows a schematic cross-sectional view of the second embodiment of the light source module according to the present invention;

FIG. 3 shows a simulated lighting effect diagram of a light source module in the prior art; and

FIG. 4 shows a simulated lighting effect diagram of the light source module in FIG. 1 .

The above-mentioned drawings include the following reference numerals:

10. Substrate; 20. Light-emitting chip; 30. Scattering layer; 40. Light-emitting layer; 50. Frame; 60. Metal wire.

Detailed ways

It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The utility model will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

As shown in FIG. 1 , the light source module of this embodiment includes a substrate 10 , a light emitting chip 20 , a scattering layer 30 and a light emitting layer 40 . The light-emitting chip 20 is disposed on the surface of the substrate 10 , the scattering layer 30 covers the light-emitting chip 20 , the light-emitting layer 40 covers the surface of the substrate 10 , and the light-emitting layer 40 is disposed on at least the circumferential outer side of the scattering layer 30 . The light emitting layer 40 of the light source module of the first embodiment is covered on the scattering layer 30 .

Applying the light source module of Embodiment 1, the light emitting chip 20 is arranged on the surface of the substrate 10, the scattering layer 30 is coated on the outside of the light emitting chip 20, the light emitting layer 40 is covered on the surface of the substrate 10, and the light emitting layer 40 is covered on the scattering layer 30 on. The scattering layer 30 can scatter the light emitted by the light-emitting chip 20 to the surroundings. After scattering, the surface of the scattering layer 30 will have light, and the light distribution on the surface of the scattering layer 30 will be uniform. Then the light after passing through the scattering layer 30 excites the luminescent layer 40 to emit white light, so that the distribution of light on the luminescent layer 40 is relatively uniform, effectively avoiding the situation that the local light intensity of the luminescent layer 40 is too high and the temperature is too high, thereby improving The stability of the light-emitting layer 40 is improved.

In order to fix the luminescent layer 40 on the substrate 10 conveniently, in the first embodiment, the light source module further includes a frame 50 disposed at the peripheral edge of the substrate 10 , and the luminescent layer 40 is filled in the frame 50 . The material of the frame 50 is a diffuse reflective material.

In order to ensure the uniformity of light on the surface of the scattering layer 30 , in the first embodiment, the scattering layer 30 has a hemispherical shape.

In Embodiment 1, the light emitting chip 20 is a blue LED chip.

In order to improve the stability of the light emitting layer 40, in the first embodiment, the material of the light emitting layer 40 is quantum dot material. Preferably, the surface of the light-emitting layer 40 is in the shape of a convex arc. In this way, the light extraction rate of the surface of the light-emitting layer 40 can be improved, and the total reflection of light can be effectively reduced.

In the first embodiment, the light emitting chip 20 is welded on the substrate 10 through the metal wire 60 . Preferably, the metal wire 60 is a gold wire or a copper wire. Preferably, the number of metal wires 60 is two or four.

In the first embodiment, the substrate 10 is a metal substrate. A circuit pattern is printed on the metal substrate, and the LED blue light chip is directly welded on the metal substrate through gold wire or copper wire, instead of packaging the LED blue light chip into an LED lamp. In this way, the heat of the LED blue light chip does not need to be dissipated through the way of the LED lampshade, which effectively reduces the way of heat dissipation, accelerates the heat dissipation of the LED blue light chip, reduces the temperature of the LED blue light chip, and then reduces the thermal resistance of the overall module. This also reduces the temperature of the quantum dot material, and improves the reliability and conversion efficiency of the LED blue light chip and the quantum dot material. Preferably, the substrate 10 is an aluminum substrate.

In the first embodiment, the material of the frame 50 is PC (polycarbonate) or PMMA (polymethyl methacrylate).

In the first embodiment, the scattering layer 30 contains diffuse reflection scattering particles. Use a mold to encapsulate the LED blue light chip with the scattering layer 30, release the mold after the scattering layer 30 is cured, then install the frame 50, evenly coat the quantum dot material in the frame 50, and complete the light source module after curing.

In the first embodiment, a thermocouple is placed on the light emitting layer 40, and the test temperature of the light emitting layer 40 of the light source module is in the range of 75 degrees to 80 degrees. However, the test temperature of the quantum dot packaging assembly of the light source module of an ordinary LED lamp is about 85 degrees, so the application of the light source module of this embodiment effectively reduces the temperature of the light-emitting layer 40, and then improves the temperature of the LED blue light chip and the quantum dot material. reliability and conversion efficiency.

Fig. 2 shows the structure of the second embodiment of the light source module of the present application. The difference between the light source module of the second embodiment and the first embodiment is that the light-emitting layer 40 is arranged around the circumferential outer side of the scattering layer 30 and the scattering layer 30 is in the form of Cuboid shape. The luminous layer 40 is arranged around the peripheral side of the scattering layer 30, so that the scattering layer 30 can also scatter the light emitted by the light-emitting chip 20 to the surroundings, and the surface of the scattering layer 30 will have light after scattering, and the surface of the scattering layer 30 Light distribution is uniform. Then the light after passing through the scattering layer 30 excites the luminescent layer 40 to emit white light, so that the distribution of light on the luminescent layer 40 is relatively uniform, effectively avoiding the situation that the local light intensity of the luminescent layer 40 is too high and the temperature is too high, thereby improving The stability of the light-emitting layer 40 is improved.

The present application also provides an LED display device. An embodiment of the LED display device according to the present application (not shown in the figure) includes a display screen and a light source module connected to the display screen. The light source module is the above-mentioned light source module . Applying the LED display device of this embodiment, the light emitting chip 20 is arranged on the surface of the substrate 10, the scattering layer 30 is coated on the outside of the light emitting chip 20, the light emitting layer 40 is covered on the surface of the substrate 10, and the light emitting layer 40 is covered on the scattering layer 30 on. The scattering layer 30 can scatter the light emitted by the light-emitting chip 20 to the surroundings. After scattering, the surface of the scattering layer 30 will have light, and the light distribution on the surface of the scattering layer 30 will be uniform. Then the light after passing through the scattering layer 30 excites the luminescent layer 40 to emit white light, so that the distribution of light on the luminescent layer 40 is relatively uniform, effectively avoiding the situation that the local light intensity of the luminescent layer 40 is too high and the temperature is too high, thereby improving The stability of the light-emitting layer 40 is improved.

As shown in Figure 3 and Figure 4, the X-axis in the figure is the width of the receiving screen, the Y-axis is the length of the receiving screen, and the histogram on the left represents the intensity of the light. The unit of the width and length of the receiving screen is millimeters. The light source module in the prior art and the light source module in Embodiment 1 simulate the lighting effect diagram under the same test parameters, and the receiving screen is set on the light-emitting layer, and the lighting effect received by the receiving screen is observed. FIG. 3 shows a diagram of a simulated lighting effect of a light source module in the prior art, and FIG. 4 shows a diagram of a simulated lighting effect of a light source module in Embodiment 1. The test parameters are as follows: substrate 1 is made of aluminum substrate, the size of the aluminum substrate is 120mm×8mm, the LED blue light chip uses six 3050LED blue light chips, the optical power of a single 3050LED blue light chip is 0.125W, and the six 3050LED blue light chips are set on the aluminum plate with an interval of 20mm. On the center line of the width direction of the substrate, the 3050 LED blue light chip emits a total of 300,000 rays, the thickness of the light-emitting layer is 4.5mm, the size of the receiving screen is the same as that of the aluminum substrate, and the distance between the receiving screen and the light-emitting layer is 0.01mm. The experimental results are shown in Table 1. The receiving screen in the prior art receives a total of 299,882 incident rays, and the receiving screen in Embodiment 1 receives a total of 286,794 incident rays.

Table 1 Comparison of lighting effects between the light source module in the prior art and the light source module in Embodiment 1

It can be seen from Figure 3 and Figure 4 that the light intensity in Figure 3 is mainly concentrated in the center of the 3050LED blue light chip, and the surrounding light intensity is relatively weak, and the distribution of light intensity is very uneven. The distribution range of the light intensity in FIG. 4 is larger than that in FIG. 3 , and the distribution of the light intensity in FIG. 4 is more uniform than that in FIG. 3 . Therefore, the illumination uniformity in FIG. 4 is significantly higher than that in FIG. 3 , that is, the illumination uniformity of the light source module in Embodiment 1 is significantly higher than that of the light source module in the prior art.

The above descriptions are only preferred embodiments of the utility model, and are not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present utility model shall be included in the protection scope of the present utility model.

Claims (10)

1. a light source module, is characterized in that, comprising:

Substrate (10);

Luminescence chip (20), is arranged on the surface of described substrate (10);

Scattering layer (30), is coated on described luminescence chip (20) outward;

Luminescent layer (40), covers on the surface of described substrate (10), at least outer circumferential of described scattering layer (30) is provided with described luminescent layer (40).

2. light source module according to claim 1, it is characterized in that, described light source module also comprises framework (50), described framework (50) arranges the circumferential edge place of described substrate (10), and described luminescent layer (40) is filled in described framework (50).

3. light source module according to claim 1, is characterized in that, described scattering layer (30) is in hemispherical.

4. light source module according to claim 1, is characterized in that, described scattering layer (30) is in rectangular-shaped.

5. light source module according to claim 1, is characterized in that, described luminescence chip (20) is LED blue chip.

6. light source module according to claim 1, is characterized in that, the material of described luminescent layer (40) is quanta point material.

7. light source module according to claim 1, is characterized in that, described luminescence chip (20) is welded on described substrate (10) by plain conductor (60).

8. light source module according to claim 1, is characterized in that, described substrate (10) is metal substrate.

9. light source module according to claim 2, is characterized in that, the material of described framework (50) is PC or PMMA.

10. a LED display, the light source module comprising display screen and be connected with described display screen, is characterized in that, the light source module of described light source module according to any one of claim 1 to 9.