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CN204179263U - Connector construction - Google Patents

Connector construction Download PDF

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Publication number
CN204179263U
CN204179263U CN201420648195.6U CN201420648195U CN204179263U CN 204179263 U CN204179263 U CN 204179263U CN 201420648195 U CN201420648195 U CN 201420648195U CN 204179263 U CN204179263 U CN 204179263U
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subplate
spacing
main substrate
contact site
terminal
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Chinese (zh)
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蔡旺昆
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P Two Electronic Technology Suzhou Co Ltd
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P Two Electronic Technology Suzhou Co Ltd
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Abstract

A kind of connector construction, be made up of insulating body, metal shell, shield group and conducting end subgroup, the wherein insulating body hyoplastron that there is base portion and extend forward, metal shell docks space around hyoplastron to be formed, shield group comprises main substrate, the first subplate and the second subplate, main substrate is arranged at hyoplastron, and the second subplate and the first subplate are that front and back are relatively arranged on base portion and are electrically connected at main substrate respectively and electrically conduct to be formed.Conducting end subgroup comprises multiple the first terminal and the second terminal, first contact site of the first terminal is arranged at the first surface of hyoplastron, its first connecting portion extend to base portion and and form the first spacing between the first subplate, second contact site of the second terminal is arranged at the second surface of hyoplastron, and its second connecting portion extends to base portion and and forms the second spacing between the second subplate.

Description

连接器结构connector structure

技术领域technical field

本实用新型涉及一种连接器结构,尤指一种可提升特性阻抗稳定性的连接器结构。The utility model relates to a connector structure, in particular to a connector structure which can improve the stability of characteristic impedance.

背景技术Background technique

近年来,随着科技的日新月异,现今多媒体、高速带宽的使用已日渐普及,多数电子装置间传输的数据量持续增加,如何在短暂的时间内传输大量电子数据,是现今信息科技发展的趋势。除了增加电子装置间传输电子讯号的通路外,目前一般采取的对应措施是提高电子装置间所传递的电子讯号频率。连接器是一种位于不同电子装置间的电子讯号沟通桥梁,随着传输量要求的提升,连接器亦渐渐面临高频讯号传递的挑战。In recent years, with the rapid development of science and technology, the use of multimedia and high-speed bandwidth has become more and more popular. The amount of data transmitted between most electronic devices continues to increase. How to transmit a large amount of electronic data in a short period of time is the trend of current information technology development. In addition to increasing the channels for transmitting electronic signals between electronic devices, the corresponding measure generally adopted at present is to increase the frequency of electronic signals transmitted between electronic devices. A connector is an electronic signal communication bridge between different electronic devices. With the increase in transmission capacity requirements, the connector is gradually facing the challenge of high-frequency signal transmission.

通用串行总线(简称USB)规格的连接器在日常生活使用中,可谓是最为广泛应用的传输界面之一,由于USB界面的方便易用、尺寸小且成本合理,因此在各个不同工作场域都随处可见USB的踪迹。不论是家庭的核心娱乐装置如电视、个人的笔记本电脑、智能手机、平板装置或是办公室的工作用计算机、打印机,乃至于汽车的多媒体通讯娱乐系统,时常都仰赖USB来进行数据传输的任务。The Universal Serial Bus (USB) specification connector is one of the most widely used transmission interfaces in daily life. Due to the convenience, small size and reasonable cost of the USB interface, it is widely used in various work fields. There are traces of USB everywhere. Whether it is the core entertainment device of the home such as TV, personal laptop, smart phone, tablet device or office computer, printer, or even the multimedia communication and entertainment system of the car, they often rely on USB for data transmission tasks.

为了使USB能够应用于更高速率的讯号传输,同时减少因USB插入方向或接线方向错误而发生无法传输的情况,全新的通用串行总线Type C便应运而生。USB国际制定标准协会(USB-IF)于日前宣布了这项名为USB Type C接口的标准规范,由于传输数据量的同步大量增加,在使用过程中可能产生相对应的电磁辐射,以致干扰其它电子组件的正常运作,有鉴于此,业界普遍都会以接地方式来降低电磁干扰(EMI)的产生。In order to enable USB to be applied to higher-speed signal transmission, and at the same time reduce the failure of transmission due to the wrong direction of USB insertion or wiring, the new Universal Serial Bus Type C came into being. The USB International Standards Association (USB-IF) recently announced this standard specification called the USB Type C interface. Due to the large increase in the amount of data transmitted simultaneously, corresponding electromagnetic radiation may be generated during use, which may interfere with other devices. For the normal operation of electronic components, in view of this, the industry generally uses grounding methods to reduce the generation of electromagnetic interference (EMI).

如图1所示,为一种采用USB Type C标准规范设计的连接器结构1,其包括有胶芯11、外壳12、上排端子13、下排端子14及接地片15,其中接地片15是位于上排端子13与下排端子14之间,此连接器结构1主要是利用接地片15来防止上排端子13与下排端子14之间产生交互干扰,藉以保护并维持连接器结构1的高频性能。上排端子13的上接脚131与下排端子14的下接脚141之间的相对位置及间距大小必需配合板端的布局设计,由于受到板端的电路布局(LAYOUT)设计的影响,上排端子13及下排端子14的后端与接地片15之间的后端间距L2通常会设计成明显大于其前端与接地片15之间的前端间距L1,如此才能配合上排端子13的上接脚131与下排端子14的下接脚141之间的相对位置及间距大小。然而,此种设计容易使得连接器结构1前后端的特性阻抗产生变化而造成不稳定,导致影响到高频讯号传输的效果,因此不能够符合客户讯号传递的要求。As shown in Figure 1, it is a connector structure 1 designed according to the USB Type C standard specification, which includes a rubber core 11, a shell 12, an upper row of terminals 13, a lower row of terminals 14 and a grounding piece 15, wherein the grounding piece 15 It is located between the upper row of terminals 13 and the lower row of terminals 14. This connector structure 1 mainly uses the grounding plate 15 to prevent mutual interference between the upper row of terminals 13 and the lower row of terminals 14, so as to protect and maintain the connector structure 1 high frequency performance. The relative position and spacing between the upper pins 131 of the upper row of terminals 13 and the lower pins 141 of the lower row of terminals 14 must match the layout design of the board end. Due to the influence of the circuit layout (LAYOUT) design of the board end, the upper row of terminals 13 and the rear distance L2 between the rear end of the lower row of terminals 14 and the grounding piece 15 is usually designed to be significantly larger than the front distance L1 between the front end and the grounding piece 15, so as to match the upper pins of the upper row of terminals 13 The relative position and distance between 131 and the lower pins 141 of the lower row of terminals 14 . However, this design easily causes the characteristic impedance of the front and rear ends of the connector structure 1 to change and cause instability, which affects the effect of high-frequency signal transmission, so it cannot meet the customer's signal transmission requirements.

发明内容Contents of the invention

悉知连接器的上下排端子受到板端电路布局设计的限制,使得上下排端子的后端与接地片之间的间距大于其前端与接地片之间的间距,因此上下排端子前后端与接地片之间的间距并不相同,导致连接器整体的特性阻抗产生变化而造成不稳定,如此容易产生高频讯号传输效果不佳的问题。It is known that the upper and lower rows of terminals of the connector are limited by the layout design of the board end, so that the distance between the rear end of the upper and lower rows of terminals and the grounding piece is greater than the distance between the front end and the grounding piece, so the front and rear ends of the upper and lower rows of terminals are connected to the grounding piece. The spacing between the chips is not the same, which causes the overall characteristic impedance of the connector to change and cause instability, so it is easy to cause the problem of poor high-frequency signal transmission.

本实用新型提供一种连接器结构,其包括有一绝缘本体、一金属外壳、一遮蔽板组及一导电端子组,其中绝缘本体具有一基部及自基部向前延伸的一舌板,该舌板具有上下相对设置的一第一表面与一第二表面。金属外壳包覆于绝缘本体外侧,金属外壳为围绕舌板以形成一对接空间,该对接空间具有一前侧开口。遮蔽板组设置于绝缘本体,遮蔽板组包括一主基板、一第一副板及一第二副板,主基板设置于舌板且位于第一表面与第二表面之间,第二副板与第一副板为各别分开独立设置于基部且呈前后相对设置,主基板、第一副板与第二副板之间形成电性导通。导电端子组设置于舌板上,其中导电端子组包括多个第一端子及多个第二端子,每个第一端子具有一第一接触部及连接第一接触部的一第一连接部,第一接触部设置于第一表面上,第一连接部延伸至基部且与第一副板之间形成一第一间距,第一副板为位于第一连接部与第二副板之间,每个第二端子具有一第二接触部及连接第二接触部的一第二连接部,第二接触部设置于第二表面上,第二连接部延伸至基部且与第二副板之间形成一第二间距,第二副板为位于第二连接部与第一副板之间。The utility model provides a connector structure, which includes an insulating body, a metal shell, a shielding plate group and a conductive terminal group, wherein the insulating body has a base and a tongue extending forward from the base, the tongue It has a first surface and a second surface opposite to each other up and down. The metal shell covers the outer side of the insulating body, and the metal shell surrounds the tongue plate to form a docking space, and the docking space has a front opening. The shielding plate group is arranged on the insulating body, and the shielding plate group includes a main substrate, a first sub-board and a second sub-board, the main substrate is arranged on the tongue plate and is located between the first surface and the second surface, and the second sub-board The main substrate, the first sub-board and the second sub-board are electrically connected to each other separately from the first sub-board and independently arranged on the base and opposite to each other. The conductive terminal group is arranged on the tongue plate, wherein the conductive terminal group includes a plurality of first terminals and a plurality of second terminals, each first terminal has a first contact portion and a first connection portion connected to the first contact portion, The first contact portion is disposed on the first surface, the first connection portion extends to the base and forms a first distance from the first sub-plate, the first sub-plate is located between the first connection portion and the second sub-plate, Each second terminal has a second contact portion and a second connection portion connected to the second contact portion, the second contact portion is disposed on the second surface, and the second connection portion extends to the base and between the second sub-board A second distance is formed, and the second sub-board is located between the second connecting portion and the first sub-board.

本实用新型所提供连接器结构,利用设置一遮蔽板组,此遮蔽板组包括有分开独立设置的第一副板及第二副板,可藉由分别控制第一副板及第二副板与上下排端子之间的相对位置,使得上下排端子的后端与遮蔽板组之间的间距大约等于其前端与遮蔽板组之间的间距,因此可以控制连接器整体的特性阻抗变化较小,使其在进行高频讯号传输时能有稳定的特性阻抗表现,如此即可解决悉知技术所容易产生的高频讯号传输效果不佳的问题。The connector structure provided by the utility model utilizes a shielding plate group, which includes a first sub-board and a second sub-board that are separately and independently arranged, and can control the first sub-board and the second sub-board respectively The relative position between the upper and lower rows of terminals makes the distance between the rear end of the upper and lower rows of terminals and the shielding plate group approximately equal to the distance between the front end and the shielding plate group, so that the overall characteristic impedance of the connector can be controlled to be small , so that it can have a stable characteristic impedance performance during high-frequency signal transmission, so that it can solve the problem of poor high-frequency signal transmission effect that is easily produced by the known technology.

附图说明Description of drawings

图1为悉知连接器结构的剖面示意图。FIG. 1 is a schematic cross-sectional view of a known connector structure.

图2为本实用新型的连接器结构的立体示意图。FIG. 2 is a three-dimensional schematic view of the connector structure of the present invention.

图3为图2的连接器结构的分解示意图。FIG. 3 is an exploded schematic diagram of the connector structure in FIG. 2 .

图4为图2的连接器结构的剖面示意图。FIG. 4 is a schematic cross-sectional view of the connector structure in FIG. 2 .

图5为图2的连接器结构中的遮蔽板组与导电端子组的侧面示意图。FIG. 5 is a schematic side view of the shielding plate set and the conductive terminal set in the connector structure of FIG. 2 .

组件标号说明:Component label description:

1                           连接器结构1 connector structure

11                          胶芯11 Rubber core

12                          外壳12 Shell

13                          上排端子13 Upper row of terminals

131                         上接脚131 Upper pin

14                          下排端子14 Lower row of terminals

141                         下接脚141 Bottom pin

15                          接地片15 ground lug

2                           连接器结构2 connector structure

3                           绝缘本体3 Insulation body

31                          基部31 Base

311                         收容槽311 Storage Tank

32                          舌板32 Tongue plate

321                         第一表面321 First surface

322                        第二表面322 Second surface

33                         固定块33 Fixed block

34                         保护块34 Protection block

4                          金属外壳4 Metal Case

41                         对接空间41 docking space

42                         前侧开口42 Front side opening

43                         焊接部43 Welding Department

5                          遮蔽板组5 Shielding plate group

50                         主基板50 Main PCB

501                        前段部501 front section

502                        后段部502 Posterior section

503                        开口503 opening

51                         第一副板51 The first board

52                         第二副板52 Second board

6                          导电端子组6 Conductive terminal set

61                         第一端子61 first terminal

611                        第一接触部611 The first contact part

612                        第一连接部612 The first connecting part

613                        第一接脚613 The first pin

62                         第二端子62 Second terminal

621                        第二接触部621 Second contact part

622                        第二连接部622 Second connecting part

623                        第二接脚623 Second pin

7                          辅助壳体7 Auxiliary housing

71                          焊接脚71 Welding feet

81                          上金属片81 Upper metal sheet

811                         弹片811 Shrapnel

82                          下金属片82 Lower metal sheet

821                         接地部821 Grounding part

L1                          前端间距L1 front-end spacing

L2                          后端间距L2 Back-end spacing

P1                          第一间距P1 first pitch

P2                          第二间距P2 Second Pitch

P3                          第三间距P3 Third distance

R1                          间距R1 spacing

R2                          间距R2 spacing

D                           间距D Spacing

具体实施方式Detailed ways

请参阅图2至图5,本实用新型为提供一种连接器结构,此连接器结构2包括有一绝缘本体3、一金属外壳4、一遮蔽板组5及一导电端子组6,此连接器结构2是以焊接方式固定于电路板(未绘示)上。Please refer to Figure 2 to Figure 5, the utility model provides a connector structure, the connector structure 2 includes an insulating body 3, a metal shell 4, a shielding plate group 5 and a conductive terminal group 6, the connector The structure 2 is fixed on the circuit board (not shown) by welding.

绝缘本体3具有一基部31及自基部31向前延伸的一舌板32,该舌板32具有上下相对设置的一第一表面321与一第二表面322。在本实施例中,为了容易方便于此连接器结构2的组装与制造,其于绝缘本体3的基部31后侧设有一收容槽311,部份遮蔽板组5为事先设置于一固定块33上,之后再将此固定块33组装固定于基部31的收容槽311内,如此以达到便于组装与制造此连接器结构2的目的。此外,还可组装一保护块34于收容槽311中,此保护块34是用于遮盖与保护固定块33及导电端子组6。The insulating body 3 has a base 31 and a tongue 32 extending forward from the base 31 . The tongue 32 has a first surface 321 and a second surface 322 opposite to each other up and down. In this embodiment, in order to facilitate the assembly and manufacture of the connector structure 2, a receiving groove 311 is provided on the rear side of the base 31 of the insulating body 3, and part of the shielding plate group 5 is pre-set on a fixing block 33. Afterwards, the fixing block 33 is assembled and fixed in the receiving groove 311 of the base 31 , so as to facilitate the assembly and manufacture of the connector structure 2 . In addition, a protection block 34 can also be assembled in the receiving groove 311 , and the protection block 34 is used to cover and protect the fixing block 33 and the conductive terminal set 6 .

金属外壳4包覆于绝缘本体3外侧,其中金属外壳4为围绕舌板32以形成一大致呈环形的对接空间41,该对接空间41具有一前侧开口42,此前侧开口42用于与对接连接器(未绘示)互相插接。在本实施例中,此金属外壳4的两侧各设有一焊接部43,为了符合电路板上的布局设计,还可另外组装一辅助壳体7于金属外壳4上,此辅助壳体7的两侧各设有一焊接脚71,加上原先金属外壳4的焊接部43,如此就可以符合电路板上的布局设计。The metal shell 4 covers the outer side of the insulating body 3, wherein the metal shell 4 surrounds the tongue plate 32 to form a substantially annular docking space 41, and the docking space 41 has a front opening 42 for docking with The connectors (not shown) are plugged into each other. In this embodiment, a welding portion 43 is provided on both sides of the metal shell 4. In order to conform to the layout design on the circuit board, an auxiliary shell 7 can be assembled on the metal shell 4. The auxiliary shell 7 A welding foot 71 is provided on each side, plus the original welding portion 43 of the metal shell 4, so that it can conform to the layout design on the circuit board.

为了符合USB标准的接地设计需求,因此连接器结构2增设有一上金属片81以及一下金属片82,此上金属片81与下金属片82分别组装设置于绝缘本体3的基部31上侧及下侧并且朝着舌板32的方向延伸,此上金属片81与下金属片82被金属外壳4所包覆,其中上金属片81上设有弹片811可与金属外壳4接触形成接地导通,下金属片82设有接地部821可与电路板上的接地布局搭接形成接地导通。In order to meet the grounding design requirements of the USB standard, the connector structure 2 is additionally provided with an upper metal sheet 81 and a lower metal sheet 82. The upper metal sheet 81 and the lower metal sheet 82 are respectively assembled on the upper side and the lower side of the base 31 of the insulating body 3. side and extends toward the tongue plate 32, the upper metal sheet 81 and the lower metal sheet 82 are covered by the metal shell 4, wherein the upper metal sheet 81 is provided with a shrapnel 811 that can contact the metal shell 4 to form a ground connection, The lower metal sheet 82 is provided with a ground portion 821 which can be overlapped with the ground layout on the circuit board to form a ground connection.

遮蔽板组5设置于绝缘本体3,遮蔽板组5包括一主基板50、一第一副板51及一第二副板52,主基板50设置于舌板32且位于第一表面321与第二表面322之间,第二副板52与第一副板51为各别分开独立设置于基部31且呈前后相对设置,主基板50、第一副板51与第二副板52之间形成电性导通。在本实施例中,为了容易便于组装与制造此连接器结构2,主基板50可分拆成一前段部501及一后段部502,其中前段部501先利用嵌入式成型(insert molding)设置于第一表面321与第二表面322之间,后段部502延伸至基部31,后段部502的后端设有第一副板51,且后段部502与第一副板51为金属冲压一体成形的结构。大致呈L形结构的后段部502与第一副板51为先组装于固定块33上,接着将第二副板52组装于固定块33上并使第二副板52接触于后段部502以形成电性导通,之后再将此固定块33组装于基部31的收容槽311内,此时后段部502接触于前段部501以形成电性导通,如此制程有利于方便组装与制造此连接器结构2。The shielding plate group 5 is disposed on the insulating body 3, the shielding plate group 5 includes a main substrate 50, a first sub-board 51 and a second sub-board 52, the main substrate 50 is arranged on the tongue plate 32 and is located between the first surface 321 and the second sub-board. Between the two surfaces 322, the second sub-board 52 and the first sub-board 51 are separately and independently arranged on the base 31 and are arranged opposite to each other front and rear. Electrical conduction. In this embodiment, in order to facilitate the assembly and manufacture of the connector structure 2, the main substrate 50 can be split into a front section 501 and a rear section 502, wherein the front section 501 is first installed on the front section 501 by insert molding. Between the first surface 321 and the second surface 322, the rear section 502 extends to the base 31, the rear end of the rear section 502 is provided with a first sub-plate 51, and the rear section 502 and the first sub-plate 51 are metal stamping One-piece structure. The rear section 502 and the first sub-plate 51 of approximately L-shaped structure are first assembled on the fixed block 33, and then the second sub-plate 52 is assembled on the fixed block 33 and the second sub-plate 52 is in contact with the rear section. 502 to form electrical conduction, and then assemble the fixing block 33 in the receiving groove 311 of the base 31. At this time, the rear section 502 is in contact with the front section 501 to form electrical conduction. This process is conducive to the convenience of assembly and Make this connector structure 2.

值得一提的是,在本实施例中,主基板50的前段部501及后段部502为分拆成二个独立组件,然不限于此,另一种选择是,主基板50的前段部501及后段部502也可以是一体成形的结构,但是此时连接器结构2的组装与制造的方式也要配合此主基板50的设计而跟着变更,同样地在主基板50的后端设有第一副板51,主基板50与第一副板51为一体成形,第二副板52通过接触于主基板50的方式电性导通于第一副板51。然不限于此,又一种选择是,主基板50、第一副板51与第二副板52可为三个各别分开独立的组件,主基板50透过同时接触于第一副板51与第二副板52而形成电性导通,也就是本实用新型并不限制主基板50、第一副板51与第二副板52彼此之间的连接关系,只要三者之间有形成电性导通即可。此外,于遮蔽板5的前段部501上设有多个开口503,该些开口503对应于上金属片81与下金属片82设置,如此可得到较佳的特性阻抗效果,以符合客户讯号传递的要求。It is worth mentioning that, in this embodiment, the front section 501 and the rear section 502 of the main substrate 50 are split into two independent components, but it is not limited thereto. Another option is that the front section of the main substrate 50 501 and the rear part 502 can also be an integrally formed structure, but at this time, the way of assembling and manufacturing the connector structure 2 should also be changed in accordance with the design of the main substrate 50, and the rear end of the main substrate 50 is also provided There is a first sub-board 51 , the main substrate 50 is integrally formed with the first sub-board 51 , and the second sub-board 52 is electrically connected to the first sub-board 51 by contacting the main substrate 50 . However, it is not limited to this, and another option is that the main substrate 50, the first sub-board 51 and the second sub-board 52 can be three separate and independent components, and the main substrate 50 is in contact with the first sub-board 51 at the same time. Form electrical conduction with the second sub-board 52, that is, the utility model does not limit the connection relationship between the main substrate 50, the first sub-board 51 and the second sub-board 52, as long as there is a connection between the three. Electrical conduction is sufficient. In addition, a plurality of openings 503 are provided on the front portion 501 of the shielding plate 5, and these openings 503 are arranged corresponding to the upper metal sheet 81 and the lower metal sheet 82, so that a better characteristic impedance effect can be obtained to meet customer signal transmission requirements.

导电端子组6设置于舌板32上,其中导电端子组6包括多个第一端子61及多个第二端子62,该些第一端子61设置于第一表面321上且向后延伸至基部31,该些第二端子62设置于第二表面322上且向后延伸至基部31,每个第一端子61具有一第一接触部611、一第一接脚613及连接第一接触部611与第一接脚613的一第一连接部612,第一接触部611设置于第一表面321上,第一连接部612相对于第一接触部611向下延伸至基部31且与第一副板51之间形成一第一间距P1,第一副板51位于第一连接部612与第二副板52之间,第一接脚613朝着绝缘本体3后侧的方向向后延伸,每个第二端子62具有一第二接触部621、一第二接脚623及连接第二接触部621与第二接脚623的一第二连接部622,第二接触部621设置于第二表面322上,第二连接部622相对于第二接触部621向下延伸至基部31且与第二副板52之间形成一第二间距P2,第二副板52位于第二连接部622与第一副板51之间,第二接脚623朝着绝缘本体3前侧的方向向前延伸。The conductive terminal group 6 is disposed on the tongue plate 32, wherein the conductive terminal group 6 includes a plurality of first terminals 61 and a plurality of second terminals 62, and the first terminals 61 are disposed on the first surface 321 and extend backward to the base 31, the second terminals 62 are arranged on the second surface 322 and extend backward to the base 31, each first terminal 61 has a first contact portion 611, a first pin 613 and connects to the first contact portion 611 A first connection portion 612 with the first pin 613, the first contact portion 611 is disposed on the first surface 321, the first connection portion 612 extends downward to the base portion 31 relative to the first contact portion 611 and is connected to the first secondary A first distance P1 is formed between the boards 51 , the first sub-board 51 is located between the first connecting portion 612 and the second sub-board 52 , and the first pins 613 extend backward toward the rear side of the insulating body 3 . A second terminal 62 has a second contact portion 621, a second pin 623 and a second connection portion 622 connecting the second contact portion 621 and the second pin 623, the second contact portion 621 is disposed on the second surface 322 , the second connecting portion 622 extends down to the base 31 relative to the second contact portion 621 and forms a second distance P2 from the second sub-plate 52 , the second sub-plate 52 is located between the second connecting portion 622 and the first Between one sub-board 51 , the second pin 623 extends forward toward the front side of the insulating housing 3 .

在本实施例中,主基板50的前段部502位于第一接触部611与第二接触部之间621,且第一接触部611距离主基板50的间距R1实质等于第一连接部612距离第一副板51的第一间距P1,第二接触部621距离主基板50的间距R2实质等于第二连接部622距离第二副板52的第二间距P2,而且第一间距P1与第二间距P2为实质相等。如此设计可以有效控制第一副板51及第二副板52分别与第一端子61及第二端子62之间的相对位置,使得第一端子61及第二端子62的后端与遮蔽板组5之间的间距大约等于其前端与遮蔽板组5之间的间距,因此可以控制连接器结构2整体的特性阻抗变化较小,使其在进行高频讯号传输时能有稳定的特性阻抗表现,如此即可解决悉知技术所容易产生的高频讯号传输效果不佳的问题。In this embodiment, the front portion 502 of the main substrate 50 is located between the first contact portion 611 and the second contact portion 621, and the distance R1 between the first contact portion 611 and the main substrate 50 is substantially equal to the distance R1 between the first connecting portion 612 and the second contact portion. The first pitch P1 of a sub-board 51 , the pitch R2 of the second contact portion 621 from the main substrate 50 is substantially equal to the second pitch P2 of the second connecting portion 622 from the second sub-plate 52 , and the first pitch P1 and the second pitch P2 is substantially equal. This design can effectively control the relative positions between the first sub-board 51 and the second sub-board 52 and the first terminal 61 and the second terminal 62 respectively, so that the rear ends of the first terminal 61 and the second terminal 62 are in contact with the shielding plate group The distance between 5 is approximately equal to the distance between the front end and the shielding plate group 5, so the change in the overall characteristic impedance of the connector structure 2 can be controlled to be small, so that it can have a stable characteristic impedance performance during high-frequency signal transmission , so as to solve the problem of poor high-frequency signal transmission effect that is easily produced by known technology.

值得一提的是,在本实施例中,第一副板51距离第二副板52的间距D大于第一间距P1。同样地,第一副板51距离第二副板52的间距D大于第二间距P2。由此可知,就算是板端的电路布局设计的间距距离很大,本实用新型利用第一副板51与第二副板52独立分隔的设计也可以很轻松地达到控制其与第一端子61及第二端子62之间间距大小的目的,因此就能够有效调控连接器结构2整体的特性阻抗,使其能有稳定的特性阻抗表现,如此以利于高频讯号传输。It is worth mentioning that, in this embodiment, the distance D between the first sub-board 51 and the second sub-board 52 is greater than the first distance P1. Likewise, the distance D between the first sub-board 51 and the second sub-board 52 is greater than the second distance P2. It can be seen that even if the distance between the circuit layout design of the board end is very large, the utility model can easily achieve the control of its connection with the first terminal 61 and the second sub-board 52 by utilizing the design of independent separation of the first sub-board 51 and the second sub-board 52. The purpose of the spacing between the second terminals 62 is to effectively control the overall characteristic impedance of the connector structure 2 so that it can have a stable characteristic impedance performance, which is beneficial to high-frequency signal transmission.

在本实施例中,第一副板51与第二副板52为平行设置且垂直向下延伸,第一连接部612及第二连接部622分别沿着第一副板51与第二副板52的外侧平行设置且垂直向下延伸。第二接脚623与第一接脚613凸出于绝缘本体3外且分别朝着前后相反方向横向延伸,其中第一接脚613与第二接脚623之间形成一第三间距P3,该第三间距P3为大于第一副板51距离第二副板52的间距D,在本实施例中,此第三间距P3的大小设计成等于第一副板51距离第二副板52的间距D再加上第一副板51与第二副板52的厚度大小,因此,可以理解的是,随着第一接脚613与第二接脚623之间的第三间距P3的距离加大,在第一间距P1与第二间距P2的距离大小不变的情况下,第一副板51与第二副板52之间的间距D就要跟着增加。In this embodiment, the first sub-board 51 and the second sub-board 52 are arranged in parallel and extend vertically downward, and the first connecting portion 612 and the second connecting portion 622 are respectively along the The outer sides of 52 are arranged in parallel and extend vertically downward. The second leg 623 and the first leg 613 protrude out of the insulating body 3 and extend laterally toward the front and rear opposite directions respectively, wherein a third distance P3 is formed between the first leg 613 and the second leg 623 , and the distance P3 is formed between the first leg 613 and the second leg 623 . The third distance P3 is greater than the distance D between the first sub-board 51 and the second sub-board 52 , in this embodiment, the size of the third distance P3 is designed to be equal to the distance between the first sub-board 51 and the second sub-board 52 D plus the thickness of the first sub-board 51 and the second sub-board 52, therefore, it can be understood that as the third distance P3 between the first pin 613 and the second pin 623 increases In the case that the distance between the first pitch P1 and the second pitch P2 is constant, the distance D between the first sub-plate 51 and the second sub-plate 52 will increase accordingly.

综上所述,本新型的连接器结构利用分别在第一端子与第二端子的后端两侧等距设置第一副板与第二副板,使得第一端子及第二端子由头至尾与遮蔽板组之间的间距维持于一变化较小的相对距离范围内,因此可以控制电连接器整体的特性阻抗变化较小,能有稳定的特性阻抗表现,故可达到有利于高频讯号传输的目的,如此即可解决悉知技术所容易产生的高频讯号传输效果不佳的问题。To sum up, the connector structure of the present invention utilizes that the first sub-board and the second sub-board are equidistantly arranged on both sides of the rear end of the first terminal and the second terminal, so that the first terminal and the second terminal The distance between the shielding plate group and the shielding plate group is maintained within a relatively small range of distance, so the overall characteristic impedance of the electrical connector can be controlled to be small, and it can have a stable characteristic impedance performance, so it can be beneficial to high-frequency signals The purpose of transmission, so that it can solve the problem of poor high-frequency signal transmission that is easy to occur in known technology.

Claims (10)

1. a connector construction, comprising:
One insulating body, its hyoplastron that there is a base portion and extend forward from this base portion, this hyoplastron has the first surface and a second surface that are oppositely arranged up and down;
One metal shell, is coated on outside this insulating body, and this metal shell is around this hyoplastron to form a docking space, and this docking space has a front openings;
One shield group, be arranged at this insulating body, this shield group comprises a main substrate, one first subplate and one second subplate, this main substrate is arranged at this hyoplastron and between this first surface and this second surface, this second subplate and this first subplate are independently arranged at this base portion for distinctly separate and are that front and back are oppositely arranged, and this main substrate, formed electrically conduct between this first subplate and this second subplate; And
One conducting end subgroup, be arranged on this hyoplastron, wherein this conducting end subgroup comprises multiple the first terminal and multiple second terminal, this the first terminal each has one first contact site and connects one first connecting portion of this first contact site, this first contact site is arranged on this first surface, this first connecting portion extend to this base portion and and form one first spacing between this first subplate, this first subplate is between this first connecting portion and this second subplate, this second terminal each has one second contact site and connects one second connecting portion of this second contact site, this second contact site is arranged on this second surface, this second connecting portion extend to this base portion and and form one second spacing between this second subplate, this second subplate is between this second connecting portion and this first subplate.
2. connector construction as claimed in claim 1, it is characterized by, this first spacing is that essence is equal with this second spacing.
3. connector construction as claimed in claim 2, it is characterized by, this first contact site equals this first connecting portion this first spacing apart from this first subplate apart from the spacing essence of this main substrate, and this second contact site equals this second connecting portion this second spacing apart from this second subplate apart from the spacing essence of this main substrate.
4. connector construction as claimed in claim 2, it is characterized by, this first subplate is greater than this first spacing apart from the spacing of this second subplate.
5. connector construction as claimed in claim 3, it is characterized by, this first subplate is greater than this second spacing apart from the spacing of this second subplate.
6. connector construction as claimed in claim 3, it is characterized by, this the first terminal each has one first pin, this second terminal each has one second pin, this first pin and this second pin protrude from outside this insulating body, form one the 3rd spacing between this first pin and this second pin, the 3rd spacing is greater than the spacing of this first subplate apart from this second subplate.
7. connector construction as claimed in claim 3, it is characterized by, this first subplate and this second subplate are for be arrangeding in parallel and extending vertically downward, and this first connecting portion and this second connecting portion arrange along the external side parallel of this first subplate and this second subplate and extend vertically downward respectively.
8. connector construction as claimed in claim 3, it is characterized by, this structure more comprises:
One fixed block, be arranged on this base portion, wherein this base portion is provided with an accepting groove, and this fixed block is assembled in this accepting groove, and this first subplate and this second subplate are arranged on this fixed block; And
One protection block, be assembled in this accepting groove, wherein this protection block hides this fixed block.
9. the connector construction according to any one of claim 1 to 8, is characterized by, and the rear end of this main substrate is provided with this first subplate, and this main substrate and this first subplate are one of the forming, and this second subplate is contacted with this main substrate to electrically conduct in this first subplate.
10. connector construction as claimed in claim 9, it is characterized by, this main substrate comprises a leading portion portion and a back segment portion, this leading portion portion is positioned between this first contact site and this second contact site, this back segment portion extends to this base portion, the rear end in this back segment portion is provided with this first subplate and is one of the forming with this first subplate, and this second subplate is contacted with this back segment portion and electrically conducts to be formed, and this back segment portion is contacted with this leading portion portion and electrically conducts to be formed.
CN201420648195.6U 2014-11-03 2014-11-03 Connector construction Expired - Lifetime CN204179263U (en)

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Application Number Priority Date Filing Date Title
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