CN204007925U - The highly reliable temperature-sensitive chip of a kind of quick response - Google Patents
The highly reliable temperature-sensitive chip of a kind of quick response Download PDFInfo
- Publication number
- CN204007925U CN204007925U CN201420420080.1U CN201420420080U CN204007925U CN 204007925 U CN204007925 U CN 204007925U CN 201420420080 U CN201420420080 U CN 201420420080U CN 204007925 U CN204007925 U CN 204007925U
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- Prior art keywords
- sensitive chip
- temperature
- ceramic substrate
- described ceramic
- highly reliable
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- Expired - Lifetime
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- 239000000758 substrate Substances 0.000 claims abstract description 31
- 239000000919 ceramic Substances 0.000 claims abstract description 27
- 239000003822 epoxy resin Substances 0.000 claims abstract description 7
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 7
- 230000008595 infiltration Effects 0.000 claims description 6
- 238000001764 infiltration Methods 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 3
- 230000035945 sensitivity Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Thermistors And Varistors (AREA)
Abstract
The utility model belongs to temperature-sensitive chip product technical field, the concrete highly reliable temperature-sensitive chip of a kind of quick response that discloses, comprise the ceramic substrate with metallic surface electrode, the top of described ceramic substrate is pasted with NTC temperature-sensitive chip, the periphery of described ceramic substrate and NTC temperature-sensitive chip is encapsulated with epoxy resin, on two surface electrodes of described ceramic substrate, is welded with lead-in wire.In this temperature-sensitive chip thermometric process, heat conduction required time is short, and thermal time constant is little, and sensitivity is high, can effectively meet the highly sensitive requirement to temperature sensing, and reliability is high, the high conformity of resistance value, and product percent of pass is high.
Description
Technical field
The utility model belongs to temperature-sensitive chip product technical field, particularly the highly reliable temperature-sensitive chip of a kind of quick response.
Background technology
NTC temperature-sensitive chip is to belong to a kind of semiconductor heat photosensitive elements, that NTC temperature-sensitive chip has is highly sensitive, fast response time, volume are little, etc. advantage.Along with the development of electronic technology, the electric equipment products in our daily life have that the finished product of NTC temperature-sensitive chip exists, its application is more extensive.
In prior art, as shown in Figure 1, it comprises NTC temperature-sensitive chip 1 ' conventional temperature-sensitive chip, and on NTC temperature-sensitive chip 1 ', is welded with lead-in wire 2 ', then seals epoxy resin 3 ', and this temperature-sensitive chip has the following disadvantages:
(1) reliability is low: because the fragility of NTC temperature-sensitive chip 1 ' is stronger, when NTC temperature-sensitive chip 1 ' is assembled into after resistance welded lead-in wire, can be subject to the effect of external force and in transportation, when vibrations and pressurized, NTC temperature-sensitive chip 1 ' easily produces micro-crack and fracture;
(2) precision is low, response speed is slow: because the spindle of the porcelain body briquetting moulding of NTC temperature-sensitive chip 1 ' has certain thickness, on in the middle of it and limit, be subject to material scatter, density and sintering atmosphere homogeneity, etc. the impact of factor, thereby make its precision low, response speed is slow;
(3) directly seal, affect its quality: in manufacturing process, NTC temperature-sensitive chip 1 ' is not carried out to technical processing to prevent the phenomenons such as chip fracture, just NTC temperature-sensitive chip 1 ' is sealed by epoxy resin 3 ', affect product quality.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, the concrete highly reliable temperature-sensitive chip of a kind of quick response that discloses, in this temperature-sensitive chip thermometric process, heat conduction required time is short, thermal time constant is little, sensitivity is high, can effectively meet the highly sensitive requirement to temperature sensing, and reliability is high, the high conformity of resistance value, product percent of pass is high.
In order to overcome above-mentioned technical purpose, the utility model is realized by following technical scheme:
The highly reliable temperature-sensitive chip of a kind of quick response described in the utility model, comprise the ceramic substrate with metallic surface electrode, the top of described ceramic substrate is pasted with NTC temperature-sensitive chip, the periphery of described ceramic substrate and NTC temperature-sensitive chip is encapsulated with epoxy resin, on two surface electrodes of described ceramic substrate, is welded with lead-in wire.
Described ceramic substrate is the alumina substrate that burning infiltration has two surperficial silver electrodes.
In the utility model, described ceramic substrate and NTC temperature-sensitive chip width dimensions are all 0.5～5mm.
Compared with prior art, the beneficial effects of the utility model are:
In temperature-sensitive chip thermometric process described in the utility model, heat conduction required time is short, and thermal time constant is little, and sensitivity is high, can effectively meet the highly sensitive requirement to temperature sensing, and reliability is high, the high conformity of resistance value, and product percent of pass is high.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail:
Fig. 1 is the temperature-sensitive chip manufacturing schematic flow sheet described in prior art;
Fig. 2 is the highly reliable temperature-sensitive chip structure of quick response described in the utility model schematic diagram;
Fig. 3 is the highly reliable temperature-sensitive chip manufacturing of quick response described in the utility model schematic flow sheet.
Embodiment
As shown in Figure 1, the highly reliable temperature-sensitive chip of a kind of quick response described in the utility model, comprise the ceramic substrate 1 that contains two metallic surface electrode, the top of described ceramic substrate 1 is pasted with NTC temperature-sensitive chip 2, the periphery of described ceramic substrate 1 and NTC temperature-sensitive chip 2 is encapsulated with epoxy resin 3, is welded with lead-in wire 4 on two surface electrodes of described ceramic substrate 1.
In the utility model, the alumina substrate of described ceramic substrate 1 two surperficial silver electrodes for burning infiltration has.
Below illustrate the manufacturing process (as shown in Figure 3) of the highly reliable temperature-sensitive chip of a kind of quick response described in the utility model:
(1) prepare bulk ceramic substrate 10;
(2) burning infiltration surface electrode: at two surperficial burning infiltration surface electrodes 11 of bulk ceramic substrate 10, for example, be the formation silver alumina substrate of burning infiltration silver slurry;
(3) the good NTC temperature-sensitive chip 20 into strips of cutting-up is bonded in to the top of ceramic substrate 10, forms together composite thermistor bar 30;
(4) scribing: composite thermistor bar 30 is carried out to accurate resistance again and control scribing, the size of calculating according to resistivity measurement is accurately by the little chip of wide rectangular cutting-up slabbing (length and width are in 0.5～5mm left and right), so just can obtain the single thermistor chip with double-face electrode, include the ceramic substrate 1 described in the utility model, NTC temperature-sensitive chip 2;
(4) on two surface electrodes of above-mentioned ceramic substrate 1, correspondence is welded with lead-in wire 4;
(5) last, the upper epoxy resin 3 of periphery encapsulation of ceramic substrate 1, NTC temperature-sensitive chip 2, lead-in wire 4 pads, can make the encapsulation of carrying out various forms of thermistors or temperature sensor described in the utility model.
The utility model is not limited to above-mentioned embodiment, every various changes of the present utility model or modification are not departed to spirit and scope of the present utility model, if these are changed and within modification belongs to claim of the present utility model and equivalent technologies scope, the utility model also means and comprises these changes and modification.
Claims (3)
1. one kind responds highly reliable temperature-sensitive chip fast, it is characterized in that: comprise the ceramic substrate with metallic surface electrode, the top of described ceramic substrate is pasted with NTC temperature-sensitive chip, the periphery of described ceramic substrate and NTC temperature-sensitive chip is encapsulated with epoxy resin, on two surface electrodes of described ceramic substrate, is welded with lead-in wire.
2. the highly reliable temperature-sensitive chip of quick response according to claim 1, is characterized in that: described ceramic substrate is the alumina substrate that burning infiltration has silver electrode.
3. the highly reliable temperature-sensitive chip of quick response according to claim 1 and 2, is characterized in that: described ceramic substrate and NTC temperature-sensitive chip width dimensions are all 0.5～5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420420080.1U CN204007925U (en) | 2014-07-28 | 2014-07-28 | The highly reliable temperature-sensitive chip of a kind of quick response |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420420080.1U CN204007925U (en) | 2014-07-28 | 2014-07-28 | The highly reliable temperature-sensitive chip of a kind of quick response |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204007925U true CN204007925U (en) | 2014-12-10 |
Family
ID=52047907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420420080.1U Expired - Lifetime CN204007925U (en) | 2014-07-28 | 2014-07-28 | The highly reliable temperature-sensitive chip of a kind of quick response |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204007925U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105651411A (en) * | 2015-12-30 | 2016-06-08 | 中国电子科技集团公司第四十九研究所 | High-temperature platinum resistor package structure and preparation method thereof |
| US20180321091A1 (en) * | 2015-11-02 | 2018-11-08 | Epcos Ag | Sensor Element and Method for Producing a Sensor Element |
-
2014
- 2014-07-28 CN CN201420420080.1U patent/CN204007925U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180321091A1 (en) * | 2015-11-02 | 2018-11-08 | Epcos Ag | Sensor Element and Method for Producing a Sensor Element |
| US10788377B2 (en) | 2015-11-02 | 2020-09-29 | Epcos Ag | Sensor element and method for producing a sensor element |
| US10908030B2 (en) * | 2015-11-02 | 2021-02-02 | Epcos Ag | Sensor element and method for producing a sensor element |
| CN105651411A (en) * | 2015-12-30 | 2016-06-08 | 中国电子科技集团公司第四十九研究所 | High-temperature platinum resistor package structure and preparation method thereof |
| CN105651411B (en) * | 2015-12-30 | 2018-06-29 | 中国电子科技集团公司第四十九研究所 | A kind of high temperature platinum resistance encapsulating structure and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141210 |