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CN203857894U - Offset testing system for secondary perforation of circuit board - Google Patents

Offset testing system for secondary perforation of circuit board Download PDF

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Publication number
CN203857894U
CN203857894U CN201420189380.3U CN201420189380U CN203857894U CN 203857894 U CN203857894 U CN 203857894U CN 201420189380 U CN201420189380 U CN 201420189380U CN 203857894 U CN203857894 U CN 203857894U
Authority
CN
China
Prior art keywords
circuit board
secondary pore
wiring board
copper layer
offset
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201420189380.3U
Other languages
Chinese (zh)
Inventor
缪宝香
程友萍
谢勇
蔡华伦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tong Yang Optoelectronics (jiangsu) Co Ltd
Original Assignee
Tong Yang Optoelectronics (jiangsu) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tong Yang Optoelectronics (jiangsu) Co Ltd filed Critical Tong Yang Optoelectronics (jiangsu) Co Ltd
Priority to CN201420189380.3U priority Critical patent/CN203857894U/en
Application granted granted Critical
Publication of CN203857894U publication Critical patent/CN203857894U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model relates to an offset testing system for secondary perforation of a circuit board, belonging to the field of circuit boards. The system comprises the circuit board, the circuit board is provided with a secondary hole which is perforated in a supplementary manner via a drilling machine, the four corners of the circuit board are respectively provided with four secondary-hole offset detection labels, each secondary-hole offset detection label comprises a circular copper layer and a circular copper ring which are both arranged on the circuit board, and the internal diameter of the circular copper ring is greater than the external diameter of the circular copper layer. The offset testing system manages and controls the offset degree of supplementary drilling via the secondary-hole offset detection labels on the circuit board, thereby improving the detection efficiency and economic benefit.

Description

Wiring board is mended the secondary pore skew test macro boring
Technical field
The utility model belongs to wiring board field, is specially a kind of wiring board and mends the secondary pore skew test macro boring.
Background technology
Printed-wiring board (PWB) is widely used in electronic product field, particularly on the consumer electronics product such as mobile phone, notebook computer.
Printed-wiring board (PWB) has to mend and bores secondary pore processing procedure in manufacturing process, because of job requirements, some client holes of subdrilling in the time of front boring processing procedure, through some after other after process operations (after making as copper face layer) get back to again boring processing procedure, mend again and bore some special drills, the hole that now two shot borehole processing procedures get out is just referred to as to mend bores secondary pore, and in the time mending brill, there will be unavoidably boring shift phenomenon, so that bring puzzlement to lower process operations.
Utility model content
The purpose of this utility model is to address the above problem, and provides a kind of secondary pore that can realize benefit brill to realize the test macro of fast detecting.
The technical scheme that realizes above-mentioned purpose is: wiring board is mended the secondary pore skew test macro boring, comprise wiring board, on wiring board, be provided with by boring board and supplement the secondary pore getting out, it is characterized in that: four jiaos of wiring board are respectively arranged with a secondary pore offset detection label, each secondary pore offset detection label comprises respectively setting round copper layer in the circuit board and circle copper ring, the internal diameter of circle copper ring is greater than the external diameter of round copper layer, the manhole that is provided with on circle copper ring and the wiring board of justifying between copper layer that drilling machine bench drill by getting out secondary pore goes out and gets out with secondary pore simultaneously, the diameter that the diameter of manhole is greater than round copper layer is less than the internal diameter of round copper ring, manhole edge equals the distance of manhole edge to circle copper layer external diameter to the distance of circle copper ring internal diameter, and equal secondary pore and allow the tolerance being offset.
Detection principle of the present utility model: behind the complete hole of secondary hole drill, personnel's range estimation, manhole covers on round copper ring or exposes middle round copper layer and can be judged to be skew.
The utility model is by arranging secondary pore offset detection label in the circuit board, and the drift rate management and control of holing while having realized existing benefit brill operation, provides detection efficiency, has improved economic benefit.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model;
Fig. 2 is secondary pore offset detection label enlarged drawing.
Embodiment
As shown in Figure 1, the utility model comprises wiring board 1, on wiring board 1, be provided with by boring board and supplement the secondary pore 2 getting out, four jiaos of wiring board 1 are respectively arranged with a secondary pore offset detection label 3, each secondary pore offset detection label 3 comprises respectively the round copper layer 4 and the circle copper ring 5 that are arranged on wiring board 1, the internal diameter of circle copper ring 5 is greater than the external diameter of round copper layer 4, the manhole 6 that is provided with on circle copper ring 5 and the wiring board 1 of justifying between copper layer 4 that drilling machine bench drill by getting out secondary pore 2 goes out and gets out with secondary pore 2 simultaneously, the diameter that the diameter of manhole 6 is greater than round copper layer 4 is less than the internal diameter of round copper ring 5, manhole 6 edges equal the distance of manhole 6 edges to circle copper layer 4 external diameter to the distance of circle copper ring 5 internal diameters, and equal secondary pore 2 and allow the tolerance being offset.

Claims (1)

1. wiring board is mended the secondary pore skew test macro boring, comprise wiring board, on wiring board, be provided with by boring board and supplement the secondary pore getting out, it is characterized in that: four jiaos of wiring board are respectively arranged with a secondary pore offset detection label, each secondary pore offset detection label comprises respectively setting round copper layer in the circuit board and circle copper ring, the internal diameter of circle copper ring is greater than the external diameter of round copper layer, the manhole that is provided with on circle copper ring and the wiring board of justifying between copper layer that drilling machine bench drill by getting out secondary pore goes out and gets out with secondary pore simultaneously, the diameter that the diameter of manhole is greater than round copper layer is less than the internal diameter of round copper ring, manhole edge equals the distance of manhole edge to circle copper layer external diameter to the distance of circle copper ring internal diameter, and equal secondary pore and allow the tolerance being offset.
CN201420189380.3U 2014-04-18 2014-04-18 Offset testing system for secondary perforation of circuit board Expired - Lifetime CN203857894U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420189380.3U CN203857894U (en) 2014-04-18 2014-04-18 Offset testing system for secondary perforation of circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420189380.3U CN203857894U (en) 2014-04-18 2014-04-18 Offset testing system for secondary perforation of circuit board

Publications (1)

Publication Number Publication Date
CN203857894U true CN203857894U (en) 2014-10-01

Family

ID=51607741

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420189380.3U Expired - Lifetime CN203857894U (en) 2014-04-18 2014-04-18 Offset testing system for secondary perforation of circuit board

Country Status (1)

Country Link
CN (1) CN203857894U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106017249A (en) * 2016-06-12 2016-10-12 广州杰赛科技股份有限公司 Layer offset detection method for printed circuit board
CN109520438A (en) * 2018-11-23 2019-03-26 梅州市志浩电子科技有限公司 The inclined distance measurement method in the hole of machine drilling
CN112985320A (en) * 2019-12-16 2021-06-18 颀邦科技股份有限公司 Circuit board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106017249A (en) * 2016-06-12 2016-10-12 广州杰赛科技股份有限公司 Layer offset detection method for printed circuit board
CN109520438A (en) * 2018-11-23 2019-03-26 梅州市志浩电子科技有限公司 The inclined distance measurement method in the hole of machine drilling
CN112985320A (en) * 2019-12-16 2021-06-18 颀邦科技股份有限公司 Circuit board
CN112985320B (en) * 2019-12-16 2024-04-16 颀邦科技股份有限公司 Circuit board

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C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20141001