CN204119708U - Heat radiator - Google Patents

Abstract

The utility model relates to a heat sink that can be arranged between an electronic component and a fan. The fan is used to blow an airflow along a first direction. The heat sink has at least one guide plate and at least two heat dissipation fins. The heat conductive plate is arranged between the two heat dissipation fins. The heat conductive plate has a top surface and a side surface. The top surface extends to the side surface. The side surface is inclined relative to the fan, and then the airflow is guided from the first direction to a second direction through the side surface. In this way, the wind resistance of the fan flow channel is reduced by gradually guiding the flow.

Description

heat sink

【Technical field】

The utility model relates to a radiator, in particular to a radiator which can be used for electronic components.

【Background technique】

Most electronic components, such as a central processing unit (CPU), a graphics processing unit (GPU), or a memory, etc., will generate working heat when performing data operations. If the electronic components in operation cannot effectively dissipate the heat energy emitted by them, the heat energy accumulated on the electronic components will affect the operation of the electronic components, resulting in a reduction in the operation speed of the electronic components. And when the temperature exceeds the temperature range that the electronic components can withstand, in addition to causing unstable operation of the electronic components, in severe cases, it is more likely to be burned due to excessive temperature. Therefore, for electronic components that tend to dissipate a large amount of heat energy, the heat dissipation efficiency is particularly important.

In order to remove heat accumulated on the electronic components, a common cooling method is to install a heat sink on the electronic components. The currently commonly used heat dissipation device includes a heat sink and a fan used in conjunction with the heat sink. The heat sink includes a heat dissipation base and a plurality of heat dissipation fins arranged at intervals on the heat dissipation base. In use, the surface of the electronic component is in contact with the heat sink, so that the heat energy of the electronic component is conducted to the heat sink, and then the heat energy is conducted to each heat dissipation fin through the heat sink. During this process, the fan blows an airflow in a direction perpendicular to the cooling base, so that the airflow flows between the plurality of cooling fins and contacts the surface of the cooling base, so that the working heat is carried away from the cooling base and the cooling fins through the airflow. Leave. This way of using a fan with a heat sink, although it can remove heat from the electronic components. However, when the airflow flows towards the heat sink, the airflow hits the surface of the heat sink in a direction perpendicular to the heat sink, so it is easy to make the air flow bounce back on the surface of the heat sink, forming a reverse airflow that resists the original airflow direction. This will cause the reverse airflow and the original airflow to form wind resistance and turbulent flow between the plurality of cooling fins. This will increase the wind pressure loss of the original airflow and reduce its flow velocity, so that the heat sink cannot fully utilize the airflow blown by the fan to remove heat, thus failing to achieve a good heat dissipation effect.

Therefore, how to improve the problem of poor heat dissipation caused by the reverse airflow when the airflow flows to the radiator is actually one of the issues that the relevant industry wants to solve at present.

【Content of utility model】

In view of the above problems, the utility model provides a radiator, which can reduce the wind resistance of the fan flow channel through gradual flow diversion.

To achieve the above purpose, the radiator of the present invention can be arranged between an electronic component and a fan. The fan is used to blow an airflow along a first direction. The radiator has at least one guide fin and at least two heat dissipation fins. The heat conduction sheet is arranged between the two heat dissipation fins. The heat conduction sheet has a top surface and a side surface. The top surface extends to the sides. The side surface forms an inclined plane relative to the fan, whereby the air flow is guided from the first direction to flow in a second direction through the side surface.

In one embodiment, the top surface is an arc surface. The curved surface can change the direction of the vertical air flow with a small flow resistance, thereby retaining the air volume and air pressure to the maximum, improving the efficiency of the fan and increasing the heat dissipation effect of the heat dissipation module.

In one embodiment, the radiator also has at least one locking piece. The locking piece is passed through the two heat conducting sheets and the cooling fins.

In one embodiment, each heat conduction fin and the heat dissipation fin are integrally formed.

In one embodiment, the heat conducting sheet is a metal sheet.

In one embodiment, the side is a curved surface.

In one embodiment, the first direction is a direction perpendicular to the electronic components. The second direction is a direction parallel to the electronic components.

In one embodiment, the side surface of the heat conducting sheet extends along the second direction. In one embodiment, the heat dissipation fins extend along the second direction.

In one embodiment, the cooling fin is a ceramic cooling fin or a graphite cooling fin.

【Description of drawings】

Fig. 1 is an exploded schematic diagram of the structure of the first embodiment of the radiator of the present invention.

Fig. 2 is a schematic side view of the first embodiment of the radiator of the present invention in cooperation with an electronic component and a fan.

Fig. 3 is an exploded schematic diagram of the structure of the second embodiment of the radiator of the present invention.

Fig. 4 is a schematic side view of the second embodiment of the radiator of the present invention cooperating with an electronic component and a fan.

Description of main component symbols:

100, 200 Radiator

110 Locking piece

111 screw

112 Nut

12 Electronic components

120, 220 heat conduction sheet

121, 221 top surface

123, 223 side

127, 137 channels

130, 230 cooling fins

131, 231 Clearance

132 fin extension

140 electronic components

2 fans

A Airflow

Y first direction

X Second direction

Z Second direction

【Detailed ways】

In order to understand the concept of the utility model more clearly, several specific implementations of the utility model will be described in detail below in conjunction with the accompanying drawings. The same symbols represent members or devices having the same or similar functions.

Please refer to FIG. 1 and FIG. 2 first. In the first embodiment of the present invention, the radiator 100 can be disposed between an electronic component 140 (such as a CPU) and a fan 2 . The fan 2 is used for blowing an airflow A along a first direction Y. The heat sink 100 has at least one heat conducting fin 120 (only one of them is marked in the figure) and at least two heat dissipation fins 130 (only one of them is marked in the figure). In this embodiment, the plurality of heat conducting fins 120 and the plurality of heat dissipation fins 130 are arranged alternately. The first direction Y is a direction perpendicular to the electronic component 140 , and the second direction X is a direction parallel to the electronic component 140 .

The heat conducting sheet 120 is, for example, a metal sheet, which has a top surface 121 and at least one side surface 123 . The top surface 121 extends to a side surface 123 . For example, in this embodiment, a side surface 123 extends from the top surface 121 to both sides, and the side surface 123 forms an inclined plane relative to the fan 2 . Thereby, the airflow A is directed from the first direction Y to flow in a second direction X through the side surface 123 .

The cooling fin 130 is, for example, a ceramic cooling fin or a graphite cooling fin. At least one heat conduction fin 120 is disposed between the two heat dissipation fins 130 , and a gap 131 is sandwiched between the heat dissipation fins 130 and the heat conduction fin 120 . The gap 131 is capable of allowing the airflow A to circulate.

In this embodiment, the side surface 123 of the heat conduction sheet 120 is further extended along the second direction X, and the side surface 123 is substantially an L-shaped curved surface. A fin extension portion 132 of the heat dissipation fin 130 is also extended along the second direction X direction, and is substantially inverted L-shaped. In this way, the contact area between the heat conduction sheet 120 and the heating elements (such as the electronic component 140 and the electronic component 12 ) and the heat dissipation fins 130 is increased to improve the heat dissipation effect.

The heat sink 100 also has at least one locking member 110 passing between the heat conduction sheet 120 and the heat dissipation fins 130 for fixing the heat conduction sheet 120 and the heat dissipation fins 130 . In an embodiment of the present invention, the radiator 100 is provided with three locking pieces 110 . The locking piece 110 can be any combination function component, for example, the locking piece 110 in this embodiment has a screw 111 and a nut 112 . Corresponding holes 127 and 137 are provided on the heat conducting sheet 120 and the cooling fins 130 . The screws 111 pass through the holes 127 of the plurality of heat conducting fins 120 and the holes 137 of the plurality of heat dissipation fins 130 and are screwed together with the nuts 112 .

Through the heat sink of the first embodiment of the present utility model, since the heat conduction fin 120 has a side surface that is an inclined plane relative to the fan 2, the air flow can be passed from the first direction Y to the second direction X, so as to improve heat dissipation. Effect.

The utility model is not limited to the above-mentioned first embodiment and its possible variations. Please refer to FIG. 3 and FIG. 4 again. The radiator 200 of the second embodiment of the present invention is disposed between the electronic component 140 and the fan 2 . The heat sink 200 has at least one heat conduction fin 220 and at least two heat dissipation fins 230 . The heat conduction sheet 220 can be sandwiched between the two heat dissipation fins 230 , and then a gap 231 is sandwiched between the two heat dissipation fins 230 for the air flow A to flow through. In this embodiment, a plurality of heat conducting fins 220 and a plurality of heat dissipation fins 230 are alternately arranged. In addition, in this embodiment, the heat conducting sheet 220 can be integrally formed with the cooling fins 230 . But not limited thereto, the two can also be combined by locking or welding the locking member 110 as in the first embodiment.

The heat conduction sheet 220 has a top surface 221 and a side surface 223 . The difference from the first embodiment is that the top surface 221 is an arc and extends to the side surface 223 . The curved top surface 221 can more effectively guide the airflow A of the fan 2 from the first direction Y to the second direction Z gradually with a lower flow resistance than the top surface 121 . In this way, the fan 2 can retain the air volume and air pressure to the maximum, so that the effective utilization rate of the fan can be improved, and the heat dissipation effect of the radiator can be increased.

The above are only preferred embodiments of the present utility model. The scope of the present utility model is not limited by the above-mentioned embodiments. All equivalent modifications or changes made by those who are familiar with the technology of this case in accordance with the spirit of the utility model should be included in the claims.

Claims (9)

1. a radiator, in order to be arranged between an electronic component and a fan, described fan will blow an air-flow along a first direction, it is characterized in that, described radiator comprises:

At least one conducting strip, described conducting strip has an end face and a side, and described end face extends to described side, and the relatively described fan in described side is an inclined-plane, and by this, described air-flow is flowed toward a second direction from described first direction water conservancy diversion by described side; And

At least two radiating fins, set firmly described conducting strip between two radiating fins.

2. the radiator according to claim the 1, is characterized in that, described end face is a cambered surface.

3. the radiator according to claim the 1 or 2, comprises at least one locking part, and described locking part is arranged in described conducting strip and described radiating fin.

4. the radiator according to claim the 1 or 2, is characterized in that, described conducting strip and described radiating fin are one-body molded persons.

5. the radiator according to claim the 1 or 2, is characterized in that, described conducting strip is a sheet metal.

6. the radiator according to claim the 1 or 2, is characterized in that, described first direction is the direction of vertical described electronic component, and described second direction is the direction of parallel described electronic component.

7. the radiator according to claim the 6, is characterized in that, the described side of described conducting strip extends along described second direction.

8. the radiator according to claim the 6, is characterized in that, described radiating fin extends along described second direction.

9. the radiator according to claim the 1 or 2, is characterized in that, described radiating fin is a ceramic radiating fin or a graphite heat radiation fin.