CN204230234U - Distribution component - Google Patents

Abstract

The utility model provides a wiring component, which can be reliably connected to a wiring substrate or the like of a connection object, and can ensure a good conduction state. The wiring part (1) has: a plurality of rectangular conductors (2), which are arranged in a planar shape; insulating films (3a, 4a), which are separated from both sides of the arrangement surface except at least one end side of the rectangular conductors (2). Pasted on the flat-angle conductor (2); the reinforcing base material (14), for the flat-angle conductor (2) on at least one end side, is pasted on one side of the arrangement surface with an adhesive (16); and a protective film (17) , which has a micro-adhesive adhesive layer (17a), which is pasted on the surface of the reinforcement substrate (14) opposite to the rectangular conductor (2) through the micro-adhesive adhesive layer (17a), protecting The film has an outer shape larger than that of the reinforcing base material (14), and its peripheral portion (17c) is arranged outside the peripheral portion (14a) of the reinforcing base material in plan view.

Description

Wiring components

technical field

The utility model relates to a wiring component used for wiring of electronic equipment and the like.

Background technique

As a wiring member that can perform high-density wiring in a limited space, the following wiring member is known. The wiring member has: a plurality of conductors arranged at predetermined intervals; The conductor is constituted by an insulating tape integrally fixed so as to be sandwiched from both sides of the arrangement surface. As an example of a wiring member, a structure in which a reinforcing base material is bonded to a conductor exposed at an end to form a connection portion to a wiring board or the like to be connected is known. (For example, refer to Patent Document 1).

Patent Document 1: Japanese Unexamined Patent Publication No. 2013-4706

The connecting portion of the above-mentioned wiring member is pressed with a punching machine in a state of being overlapped with a wiring board or the like of a connection target, and is bonded to the connection target to be connected.

However, when the connection part is punched on the wiring member, the adhesive overflowing from the reinforcing base material may adhere to the punching surface of the punching machine. Then, when the punching surface of the punching machine moves to open, the reinforcing base material or the wiring member moves together with the punching surface. As a result, there is a possibility that conduction failure may occur due to peeling of the reinforcing base material from the wiring member or insufficient adhesion between the wiring member and the connection partner.

Utility model content

An object of the present invention is to provide a wiring component which can be reliably connected to a wiring board or the like to be connected and which can ensure a good conduction state.

The wiring part of the present utility model has:

Multiple conductors arranged in a planar shape;

an insulating film pasted on the conductor from both sides of the alignment surface except at least one end side of the conductor;

a base material attached to one side of the array surface with an adhesive for the conductor at least on the one end side; and

a protective film having a microadhesive adhesive layer adhered to the surface of the substrate opposite to the conductor via the microadhesive adhesive layer,

The protective film has an outer shape larger than that of the base material, and its peripheral portion is arranged outside of the peripheral portion of the base material in plan view.

Utility Model Effect

According to the present invention, it is possible to reliably connect to a wiring board or the like to be connected, and to ensure a good conduction state.

Description of drawings

FIG. 1 is a plan view showing an embodiment of a wiring component according to the present invention.

Fig. 2 is a side sectional view of a wiring member.

Fig. 3 is a side sectional view of a connection portion of a wiring member.

Fig. 4 is an AA sectional view in Fig. 3 .

Fig. 5 is a plan view of the connection part of the wiring member viewed from the protective film side.

Fig. 6 is a plan view of a connection portion of a wiring member viewed from the release film side.

7 is a cross-sectional view of a connecting portion of a wiring member and a connecting portion of a wiring board viewed from the side in the longitudinal direction.

Fig. 8 is a cross-sectional view of the connection between the wiring member connection portion and the wiring board viewed from the longitudinal direction.

9 is a cross-sectional view of a connection between a connection portion of a wiring member and a wiring board viewed from the longitudinal direction.

Fig. 10 is a perspective view showing a method of manufacturing a wiring component.

Fig. 11 is a plan view showing a long flat cable in the middle of manufacturing the wiring member.

Fig. 12 is a plan view of a wiring component in the process of being manufactured.

Fig. 13 is a side sectional view of a wiring component in the process of being manufactured.

Fig. 14 is a side sectional view of a wiring component in the process of being manufactured by a different manufacturing method.

Fig. 15 is a side sectional view of a wiring component in the process of being manufactured by a different manufacturing method.

Explanation of labels

1: Wiring parts

2: flat-angle conductor

3a, 3b: insulating film

11: Connecting part

14: Strengthen the base material

14a: Reinforcing the peripheral portion of the base material

15: Conductive paste

16: Adhesive

17: Protective film

17a: Microadhesive adhesive

17b: bottom membrane

17c: Peripheral part of protective film

18: mark

19: Release film

21: Wiring board

22: Base material of wiring board

23: Contact of wiring board

Detailed ways

<Summary of embodiment of the present invention>

First, the outline|summary of embodiment of this invention is demonstrated.

One embodiment of the wiring component according to the present invention is as follows:

(1) Multiple conductors arranged in a planar shape;

an insulating film pasted on the conductor from both sides of the alignment surface except at least one end side of the conductor;

a base material attached to one side of the array surface with an adhesive for the conductor at least on the one end side; and

a protective film having a microadhesive adhesive layer adhered to the surface of the substrate opposite to the conductor via the microadhesive adhesive layer,

The protective film has an outer shape larger than that of the base material, and its peripheral portion is arranged outside of the peripheral portion of the base material in plan view.

According to the structure of (1), the base material is pasted on the conductor at the portion exposed from the insulating film, and the conductor at this portion can be overlapped with a wiring board or the like to be connected, and can be connected by a press machine. On the surface of the base material opposite to the conductor, a protective film having an outer shape larger than the base material and having a peripheral edge arranged outside the peripheral edge of the base material in plan view is attached. Therefore, even if the adhesive bonding the base material and the conductor overflows to the outside of the base material during pressing with a press machine, the adhesive can be prevented from adhering to the press machine by the protective film. Accordingly, the wiring member can be reliably connected to a wiring board or the like to be connected, and a good conduction state can be ensured.

(2) A release film without an adhesive layer is provided on the other side of the alignment surface at a position opposite to the base material and covering the conductor, and the release film passes through the micro An adhesive adhesive layer is attached to the protective film.

According to the structure of (2), it is possible to protect the conductor before being connected to the connection target. Since the release film does not have an adhesive layer and is attached to the protective film via a micro-adhesive layer, the release film can be easily peeled off at the time of connection work to a connection target. In addition, when the release film is peeled off, even if an adhesive, a conductive paste, or the like is applied to the conductor, it will not be peeled off.

(3) A mark indicating the position of the conductor is provided on the surface of the protective film opposite to the slightly adhesive adhesive layer.

According to the configuration of (3), by aligning the mark with the position of the contact to be connected, the conductor can be quickly and reliably positioned on the contact, and a good conduction state can be obtained.

<Detailed content of the embodiment of the present invention>

Hereinafter, examples of embodiments of the wiring member according to the present invention will be described with reference to the drawings. In addition, this invention is not limited to the structure of these illustrations, It is equivalent to a claim shown by a claim, and all changes within the range of a claim are included.

FIG. 1 is a plan view showing an embodiment of a wiring component. Fig. 2 is a side sectional view of a wiring member.

As shown in FIGS. 1 and 2 , wiring member 1 has a plurality of rectangular conductors (an example of conductors) 2 made of, for example, rolled copper foil of copper (including copper plating) or copper alloy. These rectangular conductors 2 are arranged in a planar shape at a predetermined pitch, and on both sides of the arrangement surface of the rectangular conductors 2, except for at least one end side of the rectangular conductor 2 (except for both ends in this example), paste them respectively. There are (laminated) insulating films 3a, 3b. The wiring member 1 has the form of a flat cable formed by arranging a plurality of rectangular conductors 2 on the same plane and laminating insulating films 3 a and 3 b on both sides of the arrangement surface. In addition, although the example which has four rectangular conductors 2 is shown in FIG. 1, the number of rectangular conductors 2 can be changed suitably. For example, the number of rectangular conductors 2 may be set to 20.

The insulating films 3a, 3b have a substrate portion made of a resin such as polyethylene terephthalate, polyester, polyimide, or polyphenylene sulfide, and a polyester-based adhesive or flame-retardant polyester. Adhesive layers made of vinyl chloride-based insulating adhesives, flame-retardant polyolefins, etc. The two insulating films 3a and 3b are attached to the rectangular conductor 2 so that the surfaces of the adhesive layers face each other. Electrical insulation between the rectangular conductors 2 is thereby achieved.

Fig. 3 is a side sectional view of a connection portion of a wiring member. Fig. 4 is an AA sectional view in Fig. 3 .

As shown in Fig. 3 and Fig. 4, the two ends of the lengthwise direction of wiring member 1 are as connecting portion 11, and this connecting portion 11 is the part that rectangular conductor 2 is not covered by insulating film 3a, 3b, and rectangular conductor 2 is in this portion. It is connected to the wiring board 21 etc. which are connection objects mentioned later.

In the connecting portion 11, the insulating films 3a, 3b are not pasted on the rectangular conductor 2, but the rectangular conductor 2 is exposed from the insulating films 3a, 3b. In the connecting portion 11 , a reinforcing base material (an example of a base material) 14 is pasted on one side of the arrangement surface, whereby the rectangular conductors 2 are arranged side by side on one side of the reinforcing base material 14 . The reinforcing base material 14 is formed of insulating resin such as polyethylene terephthalate (PET).

Adhesive 16 is applied to the surface of reinforcement base material 14 on the side where rectangular conductor 2 is disposed. As a result, the reinforcing base material 14 is bonded to the end portion of the insulating film 3 a on one side and the rectangular conductor 2 with the adhesive 16 . As the adhesive 16, for example, a polyester-based thermoplastic adhesive can be used.

The conductive paste 15 is applied to at least a part of each of the rectangular conductors 2 exposed at the end. The conductive paste 15 is composed of conductive particles and a binder. As the conductive particles, for example, silver powder, carbon powder, copper powder, nickel powder, or a mixed powder thereof can be used. As an adhesive constituting the conductive paste 15 , for example, any one of a polyester adhesive, a polyurethane adhesive, an epoxy adhesive, and the like can be used. In particular, as the conductive paste 15, a silver paste containing scaly silver powder with an average particle size of 0.5 to 5 μm and spherical silver powder with an average particle size of 20 nm or less coated with organic matter is preferably used. By containing nano-silver particles in the silver paste, the connection resistance is reduced, and the unevenness of the surface is reduced to increase the connection area. Therefore, the reliability of electrical connection is improved.

In addition, in the connection portion 11 , a protective film 17 is pasted on the surface of the reinforcement base material 14 opposite to the rectangular conductor 2 . The protective film 17 has, for example, a base film 17b made of resin such as polyethylene terephthalate (PET) and a slightly adhesive adhesive layer 17a. The protective film 17 is attached to the reinforcing base material 14 in a state of being easily peeled off by the slightly adhesive adhesive layer 17a.

Fig. 5 is a plan view of the connection part of the wiring member viewed from the protective film side.

As shown in FIG. 5 , this protective film 17 has an outer shape larger than that of the reinforcing base material 14 in plan view. The protective film 17 is attached to the reinforcing base material 14 so that the peripheral edge portion 17c thereof is disposed outside the peripheral edge portion 14a of the reinforcing base material 14 .

In addition, on the surface of the protective film 17 opposite to the slightly adhesive adhesive layer 17a (that is, the surface where the base film 17b is exposed), a mark 18 indicating the position of the rectangular conductor 2 is provided. The mark 18 is provided by applying coloring to the protective film 17 . In addition, as this positioning mark 18, it can also be provided by forming a notch. In addition, the shape of the mark 18 may be circular or linear. The mark 18 in this example is provided at the position which overlaps with each rectangular conductor 2 in planar view. The mark 18 does not have to be located at a position overlapping the rectangular conductor 2 as long as it has a shape and a position where the position of the rectangular conductor 2 can be identified.

As shown in Figures 3 and 4, in the connection part 11, on the other side of the arrangement surface, a release film 19 without an adhesive layer is provided at a position opposite to the reinforcing base material 14 and covering the rectangular conductor 2. . In addition, FIG. 6 is a plan view of the connection part of the wiring member seen from the release film side. The release film 19 is made of, for example, resin such as polyethylene terephthalate (PET), and has a size approximately equal to that of the protective film 17 . Part of the peripheral edge of the release film 19 is attached to the peripheral edge of the slightly adhesive adhesive layer 17 a of the protective film 17 . Thus, the exposed side of the rectangular conductor 2 in the reinforcement base material 14 is covered with the release film 19 held on the connection portion 11 .

(Connection between wiring part and connection object)

The connection portion 11 of the wiring member 1 configured as described above is connected to a wiring board or the like to be connected. This connection method will be described with reference to FIG. 7 and FIG. 8 . 7 is a cross-sectional view of a connection between a connection portion of a wiring member and a wiring board viewed from the side in the longitudinal direction. 8 is a cross-sectional view taken along line BB in FIG. 7 , and is a cross-sectional view of a state in which a connection portion of a wiring member is connected to a wiring board as viewed from the longitudinal direction.

The wiring substrate 21 to be connected has a substrate 22 and a contact 23 constituted by a conductive pattern provided on the base 22 . The width dimension and pitch of the contacts 23 are substantially the same as those of the rectangular conductors 2 of the flat cable 1 .

When connecting the connection portion 11 of the wiring member 1 to the wiring board 21 , first, the release film 19 is peeled off from the connection portion 11 . At this time, since the release film 19 is not coated with an adhesive, it can be easily peeled off from the connecting portion 11 . In addition, the conductive paste 15 coated on the rectangular conductor 2 does not peel off together with the release film 19 .

Then, as shown in FIG. 7 , the side opposite to the reinforcing base material 14 in the connecting portion 11 of the wiring member 1 is stacked toward the wiring board 21 placed on the lower punching surface 26 of the punching machine 25 . At this time, the base film 17b side of the protective film 17 faces upward. The mark 18 indicating the position of the rectangular conductor 2 is provided on the protective film 17. Therefore, using the mark 18 as a reference, the position of the rectangular conductor 2 of the connection part 11 is aligned with the position of the contact 23 of the wiring board 21, thereby, The flat-angle conductor 2 is reliably positioned on the contact 23 . In addition, when the connection portion 11 is disposed on the wiring board 21 as described above, the portion of the protective film 17 that protrudes from the periphery of the reinforcement base material 14 contacts the wiring board 21, and the slightly adhesive adhesive in this portion The layer 17a is bonded to the wiring board 21 with a relatively small adhesive force.

As shown in FIG. 8 , after the connection portion 11 is thus arranged at a predetermined position on the wiring board 21 , the upper punching surface 27 of the punching machine 25 is lowered, and the lower punching surface 26 and the upper punching surface 27 are clamped and formed. Heat while pressurizing the joint. In this way, the adhesive 16 of the reinforcing base 14 is melted and pressed against the base 22 of the wiring board 21 , and the gap between the base 22 of the wiring board 21 and the reinforcing base 14 is filled with the adhesive 16 . In addition, in this state, the conductive paste 15 coated on the rectangular conductor 2 is pressed against the contacts 23 of the wiring board 21 to closely adhere to them.

At this time, the molten adhesive 16 may overflow around the reinforcement base 14 , and the protective film 17 prevents the adhesive 16 from adhering to the upper press surface 27 . In addition, since the portion of the protective film 17 that protrudes from the periphery of the reinforcing base material 14 adheres to the wiring board 21, when pressing with the press machine 25, the position of the connecting portion 11 relative to the wiring board 21 is prevented from being misaligned. shift.

Thereafter, when the heat and pressure are released to harden the adhesive 16 , the reinforcing base material 14 of the connection portion 11 of the wiring member 1 is bonded to the wiring board 21 by the adhesive 16 . Thereafter, the protective film 17 is peeled off and removed from the wiring board 21 and the reinforcing base material 14 .

FIG. 9 shows the connection portion between the wiring member 1 and the wiring board 21 after the protective film 17 is removed. Since the protective film 17 is adhered to the wiring board 21 and the reinforcing base material 14 by the relatively small adhesive force of the slightly adhesive adhesive layer 17a, the protective film 17 can be easily peeled off. At the connecting portion between the wiring member 1 and the wiring substrate 21, the connecting portion 11 is overlapped with the wiring substrate 21 so that the rectangular conductor 2 and the contact 23 are electrically connected via the conductive paste 15, and the reinforcing base material 14 It is bonded with the substrate 22 by an adhesive 16 .

As a result, the connecting portion 11 of the wiring member 1 is heated and pressurized to be connected to the wiring board 21 , so that the rectangular conductor 2 coated with the conductive paste 15 and the contact 23 of the wiring board 21 are in a conductive state. Connect reliably.

(Method of Manufacturing Wiring Parts)

Next, a method of manufacturing the wiring component 1 having the above-mentioned structure will be described.

Fig. 10 is a perspective view showing a method of manufacturing a wiring component. Fig. 11 is a plan view showing a long flat cable in the middle of manufacturing the wiring member. Fig. 12 is a plan view of a wiring component in the process of being manufactured. Fig. 13 is a side sectional view of a wiring component in the process of being manufactured. Fig. 14 is a side sectional view of a wiring component in the process of being manufactured by a different manufacturing method. Fig. 15 is a side sectional view of a wiring component in the process of being manufactured by a different manufacturing method.

As shown in FIG. 10 , the rectangular conductors 2 are fed out from a plurality of reels 30 on which the long rectangular conductors 2 are wound, and are arranged on the same plane at a predetermined pitch. And, make the long insulating films 3a, 3b sent out from the reel 31 pass between the heating shafts 32, while the insulating films 3a, 3b are heated, and are pressed and pasted on the front and back surfaces of these rectangular conductors 2, Form long flat cables. This long flat cable is wound up on the winding roller 33 . A window portion 35 is formed in a part of the insulating films 3 a and 3 b in the longitudinal direction. The insulating films 3a and 3b are pasted so that the respective window portions 35 are aligned. The window portion 35 of the flat cable thus formed becomes the connection portion 11 .

Next, as shown in FIG. 11 , the long flat cable is cut at a position indicated by a dashed-dotted line C1 in order to remove the remainder of the insulating films 3 a and 3 b in the width direction (portions called ears). As a result, the portions where the insulating films 3 a and 3 b are connected in the longitudinal direction are removed at both ends in the width direction of the window portion 35 .

Further, the long flat cable is cut at the position shown by the dotted line C2 passing through the center of the window portion 35, and as shown in FIGS. Line Part 1.

In addition, it is also possible to manufacture a long flat cable without forming the window portion 35 in advance, remove the remaining parts in the width direction of the insulating films 3a, 3b of the long flat cable, and further cut it to form the wiring member 1 of a predetermined length, and then At both ends of the wiring member 1, portions near both ends of the insulating films 3a and 3b are removed.

In this case, as shown in FIG. 14, the insulating films 3a and 3b at the parts near both ends of the wiring member 1 are cut from the front and back with a cutter 37, and as shown in FIG. The insulating films 3a, 3b on the end side are pulled out and removed.

On one surface of the rectangular conductor 2 exposed at both ends of the wiring member 1 , a reinforcing base material 14 coated with an adhesive 16 is pasted. At this time, the reinforcing base material 14 is pasted on the end portion of the insulating film 3 a on one side and the rectangular conductor 2 . Conductive paste 15 is applied to at least a part of the exposed portion of rectangular conductor 2 by screen printing or transfer printing.

Thereafter, the protective film 17 is pasted on the surface of the reinforcing base 14 of the connecting portion 11 opposite to the rectangular conductor 2 so that the peripheral edge 17c thereof is positioned outside the peripheral edge 14a of the reinforcing base 14 . Furthermore, a release film 19 is attached to the protective film 17 on the opposite side of the connecting portion 11 to the protective film 17 so as to cover the exposed side of the rectangular conductor 2 in the reinforcing base material 14 .

As described above, according to the wiring component 1 according to the present embodiment, the connection portion 11 and the wiring board 21 are overlapped and pressed, and the reinforcing base material 14 and the wiring board 21 can be bonded together by the adhesive 16 . The material 22 is bonded, and the contact 23 of the rectangular conductor 2 and the wiring board 21 is conducted.

At this time, in the connecting portion 11, on the surface of the reinforcing base material 14 opposite to the rectangular conductor 2, a protective film 17 having a larger shape than the reinforcing base material 14 is pasted, and the peripheral portion 17c of the protective film 17 is stronger than that of the reinforcing base material 14. The peripheral portion 14a of the base material 14 is arranged on the outside. Therefore, even if the adhesive 16 protrudes outward from the peripheral portion 14a of the reinforcing base material 14 when the connection portion 11 is connected to the wiring board 21 by pressing the punch 25, the adhesive does not adhere to the punch. 25 on the upper side punching surface 27 and attached to the protective film 17 . Accordingly, it is possible to prevent the adhesive 16 from adhering to the upper press surface 27 .

Thereby, the problem that the connection portion 11 of the wiring member 1 is peeled off from the wiring board 21 due to the adhesive moving together with the upper pressing surface 27 when the upper pressing surface 27 of the pressing machine 25 is raised can be eliminated. , or insufficient adhesion between the connection portion 11 and the wiring board 21 , resulting in poor conduction. Accordingly, it is possible to securely connect the wiring component 1 to the wiring board 21 and ensure a good conduction state.

In addition, since the peripheral portion 17c of the protective film 17 is disposed outside the peripheral portion 14a of the reinforcing base material 14, when the connection portion 11 is disposed on the wiring board 21, the peripheral portion 17c of the protective film 17 is slightly adhered. The adhesive layer 17a is bonded to the wiring board 21 . As a result, when pressurized by the press machine 25, the connection portion 11 can be reliably arranged without deviating from the position with respect to the wiring board 21, and good conduction between the rectangular conductor 2 and the contact 23 of the wiring board 21 can be ensured. pass status.

In addition, since the mark 18 for positioning with respect to the wiring board 21 is provided on the protective film 17, by aligning the mark 18 with the position of the contact 23 of the wiring board 21, the contact 23 can be positioned quickly. The straight-angle conductor 2 can be positioned reliably, and a good conduction state can be obtained.

In addition, since the release film 19 is pasted on the opposite side of the protective film 17 in the connecting portion 11 , the rectangular conductor 2 side of the connecting portion 11 before being connected to the wiring board 21 can be protected. And, since the release film 19 does not have an adhesive layer, but is bonded and maintained with the slightly adhesive adhesive layer 17a of the protective film 17, when the release film 19 is peeled off, it is possible to prevent the There is a problem that the conductive paste 15 etc. applied on the surface is peeled off. In addition, it is not necessary to apply the conductive paste 15 on the rectangular conductor 2 . In this case, by covering the rectangular conductor 2 with the release film 19 , problems such as scratching the rectangular conductor 2 can be prevented.

Claims (3)

1. a distribution component, it has:

Many conductors, they are arranged in plane;

Dielectric film, it is except at least one side of described conductor, is pasted onto described conductor from two faces of arrangement plane;

Base material, it is for the described conductor of at least described end side, utilizes bonding agent to be pasted onto the side, a face of described arrangement plane; And

Diaphragm, it has micro-adhesiveness bond layer, by described micro-adhesiveness bond layer be pasted onto described base material with on the face of described conductor opposition side,

Described diaphragm has the profile larger than described base material, and when overlooking, its circumference is configured in outside compared with the circumference of described base material.

2. distribution component according to claim 1, wherein,

In another side, face of described arrangement plane, relative with described base material and cover the position of described conductor, be provided with the release film not having bond layer,

Described release film is pasted by described micro-adhesiveness bond layer and described diaphragm.

3. distribution component according to claim 1 and 2, wherein,

At described diaphragm with on the face of described micro-adhesiveness bond layer opposition side, be provided with the mark of the position representing described conductor.