CN203763342U - Electronic fever abatement paste - Google Patents

Abstract

The utility model relates to an electronic fever abatement paste. The electronic fever abatement paste comprises a resin shell and a cotton inner container, wherein a semiconductor refrigeration plate which is connected with a power source is arranged between the resin shell and the cotton inner container. The electronic fever abatement paste has the beneficial effects that a semiconductor refrigeration material is adopted, the cold end of a semiconductor is used for taking heat away, the temperature is rapidly reduced, the physical cooling is realized for human body fever which is caused by a cold or other reason, medicine is pasted, and dual efficacies of treatment are reached. The temperature adjustment and the temperature control are realized by the electronic fever abatement paste, the local temperature of the brain can be effectively reduced, the brain cells are protected from being injured to the greatest extent, and the cold symptom is relived. Meanwhile, the electronic fever abatement paste has the cooling effects of assisting a user in refreshing, restoring consciousness, allaying tiredness, comforting mind and body, reducing body temperature and the like.

Description

Electronics is defervescence plaster used

Technical field

This utility model relates to a kind of human body cooling device, and especially a kind of electronics is defervescence plaster used.

Background technology

Defervescence plaster used is to spread to domestic concept from Japan the earliest, common defervescence plaster used be to utilize the TDDS technology of international popular to make moisture and drug transdermal enter skin, the physical change of then absorbing heat by water vapor reaches falls hypothermic effect.It belongs to Physical temperature-lowering articles for use, is widely used in fever of children fever, passes the summer in a leisurely way and the situation such as work in hot environment.

(1) common defervescence plaster used be the hydrogel that hydrophilic high molecular material, glycerol, water, Herba Menthae wet goods are made, Tu applies on medical non-woven cloth base material, covers polypropylene high molecular material protecting film above and forms.Defervescence plaster used patient's forehead, temple, DAZHUI acupoint or the local affected part of being affixed on, takes away the mechanism of heat while utilizing water vapor, body part is carried out to auxiliary temperature-reducing and bring down a fever.Along with the minimizing of volatile material, the effect of bringing down a fever is going down.The most multiplex 4 hours of a slice.

(2) volatile material such as child's skin is more tender and lovely, the common defervescence plaster used glycerol including likely cause allergy.There is 40% child using first after defervescence plaster used just redly on forehead, crossed a period of time color and become mulberry by original red stain, even, after two months, on some child's foreheads, still have defervescence plaster used seal.

(3) common defervescence plaster used price, at 6-10 yuan, is disposable products.Once the use amount of fever is 5 left and right, and use cost is higher.Children's quantity of 0-14 years old is in 200,000,000 left and right, and each child has a fever 4 times for average 1 year, and the consumption of a year is at 4,000,000,000, and so huge waste and old defervescence plaster used rubbish will cause tremendous influence to environment.

Summary of the invention

This utility model will solve the shortcoming of above-mentioned prior art, provides that a kind of temperature is controlled, the electronics of environmental protection, safety and sanitation is defervescence plaster used.

This utility model solves the technical scheme that its technical problem adopts: this electronics is defervescence plaster used, comprises resin enclosure, cotton inner bag, is provided with the semiconductor chilling plate that a slice can be connected with power supply between resin enclosure and cotton inner bag.

As preferably, described semiconductor chilling plate forms by the P-type semiconductor for freezing with for the N-type semiconductor dispelling the heat, and wherein P-type semiconductor is relative with cotton inner bag, and N-type semiconductor is relative with thermal conductive network.

As preferably, described semiconductor chilling plate is connected with a PID controller, the power interface of semiconductor chilling plate, PID controller and resin enclosure side and switch form a closed-loop path, and PID controller is connected with a temperature sensor of being located on cotton inner bag.

As preferably, described in comprise between the control circuit of PID controller and thermal conductive network and be provided with heat-barrier material, prevent that heat radiation from affecting circuit stability.

As preferably, resin enclosure, cotton inner bag and semiconductor chilling plate entirety have an inside circular arc degree, meet ergonomics.

The effect that utility model is useful is: this utility model utilizes semiconductor refrigeration material, take away heat by semi-conductive cold junction, thereby fast cooling has Physical temperature-lowering to the human body fever of catching a cold or other reason causes, by pasting medicine, reach treatment double effects again.Electronization is defervescence plaster used can accomplish homoiothermic and thermostatic control, can effectively reduce brain local temperature, protects to greatest extent brain cell to be without prejudice, and alleviates cold symptoms.There is the cooling sensations such as the user of help is refreshed oneself, refreshment, allaying tiredness, happy body and mind, reduction body temperature simultaneously.

Brief description of the drawings

Fig. 1 is front view of the present utility model;

Fig. 2 is top view of the present utility model;

Description of reference numerals: power interface 1, switch 2, PID controller 3, temperature sensor 4, semiconductor chilling plate 5, cotton inner bag 6, thermal conductive network 7, resin enclosure 8.

Detailed description of the invention

Below in conjunction with accompanying drawing, the utility model is described in further detail:

Embodiment: as Fig. 1,2, a kind of electronics is defervescence plaster used, its basic structure is to be made up of resin enclosure 8 and cotton inner bag 6.Its sheathing material also can use the reasonable material of heat-insulating property to make, the semiconductor chilling plate 5 of a slice circular arc degree is installed between resin enclosure 8 and cotton inner bag 6, and a slice P-type semiconductor is towards cotton inner bag 6, for refrigeration, another sheet N-type semiconductor is towards thermal conductive network 7, for heat radiation.Control circuit is installed in housing, and between control circuit and thermal conductive network 7, heat-barrier material is installed, prevent that heat radiation from affecting circuit stability, defervescence plaster used side is power interface 1 and switch 2, has refrigeration mode, on/off function.Semiconductor chilling plate 5, switch 2, PID controller 3 and closed-loop path of electric power generating composition.

Power by 12V power interface 1, through gauge tap 2, PID controller 3 according to the temperature value of setting and the temperature that detects of temperature sensor 4 through PID computing, control the refrigerating capacity of semiconductor chilling plate 5, semiconductor chilling plate 5 is refrigeration towards cotton inner bag 6, towards high-efficiency heat conduction net 7 be to heat, human heat is dispersed in air by semiconductor chilling plate 5.

In addition to the implementation, this utility model can also have other embodiments.All employings are equal to the technical scheme of replacement or equivalent transformation formation, all drop on the protection domain of this utility model requirement.

Claims (3)

1. an electronics is defervescence plaster used, comprise resin enclosure (8), cotton inner bag (6), it is characterized in that: between resin enclosure (8) and cotton inner bag (6), be provided with the semiconductor chilling plate (5) that a slice can be connected with power supply.

2. electronics according to claim 1 is defervescence plaster used, it is characterized in that: described semiconductor chilling plate (5) forms by the P-type semiconductor for freezing with for the N-type semiconductor dispelling the heat, wherein P-type semiconductor is relative with cotton inner bag (6), and N-type semiconductor is relative with thermal conductive network (7).

3. electronics according to claim 1 and 2 is defervescence plaster used, it is characterized in that: resin enclosure (8), cotton inner bag (6) and semiconductor chilling plate (5) entirety have an inside circular arc degree.