CN203773223U - Embossing equipment - Google Patents

Abstract

The utility model belongs to the technical field of processing micro-nano-level structural materials and devices, in particular to an embossing device. The utility model solves the problem of poor molding quality of the printed object existing in the existing embossing equipment when the large-area to-be-printed object is thermally embossed. The pressing plate of the utility model is driven by a pressurizing device, the supporting plate is pushed against by the elastic element and limited to move within the length range of the guide column, and the pressing plate is fixed with an imprinting assembly formed by bonding the pressing die and the object to be imprinted, as long as Using the pressurizing device and coordinating with the elastic element, the supporting plate and the pressing plate can be approached or separated, and the pressing mold can be pressed against the object to be imprinted to achieve imprinting. The imprinting equipment has a simple structure, convenient operation and good molding quality, can realize pattern transfer with a characteristic size of 20nm to 2000nm, and is suitable for mass production of various nanoelectronic devices, optical devices, memories, nanofluidic channels, biochips, etc.

Description

Imprinting equipment

technical field

The utility model belongs to the technical field of processing micro-nano-level structural materials and devices, in particular to an embossing device.

Background technique

Nanoimprint lithography (NIL) is a parallel technology that can manufacture micro-nano-scale structures. Its idea is to transfer graphics to the corresponding imprinted objects through stamping. The transfer medium is usually a layer of The thin polymer film is hardened by hot pressing or irradiation to retain the transferred pattern, so as to achieve the purpose of mass production. Compared with traditional photolithography technology, nanoimprint technology has the advantages of simple processing principle, high resolution, high production efficiency and low cost. The process of nanoimprinting includes: stamper preparation, imprinting process, and pattern transfer. According to different imprinting methods, nanoimprinting technology is divided into hot embossing, UV imprinting and microcontact printing.

However, when the stamping equipment provided by the prior art is used for thermal embossing, the pressure on the object to be imprinted near the middle will be greater than the pressure near the outer edge, and the pressure distribution will be uneven and the stamper will be deformed, making the object to be imprinted The image forming quality obtained by the compression molding is poor. Especially when pressing a large-area object to be imprinted, the molding quality of the object to be imprinted will be even less ideal.

Utility model content

The purpose of the utility model is to provide an embossing device, aiming at solving the problem that the existing embossing equipment has poor molding quality of the imprinted object when thermally embossing a large-area to be imprinted.

The utility model is realized in the following way. An embossing device includes a base and a top plate opposite to the base. The embossing device also includes a guide column fixed on the lower side of the top plate, and The support plate on the guide post, the elastic element arranged between the top plate and the support plate, the pressurizing device arranged on the base and driven by the pressurizing device and cooperate with the support plate The pressing plate of the embossing assembly is interposed, and the supporting plate is limited to slide in the length direction of the guide post. The embossing assembly includes a stamping mold and an object to be stamped attached to the stamping mold.

Further, the elastic element is sleeved on the guide post, and opposite ends of the elastic element abut against the top plate and the support plate respectively.

Alternatively, grooves are provided on the underside of the top board and the upper side of the support board, one end of the elastic element is plugged into the groove of the top board and the other end of the elastic element is plugged into on the groove of the support plate.

Further, the number of the guide posts is several, and several of the guide posts are evenly distributed on the top plate, and the number of the elastic elements is several, and several of the elastic elements are evenly distributed between the top plate and the top plate. between the support plates.

Further, the pressurizing device is a jack, and the jack has an output end and the output end is fixedly connected to the pressing plate.

Further, the imprinting device further includes a scale mounted on the top plate and used to measure the imprinting force when the object to be imprinted is against the stamper, and the zero scale of the scale is the same as the One end face of the support plate is flush.

Further, the imprinting equipment further includes a heating device capable of heating the imprinting assembly, the heating device is installed on the pressing plate, or the heating device is installed on the support plate, or the heating The device is installed on the press plate and the support plate; the imprinting equipment also includes a heat insulation device for reducing the heat generated by the heating device from being transferred to the press plate and the support plate, and the heat insulation The device is arranged between the platen and the embossing assembly and between the support plate and the embossing assembly.

Compared with the prior art, the utility model has the following technical effects: the pressing plate is driven by the pressurizing device, the support plate is pushed against by the elastic element and is limited to move within the length range of the guide post, and the pressing plate is fixed with the pressing die and the printed object. As long as the pressing device is used to compress the elastic element arranged between the top plate and the support plate, the support plate and the pressure plate can be close to or separated, and the stamper and the object to be imprinted are offset Implement imprinting. By changing the number of elastic elements, the embossing force of the object to be imprinted can be changed. By changing the area of the supporting plate and the pressing plate, the imprinting area of the object to be imprinted can be changed. The cooperation of the pressurizing device and the elastic element makes the pressure on the object to be imprinted near the middle and the pressure near the outer edge relatively close to the pressure on the object to be imprinted during hot embossing. The molding quality of the graphics obtained by the mold becomes better. When hot embossing a large-area object to be imprinted, the molding quality of the object to be imprinted will be improved. The imprinting equipment has a simple structure, convenient operation and good molding quality, can realize pattern transfer with a characteristic size of 20nm to 2000nm, and is suitable for mass production of various nanoelectronic devices, optical devices, memories, nanofluidic channels, biochips, etc.

Description of drawings

Fig. 1 is a front view of the imprinting device provided by the first embodiment of the present invention.

FIG. 2 is a cross-sectional view of the imprint apparatus of FIG. 1 along line A-A.

Fig. 3 is a front view of the imprinting device provided by the second embodiment of the present invention.

Fig. 4 is a schematic diagram of the object to be imprinted and the stamper used in the imprinting device provided by the embodiment of the present invention when they are attached together.

Fig. 5 is a schematic diagram of the object to be imprinted and the stamper applied in the imprinting device provided by the embodiment of the present invention when they are in contact.

Fig. 6 is a schematic diagram of the object to be imprinted and the stamper used in the imprinting device provided by the embodiment of the present invention when they are separated.

Fig. 7 is a step diagram of the pressurizing method of the imprinting device provided by the first embodiment of the present invention.

Fig. 8 is a step diagram of the pressurizing method of the imprinting device provided by the second embodiment of the present invention.

FIG. 9 is a step diagram of the pressurizing method of the imprinting device provided by the third embodiment of the present invention.

Detailed ways

In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not intended to limit the utility model.

Please refer to Fig. 1, Fig. 2, a kind of embossing equipment provided by the first embodiment of the present utility model, it comprises base 11, the top board 12 that is arranged opposite to base 11 and several support columns 13, and each support column 13 The opposite ends of the base are fixedly connected with the base 11 and the top board 12 respectively. In this embodiment, the number of support columns 13 is four, and one end of each support column 13 has threads, and the other end also has threads; one end of support columns 13 is threadedly connected to the base 11, and each support column 13 The other end of the top plate passes through the top plate 12, and is screwed on the thread on the other end by two nuts 14. Locked on the other end of the support column 13 . The base 11, the top plate 12 and the support column 13 are combined to form a frame, which is compact in structure and mechanically closed. After installing other parts, the force distribution of the frame is uniform, which is conducive to the improvement of the quality of pressing.

The embossing device also includes a guide post 15 fixed on the underside of the top plate 12, a support plate 16 slidably mounted on the guide post 15, and compressed between the top plate 12 and the support plate 16. The elastic element 19, the pressing device 17 arranged on the base 11, and the pressing plate 18 driven by the pressing device 17 and cooperating with the supporting plate 16 to sandwich the embossing assembly 50, the supporting plate 16 defines Sliding in the length direction of the guide post 15 . In the present embodiment, the quantity of guide post 15 is four, and the bottom end of guide post 15 has the limiting part 15a that limits support plate 16 and can only move in the length scope of guide post 15, and the top end of guide post 15 and top plate 12 threaded connections. The pressing plate 18 and the support plate 16 are made of high-hardness materials such as stainless steel, and can also be replaced with other materials with different heat storage properties. The surface of the pressing plate 18 and the support plate 16 is smooth. Both the support plate 16 and the pressure plate 18 are rectangular, and the four corners of the support plate 16 are respectively provided with through holes 16b, and the four guide posts 15 pass through the four through holes 16b respectively, so that the support plate 16 is limited to the length range of the guide posts 15 The structure is easy to process and assemble. The pressing device 17 is placed in the center of the base 11, the pressing plate 18 is driven by the pressing device 17, the support plate 16 is pushed against by the elastic element 19 and limited to move within the length of the guide post 15, as long as the pressing device 17 is used, Cooperating with the elastic element 19, the support plate 16 and the pressing plate 18 can be approached or separated.

The embossing assembly 50 includes a stamper 51 and an object to be embossed 52 attached to the stamper 51 . The object to be imprinted 52 is formed by laminating a semiconductor layer (not shown in the figure), an insulating layer 52b and a substrate 52a. The material of the substrate 52a is glass; the insulating layer 52b is PMMA (polymethyl methacrylate), and its thickness is 500nm-1000nm; the semiconductor layer is spin-coated on the surface of the insulating layer 52b, and the semiconductor layer is ZnO (zinc oxide) or P3HT (polymer of 3-hexylthiophene) with a thickness of 10 nm. The embossing assembly 50 can be placed upright or reversed without affecting the embossing process. In this embodiment, one side of the object to be printed 52 on the printing assembly 50 abuts against the pressing plate 18 . Understandably, one side of the die 51 on the embossing assembly 50 abuts against the platen 18 . By making the supporting plate 16 and the pressing plate 18 approach or separate, pressure can be applied to or eliminated from the embossing assembly 50 . During the process of applying pressure to the embossing assembly 50 , the pressing plate 18 and the support plate 16 can move freely at the same time, so as to ensure that the embossing assembly 50 is stressed evenly. Since customers need to emboss materials of different sizes, in order to ensure a good embossing effect, the size of the platen 18 and the support plate 16 can be changed and the appropriate shape can be changed according to needs, so as to emboss materials of different shapes and sizes. When the embossing area is relatively large, the number and distribution area of the elastic elements 19 can be appropriately increased as required to realize embossing of a larger area. The stamper 51 is bonded with the object to be stamped 52 to form the stamping assembly 50, and then the stamping assembly 50 is fixed on the platen 18, and the stamping can be completed by using the pressurizing device 17, which avoids the need to connect the stamper 51 and the stamped object. After the printed matter 52 is separately arranged on the press plate 18 or the support plate 16, the problem of misalignment between the stamper 51 and the object to be printed 52 is faced. Alignment of the imprint 52, which would cause increased costs and operational troubles.

The hot embossing will use a blast drying oven, a constant temperature vacuum drying oven or an electric heating device installed on the platen 18 or the support plate 16 to heat the embossing assembly 50 . At an appropriate embossing temperature, the stamper 51 is pressed against the object to be imprinted 52 and reaches an appropriate embossing force and a predetermined time to realize hot embossing. Preferably, the embossing force is 0.5-2kN, the embossing temperature is 80-110°C, and the predetermined time is 10-30min. Take out the embossing assembly 50 from the platen 18 and separate the stamper 51 from the object to be imprinted 52, and use a scanning electron microscope (SEM) or an atomic force microscope (AFM) to observe the pattern on the object to be imprinted 52 that has been pressed, It will be seen that the imprinted object 52 reproduces the pattern on the stamper 51 .

The pressing plate 18 is driven by the pressing device 17, and the supporting plate 16 is pushed against by the elastic element 19 and is limited to move within the length range of the guide post 15. As long as the press assembly 50 is used, and the elastic element 19 arranged between the top plate 12 and the support plate 16 is combined with compression, the support plate 16 and the pressure plate 18 can be close to or separated from each other, and the press mold 51 and the pressed plate Printed material 52 offsets to realize embossing. By changing the number of elastic elements 19 , the pressing force of the object to be printed 52 can be changed. By changing the areas of the supporting plate 16 and the pressing plate 18 , the embossing area of the object to be imprinted 52 can be changed. The cooperation of the pressurizing device 17 and the elastic element 19 makes the pressure on the object 52 to be imprinted near the middle part and the pressure near the outer edge relatively close to the pressure received in the hot embossing, the pressure distribution becomes uniform, and the stamper 51 remains in its original state, so that the pressed The quality of pattern formation of the printed matter 52 by the stamper 51 becomes better. When thermally embossing a large-area object 52 to be imprinted, the molding quality of the object to be imprinted 52 is improved. The imprinting equipment has a simple structure, convenient operation and good molding quality, can realize pattern transfer with a characteristic size of 20nm to 2000nm, and is suitable for mass production of various nanoelectronic devices, optical devices, memories, nanofluidic channels, biochips, etc.

Further, the elastic element 19 is sleeved on the guide post 15 and opposite ends of the elastic element 19 abut against the top plate 12 and the support plate 16 respectively. In this embodiment, the elastic element 19 is a spring. The number of guide pillars 15 is four, the supporting plate 16 and the pressing plate 18 are rectangular, the four guiding pillars 15 are all provided with elastic elements 19, and the embossing assembly 50 is fixed on the pressing plate 18, and the pressing device 17 is used to make the pressing plate 18 Moving toward the support plate 16 , when the embossing assembly 50 abuts against the support plate 16 , the elastic element 19 is gradually compressed, and the stamper 51 abuts against the object 52 to be embossed. The pressing device 17 is used to separate the pressing plate 18 from the supporting plate 16 , and the elastic element 19 is gradually stretched. When the elastic element 19 returns, the embossing assembly 50 is separated from the supporting plate 16 . A plurality of elastic elements 19 evenly distributed between the press plate 18 and the support plate 16 allows the support plate 16 to be uniformly stressed during embossing and forming, so that the embossed object 52 has good molding quality, and when it is necessary to separate the embossing assembly 50 from the support The elastic element 19 stretches to realize the reset of the support plate 16 when the plate 16 is in place.

Or, grooves 12a, 16a are provided on the lower side of the top board 12 and the upper side of the support board 16, and one end of the elastic element 19 is inserted into the groove 12a of the top board 12 and the The other end of the elastic element 19 is plugged into the groove 16 a of the support plate 16 . In this embodiment, the elastic element 19 is a spring. The number of elastic elements 19 is twelve, the support plate 16 and the pressing plate 18 are rectangular, the underside of the top plate 12 and the upper side of the support plate 16 are respectively provided with several grooves 12a, 16a at corresponding positions up and down, and the elastic elements 19 The two ends of the two are respectively inserted into the groove 12a of the top plate 12 and the groove 16a of the support plate 16 . The embossing assembly 50 is fixed on the pressing plate 18, and the pressing device 17 is used to move the pressing plate 18 toward the supporting plate 16. When the embossing assembly 50 is pressed against the supporting plate 16, the elastic element 19 is gradually compressed, and the pressing die 51 is in contact with the supported plate 16. The imprint 52 offsets. The pressing device 17 is used to separate the pressing plate 18 from the supporting plate 16 , and the elastic element 19 is gradually stretched. When the elastic element 19 returns, the embossing assembly 50 is separated from the supporting plate 16 . A plurality of elastic elements 19 evenly distributed between the press plate 18 and the support plate 16 allows the support plate 16 to be uniformly stressed during embossing and forming, so that the embossed object 52 has good molding quality, and when it is necessary to separate the embossing assembly 50 from the support The elastic element 19 stretches to realize the reset of the support plate 16 when the plate 16 is in place.

It can be understood that a part of the elastic element 19 is sleeved on the guide post 15 and the opposite ends of the elastic element 19 abut against the top plate 12 and the support plate 16 respectively, and the lower side of the top plate 12 Several grooves 12a, 16a are opened on the upper side of the support plate 16, and one end of the other part of the elastic element 19 is inserted into the groove 12a of the top plate 12, and the other end of the elastic element 19 Inserted on the groove 16a of the support plate 16 . The elastic element 19 is a spring. Preferably, the number of elastic elements 19 is sixteen, the support plate 16 and the pressure plate 18 are rectangular, the array of elastic elements 19 is distributed between the pressure plate 18 and the support plate 16, and four elastic elements 19 are sleeved on four guide posts 15, the remaining twelve elastic elements 19 are inserted into the groove 12a of the top plate 12 and the groove 16a of the support plate 16 respectively. A plurality of elastic elements 19 evenly distributed between the press plate 18 and the support plate 16 allows the support plate 16 to be uniformly stressed during embossing and forming, so that the embossed object 52 has good molding quality, and when it is necessary to separate the embossing assembly 50 from the support The elastic element 19 stretches to realize the reset of the support plate 16 when the plate 16 is in place.

Further, the number of the guide posts 15 is several, and several of the guide posts 15 are evenly distributed on the top plate 12, and the number of the elastic elements 19 is several, and several of the elastic elements 19 are evenly distributed on the top plate 12. Between the top plate 12 and the support plate 16. Evenly distributed guide posts 15 are easy to assemble and allow the movement of the support plate 16 on the guide posts 15 to ensure the perpendicularity to the guide posts 15 . The evenly distributed elastic elements 19 allow the support plate 16 to be evenly stressed, so that the pressure on the object 52 to be imprinted near the middle is relatively close to the pressure near the outer edge during hot embossing, and the stamper 51 remains in its original shape, so that the object to be imprinted 52 52 The pattern forming quality obtained by the stamper 51 becomes better.

Further, the pressurizing device 17 is a jack, and the jack has an output end 17a and the output end 17a is fixedly connected to the pressing plate 18 . The jack is easy to operate, the output end 17a of the jack is fixedly connected to the pressing plate 18, and the imprinting assembly 50 is fixed on the pressing plate 18, together with the support plate 16 connected with the elastic element 19, it is easy to apply pressure and eliminate the pressure on the imprinting assembly 50 The operation ensures the controllable movement of vertical up and down and a single direction when pressurized, and prevents left and right and rotational movements. The hot embossing will use a blast drying oven, a constant temperature vacuum drying oven or an electric heating device installed on the platen 18 or the support plate 16 to heat the embossing assembly 50 . The jack is a purely mechanical pressurizing device 17 , which avoids damage to the pressurizing device during thermal embossing by the imprinting equipment compared with the electric pressurizing device. It can be understood that the pressurizing device may adopt other purely mechanical devices capable of applying pressure and eliminating pressure.

Further, the imprinting equipment further includes a scale 20 installed on the top plate 12 and used to measure the imprinting force when the object to be imprinted 52 is against the stamper 51 and the scale 20 The zero scale 21 is flush with one end surface of the support plate 16 . The elastic element 19 is a spring, and the scale 20 is used to measure the deformation of the spring itself in the compression process, and the imprinting force to be applied is determined by calculating through Hooke's law. When the support plate 16 is pushed against the limiting portion 15 a by the spring, the zero scale 21 is flush with the upper end surface of the support plate 16 . When the support plate 16 moves upward and the spring is compressed, the compressed length of the spring can be read by the upper end surface of the support plate 16 being aligned with the scale on the scale 20 . It can be understood that when the support plate 16 is pushed against the limiting portion 15 a by the spring, the zero scale 21 may be flush with the lower end surface of the support plate 16 . By changing springs with different elastic constants, different imprinting forces can be achieved. Usually during embossing, the embossing force on the stamper 51 is controlled within the range from 500N to 3000N, and its conversion formula is as follows:

Ft (spring force) = k (spring coefficient) × L (spring compression length)

Please refer to Fig. 3, the imprinting equipment provided by the second embodiment of the utility model is roughly the same as the imprinting equipment provided by the first embodiment, and the difference from the first embodiment is that the imprinting equipment also includes the The heating device 30 heated by the embossing assembly 50, the heating device 30 is installed on the press plate 18, or the heating device 30 is installed on the support plate 16, or the heating device 30 is installed on the press plate 18 and the support plate 16. The heating device 30 is provided on the platen 18 or the supporting plate 16, and various heating methods can be realized for the stamper 51 and the object to be stamped 52 under different environments. The stamping equipment is easy to adjust and has good adaptability. Preferably, a heating device 30 consisting of a heating plate 31, a heating rod 32 and a uniform heat plate 33 is used, because the rigidity of the heating device 30 after installation is required, and the heating device 30 has low cost, simple installation, and controllability. Simple and other advantages. Specifically, the uniform heat plate 33 serves as a secondary transfer of heat, which can prevent defects such as pattern deformation and unevenness caused by uneven heating. It is only necessary to install the heating device 30 on one or both sides of the pressing plate 18 or the support plate 16 to realize heating and pressing on one or both sides. The heating device 30 can monitor the temperature of the stamper 51 and the object to be printed 52 in real time according to the requirements of the printing conditions. The temperature control device used in conjunction with the heating device 30 adopts electronic temperature control, so that the embossing temperature can be controlled within the required range and meet the precision requirements. In this embodiment, the heating device 30 is installed on the platen 18 and the support plate 16 to realize double-sided heating of the embossing assembly 50 to ensure the hot embossing.

The imprinting equipment also includes a heat insulating device 40 for reducing the heat generated by the heating device 30 from being transmitted to the press plate 18 and the support plate 16, and the heat insulating device 40 is arranged between the press plate 18 and the support plate 16. between the embossing components 50 and between the support plate 16 and the embossing components 50 . The heat insulating device 40 can choose materials with low thermal conductivity such as asbestos.

Please refer to Fig. 1, Fig. 4 to Fig. 7, the first embodiment of the present utility model provides a pressurization method for imprinting equipment, which adopts a purely mechanical pressurizing device 17, and is suitable for use in a blast drying oven or a constant temperature vacuum drying oven Heating is carried out in the middle, and the atmosphere heating is conducive to the overall heating of the printed object 52 more uniformly, including the following steps:

S1) Provide embossing equipment, fix the embossing assembly 50 on the press plate 18, use the pressing device 17 to drive the press plate 18 to move toward the support plate 16, and make the support plate 16 and The embossing assembly 50 is abutted, and the stamper 51 is abutted against the object to be embossed 52 to achieve embossing force;

S2) Provide a drying box, the drying box operates at a set stamping temperature, and when the drying box reaches the stamping temperature, place the stamping equipment with the stamping assembly 50 fixed in the drying box heating. The embossing temperature is generally above the softening temperature of the polymer. If you need to vacuum when pressurizing, you can choose a constant temperature vacuum drying oven. When heating and pressing, the stamper 51 and the object to be stamped 52 will be heated and pressurized up and down, wherein the stamping temperature and stamping force should be controlled according to stamping needs, for example, to ensure uniform and constant heating of the stamping temperature, press SCPG is large and constant.

S3) after the imprinting equipment is heated in the drying box for a predetermined time, taking out the imprinting equipment from the drying box;

S4) After the imprinting equipment cools down naturally, use the pressurizing device 17 to drive the pressing plate 18 to move away from the supporting plate 16, and separate the supporting plate 16 from the imprinting assembly 50, in the The embossing assembly 50 is taken out from the platen 18 , and the embossing mold 51 is separated from the object to be embossed 52 .

Please refer to Fig. 1, Fig. 4 to Fig. 6 and Fig. 8. The second embodiment of the present invention provides a pressurization method for imprinting equipment. The difference from the first embodiment is mainly reflected in the pressurization method. It is no longer put back into the drying box, and the heat storage and pressurization of the equipment is used. It is suitable for the study of non-isothermal imprinting and rapid imprinting, and it is more environmentally friendly and energy-saving. It includes the following steps:

S1) providing a drying box, placing the embossing equipment in the drying box, and the drying box operates at a set imprinting temperature;

S2) After the imprinting device is heated in the drying box for a predetermined time, take out the imprinting device from the drying box.

S3) Fix the embossing assembly 50 on the pressing plate 18, use the pressing device 17 to drive the pressing plate 18 to move toward the supporting plate 16, and make the supporting plate 16 and the embossing The components 50 are abutted, and the stamper 51 is abutted against the object to be imprinted 52 to reach the embossing force;

S4) After the stamper 51 and the object to be stamped 52 contact for a predetermined time, use the pressing device 17 to drive the press plate 18 to move away from the support plate 16, and make the support plate 16 and The stamping assembly 50 is separated, the stamping assembly 50 is taken out from the platen 18 , and the stamper 51 is separated from the object 52 to be stamped.

Please refer to Fig. 3, Fig. 4 to Fig. 6 and Fig. 9. The third embodiment of the present invention provides a pressurization method for imprinting equipment. The difference from the first embodiment is that a heating device is used instead of a drying box 30 is arranged on the pressing plate 18 or the support plate 16, which is faster and more convenient during use. Preferably, a heating device 30 consisting of a heating plate 31, a heating rod 32 and a uniform heat plate 33 is used, because the rigidity of the heating device 30 after installation is required, and the heating device 30 has low cost, simple installation, and controllability. Simple and other advantages. Specifically, the uniform heat plate 33 serves as a secondary transfer of heat, which can prevent defects such as pattern deformation and unevenness caused by uneven heating. It is only necessary to install the heating device 30 on one or both sides of the pressing plate 18 or the support plate 16 to realize heating and pressing on one or both sides. The heating device 30 can monitor the temperature of the stamper 51 and the object to be printed 52 in real time according to the requirements of the printing conditions. The temperature control device used in conjunction with the heating device 30 adopts electronic temperature control, so that the embossing temperature can be controlled within the required range and meet the precision requirements. According to the needs of the embossing experiment, a heat insulating device 40 can be provided on the pressing plate 18 and the supporting plate 16 to reduce heat transfer, and the heat insulating device 40 can be selected from materials with low thermal conductivity such as asbestos. The pressurization method of the present embodiment comprises the steps:

S1) Fix the embossing assembly 50 on the pressing plate 18, use the pressing device 17 to drive the pressing plate 18 to move toward the supporting plate 16, and make the supporting plate 16 and the embossing assembly 50 is close, and the stamper 51 is against the object to be stamped 52 and reaches the embossing force;

S2) The heating device 30 operates at a set embossing temperature;

S3) After the stamper 51 and the object to be stamped 52 contact for a predetermined time, use the pressurizing device 17 to drive the press plate 18 to move away from the support plate 16, and make the support plate 16 and The stamping assembly 50 is separated, the stamping assembly 50 is taken out from the platen 18 , and the stamper 51 is separated from the object 52 to be stamped.

In the above three embodiments, the object to be imprinted 52 is formed by laminating the semiconductor layer, the insulating layer 52b and the substrate 52a. The material of the substrate 52a is glass; the insulating layer 52b is PMMA (polymethyl methacrylate), and its thickness is 500nm-1000nm; the semiconductor layer is spin-coated on the surface of the insulating layer 52b, and the semiconductor layer is ZnO (zinc oxide) or P3HT (polymer of 3-hexylthiophene) with a thickness of 10 nm. The embossing assembly 50 can be placed upright or reversed without affecting the embossing process. The hot embossing will use a blast drying oven, a constant temperature vacuum drying oven or an electric heating device installed on the platen 18 or the support plate 16 to heat the embossing assembly 50 . At an appropriate embossing temperature, the stamper 51 is pressed against the object to be imprinted 52 and reaches an appropriate embossing force and a predetermined time to realize hot embossing. Preferably, the embossing force is 0.5-2kN, the embossing temperature is 80-110°C, and the predetermined time is 10-30min. The embossing equipment of the utility model can realize the pattern transfer of the characteristic size from 20nm to 2000nm, can form fine patterns and mass-produce them, and can also meet the needs of scientific researchers who study nanostructures and devices. The imprinting device has low cost and can be used to prepare various nano electronic devices, optical devices, memories, nano fluid channels, biochips and the like.

The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present utility model shall be included in this utility model. within the scope of protection of utility models.

Claims (7)

1. an Embosser, it comprises base and the top board being oppositely arranged with described base, it is characterized in that: described Embosser also comprises the guide pillar of the downside that is fixed on described top board, be slidably mounted on the back up pad on described guide pillar, compression is arranged at the flexible member between described top board and described back up pad, be arranged on the pressue device on described base and by described pressue device, drive and coordinate with described back up pad the pressing plate of sandwiched platen assembly, described back up pad is limited on the length direction of described guide pillar and slides, described platen assembly comprise pressing mold and with the thing that is stamped of this pressing mold laminating.

2. Embosser as claimed in claim 1, is characterized in that: described flexible member is set on described guide pillar and the opposite end of this flexible member connects with described top board and described back up pad respectively.

3. Embosser as claimed in claim 1, it is characterized in that: the downside of described top board and the upside of described back up pad all offer groove, one end of described flexible member is plugged on the described groove of described top board and the other end of this flexible member is plugged on the described groove of described back up pad.

4. the Embosser as described in claims 1 to 3 any one, it is characterized in that: the quantity of described guide pillar is several, some described guide pillars are evenly distributed on described top board, the quantity of described flexible member is several, and some described flexible members are evenly distributed between described top board and described back up pad.

5. the Embosser as described in claims 1 to 3 any one, is characterized in that: described pressue device is lifting jack, and this lifting jack has an output terminal and this output terminal is fixedly connected with described pressing plate.

6. the Embosser as described in claims 1 to 3 any one, is characterized in that: described Embosser also comprises that to be arranged on the rule of force of impression and the zero graduation of this rule on described top board and when being stamped thing described in measuring and offseting with described pressing mold concordant with an end face of described back up pad.

7. the Embosser as described in claims 1 to 3 any one, it is characterized in that: described Embosser also comprises the heating arrangement that can heat described platen assembly, described heating arrangement is arranged on described pressing plate, or described heating arrangement is arranged in described back up pad, or described heating arrangement be arranged on described pressing plate with described back up pad on; Described Embosser also comprises the heat-proof device that is delivered to described pressing plate and described back up pad for reducing the heat of described heating arrangement generation, and described heat-proof device is arranged between described pressing plate and described platen assembly and between described back up pad and described platen assembly.