CN204216786U - Many pins low clearance chip type power module - Google Patents

Abstract

The utility model discloses a kind of many pins low clearance chip type power module, comprise transformer, control power circuit board and shell.Power module adopts single-ended reverse exciting circuit topology, control circuit and power circuit Integrated design are on ceramic substrate, it is integrally welded that ceramic substrate and metal shell base plate pass through tin cream, one-body molded along being connect by parallel seam welding on cover plate of outer casing and metal shell, form a confined space, and at this confined space inert gas injecting, play antioxidation; Power module is 18 pins, is mounted in metal shell by the mode of glass insulation grain, and pin the inner is welded on the pin pad of ceramic substrate.The beneficial effects of the utility model are: power module internal power loop, shell, control circuit, transformer and inductor integrated formation Integrated design, its structure is simple, volume is little, reliability is high, cost is low, applied range.

Description

Multi-Pin Low Profile Chip Power Module

technical field

The utility model relates to a power supply module, in particular to a chip-type power supply module with multiple pins and low height.

Background technique

At present, power modules generally have poor reliability if they are small in size, and large volume if they want high reliability. However, power modules with small size and high reliability are required in very important domestic occasions.

Utility model content

The utility model is a multi-pin low-height chip power module designed to solve the above-mentioned technical problems.

The technical scheme that the utility model solves its technical problem adopts is:

A multi-pin low-profile chip-type power module includes a transformer, a control power circuit board, and a housing. The power module adopts a single-ended flyback circuit topology, and the control circuit and power circuit are integrated and designed on the ceramic substrate. The ceramic substrate and the bottom plate of the metal case are welded together by solder paste, and the cover plate of the case and the upper edge of the metal case are integrally formed by welding with parallel seams. Constitute a closed space, and inject inert gas into this closed space to play an anti-oxidation effect; the power module has 18 pins, which are embedded in the metal shell through glass insulating particles, and the inner ends of the pins are welded to the leads of the ceramic substrate. on the foot pad.

The multi-pin low-height chip power module has an input voltage covering DC9V-DC80V, a single output voltage covering DC3.3V-DC36V, a maximum output power of 15W, a maximum output current of 3A, and a maximum power density of 23.3W/ in ³ , the shell size is 47.9*22.4*10mm.

The multi-pin low-height chip power module of the utility model has the following characteristics:

1. The isolation withstand voltage between the input terminal and the output terminal is DC500V;

2. Integrated design of internal power circuit, casing, casing cover, control circuit and transformer;

3. Adopt natural heat dissipation method, no need for additional heat dissipation measures.

The beneficial effect of the multi-pin low-height chip power supply module of the utility model is that: the internal power circuit, casing, control circuit, transformer and inductor of the power supply module are integrated to form an integrated design, and the structure is simple, small in size, high in reliability and low in cost. ,Wide range of applications.

Description of drawings

Fig. 1 is a working principle diagram of the multi-pin low-height chip power module of the present invention.

Fig. 2 is a circuit diagram of the multi-pin low-height chip power module of the present invention.

Fig. 3 is a top structural view of the ceramic substrate of the multi-pin low-height chip power module of the present invention.

Fig. 4 is a cross-sectional structure diagram of a multi-pin low-height chip power module of the present invention.

Fig. 5 is a structural diagram of pin welding inside the multi-pin low-height chip power module of the present invention.

Fig. 6 is a diagram of the external dimensions of the multi-pin low-height chip power module of the present invention.

Detailed ways

Below in conjunction with accompanying drawing and embodiment the utility model is further described.

As shown in Figure 1 and Figure 2, the utility model is a new multi-pin low-height chip power module. When the main MOSFET switch is turned on, the power supply voltage is applied to the primary winding of the transformer, and the secondary winding induces Voltage, whose polarity "*" terminal is "positive", makes the diode D1 cut off, and the load current is provided by the filter capacitor C0. At this time, the secondary winding of the transformer is open, and only the primary winding works, which is equivalent to an inductor, so the primary current begins to rise linearly. During this process, the transformer core is magnetized and its flux increases linearly. When the MOSFET switch tube is turned off, the primary winding of the transformer is open, the induced potential of the secondary winding is reversed, and the "*" terminal is "negative", which makes the diode D1 conduct, and the energy stored in the transformer magnetic field is released through D1. On the one hand, it charges the capacitor C0, on the other hand, it supplies power to the load. At this time, only the secondary winding of the transformer works, which is equivalent to an inductor. The secondary winding current starts to decrease linearly. During this process, the transformer is demagnetized, and its magnetic flux also decreases linearly. A single-ended flyback circuit is adopted, which has a simple structure and high working reliability.

As shown in Fig. 3, Fig. 4, Fig. 5 and Fig. 6, the internal control circuit and power circuit of the power module of the utility model are integrated and designed on the ceramic substrate 4, and the ceramic substrate 4 and the metal shell 1 are integrally formed into an integrated body through solder paste welding 5 With modern design, the ceramic substrate 4 has the characteristics of high insulation and high thermal conductivity, and the heat lost by the power module can be almost completely conducted to the metal shell 1 to reach an ideal thermal balance state. The power module has 18 pins 8, which are inlaid into the housing by means of glass insulating particles 7. The inner ends of the pins 8 are welded on the pin pads 6 of the ceramic substrate, and the inside 3 of the power module is filled with inert gas to reach the Due to oxidation, the shell cover plate 2 and the metal shell 1 are integrally formed by parallel seam welding, which prevents the inert gas inside the power module 3 from leaking out and has good airtightness. The utility model realizes the integrated design of the internal power circuit, the metal casing 1, the casing cover plate 2, the control circuit, the transformer and the inductor.

By adopting the above-mentioned design scheme, the power supply module of the utility model realizes that the input voltage covers DC9V-DC80V, and the output voltage covers DC3.3V-DC36V (single output), and the volume is: 47.9*22.4*10 (unit: mm), the largest The output power is 15W, the maximum output current is 3A, and the maximum power density is 23.3W/in ³ .

The utility model is not limited to the above-mentioned best implementation mode, and any other products identical or similar to the utility model obtained by anyone under the enlightenment of the utility model all fall within the protection scope of the utility model.

Claims (2)

1. the low clearance of pin more than a chip type power module, comprises transformer, controls power circuit board and shell; It is characterized in that: power module adopts single-ended reverse exciting circuit topology, control circuit and power circuit Integrated design are on ceramic substrate, ceramic substrate (4) and metal shell (1) base plate by tin cream weld (5) integral, one-body molded along being connect by parallel seam welding on cover plate of outer casing (2) and metal shell, form a confined space (3), and at this confined space inert gas injecting, play antioxidation; Power module is 18 pins (8), is mounted in metal shell (1) by the mode of glass insulation grain (7), and pin the inner is welded on the pin pad (6) of ceramic substrate.

2. many pins low clearance chip type power module according to claim 1, it is characterized in that: input voltage covers DC9V-DC80V, single channel output voltage covers DC3.3V-DC36V, and peak power output is 15W, maximum output current is 3A, and maximum power density is 23.3W/in ³, shell sizes is 47.9*22.4*10mm.