CN203893485U - Heat pipe type efficient semiconductor refrigeration device - Google Patents
Heat pipe type efficient semiconductor refrigeration device Download PDFInfo
- Publication number
- CN203893485U CN203893485U CN201420313493.XU CN201420313493U CN203893485U CN 203893485 U CN203893485 U CN 203893485U CN 201420313493 U CN201420313493 U CN 201420313493U CN 203893485 U CN203893485 U CN 203893485U
- Authority
- CN
- China
- Prior art keywords
- hot
- heat pipe
- heat
- hot end
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 238000005057 refrigeration Methods 0.000 title abstract description 9
- 239000007788 liquid Substances 0.000 claims abstract description 13
- 238000001816 cooling Methods 0.000 claims description 22
- 238000009413 insulation Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a heat pipe type efficient semiconductor refrigeration device. The heat pipe type efficient semiconductor refrigeration device comprises a hot end heat pipe radiator, a hot end bottom plate, a liquid pipe and an air pipe. One end of the hot end heat pipe radiator and one end of the hot end bottom plate are respectively connected with the liquid pipe, the other end of the hot end heat pipe radiator and the other end of the hot end bottom plate are respectively connected with the air pipe, a TEC refrigeration sheet is arranged on the hot end bottom plate, the faces, except the face provided with the TEC refrigeration sheet, of the hot end bottom plate are covered with heat-insulating layers, the TEC refrigeration sheet is connected with a cold end profile radiator, a first fan is arranged beside the cold end profile radiator, and a second fan is arranged beside the hot end heat pipe radiator. The heat pipe type efficient semiconductor refrigeration device is suitable for high-temperature environments, the cold and hot section temperature difference is reduced, and refrigeration efficiency is improved; flow resistance of gas-state and liquid-state working media inside a heat pipe is reduced and heat exchange efficiency is improved; heat transfer resistance is reduced to the maximum degree; a super-high power semiconductor refrigerator is convenient to design and manufacture.
Description
Technical field
The utility model relates to a kind of refrigerating plant, is specifically related to a kind of hot-tube type efficient semiconductor cooling device.
Background technology
Refrigerating plant of the present utility model, adopt thermoelectric cooling principle, hot junction at thermoelectric module adopts high efficiency circulating circulating heat pipe, the heat that utilizes phase-change heat transfer that hot junction is produced is taken away rapidly, guarantee hot junction lower temperature, to reduce the temperature difference between cooling piece cold junction, hot junction, improve refrigerating efficiency, make semiconductor refrigerating be suitable for more high ambient temperature condition.Hot junction circulation heat tube radiator adopts split-type structural design, and making to manufacture ultra-high power semiconductor refrigerator becomes possibility.
Utility model content
The purpose of this utility model is to overcome the problem that prior art exists, and a kind of hot-tube type efficient semiconductor cooling device is provided.
For realizing above-mentioned technical purpose, reach above-mentioned technique effect, the utility model is achieved through the following technical solutions:
A kind of hot-tube type efficient semiconductor cooling device, comprise hot side heat radiator, hot junction base plate, liquid pipe and tracheae, described hot side heat radiator has respectively one end to be all connected with described liquid pipe with described hot junction base plate, and the other end is all connected with described tracheae, and described hot junction base plate is provided with TEC cooling piece, and the face beyond the TEC cooling piece on the base plate of described hot junction is coated with thermal insulation layer, and described TEC cooling piece is connected with cold junction Section Bar Heat Sinks.
Further, described cold junction Section Bar Heat Sinks side is provided with the first fan.
Further, described hot side heat radiator side is provided with the second fan.
The beneficial effects of the utility model:
Adopt technical solutions of the utility model, have following benefit:
1, hot junction adopts heat pipe radiating system, is applicable to hot environment, reduces the cold and hot section of temperature difference, promotes refrigerating efficiency.
2, circulation cycle heat pipe: hot junction base plate, tracheae, liquid pipe, hot side heat radiator composition circulation cycle heat pipe, reduce inside heat pipe gaseous state, liquid working media flow resistance, improving heat exchanging efficiency.
3, hot side heat radiator: adopt vacuum brazing radiator, increase heat exchange area per unit volume, reduce to greatest extent heat transmission resistance.
4, hot junction circulation heat tube radiator adopts split-type structural design, is convenient to designing and producing of ultra-high power semiconductor refrigerator.
Brief description of the drawings
Fig. 1 is the structural representation (arrow represents heat or cold flow direction) of the utility model hot-tube type efficient semiconductor cooling device.
Number in the figure explanation: 1, hot side heat radiator, 2, hot junction base plate, 3, liquid pipe, 4, tracheae, 5, TEC cooling piece, 6, thermal insulation layer, 7, cold junction Section Bar Heat Sinks, 8, the first fan, 9, the second fan.
Detailed description of the invention
Below with reference to the accompanying drawings and in conjunction with the embodiments, describe the utility model in detail.
Shown in Fig. 1, a kind of hot-tube type efficient semiconductor cooling device, comprise hot side heat radiator 1, hot junction base plate 2, liquid pipe 3 and tracheae 4, described hot side heat radiator 1 has respectively one end to be all connected with described liquid pipe 3 with described hot junction base plate 2, the other end is all connected with described tracheae 4, described hot junction base plate 2 is provided with TEC cooling piece 5, and face beyond TEC cooling piece on described hot junction base plate 25 is coated with thermal insulation layer, and described TEC cooling piece 5 is connected with cold junction Section Bar Heat Sinks 7.
Further, described cold junction Section Bar Heat Sinks 7 sides are provided with the first fan 8.
Further, described hot side heat radiator 3 sides are provided with the second fan 9.
Principle of the present utility model:
First after TEC cooling piece 5 is connected direct current, one end turns cold (cold junction), one end heating (hot junction); Then heat (cold) is passed to Section Bar Heat Sinks by TEC cold junction, heat (cold) is delivered in the space that needs refrigeration by the first fan 8; Then TEC hot junction transfers heat to hot junction base plate 2, and base plate 2 temperature in hot junction raise, and transfer heat to inner heat-pipe working medium, heat-pipe working medium gasification, becomes gaseous state by liquid state, absorbs heat, gaseous working medium is due to pressure reduction, be delivered to hot side heat radiator 1 along tracheae 4, transfer heat to cool exterior air, by the second fan 9, heat is delivered in atmosphere, the condensation of inside heat pipe gaseous working medium, liquefy, flows back to hot junction base plate 2 again by liquid pipe 3, thus periodic duty.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any amendment of doing, be equal to replacement, improvement etc., within all should being included in protection domain of the present utility model.
Claims (3)
1. a hot-tube type efficient semiconductor cooling device, it is characterized in that, comprise hot side heat radiator (1), hot junction base plate (2), liquid pipe (3) and tracheae (4), described hot side heat radiator (1) has respectively one end to be all connected with described liquid pipe (3) with described hot junction base plate (2), the other end is all connected with described tracheae (4), described hot junction base plate (2) is provided with TEC cooling piece (5), and the face in addition of the TEC cooling piece (5) on described hot junction base plate (2) is coated with thermal insulation layer (6), and described TEC cooling piece (5) is connected with cold junction Section Bar Heat Sinks (7).
2. hot-tube type efficient semiconductor cooling device according to claim 1, is characterized in that, described cold junction Section Bar Heat Sinks (7) side is provided with the first fan (8).
3. hot-tube type efficient semiconductor cooling device according to claim 1, is characterized in that, described hot side heat radiator (3) side is provided with the second fan (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420313493.XU CN203893485U (en) | 2014-06-13 | 2014-06-13 | Heat pipe type efficient semiconductor refrigeration device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420313493.XU CN203893485U (en) | 2014-06-13 | 2014-06-13 | Heat pipe type efficient semiconductor refrigeration device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203893485U true CN203893485U (en) | 2014-10-22 |
Family
ID=51719880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420313493.XU Expired - Fee Related CN203893485U (en) | 2014-06-13 | 2014-06-13 | Heat pipe type efficient semiconductor refrigeration device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203893485U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106274631A (en) * | 2016-11-07 | 2017-01-04 | 高秀民 | Semiconductor refrigerating heat pipe-type cold chain transport vehicle and refrigerating method |
| CN107560264A (en) * | 2017-09-26 | 2018-01-09 | 上海创始实业（集团）有限公司 | Semiconductor chilling plate refrigerating box |
| CN109168302A (en) * | 2018-10-23 | 2019-01-08 | 歌尔科技有限公司 | A kind of wearable device |
-
2014
- 2014-06-13 CN CN201420313493.XU patent/CN203893485U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106274631A (en) * | 2016-11-07 | 2017-01-04 | 高秀民 | Semiconductor refrigerating heat pipe-type cold chain transport vehicle and refrigerating method |
| CN107560264A (en) * | 2017-09-26 | 2018-01-09 | 上海创始实业（集团）有限公司 | Semiconductor chilling plate refrigerating box |
| CN109168302A (en) * | 2018-10-23 | 2019-01-08 | 歌尔科技有限公司 | A kind of wearable device |
| CN109168302B (en) * | 2018-10-23 | 2024-04-09 | 歌尔科技有限公司 | Wearable equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141022 Termination date: 20210613 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |