CN204170914U - Piezo-activator, piezoelectric vibrating device and portable terminal - Google Patents
Piezo-activator, piezoelectric vibrating device and portable terminal Download PDFInfo
- Publication number
- CN204170914U CN204170914U CN201290001193.7U CN201290001193U CN204170914U CN 204170914 U CN204170914 U CN 204170914U CN 201290001193 U CN201290001193 U CN 201290001193U CN 204170914 U CN204170914 U CN 204170914U
- Authority
- CN
- China
- Prior art keywords
- piezoelectric
- piezoelectric actuator
- piezoelectric element
- main surface
- flexible wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000012190 activator Substances 0.000 title abstract 3
- 239000000853 adhesive Substances 0.000 claims abstract description 53
- 230000001070 adhesive effect Effects 0.000 claims abstract description 53
- 239000002245 particle Substances 0.000 claims abstract description 37
- 239000004020 conductor Substances 0.000 claims abstract description 23
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims description 28
- 238000005304 joining Methods 0.000 claims description 18
- 230000002093 peripheral effect Effects 0.000 claims description 17
- 238000010030 laminating Methods 0.000 claims description 4
- 210000004728 ear cartilage Anatomy 0.000 claims description 2
- 230000007774 longterm Effects 0.000 abstract 2
- 239000000919 ceramic Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 7
- 230000002159 abnormal effect Effects 0.000 description 6
- 238000005452 bending Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 4
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004014 plasticizer Substances 0.000 description 4
- 238000010008 shearing Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 3
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 3
- 239000004745 nonwoven fabric Substances 0.000 description 3
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- 210000000845 cartilage Anatomy 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
- H04R7/045—Plane diaphragms using the distributed mode principle, i.e. whereby the acoustic radiation is emanated from uniformly distributed free bending wave vibration induced in a stiff panel and not from pistonic motion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0611—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements in a pile
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/093—Forming inorganic materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N35/00—Magnetostrictive devices
- H10N35/01—Manufacture or treatment
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
Abstract
Description
技术领域technical field
本实用新型涉及适于压电振动装置、便携式终端的压电致动器、压电振动装置以及便携式终端。The utility model relates to a piezoelectric actuator suitable for a piezoelectric vibration device, a portable terminal, a piezoelectric vibration device and a portable terminal.
背景技术Background technique
作为压电致动器,已知如图8所示,使用了在将内部电极101与压电体层102层叠多个而成的层叠体103的表面形成表面电极104而得到的双压电晶片型的压电元件10的压电致动器(参照专利文献1)、用导电性接合构件106将柔性布线基板105接合在压电元件10的主面,使压电元件10的表面电极104与柔性布线基板105的布线导体107电连接的技术(参照专利文献2)。As a piezoelectric actuator, as shown in FIG. 8 , a bimorph obtained by forming a surface electrode 104 on the surface of a laminate 103 formed by laminating a plurality of internal electrodes 101 and piezoelectric layers 102 is known. type piezoelectric actuator 10 (see Patent Document 1), the flexible wiring substrate 105 is bonded to the main surface of the piezoelectric element 10 with a conductive bonding member 106, and the surface electrode 104 of the piezoelectric element 10 is connected to the A technique for electrically connecting the wiring conductors 107 of the flexible wiring substrate 105 (see Patent Document 2).
而且,还已知将双压电晶片型的压电元件的长度方向的中央部或一端固定于振动板的压电振动装置(参照专利文献3、4)。In addition, there are also known piezoelectric vibration devices in which the central portion or one end in the longitudinal direction of a bimorph piezoelectric element is fixed to a vibration plate (see Patent Documents 3 and 4).
在先技术文献prior art literature
专利文献patent documents
专利文献1:JP特开2002-10393号公报Patent Document 1: JP Unexamined Publication No. 2002-10393
专利文献2:JP特开平6-14396号公报Patent Document 2: JP Unexamined Patent Publication No. 6-14396
专利文献3:国际公开第2005/004535号Patent Document 3: International Publication No. 2005/004535
专利文献4:JP特开2006-238072号公报Patent Document 4: JP Unexamined Publication No. 2006-238072
实用新型内容Utility model content
实用新型要解决的课题Problems to be solved by utility models
在此,作为将柔性布线基板105与压电元件10接合的导电性接合构件106,使用了焊料或导电性粘接剂。Here, solder or a conductive adhesive is used as the conductive joining member 106 that joins the flexible wiring board 105 and the piezoelectric element 10 .
但是,在作为导电性接合构件106而使用焊料进行了接合的情况下,因为焊料的刚性高,由于发生因在柔性布线基板105处发生的来自外部的振动、柔性布线基板105自身的共振而引起的不跟随压电致动器的振动的异常的柔性布线基板105的振动,在压电元件10与柔性布线基板105的接合部的端面附近发生剪切、弯曲等的应力集中,有可能让柔性布线基板105从压电元件10剥离。However, in the case where solder is used as the conductive bonding member 106 for bonding, since the rigidity of the solder is high, vibrations from the outside that occur at the flexible wiring substrate 105 and resonance of the flexible wiring substrate 105 itself occur. Due to the abnormal vibration of the flexible wiring substrate 105 that does not follow the vibration of the piezoelectric actuator, stress concentration such as shearing and bending occurs near the end surface of the junction of the piezoelectric element 10 and the flexible wiring substrate 105, which may make the flexible wiring substrate 105 The wiring board 105 is peeled off from the piezoelectric element 10 .
此外,在仅用导电性粘接剂进行了接合的情况下,在流过大电流来高速驱动压电元件10的情况下,因为导电性粘接剂的电阻值以及热阻值高,由于压电元件10的振动所引起的发热或导电性粘接剂自身的焦耳热,构成导电性粘接剂的树脂发生热劣化,接合强度下降,结果,有可能让柔性布线基板105从压电元件10剥落。In addition, when the piezoelectric element 10 is driven at a high speed by flowing a large current in the case of joining only with a conductive adhesive, the electrical resistance and thermal resistance of the conductive adhesive are high, and the voltage The heat generated by the vibration of the electric element 10 or the Joule's heat of the conductive adhesive itself causes thermal deterioration of the resin constituting the conductive adhesive, and the joint strength decreases. peeling off.
本实用新型是鉴于上述问题点而研究出的,其目的在于,提供一种即使接合于压电元件的柔性布线基板长期间驱动也不会从压电元件剥离,而能长期间稳定驱动的压电致动器、压电振动装置以及便携式终端。The present invention has been developed in view of the above-mentioned problems, and an object of the present invention is to provide a piezoelectric device that can be stably driven for a long period of time without peeling off from the piezoelectric element even if the flexible wiring substrate bonded to the piezoelectric element is driven for a long period of time. Electric actuators, piezoelectric vibration devices, and portable terminals.
解决课题的手段means of solving problems
本实用新型的压电致动器的特征在于,具有:压电元件,其具备将内部电极以及压电体层层叠而成的层叠体、和在该层叠体的一个主面与所述内部电极电连接的表面电极;和柔性布线基板,其一部分通过包含导电粒子和树脂的导电性粘接剂而被接合在所述一个主面上,并具备与所述表面电极电连接的布线导体,所述柔性布线基板与所述压电元件的接合区域中,缘部的至少一部分与其他部分相比所述导电粒子配置得更多。The piezoelectric actuator of the present invention is characterized in that it has: a piezoelectric element including a laminate formed by laminating internal electrodes and piezoelectric layers; a surface electrode electrically connected; and a flexible wiring substrate, a part of which is bonded to the one main surface through a conductive adhesive containing conductive particles and resin, and has a wiring conductor electrically connected to the surface electrode, In the bonding region between the flexible wiring board and the piezoelectric element, at least a part of the edge part is arranged more of the conductive particles than other parts.
此外本实用新型的压电振动装置的特征在于,具有所述压电致动器和接合于所述压电元件的所述另一个主面的振动板。Moreover, the piezoelectric vibration device of this invention is characterized by including the said piezoelectric actuator and the vibration plate joined to the said other main surface of the said piezoelectric element.
此外,本实用新型的便携式终端的特征在于,具有所述压电致动器、电子电路、显示器和框体,所述压电致动器的另一个主面接合于所述显示器或所述框体。In addition, the portable terminal of the present invention is characterized in that it includes the piezoelectric actuator, an electronic circuit, a display, and a frame, and the other main surface of the piezoelectric actuator is joined to the display or the frame. body.
实用新型效果Utility Model Effect
根据本实用新型,能够得到压电元件不会异常振动、即使长期间驱动柔性布线基板也不会从压电元件剥落的压电致动器。According to the present invention, it is possible to obtain a piezoelectric actuator in which the piezoelectric element does not vibrate abnormally and does not peel off from the piezoelectric element even when the flexible wiring board is driven for a long period of time.
附图说明Description of drawings
图1是表示本实用新型的压电致动器的实施方式的一例的示意立体图。FIG. 1 is a schematic perspective view showing an example of an embodiment of the piezoelectric actuator of the present invention.
图2(a)是沿图1(b)所示的A-A线进行切断的概略剖面图,(b)是图1所示的压电致动器的一部分放大平面透视图。2( a ) is a schematic cross-sectional view taken along line A-A shown in FIG. 1( b ), and (b) is a partially enlarged plan perspective view of the piezoelectric actuator shown in FIG. 1 .
图3是表示图2(b)的其他例的一部分放大平面透视图。Fig. 3 is a partially enlarged plan perspective view showing another example of Fig. 2(b).
图4是示意性地表示本实用新型的实施方式的压电振动装置的概略立体图。4 is a schematic perspective view schematically showing a piezoelectric vibration device according to an embodiment of the present invention.
图5是示意性地表示本实用新型的实施方式的便携式终端的概略立体图。FIG. 5 is a schematic perspective view schematically showing a mobile terminal according to an embodiment of the present invention.
图6是沿图5所示的A-A线进行切断的概略剖面图。Fig. 6 is a schematic cross-sectional view taken along line A-A shown in Fig. 5 .
图7是沿图5所示的B-B线进行切断的概略剖面图。Fig. 7 is a schematic cross-sectional view taken along line B-B shown in Fig. 5 .
图8(a)是表示现有的压电致动器的实施方式的一例的概略立体图,(b)是沿(a)所示的A-A线进行切断的概略剖面图。8( a ) is a schematic perspective view showing an example of an embodiment of a conventional piezoelectric actuator, and ( b ) is a schematic cross-sectional view cut along line A-A shown in ( a ).
具体实施方式Detailed ways
参照附图对本实用新型的压电致动器的实施方式的一例进行详细说明。An example of an embodiment of the piezoelectric actuator of the present invention will be described in detail with reference to the drawings.
图1是表示本实用新型的压电致动器的实施方式的一例的概略立体图,图2(a)是沿图1(b)所示的A-A线进行切断的概略剖面图,图2(b)是图1所示的压电致动器的一部分放大平面透视图。Fig. 1 is a schematic perspective view showing an example of an embodiment of a piezoelectric actuator of the present invention, Fig. 2(a) is a schematic cross-sectional view taken along line A-A shown in Fig. 1(b), and Fig. 2(b ) is a partially enlarged plan perspective view of the piezoelectric actuator shown in FIG. 1 .
图1所示的本实施方式的压电致动器1的特征在于,具有:压电元件10,其具备将内部电极2以及压电体层3层叠而成的层叠体4、和在层叠体4的一个主面与内部电极2电连接的表面电极5;柔性布线基板6,其一部分通过包含导电粒子和树脂的导电性粘接剂7而被接合在一个主面上,并具备与表面电极5电连接的布线导体61,柔性布线基板6与压电元件10的接合区域中,周缘部601的至少一部分与其他部分相比导电粒子配置得更多。The piezoelectric actuator 1 of the present embodiment shown in FIG. 1 is characterized by having a piezoelectric element 10 including a laminated body 4 in which internal electrodes 2 and piezoelectric layers 3 are stacked, and a laminated body A surface electrode 5 whose one main surface of 4 is electrically connected to the internal electrode 2; a flexible wiring substrate 6, a part of which is bonded to one main surface by a conductive adhesive 7 containing conductive particles and resin, and has a surface electrode 5 connected to the surface electrode. In the wiring conductor 61 that is electrically connected to the flexible wiring board 6 and the piezoelectric element 10, at least a part of the peripheral portion 601 has more conductive particles than other parts.
构成压电元件10的层叠体4由内部电极2以及压电体层3层叠而成,因而具有多个内部电极2在层叠方向上重叠的活性部41、和该活性部以外的非活性部42,例如形成为长尺状。在安装于便携式终端的显示器或框体的压电致动器的情况下,作为层叠体4的长度优选为例如18mm~28mm,进一步优选为22mm~25mm。层叠体4的宽度优选为例如1mm~6mm,进一步优选为3mm~4mm。层叠体4的厚度优选为例如0.2mm~1.0mm,进一步优选为0.4mm~0.8mm。The laminate 4 constituting the piezoelectric element 10 is formed by laminating the internal electrodes 2 and the piezoelectric layers 3 , and thus has an active portion 41 in which a plurality of internal electrodes 2 overlap in the lamination direction, and an inactive portion 42 other than the active portion. , for example formed into a long ruler shape. In the case of a piezoelectric actuator mounted on a display or a housing of a mobile terminal, the length of the laminated body 4 is preferably, for example, 18 mm to 28 mm, more preferably 22 mm to 25 mm. The width of the laminated body 4 is preferably, for example, 1 mm to 6 mm, more preferably 3 mm to 4 mm. The thickness of the laminated body 4 is preferably, for example, 0.2 mm to 1.0 mm, more preferably 0.4 mm to 0.8 mm.
构成层叠体4的内部电极2通过和形成压电体层3的陶瓷同时烧成而形成,由第1极21以及第2极22构成。例如,第1极21为接地极,第2极22为正极或负极。通过与压电体层3交替层叠而从上下夹持压电体层3,并按照层叠顺序配置第1极21以及第2极22,由此对夹在它们之间的压电体层3施加驱动电压。作为该形成材料,可以使用例如以与压电陶瓷的反应性低的银或银-钯合金为主要成分的导体或者包含铜、铂等的导体,但也可以使它们含有陶瓷成分、玻璃成分。The internal electrode 2 constituting the laminated body 4 is formed by simultaneous firing with the ceramics forming the piezoelectric layer 3 , and is composed of a first pole 21 and a second pole 22 . For example, the first pole 21 is a ground pole, and the second pole 22 is a positive pole or a negative pole. Piezoelectric layers 3 are sandwiched from above and below by alternate lamination with piezoelectric layers 3, and the first poles 21 and second poles 22 are arranged in the order of stacking, thereby applying pressure to the piezoelectric layers 3 sandwiched between them. driving voltage. As the forming material, for example, a conductor mainly composed of silver or a silver-palladium alloy having low reactivity with piezoelectric ceramics, or a conductor containing copper, platinum, or the like can be used, but these may also contain ceramic components or glass components.
在图1所示的示例中,第1极21以及第2极22的端部分别向层叠体4的对置的一对侧面交替地导出。在安装于便携式终端的显示器或框体的压电致动器的情况下,内部电极2的长度优选为例如17mm~25mm,进一步优选为21mm~24mm。内部电极2的宽度优选为例如1mm~5mm,进一步优选为2mm~4mm。内部电极2的厚度优选为例如0.1~5μm。In the example shown in FIG. 1 , the ends of the first poles 21 and the second poles 22 are respectively led out alternately to a pair of opposing side surfaces of the laminated body 4 . In the case of a piezoelectric actuator mounted on a display or housing of a mobile terminal, the length of the internal electrode 2 is preferably, for example, 17 mm to 25 mm, more preferably 21 mm to 24 mm. The width of the internal electrodes 2 is preferably, for example, 1 mm to 5 mm, more preferably 2 mm to 4 mm. The thickness of the internal electrodes 2 is preferably, for example, 0.1 to 5 μm.
构成层叠体4的压电体层3由具有压电特性的陶瓷形成,作为这样的陶瓷,可以使用例如由锆钛酸铅(PbZrO3-PbTiO3)构成的钙钛矿型氧化物、铌酸锂(LiNbO3)、钽酸锂(LiTaO3)等。压电体层3的1层的厚度优选设定为例如0.01~0.1mm,以便于用低电压进行驱动。此外,为了得到较大的弯曲振动,优选具有200pm/V以上的压电d31常数。The piezoelectric layer 3 constituting the laminated body 4 is formed of ceramics having piezoelectric properties. As such ceramics, for example, perovskite-type oxides composed of lead zirconate titanate (PbZrO 3 -PbTiO 3 ), niobate Lithium (LiNbO 3 ), lithium tantalate (LiTaO 3 ), etc. The thickness of one piezoelectric layer 3 is preferably set to, for example, 0.01 to 0.1 mm in order to facilitate driving with a low voltage. In addition, in order to obtain a large bending vibration, it is preferable to have a piezoelectric d31 constant of 200 pm/V or more.
在层叠体4的一个主面,设置有与内部电极2电连接的表面电极5。图1所示的方式中的表面电极5,由大面积的第1表面电极51、小面积的第2表面电极52以及第3表面电极53构成。例如,第1表面电极51与成为第1极21的内部电极2电连接,第2表面电极52与配置于一个主面侧的成为第2极22的内部电极2电连接,第3表面电极53与配置于另一个主面侧的成为第2极22的内部电极2电连接。在安装于便携式终端的显示器或框体的压电致动器的情况下,第1表面电极51的长度优选为例如17mm~23mm,进一步优选为19mm~21mm。第1表面电极51的宽度优选为例如1mm~5mm,进一步优选为2mm~4mm。第2表面电极52以及第3表面电极53的长度优选设为例如1mm~3mm。第2表面电极52以及第3表面电极53的宽度优选设为例如0.5mm~1.5mm。On one main surface of the laminated body 4, a surface electrode 5 electrically connected to the internal electrode 2 is provided. The surface electrode 5 in the form shown in FIG. 1 is composed of a large-area first surface electrode 51 , a small-area second surface electrode 52 , and a third surface electrode 53 . For example, the first surface electrode 51 is electrically connected to the internal electrode 2 that becomes the first pole 21, the second surface electrode 52 is electrically connected to the internal electrode 2 that is disposed on one main surface side and becomes the second pole 22, and the third surface electrode 53 It is electrically connected to the internal electrode 2 serving as the second pole 22 arranged on the other main surface side. In the case of a piezoelectric actuator mounted on a display or a housing of a mobile terminal, the length of the first surface electrode 51 is preferably, for example, 17 mm to 23 mm, more preferably 19 mm to 21 mm. The width of the first surface electrode 51 is preferably, for example, 1 mm to 5 mm, more preferably 2 mm to 4 mm. The lengths of the second surface electrodes 52 and the third surface electrodes 53 are preferably set to, for example, 1 mm to 3 mm. The width of the second surface electrode 52 and the third surface electrode 53 is preferably set to, for example, 0.5 mm to 1.5 mm.
此外,压电致动器1具有柔性布线基板6,该柔性布线基板6的一部分通过由导电粒子和树脂构成的导电性粘接剂7与构成压电元件10的层叠体4的一个主面相接合。In addition, the piezoelectric actuator 1 has a flexible wiring substrate 6, and a part of the flexible wiring substrate 6 is bonded to one main surface of the laminated body 4 constituting the piezoelectric element 10 via a conductive adhesive 7 made of conductive particles and resin. .
该柔性布线基板6具备布线导体61,以通过导电性粘接剂7将表面电极5与布线导体61电连接的方式,将柔性布线基板6的一部分与层叠体4的一个主面接合。The flexible wiring board 6 includes a wiring conductor 61 , and a part of the flexible wiring board 6 is bonded to one main surface of the laminate 4 so that the surface electrode 5 and the wiring conductor 61 are electrically connected via the conductive adhesive 7 .
柔性布线基板6例如是在树脂膜中埋设有2根布线导体61的柔性印刷布线基板,在其一端连接有用于与外部电路进行连接的连接器(未图示)。The flexible wiring board 6 is, for example, a flexible printed wiring board in which two wiring conductors 61 are embedded in a resin film, and a connector (not shown) for connecting to an external circuit is connected to one end thereof.
作为导电性粘接剂7,例如使由银粉末、金粉末等金属粉末或对树脂球实施了镀Au等的导电被覆的物质等构成的导电粒子分散在聚酰亚胺、聚酰胺酰亚胺、硅酮橡胶、合成橡胶等低弹性模量(杨氏模量)的树脂中而形成。由此,与焊料相比能够减少因振动而产生的应力。更优选的是,在导电性粘接剂7中也是各向异性导电材料为佳。各向异性导电材料由担负电接合的导电粒子和担负粘接的树脂粘接剂构成。该各向异性导电材料在厚度方向上取得导通,在面内方向上取得绝缘,因此即使是窄间距的布线在异极的表面电极间也不会发生电短路,从而能够使与柔性布线基板6的连接部紧凑。As the conductive adhesive 7, for example, conductive particles made of metal powder such as silver powder and gold powder, or resin balls subjected to conductive coating such as Au plating are dispersed in polyimide, polyamideimide, etc. , Silicone rubber, synthetic rubber and other low elastic modulus (Young's modulus) resin. Thereby, stress due to vibration can be reduced compared to solder. More preferably, the conductive adhesive 7 is also an anisotropic conductive material. The anisotropic conductive material is composed of conductive particles responsible for electrical connection and a resin adhesive responsible for bonding. The anisotropic conductive material achieves conduction in the thickness direction and insulation in the in-plane direction, so even if it is a narrow-pitch wiring, there will be no electrical short circuit between the surface electrodes of different electrodes, so that it can be connected to the flexible wiring substrate. 6. The connection part is compact.
而且,柔性布线基板6与压电元件10的接合区域中,周缘部601的至少一部分与其他部分相比导电粒子配置得较多。在此,所谓接合区域指的是导电性粘接剂7所占据的区域,所谓接合区域的周缘部601则是意味着距离端面0.4mm以内的区域。此外,所谓导电粒子在周缘部601的一部分中配置得比其他部分多则是意味着,剥下柔性布线基板6用电子显微镜观察导电性粘接剂7的表面上时的占据在周缘部601的一部分的每单位面积的导电粒子的比例大于其他部分。Furthermore, in the bonding region between the flexible wiring board 6 and the piezoelectric element 10 , at least a part of the peripheral portion 601 has more conductive particles than other parts. Here, the bonding region refers to the region occupied by the conductive adhesive 7 , and the peripheral portion 601 of the bonding region refers to a region within 0.4 mm from the end surface. In addition, the phrase that conductive particles are disposed more in a part of the peripheral portion 601 than in other portions means that the conductive particles occupying the peripheral portion 601 when the flexible wiring board 6 is peeled off and the surface of the conductive adhesive 7 is observed with an electron microscope. The proportion of conductive particles per unit area is larger in some parts than in other parts.
这样,通过在柔性布线基板6与压电元件10的接合区域的周缘部601中的至少一部分将导电粒子配置得比其他部分多,由于该部分的热传导性提高,因此即使在流过大电流以高速进行驱动的情况下,也会促进压电元件10的振动所引起的发热或导电性粘接剂7的焦耳热的热传导、扩散,因而能够大幅降低发生构成导电性粘接剂7的树脂热劣化、柔性布线基板6从压电元件10剥落这样的问题。In this way, at least a part of the peripheral portion 601 of the bonding region between the flexible wiring board 6 and the piezoelectric element 10 is arranged more conductive particles than other parts, since the thermal conductivity of this part is improved, even when a large current flows In the case of high-speed driving, the heat generation caused by the vibration of the piezoelectric element 10 or the heat conduction and diffusion of the Joule heat of the conductive adhesive 7 are also promoted, so that the generation of heat of the resin constituting the conductive adhesive 7 can be greatly reduced. degradation and peeling of the flexible wiring substrate 6 from the piezoelectric element 10 .
此外,通过在周缘部601中的至少一部分将导电粒子配置得较多,从而由于导电粒子的旋转和低杨氏模量而导致剪切、拉伸的应力集中下降。因此,可防止从这部分起在导电性粘接剂7产生裂纹。尤其是在力施加到柔性布线基板6与外部连接的方向的情况下,较大的剪切、拉伸的应力会集中在柔性布线基板6的接合部的根部,但如上所述将导电粒子较多地配置于周缘部601,因此通过导电性粘接剂7的导电粒子的旋转,尤其能够抑制剪切应力的集中,没有在接合部的根部产生裂纹而导致柔性布线基板6剥落的危险。优选作为导电粒子比其他部分多的周缘部601中的至少一部分,为周缘部601的整周。Furthermore, by arranging a large number of conductive particles in at least a part of the peripheral portion 601 , stress concentration due to shearing and stretching due to rotation of the conductive particles and low Young's modulus is reduced. Therefore, it is possible to prevent cracks from being generated in the conductive adhesive 7 from this portion. In particular, when a force is applied to the direction in which the flexible wiring substrate 6 is connected to the outside, a large shearing and tensile stress will concentrate on the root of the joint portion of the flexible wiring substrate 6, but as described above, the conductive particles are relatively small. Many are arranged on the peripheral portion 601 , so the rotation of the conductive particles of the conductive adhesive 7 can especially suppress the concentration of shear stress, and there is no risk of the flexible wiring board 6 being peeled off due to cracks at the root of the joint. Preferably, at least a portion of the peripheral portion 601 having more conductive particles than other portions is the entire circumference of the peripheral portion 601 .
另外,对于导电粒子被配置得较多的周缘部601中的至少一部分,优选例如与其他部分相比导电粒子的个数或比例多5~20%。该比率能够通过剥下柔性布线基板6用电子显微镜观察而求得。In addition, for at least a part of the peripheral portion 601 where many conductive particles are arranged, it is preferable that the number or ratio of conductive particles is 5 to 20% larger than that of other parts, for example. This ratio can be obtained by peeling off the flexible wiring board 6 and observing it with an electron microscope.
此外,如图3所示,通过所述一部分位于压电元件10的一个主面的外周与表面电极5之间的区域,从而树脂的低杨氏模量、许多的导电粒子的旋转能够降低由于外部的振动、柔性布线基板6自身的共振等的不跟随致动器的振动而产生的应力,并且树脂的粘弹性能够降低这种不跟随的振动的振幅。In addition, as shown in FIG. 3, by the region between the outer periphery of one main surface of the piezoelectric element 10 and the surface electrode 5, the low Young's modulus of the resin, the rotation of many conductive particles can be reduced due to Stress generated by non-following vibration of the actuator, such as external vibration and resonance of the flexible wiring board 6 itself, and the viscoelasticity of the resin can reduce the amplitude of such non-following vibration.
此外,在压电元件10的一个主面的外周与表面电极5之间的区域中接合的导电性粘接剂7的厚度,比将布线导体61与表面电极5对置地电连接的导电性粘接剂7的厚度厚,因而热阻增大,但通过将高热传导率的导电粒子较多地配置到该区域,能够成为也具有抑制了热阻的增大的热传导的功能的连接。结果,能够使压电元件10由于振动而产生的热、导电性粘接剂7自身的焦耳热传导/扩散,并减少构成导电性粘接剂7的树脂的劣化所引起的裂纹的发生。In addition, the thickness of the conductive adhesive 7 bonded to the region between the outer periphery of one main surface of the piezoelectric element 10 and the surface electrode 5 is smaller than that of the conductive adhesive that electrically connects the wiring conductor 61 and the surface electrode 5 to face each other. Since the thickness of the adhesive 7 is thick, the thermal resistance increases. However, by arranging many conductive particles with high thermal conductivity in this region, it is possible to provide a connection that also has the function of heat conduction that suppresses an increase in thermal resistance. As a result, the heat generated by the vibration of the piezoelectric element 10 and the Joule heat of the conductive adhesive 7 itself can be conducted/diffused, and the occurrence of cracks due to deterioration of the resin constituting the conductive adhesive 7 can be reduced.
此外,在上述的结构中,在导电性粘接剂7为例如作为导电粒子而包含进行了镀金的树脂球等的各向异性导电材料的情况下,在俯视时布线导体61与表面电极5重叠的区域中构成导电性粘接剂7的导电粒子将表面电极5与布线导体61电连接,导电粒子彼此之间为未接合的连接形态,在其他区域中容易形成与压电元件10和布线导体61的哪一方都不连接或仅与其中一方连接的导电粒子主要存在的连接形态。只要是这样的连接形态,就能够如上所述维持高热传导的情况下抑制剪切、拉伸的应力集中,但也不必一定是基于各向异性导电材料等的接合件、接合工艺。In addition, in the above structure, when the conductive adhesive 7 is an anisotropic conductive material including, for example, gold-plated resin balls as conductive particles, the wiring conductor 61 overlaps the surface electrode 5 in plan view. The conductive particles constituting the conductive adhesive 7 in the region electrically connect the surface electrode 5 and the wiring conductor 61, and the conductive particles are in an unbonded connection form, and it is easy to form a connection with the piezoelectric element 10 and the wiring conductor in other regions. The connection form in which conductive particles that are not connected to either of 61 or are connected to only one of them are mainly present. As long as it is such a connection form, it is possible to suppress stress concentration due to shearing and tension while maintaining high heat conduction as described above, but it does not necessarily need to be a bonding material or bonding process based on an anisotropic conductive material or the like.
为了如上所述有效地实现热传导的提高、应力集中的降低,与压电元件10和布线导体61的哪一方都不连接的导电粒子为整体的70%以上为佳。In order to effectively improve heat conduction and reduce stress concentration as described above, it is preferable that the conductive particles not connected to either the piezoelectric element 10 or the wiring conductor 61 account for 70% or more of the whole.
此外,通过预先使压电元件10的另一个主面成为平坦,例如在将另一个主面贴合于施加振动的对象物(例如后述的振动板等)时,容易与施加振动的对象物成为一体来进行弯曲振动,能够作为整体提高弯曲振动的效率。In addition, by making the other main surface of the piezoelectric element 10 flat in advance, for example, when the other main surface is attached to an object to which vibration is applied (for example, a vibrating plate, which will be described later), it is easy to contact with the object to which vibration is applied. Bending vibration is performed integrally, and the efficiency of bending vibration can be improved as a whole.
另外,图1所示的压电致动器1是所谓双压电晶片型的压电致动器,从表面电极5输入电气信号而使一个主面以及另一个主面成为弯曲面地进行弯曲振动,但作为本实用新型的压电致动器,并不限于双压电晶片型,也可以是单压电晶片型,例如通过将压电致动器的另一个主面接合(贴合)于后述的振动板,即使是单压电晶片型也能够进行弯曲振动。In addition, the piezoelectric actuator 1 shown in FIG. 1 is a so-called bimorph type piezoelectric actuator, and an electric signal is input from the surface electrode 5 so that one main surface and the other main surface become curved surfaces and bend. Vibration, but as the piezoelectric actuator of the present utility model, it is not limited to the bimorph type, and may also be a unimorph type, for example, by bonding (bonding) the other main surface of the piezoelectric actuator In the vibrating plate described later, flexural vibration can be performed even if it is a unimorph type.
接着,对本实施方式的压电致动器1的制造方法进行说明。Next, a method of manufacturing the piezoelectric actuator 1 of the present embodiment will be described.
首先,制作成为压电体层3的陶瓷生片。具体来说,将压电陶瓷的煅烧粉末、由丙烯酸系、丁醛系等的有机高分子构成的粘合剂和可塑剂混合来制作陶瓷浆料。然后,通过使用刮刀法、压延辊法等的流延成型法,使用该陶瓷浆料来制作陶瓷生片。作为压电陶瓷,只要具有压电特性即可,可以使用例如由锆钛酸铅(PbZrO3-PbTiO3)构成的钙钛矿型氧化物等。此外,作为可塑剂,可以使用邻苯二甲酸二丁酯(DBP)、邻苯二甲酸二辛酯(DOP)等。First, a ceramic green sheet to be the piezoelectric layer 3 is produced. Specifically, a ceramic slurry is produced by mixing calcined powder of piezoelectric ceramics, a binder composed of an acrylic-based or butyral-based organic polymer, and a plasticizer. Then, a ceramic green sheet is produced using this ceramic slurry by a tape casting method using a doctor blade method, a calender roll method, or the like. As the piezoelectric ceramics, as long as it has piezoelectric properties, for example, a perovskite-type oxide composed of lead zirconate titanate (PbZrO 3 -PbTiO 3 ) can be used. Moreover, as a plasticizer, dibutyl phthalate (DBP), dioctyl phthalate (DOP), etc. can be used.
接着,制作成为内部电极2的导电性膏。具体来说,通过向银-钯合金的金属粉末中添加混合粘合剂以及可塑剂来制作导电性膏。使用丝网印刷法按内部电极2的图案将该导电性膏涂敷在上述的陶瓷生片上。进而,将印刷有该导电性膏的陶瓷生片层叠多张,以规定温度进行了脱粘合剂处理之后,在900~1200℃的温度下烧成,使用平面磨床等施行磨削处理以便成为规定的形状,由此制作出具备交替层叠的内部电极2以及压电体层3的层叠体4。Next, a conductive paste to be the internal electrode 2 is produced. Specifically, a conductive paste is prepared by adding a mixed binder and a plasticizer to silver-palladium alloy metal powder. This conductive paste was applied on the above-mentioned ceramic green sheet in the pattern of the internal electrodes 2 by a screen printing method. Furthermore, a plurality of ceramic green sheets printed with the conductive paste are laminated, subjected to binder removal treatment at a predetermined temperature, fired at a temperature of 900 to 1200° C., and subjected to grinding treatment using a surface grinder or the like to become The laminated body 4 including the internal electrodes 2 and piezoelectric layers 3 laminated alternately is manufactured.
层叠体4并不限于通过上述的制造方法来制作,只要能够制作出由内部电极2与压电体层3层叠多层而成的层叠体4即可,可以通过任意的制造方法来制作。The laminated body 4 is not limited to the production method described above, and may be produced by any production method as long as the laminated body 4 in which internal electrodes 2 and piezoelectric layers 3 are laminated in multiple layers can be produced.
然后,在混合了以银为主要成分的导电粒子和玻璃而成的混合物中,添加粘合剂、可塑剂以及溶剂而制作出的含银玻璃的导电性膏,将该导电性膏通过丝网印刷法等按表面电极5的图案印刷在层叠体4的主面以及侧面并使其干燥后,在650~750℃的温度下进行烧结处理,形成表面电极5。Then, a conductive paste containing silver glass is prepared by adding a binder, a plasticizer, and a solvent to a mixture of conductive particles mainly composed of silver and glass, and the conductive paste is passed through a screen. The main surface and side surfaces of the laminated body 4 are printed and dried according to the pattern of the surface electrodes 5 by a printing method, and then sintered at a temperature of 650 to 750° C. to form the surface electrodes 5 .
另外,在将表面电极5与内部电极2电连接的情况下,可以形成贯通压电体层3的通孔来连接,也可以在层叠体4的侧面形成侧面电极,可以通过任意的制造方法来制作。In addition, in the case of electrically connecting the surface electrode 5 and the internal electrode 2, a via hole penetrating the piezoelectric layer 3 may be formed for connection, or a side electrode may be formed on the side surface of the laminate 4, and any manufacturing method may be used. make.
接着,使用导电性粘接剂7将柔性布线基板6连接固定于(接合)压电元件10。Next, the flexible wiring board 6 is connected and fixed (bonded) to the piezoelectric element 10 using the conductive adhesive 7 .
首先,使用丝网印刷等方法在压电元件10的规定位置涂敷形成导电性粘接剂用膏。然后,通过在使柔性布线基板6抵接的状态下使导电性粘接剂用膏固化,从而将柔性布线基板6连接固定于压电元件10。另外,作为导电性粘接剂用膏也可以在柔性布线基板6侧涂敷形成。First, a conductive adhesive paste is applied to a predetermined position of the piezoelectric element 10 by screen printing or the like. Then, the flexible wiring board 6 is connected and fixed to the piezoelectric element 10 by curing the conductive adhesive paste in a state where the flexible wiring board 6 is brought into contact. In addition, the conductive adhesive paste may be applied and formed on the flexible wiring board 6 side.
在构成导电性粘接剂7的树脂由热塑性树脂构成的情况下,将导电性粘接剂涂敷形成在压电元件10或柔性布线基板6的规定位置之后,在使压电元件10与柔性布线基板6隔着导电性粘接剂相抵接的状态下进行加热加压,由此热塑性树脂软化流动,然后返回到常温,由此热塑性树脂重新固化,从而将柔性布线基板6连接固定于压电元件10。When the resin constituting the conductive adhesive 7 is made of a thermoplastic resin, after applying the conductive adhesive to a predetermined position of the piezoelectric element 10 or the flexible wiring board 6, the piezoelectric element 10 and the flexible wiring board 6 are connected. When the wiring substrate 6 is in contact with the conductive adhesive, heat and pressure are applied, thereby softening and flowing the thermoplastic resin, and then returning to normal temperature, whereby the thermoplastic resin is cured again, thereby connecting and fixing the flexible wiring substrate 6 to the piezoelectric substrate. Element 10.
在此,为了在俯视时在柔性布线基板6的与压电元件10重叠的区域的周缘部将构成导电性粘接剂7的导电粒子配置得较多,只要准备导电粒子的含有率更多的导电性粘接剂膏,并在周缘部涂敷形成导电粒子的含有率多的导电性粘接剂膏即可。Here, in order to arrange a large number of conductive particles constituting the conductive adhesive 7 in the peripheral portion of the region overlapping the piezoelectric element 10 of the flexible wiring substrate 6 in a plan view, it is only necessary to prepare a A conductive adhesive paste may be used, and a conductive adhesive paste having a large content of conductive particles may be applied to the peripheral portion.
尤其是在作为导电性接合构件7而使用各向异性导电构件的情况下,需要控制加压量,以使得接近的导电粒子不发生接触。In particular, when an anisotropic conductive member is used as the conductive bonding member 7 , it is necessary to control the amount of pressure so that approaching conductive particles do not come into contact.
此外,在上述中,示出了将导电性粘接剂7涂敷形成于压电元件10或柔性布线基板6的方法,但也可以在将预先形成为片状的导电性粘接剂7的片夹在压电元件10与柔性布线基板6之间的状态下进行加热加压来进行接合。In addition, in the above, the method of applying and forming the conductive adhesive 7 on the piezoelectric element 10 or the flexible wiring board 6 has been shown, but it is also possible to apply the conductive adhesive 7 previously formed into a sheet. Bonding is performed by heating and pressing the sheet sandwiched between the piezoelectric element 10 and the flexible wiring board 6 .
如图4所示,本实用新型的压电振动装置具有压电致动器1和接合于压电致动器1的另一个主面的振动板81。As shown in FIG. 4 , the piezoelectric vibration device of the present invention has a piezoelectric actuator 1 and a vibration plate 81 joined to the other main surface of the piezoelectric actuator 1 .
振动板81具有矩形的薄板状的形状。振动板81可以适宜使用丙烯树脂、玻璃等刚性以及弹性大的材料来形成。此外,振动板81的厚度设定为例如0.4mm~1.5mm。The vibrating plate 81 has a rectangular thin plate shape. The vibrating plate 81 can be formed using a material with high rigidity and elasticity, such as acrylic resin and glass, as appropriate. In addition, the thickness of the vibrating plate 81 is set to, for example, 0.4 mm to 1.5 mm.
振动板81通过接合构件82而被接合于压电致动器1的另一个主面。可以通过接合构件82将另一个主面的整个面接合于振动板81,也可以对另一个主面的大致整个面进行接合。Vibration plate 81 is joined to the other main surface of piezoelectric actuator 1 via joining member 82 . The entire other main surface may be joined to the vibration plate 81 by the joining member 82, or substantially the entire other main surface may be joined.
接合构件82具有膜状的形状。此外,接合构件82由比振动板81柔软且容易变形的材质形成,且杨氏模量、刚性模量、体积弹性模量等的弹性模量、刚性比振动板81小。即,接合构件82能变形,在施加有相同力时,比振动板81变形得大。并且,在接合构件82的一个主面(图的+z方向侧的主面)整体地固定有压电致动器1的另一个主面(图的-z方向侧的主面),在接合构件82的另一个主面(图的-z方向侧的主面)固定有振动板81的一个主面(图的+z方向侧的主面)的一部分。The bonding member 82 has a film-like shape. Furthermore, the bonding member 82 is made of a softer and more easily deformable material than the vibrating plate 81 , and has smaller elastic modulus and rigidity such as Young's modulus, rigidity modulus, and bulk modulus than the vibrating plate 81 . That is, the joining member 82 is deformable, and deforms more than the vibrating plate 81 when the same force is applied. In addition, the other main surface (the main surface on the −z direction side in the drawing) of the piezoelectric actuator 1 is integrally fixed to one main surface (the main surface on the +z direction side in the figure) of the joining member 82, and A part of one main surface (principal surface on the +z direction side in the drawing) of the diaphragm 81 is fixed to the other main surface (the main surface on the −z direction side in the drawing) of the member 82 .
接合构件82可以是单一构件,也可以是由几个构件构成的复合体。作为这样的接合构件82,可以适当地使用例如在由无纺布等构成的基材的两面附着有粘着剂的双面胶带、作为具有弹性的粘接剂的各种弹性粘接剂等。此外,接合构件82的厚度最好大于压电致动器1的弯曲振动的振幅,但若过厚则振动会被衰减,因此设定为例如0.1mm~0.6mm。但是,在本实用新型的压电振动装置中,并不限定于接合构件82的材质,也可以是接合构件82由比振动板81坚硬且难以变形的材质形成。此外,根据情况不同,也可以是不具有接合构件82的结构。The joining member 82 may be a single member or a complex of several members. As such joining member 82 , for example, a double-sided tape in which an adhesive is adhered to both surfaces of a substrate made of nonwoven fabric or the like, various elastic adhesives that are elastic adhesives, and the like can be suitably used. In addition, the thickness of the joining member 82 is preferably larger than the amplitude of the bending vibration of the piezoelectric actuator 1, but if it is too thick, the vibration will be attenuated, so it is set to, for example, 0.1 mm to 0.6 mm. However, in the piezoelectric vibration device of the present invention, the material of the joining member 82 is not limited, and the joining member 82 may be formed of a material that is harder and less deformable than the vibration plate 81 . In addition, depending on circumstances, a structure not having the joining member 82 may be used.
具备这样的结构的本例的压电振动装置,通过施加电信号而使压电致动器1弯曲振动,由此作为使振动板81振动的压电振动装置而发挥作用。另外,振动板81的长度方向上的另一个端部(图-y方向端部、振动板81的周缘部等也可以由未图示的支撑构件来支撑。The piezoelectric vibration device of this example having such a structure functions as a piezoelectric vibration device that vibrates the vibration plate 81 by applying an electric signal to cause the piezoelectric actuator 1 to bend and vibrate. In addition, the other end in the longitudinal direction of the vibrating plate 81 (the end in the y direction in the figure, the peripheral edge of the vibrating plate 81 , etc. may be supported by a support member not shown.
本例的压电振动装置,使用降低了不需要的振动的发生的压电致动器1而构成,所以能够成为降低了不需要的振动的发生的压电振动装置。The piezoelectric vibration device of this example is configured using the piezoelectric actuator 1 that reduces the generation of unnecessary vibrations, so it can be a piezoelectric vibration device that reduces the generation of unnecessary vibrations.
此外,本例的压电振动装置在压电致动器1的平坦的另一个主面接合了振动板81。由此,能够成为将压电致动器1与振动板81牢固接合而成的压电振动装置。In addition, in the piezoelectric vibration device of this example, the vibration plate 81 is bonded to the other flat main surface of the piezoelectric actuator 1 . Accordingly, it is possible to obtain a piezoelectric vibration device in which the piezoelectric actuator 1 and the vibration plate 81 are firmly bonded.
如图5~图7所示,本实用新型的便携式终端具有压电致动器1、电子电路(未图示)、显示器91和框体92,压电致动器1的另一个主面接合于框体92。另外,图5是示意性地表示本实用新型的便携式终端的概略立体图,图6是沿图5所示的A-A线进行切断的概略剖面图,图7是沿图5所示的B-B线进行切断的概略剖面图。As shown in Figures 5 to 7, the portable terminal of the present invention has a piezoelectric actuator 1, an electronic circuit (not shown), a display 91 and a frame 92, and the other main surface of the piezoelectric actuator 1 is joined in frame 92. In addition, FIG. 5 is a schematic perspective view schematically showing a portable terminal of the present invention, FIG. 6 is a schematic cross-sectional view cut along the line A-A shown in FIG. 5 , and FIG. 7 is cut along the line B-B shown in FIG. 5 a schematic cross-section of the .
在此,优选使用能变形的接合构件将压电致动器1与框体92接合。即,在图6以及图7中接合构件82是能变形的接合构件。Here, it is preferable to join the piezoelectric actuator 1 and the housing 92 using a deformable joining member. That is, the joint member 82 is a deformable joint member in FIGS. 6 and 7 .
通过用能变形的接合构件82将压电致动器1与框体92接合,在从压电致动器1传递振动时,能变形的接合构件82与框体92相比变形得更大。By joining the piezoelectric actuator 1 to the frame body 92 with the deformable bonding member 82 , the deformable bonding member 82 deforms more than the frame body 92 when vibration is transmitted from the piezoelectric actuator 1 .
此时,可以通过能变形的接合构件82来缓和从框体92反射的反相位的振动,因此压电致动器1能够不受到周围的振动的影响地向框体92传递强振动。At this time, since the anti-phase vibration reflected from the frame body 92 can be moderated by the deformable joint member 82 , the piezoelectric actuator 1 can transmit strong vibration to the frame body 92 without being affected by surrounding vibrations.
其中,通过接合构件82的至少一部分由粘弹性体构成,从而能够将来自压电致动器1的强振动向框体92传递,并且由接合构件82吸收从框体92反射的弱振动,在这一点上优选。可以使用例如在由无纺布等构成的基材的两面附着有粘着剂的双面胶带、包含具有弹性的粘接剂的结构的接合构件,作为它们的厚度可以使用例如10μm~2000μm的厚度。Among them, since at least a part of the joint member 82 is made of a viscoelastic body, the strong vibration from the piezoelectric actuator 1 can be transmitted to the frame body 92, and the weak vibration reflected from the frame body 92 can be absorbed by the joint member 82. This is preferable. For example, a double-sided tape having an adhesive attached to both sides of a substrate made of nonwoven fabric or a bonding member having a structure including an elastic adhesive can be used, and their thickness can be, for example, 10 μm to 2000 μm.
并且,在本例中,压电致动器1安装于成为显示器91的盖的框体92的一部分,该框体92的一部分作为振动板922而发挥作用。In addition, in this example, the piezoelectric actuator 1 is attached to a part of a housing 92 serving as a cover of the display 91 , and a part of the housing 92 functions as a vibrating plate 922 .
另外,在本例中示出了压电致动器1接合于框体92的情形,但压电致动器1也可以接合于显示器91。In addition, in this example, a case where the piezoelectric actuator 1 is joined to the housing 92 is shown, but the piezoelectric actuator 1 may be joined to the display 91 .
框体92具有1个面开口的箱状的框体主体921、和堵住框体主体921的开口的振动板922。该框体92(框体主体921以及振动板922)可以适宜地使用刚性以及弹性模量大的合成树脂等材料来形成。The frame body 92 has a box-shaped frame body body 921 with one surface open, and a vibration plate 922 closing the opening of the frame body body 921 . The housing 92 (the housing main body 921 and the vibrating plate 922 ) can be suitably formed using a material such as a synthetic resin with high rigidity and high modulus of elasticity.
振动板922的周缘部通过接合件93以能振动的方式安装于框体主体921。接合件93由比振动板922柔软且容易变形的材质形成,杨氏模量、刚性模量、体积弹性模量等的弹性模量、刚性比振动板922小。即,接合件93能够变形,在施加了相同力时与振动板922相比变形得大。The peripheral portion of the vibrating plate 922 is attached to the frame main body 921 in a vibrating manner via the joint 93 . The joint member 93 is made of a softer and more easily deformable material than the vibrating plate 922 , and has smaller elastic modulus and rigidity than the vibrating plate 922 such as Young's modulus, rigidity modulus, and bulk modulus. That is, the joint 93 is deformable, and deforms more than the vibrating plate 922 when the same force is applied.
接合件93可以是单一构件,也可以是由几个构件构成的复合体。作为这样的接合件93,可以适当地使用例如在由无纺布等构成的基材的两面附着有粘着剂的双面胶带等。接合件93的厚度设定为不会过厚而使振动衰减,例如设定为0.1mm~0.6mm。但是,在本实用新型的便携式终端中,接合件93的材质没有限定,接合件93也可以由比振动板922坚硬且难以变形的材质形成。此外,根据情况不同,也可以是不具有接合件93的结构。The joining member 93 may be a single member or a composite body composed of several members. As such a bonding material 93 , for example, a double-sided tape in which an adhesive is adhered to both surfaces of a base material made of nonwoven fabric or the like can be suitably used. The thickness of the bonding material 93 is set so as not to attenuate vibration due to excessive thickness, and is set to, for example, 0.1 mm to 0.6 mm. However, in the portable terminal of the present invention, the material of the joint member 93 is not limited, and the joint member 93 may be formed of a material that is harder and less deformable than the vibrating plate 922 . In addition, depending on circumstances, a structure not including the joint 93 may be used.
作为电子电路(未图示),例如可以例示对显示于显示器91的图像信息、通过便携式终端传递的声音信息进行处理的电路、通信电路等。可以是这些电路中的至少1个,也可以包含全部电路。此外,也可以是具有其他功能的电路。而且,也可以具有多个电子电路。另外,电子电路与压电致动器1由未图示的连接用布线连接。As an electronic circuit (not shown), for example, a circuit for processing image information displayed on the display 91 or audio information transmitted through a mobile terminal, a communication circuit, and the like can be exemplified. At least one of these circuits may be used, or all circuits may be included. In addition, a circuit having other functions may also be used. Furthermore, it is also possible to have a plurality of electronic circuits. In addition, the electronic circuit and the piezoelectric actuator 1 are connected by unillustrated connection wiring.
显示器91是具有显示图像信息的功能的显示装置,可以适宜地使用例如液晶显示器、等离子显示器、以及有机EL显示器等已知的显示器。另外,显示器91可以具有触摸面板那样的输入装置。此外,显示器91的盖(振动板922)也可以具有触摸面板那样的输入装置。而且,显示器91整体或显示器91的一部分也可以作为振动板而发挥作用。The display 91 is a display device having a function of displaying image information, and known displays such as a liquid crystal display, a plasma display, and an organic EL display, for example, can be suitably used. In addition, the display 91 may have an input device such as a touch panel. In addition, the cover (vibration plate 922) of the display 91 may have an input device such as a touch panel. Moreover, the whole display 91 or a part of the display 91 may function as a diaphragm.
此外,本实用新型的便携式终端的特征在于,使显示器91或框体92产生通过耳朵的软骨或空气传导来传递声音信息的振动。本例的便携式终端能够通过使振动板(显示器91或框体92)直接或经由其他构件与耳朵接触来向耳朵的软骨传递振动,从而传递声音信息。即,能够通过使振动板(显示器91或框体92)直接或间接地与耳朵接触来向耳朵的软骨传递振动,从而传递声音信息。由此,能够得到例如即使在周围比较吵闹时也能传递声音信息的便携式终端。另外,介于振动板(显示器91或框体92)与耳朵之间的构件,例如可以是便携式终端的盖,也可以是头戴式耳机(headphone)或耳机(earphone),只要是能传递振动的构件什么样的构件都可以。此外,也可以是通过使从振动板(显示器91或框体92)产生的声音在空气中传播来传递声音信息那样的便携式终端。而且,也可以是经由多个路径来传递声音信息那样的便携式终端。Furthermore, the mobile terminal of the present invention is characterized in that the display 91 or the housing 92 is vibrated to transmit sound information through ear cartilage or air conduction. The mobile terminal of this example can transmit sound information by bringing the vibrating plate (display 91 or housing 92 ) into contact with the ear directly or via other members to transmit vibration to the cartilage of the ear. That is, by directly or indirectly contacting the vibrating plate (display 91 or housing 92 ) with the ear, it is possible to transmit vibration to the cartilage of the ear and thereby transmit sound information. Thereby, for example, a mobile terminal capable of delivering audio information even when the surroundings are noisy can be obtained. In addition, the member interposed between the vibrating plate (display 91 or frame 92) and the ear may be, for example, a cover of a portable terminal, or a headphone (headphone) or an earphone (earphone), as long as it can transmit vibration. Any kind of component can be used. In addition, it may be a portable terminal that transmits sound information by propagating sound generated from a vibrating plate (display 91 or housing 92 ) in the air. Furthermore, it may be a portable terminal that transmits audio information via a plurality of paths.
本例的便携式终端,使用降低了不需要的振动的发生的压电致动器1来传递声音信息,因此能够传递高品质的声音信息。The portable terminal of this example transmits audio information using the piezoelectric actuator 1 that reduces the occurrence of unnecessary vibrations, so that high-quality audio information can be transmitted.
【实施例】【Example】
对本实用新型的压电致动器的具体例进行说明。具体来说,如下所示制作出图1所示的压电致动器。A specific example of the piezoelectric actuator of the present invention will be described. Specifically, the piezoelectric actuator shown in FIG. 1 was manufactured as follows.
压电元件成为长度23.5mm、宽度3.3mm、厚度0.5mm的长方体状。此外,压电元件成为将厚度30μm的压电体层与内部电极交替层叠的结构,压电体层的总数为16层。压电体层由锆钛酸铅形成。内部电极使用了银钯的合金。The piezoelectric element was in the shape of a cuboid with a length of 23.5 mm, a width of 3.3 mm, and a thickness of 0.5 mm. In addition, the piezoelectric element has a structure in which piezoelectric layers having a thickness of 30 μm and internal electrodes are alternately laminated, and the total number of piezoelectric layers is 16. The piezoelectric layer is formed of lead zirconate titanate. An alloy of silver palladium is used for the internal electrodes.
将印刷有由银钯构成的导电性膏的陶瓷生片层叠之后,加压使其密接,并在规定温度下进行脱脂之后,在1000℃进行烧成,得到了层叠烧结体。The ceramic green sheets on which the conductive paste made of silver and palladium was printed were laminated, pressed to make them stick together, degreased at a predetermined temperature, and then fired at 1000° C. to obtain a laminated sintered body.
接着,将表面电极印刷成与内部电极相比在宽度方向上的两端各长1mm。Next, the surface electrodes were printed so that both ends in the width direction were 1 mm longer than the internal electrodes.
通过表面电极对内部电极间(第1极间、第2极间)施加2kV/mm的电场强度的电压,对压电元件实施了极化。The piezoelectric element was polarized by applying a voltage with an electric field strength of 2 kV/mm between the internal electrodes (between the first and second electrodes) via the surface electrodes.
然后,在与柔性布线基板接合的压电元件的表面,涂敷形成了导电性粘接剂,该导电性粘接剂作为导电粒子而包含进行了镀金的树脂球。此时,在柔性布线基板与压电元件的重叠区域的周缘部的宽度0.3mm的区域,涂敷形成了含有20vol%的导电粒子的导电性粘接剂,在其内侧区域,涂敷形成了含有10vol%的导电粒子的导电性粘接剂。Then, a conductive adhesive containing gold-plated resin balls as conductive particles was applied to the surface of the piezoelectric element bonded to the flexible wiring board. At this time, a conductive adhesive containing 20 vol % of conductive particles was applied to a region of 0.3 mm in width at the periphery of the overlapping region of the flexible wiring board and the piezoelectric element, and a conductive adhesive was applied to the inner region of the region. Conductive adhesive containing 10vol% conductive particles.
然后,通过在使柔性布线基板抵接的状态下进行加热加压,将柔性布线基板导通、固定于压电元件,从而制作出了本实用新型实施例的压电致动器(试样No.1)。另外,作为上述的导电性粘接剂,使用了在厚度方向上导通、在面内方向上不导通的各向异性导电材料。Then, by heating and pressing the flexible wiring substrate in contact with it, the flexible wiring substrate was conducted and fixed to the piezoelectric element, thereby producing the piezoelectric actuator of the embodiment of the present invention (Sample No. .1). In addition, as the above-mentioned conductive adhesive, an anisotropic conductive material that conducts in the thickness direction and does not conduct in the in-plane direction is used.
此外,作为比较例,制作出了除了用焊料将柔性布线基板接合于压电元件以外,与上述的试样No.1相同结构的本实用新型的范围外的压电致动器(试样No.2)。In addition, as a comparative example, except that the flexible wiring substrate was bonded to the piezoelectric element with solder, a piezoelectric actuator outside the scope of the present invention having the same structure as the above-mentioned sample No. 1 was produced (sample No. .2).
然后,对于各个压电致动器,通过柔性布线基板向压电元件施加1kHz的频率、有效值±10Vrms的正弦波信号,进行了驱动试验,结果试样No.1、2都得到了具有100μm的位移量的弯曲振动。Then, for each piezoelectric actuator, a sine wave signal with a frequency of 1kHz and an effective value of ±10Vrms was applied to the piezoelectric element through the flexible wiring substrate, and a driving test was carried out. The displacement of the bending vibration.
接着,输入使频率在0.2~5000Hz之间进行了变化的有效值3V的正弦波信号,对由于柔性布线基板接合面的裂纹而引起的异常振动是否发生进行了确认,结果在本实用新型实施例的试样No.1的压电致动器中,除了观察到源自压电元件的共振、反共振频率的振动以外,并未观察到异常振动。另一方面,对于作为本实用新型的范围外的试样No.2的压电致动器,在源自压电元件的振动以外的频率,测量到异常振动。Next, a sine wave signal with an effective value of 3V whose frequency was changed between 0.2 and 5000 Hz was input to confirm whether abnormal vibrations due to cracks in the joint surface of the flexible wiring board occurred. In the piezoelectric actuator of sample No. 1, abnormal vibration was not observed except vibrations at the resonance and anti-resonance frequencies of the piezoelectric element. On the other hand, in the piezoelectric actuator of Sample No. 2, which is outside the scope of the present invention, abnormal vibration was measured at frequencies other than the vibration originating in the piezoelectric element.
然后,连续施加10万周期的有效值±10Vrms的正弦波信号来进行了驱动试验。本实用新型的范围外的试样No.2发生异常振动,在9万周期柔性布线基板从压电元件剥落下来。Then, a driving test was performed by continuously applying a sine wave signal of an effective value ±10 Vrms for 100,000 cycles. Sample No. 2 outside the scope of the present invention vibrated abnormally, and the flexible wiring board peeled off from the piezoelectric element at 90,000 cycles.
另一方面,本实用新型实施例的试样No.1的压电致动器即使在经过10万周期之后,也没有发生异常振动而继续驱动。此外,在对柔性布线基板进行连接固定的导电性粘接剂也未观察到裂纹、破裂等,没有观察到柔性布线基板的剥落。On the other hand, the piezoelectric actuator of Sample No. 1 of the embodiment of the present invention continued to drive without generating abnormal vibration even after 100,000 cycles. In addition, no cracks, cracks, etc. were observed in the conductive adhesive for connecting and fixing the flexible wiring board, and no peeling of the flexible wiring board was observed.
通过使用本实用新型的压电致动器,不会发生异常振动,此外,即使在长期连续进行了驱动的情况下,也不会发生柔性布线基板从压电元件剥离这样的问题,优异的耐久性得到了确认。By using the piezoelectric actuator of the present invention, abnormal vibration does not occur, and even if it is driven continuously for a long period of time, there is no such problem that the flexible wiring board is peeled off from the piezoelectric element, and it is excellent in durability. Sex is confirmed.
符号说明Symbol Description
1:压电致动器1: Piezoelectric Actuator
2:内部电极2: Internal electrodes
21:第1极21: 1st pole
22:第2极22: 2nd pole
3:压电体层3: Piezoelectric layer
4:层叠体4: laminated body
41:活性部41: Active Department
42:非活性部42: Inactive Department
5:表面电极5: Surface electrode
51:第1表面电极51: 1st surface electrode
52:第2表面电极52: 2nd surface electrode
53:第3表面电极53: 3rd surface electrode
6:柔性布线基板6: Flexible wiring substrate
61:布线导体61: wiring conductor
601:周缘部601: peripheral part
602:一个主面的外周与表面电极之间的区域602: the area between the periphery of one main surface and the surface electrode
7:导电性粘接剂7: Conductive adhesive
81:振动板81: Vibration plate
82:接合构件82: Joining components
91:显示器91: display
92:框体92: frame
921:框体主体921: Frame body
922:振动板922: Vibration plate
93:接合件93: Joints
Claims (8)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012-111705 | 2012-05-15 | ||
JP2012111705 | 2012-05-15 | ||
PCT/JP2012/072201 WO2013171915A1 (en) | 2012-05-15 | 2012-08-31 | Piezoelectric actuator, piezoelectric vibration device, and mobile terminal |
Publications (1)
Publication Number | Publication Date |
---|---|
CN204170914U true CN204170914U (en) | 2015-02-25 |
Family
ID=49583353
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201290001193.7U Expired - Fee Related CN204170914U (en) | 2012-05-15 | 2012-08-31 | Piezo-activator, piezoelectric vibrating device and portable terminal |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5474262B1 (en) |
KR (1) | KR101601750B1 (en) |
CN (1) | CN204170914U (en) |
TW (1) | TWI520390B (en) |
WO (1) | WO2013171915A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113423514A (en) * | 2019-02-14 | 2021-09-21 | Tdk株式会社 | Piezoelectric composition, piezoelectric element, piezoelectric device, piezoelectric transformer, ultrasonic motor, ultrasonic generating element, and filter element |
CN114697831A (en) * | 2020-12-25 | 2022-07-01 | Tdk株式会社 | Vibration device |
CN115315320A (en) * | 2020-03-18 | 2022-11-08 | 株式会社村田制作所 | Actuator, fluid control device, and method for manufacturing actuator |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106716660B (en) * | 2014-08-29 | 2019-09-13 | 天津威盛电子有限公司 | Stacked piezo ceramic element |
CN110139478B (en) * | 2019-04-02 | 2021-08-13 | 苏州诺莱声科技有限公司 | Method for connecting piezoelectric element with good consistency with flexible circuit board |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0614396A (en) | 1991-11-30 | 1994-01-21 | Nippon Dempa Kogyo Co Ltd | Ultrasonic probe |
JPH11185526A (en) * | 1997-12-17 | 1999-07-09 | Murata Mfg Co Ltd | Anisotropic conductive adhesive, electronic circuit parts, and piezoelectric parts, and bonding method for electric parts |
DE60044666D1 (en) * | 1999-10-01 | 2010-08-26 | Ngk Insulators Ltd | PIEZOELECTRIC / ELECTROSTRICTIVE COMPONENT AND METHOD FOR THE PRODUCTION THEREOF |
JP2001284669A (en) * | 2000-03-31 | 2001-10-12 | Hitachi Koki Co Ltd | Piezoelectric actuator and ink jet print head having the same |
JP2002010393A (en) | 2000-04-19 | 2002-01-11 | Murata Mfg Co Ltd | Piezo-electric electroacoustic transducer |
JPWO2005004535A1 (en) | 2003-07-02 | 2006-11-24 | シチズン電子株式会社 | Panel type speaker |
JP2006082343A (en) * | 2004-09-15 | 2006-03-30 | Fuji Photo Film Co Ltd | Liquid jet head, image forming apparatus, and method of manufacturing liquid jet head |
JP2006238072A (en) | 2005-02-25 | 2006-09-07 | Nec Tokin Corp | Acoustic vibration generating piezoelectric bimorph element |
JP5028905B2 (en) * | 2006-08-11 | 2012-09-19 | コニカミノルタアドバンストレイヤー株式会社 | Drive device |
JP5506009B2 (en) * | 2007-02-27 | 2014-05-28 | キヤノン株式会社 | Piezoelectric element, method for manufacturing the same, diaphragm, and vibration wave drive device |
JP2009177751A (en) * | 2008-01-28 | 2009-08-06 | Taiyo Yuden Co Ltd | Piezoelectric element, piezoelectrically vibrating plate and piezoelectric-type electroacoustic transducer |
JP5675137B2 (en) * | 2010-03-23 | 2015-02-25 | キヤノン株式会社 | Piezoelectric element used in vibration device, vibration device, and dust removing device having vibration device |
JP5584775B2 (en) * | 2010-10-27 | 2014-09-03 | 京セラ株式会社 | Electronic device and portable terminal equipped with the same |
-
2012
- 2012-08-31 KR KR1020127025687A patent/KR101601750B1/en active Active
- 2012-08-31 CN CN201290001193.7U patent/CN204170914U/en not_active Expired - Fee Related
- 2012-08-31 WO PCT/JP2012/072201 patent/WO2013171915A1/en active Application Filing
- 2012-08-31 JP JP2013516892A patent/JP5474262B1/en active Active
-
2013
- 2013-05-15 TW TW102117247A patent/TWI520390B/en active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113423514A (en) * | 2019-02-14 | 2021-09-21 | Tdk株式会社 | Piezoelectric composition, piezoelectric element, piezoelectric device, piezoelectric transformer, ultrasonic motor, ultrasonic generating element, and filter element |
CN115315320A (en) * | 2020-03-18 | 2022-11-08 | 株式会社村田制作所 | Actuator, fluid control device, and method for manufacturing actuator |
CN115315320B (en) * | 2020-03-18 | 2024-04-02 | 株式会社村田制作所 | Actuator, fluid control device, and method for manufacturing actuator |
CN114697831A (en) * | 2020-12-25 | 2022-07-01 | Tdk株式会社 | Vibration device |
Also Published As
Publication number | Publication date |
---|---|
JP5474262B1 (en) | 2014-04-16 |
TWI520390B (en) | 2016-02-01 |
TW201401591A (en) | 2014-01-01 |
JPWO2013171915A1 (en) | 2016-01-07 |
WO2013171915A1 (en) | 2013-11-21 |
KR101601750B1 (en) | 2016-03-09 |
KR20140099563A (en) | 2014-08-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103534827B (en) | Piezoelectric actuator, piezoelectric vibrating device and portable terminal device | |
CN104350765B (en) | Piezo-activator, piezoelectric vibrating device and portable terminal device | |
CN204577470U (en) | Piezo-activator, piezoelectric vibrating device and portable terminal | |
CN103534828B (en) | Piezoelectric actuator, piezoelectric vibrating device and portable terminal | |
CN204130594U (en) | Piezoelectric actuator, piezoelectric vibrating device and portable terminal | |
CN204170914U (en) | Piezo-activator, piezoelectric vibrating device and portable terminal | |
JP5865963B2 (en) | Piezoelectric actuator, piezoelectric vibration device, and portable terminal | |
WO2013171918A1 (en) | Piezoelectric actuator, piezoelectric vibration device, and mobile terminal | |
CN104285309B (en) | Piezoelectric element and possess its piezoelectric vibrating device, portable terminal, sound generator, sound generation device and electronic equipment | |
CN104285309A (en) | Piezoelectric element, piezoelectric vibrating device having same, portable terminal, sound generator, sound generating device, and electronic equipment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150225 Termination date: 20210831 |
|
CF01 | Termination of patent right due to non-payment of annual fee |