CN204029790U - A kind of radiator structure of semiconductor components and devices - Google Patents
A kind of radiator structure of semiconductor components and devices Download PDFInfo
- Publication number
- CN204029790U CN204029790U CN201420489436.7U CN201420489436U CN204029790U CN 204029790 U CN204029790 U CN 204029790U CN 201420489436 U CN201420489436 U CN 201420489436U CN 204029790 U CN204029790 U CN 204029790U
- Authority
- CN
- China
- Prior art keywords
- devices
- semiconductor components
- radiator
- heat
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 66
- 239000004519 grease Substances 0.000 claims abstract description 19
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 6
- 238000009434 installation Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses heat radiation (heat balance) structure of a kind of semiconductor components and devices relating to semiconductor heat-dissipating technical field.This radiator structure comprises pcb board, the semiconductor components and devices be welded on pcb board, heat-conducting silicone grease and radiator, described radiator offers hole, described pcb board concora crush is on described radiator, and the semiconductor components and devices be welded on pcb board is placed in the hole of described radiator; Described heat-conducting silicone grease fills up the space between semiconductor components and devices and hole corresponding to it.The utility model is by changing the reasonable arrangement of bar-shaped semiconductor components and devices on pcb board and radiator and special installation, and bar-shaped semiconductor components and devices is dispelled the heat balanced, reduce thermal resistance, reduce volumetric spaces, this radiator structure profile is unrestricted.
Description
Technical field
The utility model relates to semiconductor heat-dissipating technical field, particularly relates to a kind of heat radiation (heat balance) structure of semiconductor components and devices.
Background technology
In electronic circuit, along with improving constantly of integrated level and progressively reducing of volume, the electronic equipment originally taking larger space is reduced gradually, but the caloric value of its internal unit volume constantly increase.In Switching Power Supply, power circuit, bar-shaped semiconductor components and devices greatly and very easily causes temperature overheating problem because of caloric value, if the heat distributed can not be got rid of in time, then the operating state of electronic devices and components and the stability of system can be greatly affected.
In prior art, electronic devices and components are normally fixed on aluminum soleplate by securing member by radiator structure, aluminum soleplate is fixed on a heat sink, it is wherein plane contact between electronic devices and components and aluminum soleplate, coated with thermally conductive silicone grease between the two, utilize heat-conducting silicone grease and aluminum soleplate that the heat of electronic devices and components is delivered to radiator rapidly, then drained in air by radiator.In this traditional radiator structure, because electronic devices and components and aluminum soleplate are directly for face contacts, heat transfer between the two can only be realized by this heat dissipation channel of contact plane, and thus the size of contact plane determines its radiating effect.
Utility model content
The utility model object is to provide a kind of heat radiation (heat balance) structure of small volume space semiconductor components and devices.
The utility model technical solution problem adopts following technical scheme:
Heat radiation (heat balance) structure of a kind of small volume space semiconductor components and devices that the utility model provides, this radiator structure comprises pcb board, the semiconductor components and devices be welded on pcb board, heat-conducting silicone grease and radiator, described radiator offers hole, described pcb board concora crush is on described radiator, and the semiconductor components and devices be welded on pcb board is placed in the hole of described radiator; Described heat-conducting silicone grease fills up the space between semiconductor components and devices and hole corresponding to it.
Optionally, described semiconductor components and devices is evenly welded on pcb board, and vertical with pcb board.This kind of structure can make the heat conduction of heater (semiconductor components and devices) even, improves radiating effect.
Optionally, described semiconductor components and devices is bar-shaped semiconductor components and devices.Scheme of the present utility model effectively can solve the heat dissipation problem of the especially bar-shaped semiconductor components and devices of semiconductor components and devices.
Optionally, described radiator material can be copper or aluminium, and above-mentioned material is just enumerated, and exhaustive, also can select the radiator of other materials, can radiating effect be reached.
Optionally, described hole cross section is circular.This kind of structure also can make the heat conduction of heater (semiconductor components and devices) even, improves radiating effect.
Optionally, hole diameter on described radiator is more bigger than semiconductor components and devices, depth ratio semiconductor components and devices is slightly dark, just as semiconductor components and devices, with the fill gaps heat-conducting silicone grease between semiconductor components and devices and corresponding with it hole offered on a heat sink.
Described bar-shaped semiconductor components and devices is in applications of electronic circuitry, the power semiconductor components and parts that a kind of caloric value is large.
Described heat-conducting silicone grease is high temperature resistant, the silicon grease material that good insulating, conductive coefficient are high that this area is commonly used.
The utility model has following beneficial effect:
The utility model solves in small volume space environment, power circuit semiconductor components and devices temperature overheating problem, because of between heat-conducting silicone grease with radiator for body contacts, the heat that semiconductor components and devices is produced better can be passed to radiator by heat-conducting silicone grease.Make semiconductor components and devices minimum with the thermal resistance of external environment, keep the bulk temperature lower (with structure heat balance) of semiconductor components and devices (heater).
The utility model is by changing the reasonable arrangement of semiconductor components and devices on pcb board and radiator and special installation, and semiconductor components and devices is dispelled the heat balanced, reduce thermal resistance, reduce volumetric spaces, this radiator structure profile is unrestricted.
Accompanying drawing explanation
Fig. 1 is heat radiation (heat balance) structural representation of the small volume space semiconductor components and devices that the utility model embodiment 1 provides;
In figure, mark is illustrated as: 1-PCB plate; 2-semiconductor components and devices; 3-heat-conducting silicone grease; 4-radiator.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the technical solution of the utility model is further elaborated.
Embodiment 1
Present embodiments provide a kind of heat radiation (heat balance) structure of small volume space semiconductor components and devices, as shown in Figure 1, this radiator structure comprises pcb board 1, the semiconductor components and devices 2 be welded on pcb board 1, heat-conducting silicone grease 3 and radiator 4, described radiator 4 offers hole, described pcb board 1 concora crush is on described radiator 4, and the semiconductor components and devices 2 be welded on pcb board is placed in the hole of described radiator 4; Described heat-conducting silicone grease 3 fills up the space between semiconductor components and devices 2 and hole corresponding to it.
Preferred described semiconductor components and devices is evenly welded on pcb board, and vertical with pcb board.
The preferred bar-shaped semiconductor components and devices of described semiconductor components and devices.
Described radiator material can be copper or aluminium.
Preferred described hole cross section is circular.
Optionally, hole diameter on described radiator is more bigger than semiconductor components and devices, depth ratio semiconductor components and devices is slightly dark, just as semiconductor components and devices, with the fill gaps heat-conducting silicone grease between semiconductor components and devices and corresponding with it hole offered on a heat sink.
Described bar-shaped semiconductor components and devices is in applications of electronic circuitry, the power semiconductor components and parts that a kind of caloric value is large.
Described heat-conducting silicone grease is high temperature resistant, the silicon grease material that good insulating, conductive coefficient are high that this area is commonly used.Last it is noted that above embodiment is only in order to illustrate the technical solution of the utility model, be not intended to limit; Although be described in detail the utility model with reference to previous embodiment, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of each embodiment technical scheme of the utility model.
Claims (6)
1. the radiator structure of a semiconductor components and devices, this radiator structure comprises pcb board (1), the semiconductor components and devices (2) be welded on pcb board (1), heat-conducting silicone grease (3) and radiator (4), (4) offer hole with described radiator, described pcb board (1) concora crush is on described radiator (4), and the semiconductor components and devices (2) be welded on pcb board is placed in the hole of described radiator (4); Described heat-conducting silicone grease (3) fills up the space between semiconductor components and devices (2) and hole corresponding to it.
2. the radiator structure of semiconductor components and devices according to claim 1, is characterized in that, described semiconductor components and devices is evenly welded on pcb board, and vertical with pcb board.
3. the radiator structure of semiconductor components and devices according to claim 1, is characterized in that, described semiconductor components and devices is bar-shaped semiconductor components and devices.
4. the radiator structure of semiconductor components and devices according to claim 1, is characterized in that, described radiator material is copper or aluminium.
5. the radiator structure of semiconductor components and devices according to claim 1, is characterized in that, described hole cross section is circular.
6. the radiator structure of semiconductor components and devices according to claim 1, is characterized in that, the hole diameter on described radiator is more bigger than semiconductor components and devices, and depth ratio semiconductor components and devices is slightly dark, just as semiconductor components and devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420489436.7U CN204029790U (en) | 2014-08-27 | 2014-08-27 | A kind of radiator structure of semiconductor components and devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420489436.7U CN204029790U (en) | 2014-08-27 | 2014-08-27 | A kind of radiator structure of semiconductor components and devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204029790U true CN204029790U (en) | 2014-12-17 |
Family
ID=52069621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420489436.7U Expired - Fee Related CN204029790U (en) | 2014-08-27 | 2014-08-27 | A kind of radiator structure of semiconductor components and devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204029790U (en) |
-
2014
- 2014-08-27 CN CN201420489436.7U patent/CN204029790U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141217 Termination date: 20170827 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |