CN203968554U - Double-sided adhesive thermal silicone sheet - Google Patents
Double-sided adhesive thermal silicone sheet Download PDFInfo
- Publication number
- CN203968554U CN203968554U CN201420300563.8U CN201420300563U CN203968554U CN 203968554 U CN203968554 U CN 203968554U CN 201420300563 U CN201420300563 U CN 201420300563U CN 203968554 U CN203968554 U CN 203968554U
- Authority
- CN
- China
- Prior art keywords
- heat
- silica gel
- release film
- double
- film layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
技术领域 technical field
本实用新型涉及电子元器件的导热技术,尤其是涉及一种双面粘性导热硅胶片。 The utility model relates to the heat conduction technology of electronic components, in particular to a double-sided viscous heat conduction silica gel sheet.
背景技术 Background technique
由于电子产品不断的更新换代,产品设计越来越精良细小化如笔记本电脑,灯饰、播放器、手机、电视等等,由于产品空间变小,所以带来的散热难问题越来越严重,对于这样的问题,只有研发出多种高性能的热传导材料,才能应对各种各样的复杂情况散热问题,想办法让热量快速散去,或者快速传递到产品外界,确保产品的使用性能和寿命。先热传导材料研发推广,已能达到散热快的目的。现在很多行业产品需求导热材料自带粘性,是其年热源和散热器件,很多超薄型电子需求的导热硅胶片无法得到有效的生产。 Due to the continuous upgrading of electronic products, the design of products is becoming more and more sophisticated and miniaturized, such as notebook computers, lighting, players, mobile phones, TVs, etc., because the space of products becomes smaller, the problem of heat dissipation becomes more and more serious. For such problems, only by developing a variety of high-performance heat-conducting materials can we deal with various complex heat dissipation problems, find ways to quickly dissipate the heat, or quickly transfer it to the outside of the product to ensure the performance and life of the product. The research and development and promotion of heat conduction materials have been able to achieve the purpose of fast heat dissipation. Many industries now require thermally conductive materials with their own viscosity, which is their annual heat source and heat dissipation device. Many ultra-thin electronic thermally conductive silicone sheets cannot be effectively produced.
发明内容 Contents of the invention
本实用新型所要解决的技术问题是提供一种你能够供超薄型电子导热的双面粘性导热硅胶片。 The technical problem to be solved by the utility model is to provide a double-sided viscous heat-conducting silica gel sheet that can conduct heat for ultra-thin electronics.
本实用新型解决其技术问题所采取的技术方案是:一种双面粘性导热硅胶片,包括第一离型膜层,在所述的第一离型膜层上设有一第一粘性胶料层,在所述的第一粘性胶料层上设有导热硅胶,在所述的导热硅胶上设有第二粘性胶料层,在所述的第二粘性胶料层上设有第二离型膜层。 The technical solution adopted by the utility model to solve the technical problem is: a double-sided viscous heat-conducting silica gel sheet, including a first release film layer, and a first viscous rubber material layer is arranged on the first release film layer , a heat-conducting silica gel is provided on the first viscous rubber layer, a second viscous rubber layer is provided on the heat-conducting silica gel, and a second release type is provided on the second viscous rubber layer film layer.
进一步具体的,所述的第一粘性胶料层与第二粘性胶料层的胶料为高温硫化硅橡胶的液体硅酮。 More specifically, the rubber of the first adhesive rubber layer and the second adhesive rubber layer is liquid silicone of high temperature vulcanized silicone rubber.
进一步具体的,所述的第一离型膜层与第二离型膜层为低剥离力的PE离型膜。 Further specifically, the first release film layer and the second release film layer are PE release films with low peeling force.
进一步具体的,所述的第一离型膜层与第二离型膜层的剥离力为3~10 g/25mm。 More specifically, the peeling force between the first release film layer and the second release film layer is 3-10 g/25mm.
本实用新型的有益效果是:采用了上述导热硅胶片之后,可以方便客户定位及重工操作,避免撕裂材料本身,方便作业,从机壳及散热片上取下可重复使用;当组装过程中散热器或者壳体有相对滑动的时候,导热硅胶片不会产生位置偏移;能够使导热硅胶片双面背胶,使其可以用来固定散热器,将IC等发热源与散热片贴住,不需要另外设计固定结构。 The beneficial effects of the utility model are: after adopting the above-mentioned heat-conducting silica gel sheet, it is convenient for customers to locate and operate in heavy industry, to avoid tearing the material itself, to facilitate operation, and to take it off from the casing and heat sink for reuse; When the device or the shell is relatively sliding, the thermally conductive silicone sheet will not shift in position; the thermally conductive silicone sheet can be double-sided adhesive, so that it can be used to fix the heat sink, and stick the heat source such as IC to the heat sink. There is no need to additionally design a fixed structure.
附图说明 Description of drawings
图1是本实用新型的结构示意图。 Fig. 1 is a structural representation of the utility model.
图中:1、第一离型膜层; 2、第一粘性胶料层; 3、导热硅胶; 4、第二粘性胶料层; 5、第二离型膜层。 In the figure: 1. The first release film layer; 2. The first viscous rubber layer; 3. Thermal silica gel; 4. The second viscous rubber layer; 5. The second release film layer.
具体实施方式 Detailed ways
下面结合附图对本实用新型作详细的描述。 Below in conjunction with accompanying drawing, the utility model is described in detail.
如图1所示一种双面粘性导热硅胶片,包括第一离型膜层1,在所述的第一离型膜层1上设有一第一粘性胶料层2,在所述的第一粘性胶料层2上设有导热硅胶3,在所述的导热硅胶3上设有第二粘性胶料层4,在所述的第二粘性胶料层4上设有第二离型膜层5;所述的第一粘性胶料层2与第二粘性胶料层4的胶料为高温硫化硅橡胶的液体硅酮,所述的液体硅酮包括有机聚硅氧烷组合物、抑制剂、催化剂和硅油;所述的第一离型膜层1与第二离型膜层5为低剥离力的PE离型膜;所述的第一离型膜层1与第二离型膜层5的剥离力为3~10 g/25mm。 As shown in Figure 1, a double-sided viscous heat-conducting silicone sheet includes a first release film layer 1, on which a first release film layer 1 is provided with a first adhesive rubber layer 2, on the first release film layer 1 A thermally conductive silica gel 3 is provided on a viscous rubber layer 2, a second viscous rubber layer 4 is provided on the thermally conductive silica gel 3, and a second release film is provided on the second viscous rubber layer 4 Layer 5; the rubber of the first adhesive rubber layer 2 and the second adhesive rubber layer 4 is liquid silicone of high-temperature vulcanized silicone rubber, and the liquid silicone includes an organopolysiloxane composition, an inhibitor agent, catalyst and silicone oil; the first release film layer 1 and the second release film layer 5 are PE release films with low peeling force; the first release film layer 1 and the second release film The peel force of layer 5 is 3-10 g/25mm.
本实用新型提供的导热硅胶其主要成份有金属氧化物的导热粉体和导热有机硅凝胶,所述的导热粉可以是氧化铝、氧化镁、氧化锌、氮化铝、氮化硼、氮化硅、碳化硅、碳纤维、石墨烯中的一种或多种的组合,具有高的导热系数;所述机聚硅氧烷组合物在固化前25℃的黏度范围10~1000Pa.s。 The main components of the heat-conducting silica gel provided by the utility model are metal oxide heat-conducting powder and heat-conducting silicone gel. The heat-conducting powder can be aluminum oxide, magnesium oxide, zinc oxide, aluminum nitride, boron nitride, nitrogen The combination of one or more of silicon carbide, silicon carbide, carbon fiber, and graphene has high thermal conductivity; the viscosity of the organopolysiloxane composition at 25°C before curing is in the range of 10 to 1000 Pa.s.
双面粘性导热硅胶片的制备方法,其特征在于包含以下步骤: The preparation method of the double-sided viscous heat-conducting silica gel sheet is characterized in that it comprises the following steps:
先将处理过或未处理的导热粉体和导热有机硅凝胶真空混合均匀,经过压延设备后,在上下两层离型膜上喷涂粘性层胶料,在成型机中热固化成片材。 First, the treated or untreated heat-conducting powder and heat-conducting silicone gel are mixed evenly in vacuum, and after passing through the calendering equipment, the adhesive layer rubber is sprayed on the upper and lower release films, and heat-cured into a sheet in a molding machine.
需要强调的是:以上仅是本实用新型的较佳实施例而已,并非对本实用新型作任何形式上的限制,凡是依据本实用新型的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本实用新型技术方案的范围内。 It should be emphasized that: the above are only preferred embodiments of the present utility model, and are not intended to limit the present utility model in any form. Any simple modification, equivalent change and Modifications still belong to the scope of the technical solution of the utility model.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420300563.8U CN203968554U (en) | 2014-06-09 | 2014-06-09 | Double-sided adhesive thermal silicone sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420300563.8U CN203968554U (en) | 2014-06-09 | 2014-06-09 | Double-sided adhesive thermal silicone sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
CN203968554U true CN203968554U (en) | 2014-11-26 |
Family
ID=51929087
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201420300563.8U Expired - Fee Related CN203968554U (en) | 2014-06-09 | 2014-06-09 | Double-sided adhesive thermal silicone sheet |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN203968554U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105254912A (en) * | 2015-10-28 | 2016-01-20 | 深圳市安品有机硅材料有限公司 | Release film, preparation method thereof and organic silicon composite sheet containing release film |
CN111690333A (en) * | 2020-06-11 | 2020-09-22 | 东莞市兆科电子材料科技有限公司 | Heat-conducting gasket and preparation method and application thereof |
-
2014
- 2014-06-09 CN CN201420300563.8U patent/CN203968554U/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105254912A (en) * | 2015-10-28 | 2016-01-20 | 深圳市安品有机硅材料有限公司 | Release film, preparation method thereof and organic silicon composite sheet containing release film |
CN105254912B (en) * | 2015-10-28 | 2018-09-18 | 深圳市安品有机硅材料有限公司 | Release film, preparation method thereof and organic silicon composite sheet containing release film |
CN111690333A (en) * | 2020-06-11 | 2020-09-22 | 东莞市兆科电子材料科技有限公司 | Heat-conducting gasket and preparation method and application thereof |
CN111690333B (en) * | 2020-06-11 | 2022-03-25 | 东莞市兆科电子材料科技有限公司 | Heat-conducting gasket and preparation method and application thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102675824B (en) | Insulating heat-conducting composition and electronic device | |
CN101247715B (en) | Thermal diffusion sheet and manufacturing method of the same | |
EP3255969B1 (en) | Heat-conducting sheet and electronic device | |
JP3208275U (en) | Curable heat conductive interface material and heat dissipation device | |
JP6831179B2 (en) | Manufacturing method of heat-dissipating sheet material with high thermal conductivity | |
CN203968554U (en) | Double-sided adhesive thermal silicone sheet | |
KR101796206B1 (en) | thermal dissipation pad | |
WO2017185960A1 (en) | Terminal device and related method | |
WO2013139058A1 (en) | Thermal dissipation substrate and manufacturing method therefor | |
US20180063995A1 (en) | Heat dissipation foil and methods of heat dissipation | |
CN205488100U (en) | Cured thermal interface element and its heat dissipation device | |
CN104102277A (en) | portable computer equipment | |
TWI299341B (en) | ||
JP4030399B2 (en) | Self-adhesive phase change heat dissipation member | |
JP2005203735A (en) | Thermally conductive composite sheet | |
CN207733156U (en) | A kind of composite heat-conducting silica gel piece | |
CN203590618U (en) | A protective case for a mobile device | |
CN107318236B (en) | Portable electronic product and heat dissipation housing structure for portable electronic product | |
TWM444700U (en) | Heat dissipation patch | |
CN203225057U (en) | Heat conducting thin film and heat conducting label | |
CN206196223U (en) | Heat dissipation film | |
JP3023821U (en) | Radiation fin | |
JP2014210857A (en) | Thermally conductive sheet | |
JP2011514663A5 (en) | ||
CN211390450U (en) | Anisotropic heat conducting material for electronic component |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information |
Inventor after: Zhao Zhongxiang Inventor before: Wang Yanfen |
|
CB03 | Change of inventor or designer information | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170912 Address after: 523570, D building, litchi garden village, Lu Village, Changping Town, Dongguan, Guangdong Patentee after: Dongguan Huayue heat conduction technology Co., Ltd. Address before: Suzhou City, Jiangsu province 215300 Kunshan Development Zone No. 25 king Xiulu Patentee before: Easy access Tiancheng new material technology (Suzhou) Co., Ltd. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141126 Termination date: 20210609 |
|
CF01 | Termination of patent right due to non-payment of annual fee |